A3P250-FG144T - ProASIC3 250K-Gate Flash FPGA | Microchip
N.º da peça: A3P250-FG144T ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $34.73 | $34,73 |
| 10 | $33.5 | $335,00 |
| 100 | $31.8 | $3.180,00 |
| 500 | $30.1 | $15.050,00 |
| 1.000 | $28.6 | $28.600,00 |
A3P250-FG144T Visão geral
A flash-based FPGA stores its configuration in on-chip flash cells rather than SRAM, so the A3P250-FG144T is a single-chip, non-volatile solution that powers up instantly without an external configuration PROM or boot flash. Within the programmable logic hierarchy (FPGA -> programmable logic device -> digital logic IC), this differentiates ProASIC3 from SRAM FPGAs such as the Xilinx Spartan family, improving security and reducing board cost.
Key features include 6144 CLBs, a system clock rate of 231 MHz, 97 user I/Os with flexible standards support, instant-on operation, and live reprogrammability. The flash fabric also provides inherent protection against configuration cloning, a frequently cited advantage in automotive and industrial designs. Low total cost of ownership (TOC) and small-footprint packaging are core family features listed by Microchip.
The ProASIC3 architecture uses a fine-grained VersTile logic element on a 130 nm flash process, with embedded SRAM blocks available for FIFOs and dual-port memories. Clock conditioning and I/O registers support high-performance synchronous designs implemented through Microchip Libero SoC design tools.
Typical applications include automotive body and powertrain control, industrial motor control and automation, portable instrumentation, and secure embedded control where instant-on and configuration security matter.
Design consideration: the 144-FBGA requires careful PCB layout with controlled-impedance routing and recommended power decoupling; verify the FG versus FGG package variant (solder-ball composition) matches your assembly process.
This page synthesizes distributor pricing, same-family drop-in variants, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para A3P250-FG144T — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P250-FG144T (mesmo formato e footprint) — diferindo em Package, Process Technology, RoHS Status, System Gates, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P250-FGG144T
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P250-FG144I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P250-1FG144T
✅ Drop-In✓ Em estoque
$28.9 / unidade
Ver ficha técnica →A3P250-1FGG144T
✅ Drop-In✓ Em estoque
$19.2 / unidade
Ver ficha técnica →A3P250-FG144
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P250-FGG144I
✅ Drop-In✓ Em estoque
$14.06 / unidade
Ver ficha técnica →A3P250-FG144T Classificações máximas e características elétricas
| Family | ProASIC3 Flash FPGA |
| Number of Gates | 250,000 |
| Configurable Logic Blocks (CLBs) | 6144 |
| Logic Elements (LEs) | 3K LEs |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm Flash |
| Core Supply Voltage | 1.5 V |
| Number of User I/Os | 97 |
| Encapsulamento | 144-Ball FBGA (13 x 13 mm, 1 mm pitch, 1.45 mm height) |
| Tipo de montagem | Surface Mount |
| Configuration Memory | Non-volatile Flash (single-chip, instant-on) |
| Temperature Grade | Automotive (T suffix) |
| Lead Free Status | Contains Lead (per DigChip) |
| Status RoHS | RoHS Non-Compliant (per DigChip) |
| Packaging | Tray |
Guia de Configuração de Pinos do A3P250-FG144T 144-ball fbga (13 x 13 mm, 1 mm pitch, 1.45 mm height)
Configuração de pinos para A3P250-FG144T (pacote 144-ball fbga (13 x 13 mm, 1 mm pitch, 1.45 mm height)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3P250-FG144T.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3P250-FG144T é adequado para 6 aplicaçãos: Automotive Body and Powertrain Control, Industrial Motor Control and Automation, Portable and Battery-Powered Instrumentation, Secure Embedded Control Systems, Test and Measurement Equipment, Communications and Interface Bridge Logic.
Automotive Body and Powertrain Control
The A3P250-FG144T is designed for automotive ECUs: the datasheet identifies it explicitly as part of the Automotive ProASIC3 Flash Family with the T temperature suffix. Its 250K gates and 6144 CLBs provide enough capacity for body-control logic, CAN/LIN glue logic, gateways, and powertrain supervisory functions, while 97 user I/Os interface sensors, lamps, and actuators directly. The non-volatile flash fabric delivers instant-on operation - logic is functional within microseconds of key-on, eliminating external boot ROM and its failure modes. Configuration security from flash cells protects against firmware cloning in fielded vehicles. Implemented in Libero SoC with timing closure at up to 231 MHz, it suits 12V automotive rails with appropriate level-shifting on I/O banks.
Recomendado
Industrial Motor Control and Automation
In industrial drives, PLC I/O modules, and motion controllers, the A3P250-FG144T provides deterministic parallel logic that microcontrollers cannot match: PWM generation, quadrature decoding, and safety interlock logic execute in hardware at up to 231 MHz. The flash-based single-chip architecture removes the configuration device required by SRAM FPGAs, improving uptime in electrically noisy factory environments where a failed boot sequence means a stopped line. With 97 I/Os in a 13 x 13 mm 144-FBGA, it consolidates discrete glue logic, reducing BOM count and board area. The 1.5 V core keeps dynamic power low for fanless industrial designs, and live reprogrammability allows field firmware updates without suspending the whole system.
Recomendado
Portable and Battery-Powered Instrumentation
The A3P250-FG144T's 1.5 V core on a 130 nm flash process yields low static power, important in handheld test equipment, battery data loggers, and portable medical diagnostic devices. Instant-on flash configuration means the instrument is ready the moment power is applied - no multi-hundred-millisecond SRAM boot - which improves user experience and enables duty-cycled designs that cut power between measurements. The compact 144-ball FBGA (13 x 13 mm, 1.45 mm height) fits space-limited handheld PCBs, while 97 I/Os drive displays, keypads, and sensor front ends. Its single-chip nature also simplifies mechanical sealing of the enclosure by removing external configuration memory and its connectors.
Recomendado
Secure Embedded Control Systems
Flash-based FPGAs resist configuration readback attacks: unlike SRAM FPGAs whose bitstream sits in an external PROM, the A3P250-FG144T stores configuration inside the chip, so the design never traverses a bus during boot. This makes it a strong fit for secure access controllers, encryption key handling glue logic, industrial anti-counterfeiting modules, and defense-adjacent control boards. The 250K-gate capacity hosts AES-style datapaths alongside control state machines, and 231 MHz system performance supports time-critical authentication logic. Because the device is also live reprogrammable, key-update state machines can be fielded without returning hardware. Design implementation in Libero SoC includes FlashLock security features of the ProASIC3 family.
Recomendado
Test and Measurement Equipment
Bench instruments, protocol analyzers, and automated test fixtures benefit from the A3P250-FG144T's deterministic hardware timing: trigger chains, time-to-digital logic, and channel formatting run without software jitter at clock rates up to 231 MHz. The 97 user I/Os with registered I/O cells support dense channel counts in a 13 x 13 mm footprint, and the automotive-grade temperature rating provides margin for instruments used near thermal limits. Flash configuration means the instrument presents a working front-end immediately at power-up, and IEEE-style JTAG programming through Libero SoC enables test-fixture firmware updates in the field. Replacing dozens of TTL devices with one FPGA also simplifies calibration documentation.
Recomendado
Communications and Interface Bridge Logic
The A3P250-FG144T serves as protocol bridge and glue logic in networking and communication boards, converting between legacy interfaces and modern controllers. With 6144 CLBs and up to 231 MHz performance, it implements UART/SPI/I2C multiplexing, parallel bus adaptation, and simple framing engines in hardware. The flash fabric is instantly active at power-on, which matters in backplane systems where a slave device must answer early enumeration, and the single-chip design removes configuration PROMs that add BOM cost per node in high-volume communication hardware. The 144-FBGA with 1 mm ball pitch is reworkable with standard BGA equipment, supporting board-level service in deployed communication racks.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P250-FG144T — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P250-FGG144T | A3P250-FG144I | A3P250-1FG144T | A3P250-FG144 |
|---|---|---|---|---|---|
| Package | 144-Ball FBGA (13 x 13 mm) | 144-Ball FBGA - same footprint | 144-Ball FBGA - same footprint | 144-Ball FBGA - same footprint | 144-Ball FBGA - same footprint |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| User I/Os | 97 | 97 | 97 | 97 | 97 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Principais diferenciais
- Automotive temperature grade with standard speed performance (vs A3P250-FG144I)
- Standard speed grade at no timing penalty (vs A3P250-1FG144T)
- Cost of RoHS non-compliance is real (vs A3P250-FGG144T)
Notas de projeto
The 144-ball FBGA uses a 1.0 mm ball pitch on a 13 x 13 mm body with 1.45 mm height. Design the land pattern per the package mechanical drawing in the ProASIC3 datasheet and route the dense center ball breakout with via-in-pad or dog-bone fanout on at least a 4-layer board. Verify whether your assembly line's reflow profile is compatible with the FG package's lead-containing balls; if the line is RoHS-only, switch to the A3P250-FGG144T Pb-free variant, which is pin-to-pin identical.
The A3P250 core runs from 1.5 V while I/O banks use separate supplies, so plan a multi-rail power tree and budget core current from the ProASIC3 power calculator in Libero SoC using your actual design utilization and toggle rates. Decouple all VCC/VCCI/VCCA banks with the capacitor combination recommended in the datasheet power section, placing capacitors close to the ball fanout vias. Because the flash fabric is non-volatile, no configuration power sequencing or boot-current spike from an external PROM exists, simplifying supply design versus SRAM FPGAs.
Three pitfalls recur with this part. First, order the correct package suffix: FG is lead-bearing and RoHS non-compliant per DigChip, FGG is Pb-free - a compliance audit failure is a costly rework. Second, confirm speed grade against your Libero timing report before substituting a -1 grade part such as A3P250-1FG144T. Third, since this is a mature family, verify date codes and request certificates of conformance from distributors; marketplaces report stock from non-franchise sources, so qualify suppliers before production placement.
Informações de conformidade
Per DigChip specification summary, A3P250-FG144T contains lead and is RoHS Non-Compliant. The datasheet identifies the part as belonging to the Automotive ProASIC3 Flash Family (T suffix). For RoHS-compliant builds, use the A3P250-FGG144T Pb-free/green package variant, which FindIC confirms as a complete drop-in replacement.
