A3P600-2FGG256I - ProASIC3 600K FPGA | Microchip
N.º da peça: A3P600-2FGG256I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $86.42 | $86,42 |
| 10 | $78.15 | $781,50 |
| 100 | $65.9 | $6.590,00 |
| 500 | $57.35 | $28.675,00 |
| 1.000 | $49.8 | $49.800,00 |
A3P600-2FGG256I Visão geral
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured after manufacturing to implement arbitrary digital logic. FPGAs belong to the programmable logic device family and are used when a design requires flexibility, parallel processing, or fast time-to-market without the non-recurring engineering costs of an ASIC. The ProASIC3 family specifically uses non-volatile flash cells for configuration, meaning the device is live at power-up and does not require an external configuration PROM, unlike SRAM-based FPGAs.
Key features of the A3P600-2FGG256I include 600K system gates, 177 single-ended or differential user I/Os, 110,592 bits of RAM, and a maximum internal frequency of 310 MHz according to family data. The -2 speed grade supports the highest performance tier in the ProASIC3 600K device. The device is built on a 130 nm process and operates from a nominal 1.5 V core supply with a recommended range of 1.425 V to 1.575 V. Four I/O banks allow flexible mixed-voltage I/O support, as noted in Microchip migration application notes.
The A3P600-2FGG256I has an industrial temperature range of -40C to +100C, making it suitable for demanding environments. The FGG package suffix indicates a lead-free/RoHS-compliant 256-ball FBGA. Because ProASIC3 uses flash technology, the FPGA holds its configuration permanently without a boot ROM, and supports In-System Programming (ISP) through JTAG, simplifying field updates and reducing system BOM cost.
Typical applications for the A3P600-2FGG256I include industrial automation controllers, communications infrastructure, aerospace and defense electronics, IoT edge gateways, medical instrumentation, and test-and-measurement systems. The 177 I/O pins, combined with 600K gates, provide an ideal balance for glue logic, bus interfaces, and small protocol bridges.
When designing with this device, pay close attention to I/O bank supply voltages (VCCIBX) and decoupling. Because the device is flash-based, no configuration device is required, but the JTAG interface should be accessible for programming and boundary-scan testing. Use the Microchip Libero SoC software for design implementation and the Power Calculator early in the design cycle to plan thermal and power-supply margins.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a complete decision hub for the A3P600-2FGG256I.
Alternativas drop-in para A3P600-2FGG256I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P600-2FGG256I (mesmo formato e footprint) — diferindo em Package, Operating Temperature, System Gates, Process Technology, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P600-2FGG256
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$50.51 / unidade
Ver ficha técnica →A3P600-FGG256I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$96.23 / unidade
Ver ficha técnica →A3P600-2FG256I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$44.4 / unidade
Ver ficha técnica →A3P600-FG256I
✅ Drop-In✓ Em estoque
$23.1 / unidade
Ver ficha técnica →A3P1000-2FGG256I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
A3P600-2FGG256I Classificações máximas e características elétricas
| Product Family | ProASIC3 |
| System Gates | 600,000 |
| Logic Elements / D-Flip-Flops | 13,824 |
| User I/O | 177 |
| RAM Bits | 110,592 |
| Tensão de alimentação | 1.5 V (1.425 V to 1.575 V) |
| Process Technology | 130 nm |
| Maximum Internal Frequency | 310 MHz |
| Encapsulamento | 256-LBGA / 256FBGA |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +100C |
| Number of I/O Banks | 4 |
Guia de Configuração de Pinos do A3P600-2FGG256I 256-lbga / 256fbga
Configuração de pinos para A3P600-2FGG256I (pacote 256-lbga / 256fbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3P600-2FGG256I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3P600-2FGG256I é adequado para 6 aplicaçãos: Industrial Automation Controller, Communications Infrastructure, Aerospace and Defense Electronics, IoT Edge Gateway, Medical Instrumentation, Test and Measurement Equipment.
Industrial Automation Controller
The A3P600-2FGG256I is well-suited for industrial automation controllers because its flash-based configuration is live at power-up and resists bitstream corruption in electrically noisy factories. The 177 user I/Os allow direct interface to PLC fieldbus transceivers, optocouplers, and encoder inputs, while the 600K gates provide enough logic for multi-axis motion interpolation and safety interlock logic. The industrial temperature range (-40C to +100C) matches common PLC and robotics enclosures where internal temperature is not tightly controlled. By using 4 I/O banks, the FPGA can mix 3.3 V sensor inputs with 1.8 V memory interfaces without external level shifters, simplifying the controller BOM and reducing component count.
Recomendado
Communications Infrastructure
In communications infrastructure, the A3P600-2FGG256I serves as a protocol bridge, packet pre-processor, and clock-domain-crossing manager in routers, switches, and base station backhaul cards. Its 310 MHz internal frequency supports line-rate data handling for 10/100 Ethernet MACs and SPI/I2C management buses, while the 110,592 bits of RAM buffer small packets or FIFOs. The 4 I/O banks allow direct connection to different voltage domains: 2.5 V MII interfaces, 1.8 V DDR/QDR SRAM, and 3.3 V management controllers on the same device. The flash-based nature eliminates the need for a configuration PROM, reducing board space on space-constrained line cards. Microchip ProASIC3 devices are commonly used in telecommunication designs where reliability and long-term supply are essential.
Recomendado
Aerospace and Defense Electronics
The A3P600-2FGG256I fits aerospace and defense electronics requiring radiation-tolerant, non-volatile logic in a compact footprint. Its flash configuration cells hold the design across power cycles without external memory, simplifying secure boot and reducing single-event-upset vulnerabilities compared to SRAM FPGAs. With an industrial temperature range, the device can operate in unpressurized avionics bays and ground-support equipment. The 177 I/O pins support discrete signals, MIL-STD-1553 bus controllers, and video interface glue logic. Because Microchip is a qualified supplier for defense programs, the A3P600-2FGG256I is often selected for radar processing pre-filters, telemetry frame sync, and payload controllers. Existing designs frequently migrate between A3P600 and A3P1000 densities within the same 256-ball package to adapt to evolving requirements.
Recomendado
IoT Edge Gateway
The A3P600-2FGG256I provides a secure, deterministic logic core for IoT edge gateways that aggregate sensor data, run simple analytics, and forward data to the cloud. Its flash architecture gives a secure root of trust because configuration data is stored on-chip and can be protected by Microchip security locks. The 600K gates are sufficient for protocol conversion between Modbus, CAN, Ethernet, and LoRaWAN front-ends without burdening the host microcontroller. The 1.5 V core supply is suited to low-power operation, and the FPGA can be put into Flash*Freeze mode in designs that require it. The 256-ball BGA package allows a compact host board layout, and the industrial temperature range makes it viable for outdoor edge enclosures. Integration with Microchip microcontrollers, such as those in the Site MPN list, enables a complete gateway subsystem.
Recomendado
Medical Instrumentation
Medical instrumentation relies on deterministic timing and long-term reliability, making the A3P600-2FGG256I an excellent fit for patient monitors, infusion pumps, and imaging front-ends. The flash FPGA starts up instantly and has no configuration bitstream to corrupt, which is important in life-critical equipment. Its 110,592 bits of RAM can be used for acquisition FIFOs, while the 177 I/Os interface to ADCs, DACs, and display controllers. The device's industrial temperature range supports equipment that may be exposed to elevated temperatures during sterilization or transport. Engineers designing medical systems often choose ProASIC3 because of its field-upgradability via JTAG, allowing firmware enhancements without board redesign. Microchip's long product lifecycle policy is an additional factor for medical OEMs with regulatory approvals tied to a specific BOM.
Recomendado
Test and Measurement Equipment
In test and measurement equipment, the A3P600-2FGG256I provides the digital glue logic and data acquisition timing control needed in oscilloscopes, logic analyzers, and signal generators. The 310 MHz internal frequency supports high-speed trigger logic and time-interval counters, while the 177 I/O pins interface to high-speed ADCs, DACs, and PLLs. The 4 I/O banks allow mixing of 1.8 V ADC digital outputs and 3.3 V front-panel control logic on a single FPGA. The flash-based nature of ProASIC3 reduces processorn startup delays and enables instant-on measurement modes. Designers can use the device's embedded RAM for acquisition buffers, reducing external SRAM cost. For benchtop instruments, the -40C to +100C temperature range provides ample margin for enclosure airflow and adjacent power supplies.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P600-2FGG256I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P600-2FGG256 | A3P600-FGG256I | A3P600-2FG256I |
|---|---|---|---|---|
| Package | 256-LBGA / 256FBGA | 256-LBGA / 256FBGA | 256-LBGA / 256FBGA | 256-LBGA / 256FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Elements / DFF | 13,824 | 13,824 | 13,824 | 13,824 |
| User I/O | 177 | 177 | 177 | 177 |
| RAM Bits | 110,592 | 110,592 | 110,592 | 110,592 |
| Speed Grade | -2 | -2 | -1 | -2 |
| Temperature Range | -40C to +100C | 0C to +70C | -40C to +100C | -40C to +100C |
| Ball Finish | Lead-free (FGG) | Lead-free (FGG) | Lead-free (FGG) | Tin-lead (FG) |
Principais diferenciais
- Industrial temperature grade in a lead-free 256-ball FBGA (vs A3P600-2FGG256)
- Highest -2 speed grade (vs A3P600-FGG256I)
- Lead-free FGG ball finish for RoHS-compliant production (vs A3P600-2FG256I)
Notas de projeto
Estimated: Use the Microchip Libero SoC Power Calculator to estimate core and I/O power for your design. For a typical 100 MHz design with 50% utilization, A3P600 core current is in the 50-200 mA range depending on routing and toggle rate. Place 0.1 uF and 1 uF ceramic capacitors close to each VCC and VCCIBX ball, and a bulk 10 uF capacitor per power rail. Ensure the 1.5 V supply stays within 1.425 V to 1.575 V under load transients.
The 256-ball FBGA requires careful fan-out routing. Microvias are recommended for 0.8 mm pitch BGA designs. Keep high-speed I/O traces length-matched and unterminated stubs to a minimum. Use a solid ground plane beneath the package to reduce inductance and improve signal integrity. Follow Microchip ProASIC3 PCB layout guidelines for VCC, VCCIBX, and JTAG pin filtering.
Set each I/O bank voltage (VCCIBX) to match the I/O standard used on that bank; mismatched bank voltage can damage I/O cells or cause functional failures. Configure unused I/Os as pulled-down or tristated to reduce power. Use the JTAG port for programming and boundary-scan testing, and protect the programming pins with series resistors if used on a multi-board backplane.
Informações de conformidade
The FGG package suffix generally indicates lead-free/RoHS-compliant assembly, but the provided verified web data does not explicitly state RoHS/REACH certificates. AEC-Q100 is not applicable for general-purpose FPGAs.
