A3P600-FG256I - ProASIC3 FPGA, 600K Gates | Microchip Technology
N.º da peça: A3P600-FG256I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.25 | $38,25 |
| 10 | $34.6 | $346,00 |
| 100 | $30.95 | $3.095,00 |
| 500 | $28.2 | $14.100,00 |
| 1.000 | $25.65 | $25.650,00 |
| 3.000 | $23.1 | $69.300,00 |
A3P600-FG256I Visão geral
What is a Field Programmable Gate Array? An FPGA is a semiconductor device containing configurable logic blocks and programmable interconnects that can be reconfigured after manufacturing to implement arbitrary digital logic. Unlike fixed-function ASICs, FPGAs allow in-system design changes and rapid prototyping. Microchip's ProASIC3 family uses nonvolatile flash-based configuration, meaning the FPGA retains its programming without an external boot PROM while still being reprogrammable. The A3P600-FG256I sits in the FPGA -> programmable logic -> integrated circuit hierarchy and is often selected for applications requiring secure IP protection, flexible I/O, and low total cost of ownership.
Key features of the A3P600-FG256I include 600K system gates, 13,824 VersaTiles, 177 user I/O, 110,592 RAM bits, a 1.5 V core supply, and a 17 x 17 mm 256-ball FBGA package with 1 mm pitch. The flash-based architecture provides nonvolatile configuration, in-system programmability, and a small footprint for mid-density logic designs. According to Mouser, the device is categorized as a 7KLEs ProASIC3 FPGA, and DigiKey confirms the 177 I/O and 110,592 RAM bit organization.
Technically, the ProASIC3 architecture uses a proprietary VersaTile structure that can be configured as a three-input lookup table or a D-flip-flop with enable, giving designers efficient implementation of combinational and sequential logic. The 256-LBGA package balances I/O count and board area while offering a standard 1.5 V core voltage. The device is in-system programmable, and its flash configuration simplifies power-up sequencing because no external configuration device is required. Arrow lists the device as a 600K-gate FPGA with 231 MHz system performance, while other listings cite 350 MHz; designers should verify the exact speed grade against the latest datasheet.
Typical applications for the A3P600-FG256I include industrial automation, motor control, wired communications, medical device signal processing, and IoT edge gateways. Its 177 user I/O and 110K-bit embedded RAM support bus interfaces, state machines, and digital signal processing functions. The industrial temperature suffix (I) makes it suitable for harsh operating environments. The flash-based architecture also reduces system cost by eliminating external PROMs and simplifies field updates.
When designing with the A3P600-FG256I, pay careful attention to power supply decoupling, BGA thermal management, and I/O bank voltage assignments. Because the device is flash-based, no external configuration device is required, which saves board space and reduces boot time. Sufficient VCC and ground plane stitching under the 256-ball package is essential for reliable operation, especially at higher I/O toggle rates.
This page synthesizes distributor pricing, drop-in package variants, practical design notes, a comparison table, and AEO-optimized FAQ content that goes beyond the raw manufacturer datasheet. It is intended to help engineers quickly evaluate the A3P600-FG256I against other ProASIC3 family members and make a confident selection for new designs.
Alternativas drop-in para A3P600-FG256I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P600-FG256I (mesmo formato e footprint) — diferindo em Package, Operating Temperature, RoHS Status, Process Technology, Configuration Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P600-FG256
✅ Drop-In✓ Em estoque
$48.9 / unidade
Ver ficha técnica →A3P600-FGG256
✅ Drop-In✓ Em estoque
$15.4 / unidade
Ver ficha técnica →A3P600-FGG256I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$96.23 / unidade
Ver ficha técnica →A3P600L-FG256I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$53.6 / unidade
Ver ficha técnica →A3P600L-FGG256I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
A3P600-FG256I Classificações máximas e características elétricas
| Product Type | Field Programmable Gate Array (FPGA) |
| Series | ProASIC3 |
| System Gates | 600,000 |
| Logic Elements / VersaTiles | 13,824 VersaTiles (7K logic elements per Mouser) |
| Total RAM Bits | 110,592 |
| Number of User I/O | 177 |
| Core Supply Voltage | 1.5 V |
| Encapsulamento | 256-LBGA (FBGA-256) |
| Package Dimensions | 17 x 17 mm, 1.6 mm height, 1 mm pitch |
| Tipo de montagem | Surface Mount |
| Programming Technology | Nonvolatile Flash |
| Reprogrammability | In-system programmable |
| Status RoHS | unknown |
| REACH Status | unknown |
| Status do ciclo de vida | active per DigiKey (ships today) |
Guia de Configuração de Pinos do A3P600-FG256I 17 x 17 mm, 1.6 mm height, 1 mm pitch
Configuração de pinos para A3P600-FG256I (pacote 17 x 17 mm, 1.6 mm height, 1 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3P600-FG256I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3P600-FG256I é adequado para 6 aplicaçãos: Industrial Automation, Motor Control, Wired Communications, Medical Electronics, IoT Edge Gateways, Aerospace & Defense.
Industrial Automation
The A3P600-FG256I is well suited for industrial automation because its 177 user I/O can interface with multiple sensors, actuators, and fieldbus controllers while its flash-based configuration eliminates external boot memory and provides deterministic power-up. With 600K system gates and 110,592 RAM bits, it can implement soft logic controllers, protocol bridges, and safety interlocks in a single 17x17 mm package. The industrial temperature suffix supports operation in factory environments where ambient temperature can exceed 70°C. Compared to a microcontroller, the FPGA-based approach offers parallel processing and custom timing; compared to a larger FPGA, the A3P600 density keeps cost and power moderate while still providing enough resources for typical PLC and motor-control tasks. Designers should provide separate I/O bank power supplies and adequate decoupling to maintain signal integrity when driving long cable runs.
Recomendado
Motor Control
In motor control applications, the A3P600-FG256I provides the logic resources needed for multi-axis PWM generation, encoder decoding, and current-loop processing. Its 13,824 VersaTiles allow implementation of both time-critical control state machines and communication stacks such as EtherCAT or Modbus interfaces. The 177 user I/O can be assigned to high-speed PWM outputs, analog-to-digital converter interfaces, and fault inputs. The 110,592 RAM bits provide local buffering for control parameters and diagnostic logs. Because it is flash-based, the FPGA starts immediately at power-on, reducing the window where a motor could be uncontrolled. Designers should use dedicated clock inputs for PWM synchronization and place decoupling capacitors close to each I/O bank. The standard-product A3P600-FG256I offers the full ProASIC3 performance class; if static power is critical, consider the A3P600L variants as pin-compatible alternatives.
Recomendado
Wired Communications
The A3P600-FG256I is an excellent choice for wired communications equipment such as industrial switches, protocol converters, and network interface cards. Its 177 user I/O can connect to multiple PHY devices, MAC controllers, and backplane buses, while the embedded RAM supports FIFOs and packet buffers. The flash-based architecture provides instant configuration and high security, protecting IP from readback attacks. In a typical design, the FPGA performs protocol framing, timestamping, and bridging functions at speeds compatible with common Ethernet and serial standards. The 1.5 V core supply keeps power dissipation manageable, and the 256-LBGA package saves board area. To maximize signal integrity, route high-speed serial lines with controlled impedance and keep I/O bank supply decoupling close to the BGA pads. The industrial temperature grade supports telecom cabinets and outdoor enclosures where temperatures vary widely.
Recomendado
Medical Electronics
The A3P600-FG256I can be used in medical devices such as patient monitors, ultrasound front-end controllers, and diagnostic instruments where reliable, deterministic logic is essential. The FPGA's nonvolatile flash configuration ensures that the device powers up into the intended state without needing to load firmware from a host processor. Its 600K system gates provide ample room for sensor interface logic, digital filtering, and display control. The 177 user I/O allow direct connection to multiple ADCs, DACs, and serial peripherals. The industrial temperature grade suits equipment that may be exposed to elevated temperatures during sterilization or prolonged operation. Designers should implement redundant safety trips and use the FPGA's abundant registers for latching critical alarm conditions. With the A3P600-FG256I, medical electronics designers can reduce BOM cost by eliminating external configuration memories and improve security by leveraging flash-based IP protection.
Recomendado
IoT Edge Gateways
The A3P600-FG256I is well suited for IoT edge gateways that need to bridge multiple sensors, communication protocols, and local decision-making without relying on a heavy applications processor. With 177 user I/O, the FPGA can interface to SPI, I2C, UART, and parallel sensor buses simultaneously. Its 110,592 RAM bits buffer sensor samples and protocol packets, while its 13,824 VersaTiles implement custom pre-processing and protocol conversion. The flash-based design consumes no configuration current at startup and starts instantly, which is valuable in battery-powered or energy-harvesting gateways. The 256-LBGA package is compact enough for small PCB designs, and the industrial temperature grade supports outdoor IoT deployments. For lower power, the A3P600L-FG256I is a pin-compatible variant that reduces static power. Designers should use low-power I/O standards and gate clocks to minimize dynamic power in always-on applications.
Recomendado
Aerospace & Defense
The A3P600-FG256I's nonvolatile flash architecture and industrial temperature grade make it attractive for aerospace and defense electronics such as avionics data concentrators, radar signal conditioning, and secure communication terminals. Flash-based FPGAs offer instant-on operation and are less vulnerable to configuration bitstream interception than SRAM-based FPGAs. With 600K system gates, the device can implement cryptographic acceleration, bus conversion, and telemetry processing in a single package. The 177 user I/O support diverse interfaces, including serdes and parallel buses, while the 110,592 RAM bits provide local packet storage. The 17x17 mm BGA package enables dense board layouts in constrained line-replaceable units. Designers should select the appropriate Microchip aerospace-grade or extended-temperature variants when required, and follow derating guidelines for high-reliability applications. The A3P600-FG256I offers a balanced combination of density, security, and environmental tolerance for defense programs in early development.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P600-FG256I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P600-FG256 | A3P600-FGG256 | A3P600-FGG256I | A3P600L-FG256I | A3P600L-FGG256I |
|---|---|---|---|---|---|---|
| Package | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Elements / VersaTiles | 13,824 VersaTiles (~7K LEs) | 13,824 VersaTiles | 13,824 VersaTiles | 13,824 VersaTiles | 13,824 VersaTiles | 13,824 VersaTiles |
| Total RAM Bits | 110,592 | 110,592 | 110,592 | 110,592 | 110,592 | 110,592 |
| User I/O Count | 177 | 177 | 177 | 177 | 177 | 177 |
| Temperature Grade | Industrial (I suffix) | Commercial | Commercial | Industrial | Industrial | Industrial |
| Package Finish | Standard | Standard | Green / RoHS-compliant | Green / RoHS-compliant | Standard | Green / RoHS-compliant |
| Power Profile | Standard ProASIC3 | Standard ProASIC3 | Standard ProASIC3 | Standard ProASIC3 | Low-power ProASIC3L | Low-power ProASIC3L |
Principais diferenciais
- Industrial temperature grade in a standard-finish 256-FBGA (vs A3P600-FGG256I)
- Standard ProASIC3 performance instead of low-power ProASIC3L (vs A3P600L-FG256I)
- Industrial operating temperature versus commercial variants (vs A3P600-FG256)
Notas de projeto
The A3P600-FG256I requires a regulated 1.5 V core supply. Place at least one 100 nF capacitor and one 10 uF bulk capacitor close to each VCC ball group, and use dedicated power planes with low inductance. The FPGA's I/O banks may require separate supply voltages depending on the interface standard; consult the datasheet for bank-specific voltage limits. If the design uses low-power ProASIC3L variants, additional static power savings can be achieved with power-down modes.
The 256-LBGA package has a 17x17 mm body and relies on PCB copper for heat spreading. For applications with high I/O toggle rates, ensure sufficient vias, a solid ground plane, and a thermal pad connection as directed by the Microchip board design guidelines. If the device is used near the maximum junction temperature, consider airflow or a thermal interface to a metal enclosure. These observations are general design guidance, not explicit datasheet thermal data.
Do not assume the A3P600-FG256I is SRAM-based; it is flash-based and does not require an external configuration PROM. Ensure the FPGA is programmed with the correct I/O standard and bank voltage before applying external signals. Also, when using the A3P600L low-power variants, verify startup timing and flash programming compatibility with your existing ProASIC3 toolchain. For every new PCB, review the latest Microchip ProASIC3 pinout and package drawing to avoid ball mapping errors.
Informações de conformidade
Compliance status is not explicitly stated in the verified web data. For RoHS-required designs, choose the A3P600-FGG256I green variant. Verify current compliance certificates with Microchip before production.
