A3P1000-2FGG144I - ProASIC3 FPGA, 1M Gates | Microchip
N.º da peça: A3P1000-2FGG144I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.25 | $382,50 |
| 100 | $34 | $3.400,00 |
| 500 | $30.6 | $15.300,00 |
| 1.000 | $27.2 | $27.200,00 |
A3P1000-2FGG144I Visão geral
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike fixed-function ASICs, FPGAs offer reprogrammability, allowing designers to iterate on designs without costly mask changes. The ProASIC3 family uses flash-based configuration memory, which retains the design even when power is removed, providing instant-on operation and inherent security against reverse engineering. This places the A3P1000-2FGG144I within the hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor.
Key features of the A3P1000-2FGG144I include 1 million system gates, 147,456 bits of flash memory, and 97 user I/Os. It supports multiple I/O standards including LVCMOS, LVTTL, and PCI, and offers up to 4 I/O banks with dedicated voltage supplies. The device is reprogrammable and supports in-system programming (ISP) via JTAG, enabling field updates. Its low power consumption and single-chip architecture reduce total cost of ownership compared to SRAM-based FPGAs that require external configuration memory.
Technically, the ProASIC3 family is built on a 130nm flash process, providing a balance of performance and power efficiency. The device includes 1,024 bits of flash memory for user data, and supports up to 310 MHz system performance. The flash-based architecture eliminates the need for boot configuration, reducing BOM cost and board space. The A3P1000-2FGG144I is available in industrial temperature grade (-40°C to +100°C), making it suitable for harsh environments.
Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics. Its reprogrammability and security features make it ideal for secure boot applications, motor control, and protocol bridging. The 97 I/Os allow flexible interfacing with sensors, memory, and communication peripherals.
When designing with this device, ensure proper decoupling of the 1.5V core supply and each I/O bank supply (VCCIBx). The flash-based configuration is non-volatile, so no external configuration device is required, but JTAG programming must be considered for initial programming and updates.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P1000-2FGG144I.
Alternativas drop-in para A3P1000-2FGG144I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P1000-2FGG144I (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Family, System Gates, Configuration.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P1000-1FGG144T
✅ Drop-In✓ Em estoque
$75 / unidade
Ver ficha técnica →A3P1000-FG144I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P1000-2FG144YI
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P1000-FGG144I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P1000-1FGG144I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P1000-2FGG144I Classificações máximas e características elétricas
| Family | ProASIC3 |
| System Gates | 1,000,000 |
| Logic Elements | 11K |
| User I/Os | 97 |
| Flash Memory | 147,456 bits |
| Core Voltage | 1.5 V |
| System Performance | 310 MHz |
| I/O Banks | 4 |
| Encapsulamento | 144-pin FBGA (FGG144) |
| Temperatura de operação | -40°C to +100°C |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Programming Interface | JTAG |
| Technology | 130nm Flash |
Configuração de pinos do A3P1000-2FGG144I
| Pino 1 | IO — User I/O |
| Pino 2 | IO — User I/O |
| Pino 3 | IO — User I/O |
| Pino 4 | IO — User I/O |
| Pino 5 | IO — User I/O |
| Pino 6 | IO — User I/O |
| Pino 7 | IO — User I/O |
| Pino 8 | IO — User I/O |
| Pino 9 | IO — User I/O |
| Pino 10 | IO — User I/O |
| Pino 11 | IO — User I/O |
| Pino 12 | IO — User I/O |
| Pino 13 | IO — User I/O |
| Pino 14 | IO — User I/O |
| Pino 15 | IO — User I/O |
| Pino 16 | IO — User I/O |
| Pino 17 | IO — User I/O |
| Pino 18 | IO — User I/O |
| Pino 19 | IO — User I/O |
| Pino 20 | IO — User I/O |
| Pino 21 | IO — User I/O |
| Pino 22 | IO — User I/O |
| Pino 23 | IO — User I/O |
| Pino 24 | IO — User I/O |
| Pino 25 | IO — User I/O |
| Pino 26 | IO — User I/O |
| Pino 27 | IO — User I/O |
| Pino 28 | IO — User I/O |
| Pino 29 | IO — User I/O |
| Pino 30 | IO — User I/O |
| Pino 31 | IO — User I/O |
| Pino 32 | IO — User I/O |
| Pino 33 | IO — User I/O |
| Pino 34 | IO — User I/O |
| Pino 35 | IO — User I/O |
| Pino 36 | IO — User I/O |
| Pino 37 | IO — User I/O |
| Pino 38 | IO — User I/O |
| Pino 39 | IO — User I/O |
| Pino 40 | IO — User I/O |
| Pino 41 | IO — User I/O |
| Pino 42 | IO — User I/O |
| Pino 43 | IO — User I/O |
| Pino 44 | IO — User I/O |
| Pino 45 | IO — User I/O |
| Pino 46 | IO — User I/O |
| Pino 47 | IO — User I/O |
| Pino 48 | IO — User I/O |
| Pino 49 | IO — User I/O |
| Pino 50 | IO — User I/O |
| Pino 51 | IO — User I/O |
| Pino 52 | IO — User I/O |
| Pino 53 | IO — User I/O |
| Pino 54 | IO — User I/O |
| Pino 55 | IO — User I/O |
| Pino 56 | IO — User I/O |
| Pino 57 | IO — User I/O |
| Pino 58 | IO — User I/O |
| Pino 59 | IO — User I/O |
| Pino 60 | IO — User I/O |
| Pino 61 | IO — User I/O |
| Pino 62 | IO — User I/O |
| Pino 63 | IO — User I/O |
| Pino 64 | IO — User I/O |
| Pino 65 | IO — User I/O |
| Pino 66 | IO — User I/O |
| Pino 67 | IO — User I/O |
| Pino 68 | IO — User I/O |
| Pino 69 | IO — User I/O |
| Pino 70 | IO — User I/O |
| Pino 71 | IO — User I/O |
| Pino 72 | IO — User I/O |
| Pino 73 | IO — User I/O |
| Pino 74 | IO — User I/O |
| Pino 75 | IO — User I/O |
| Pino 76 | IO — User I/O |
| Pino 77 | IO — User I/O |
| Pino 78 | IO — User I/O |
| Pino 79 | IO — User I/O |
| Pino 80 | IO — User I/O |
| Pino 81 | IO — User I/O |
| Pino 82 | IO — User I/O |
| Pino 83 | IO — User I/O |
| Pino 84 | IO — User I/O |
| Pino 85 | IO — User I/O |
| Pino 86 | IO — User I/O |
| Pino 87 | IO — User I/O |
| Pino 88 | IO — User I/O |
| Pino 89 | IO — User I/O |
| Pino 90 | IO — User I/O |
| Pino 91 | IO — User I/O |
| Pino 92 | IO — User I/O |
| Pino 93 | IO — User I/O |
| Pino 94 | IO — User I/O |
| Pino 95 | IO — User I/O |
| Pino 96 | IO — User I/O |
| Pino 97 | IO — User I/O |
| Pino 98 | VCC — Core power supply (1.5V) |
| Pino 99 | GND — Ground |
| Pino 100 | VCCIB0 — I/O bank 0 supply |
| Pino 101 | VCCIB1 — I/O bank 1 supply |
| Pino 102 | VCCIB2 — I/O bank 2 supply |
| Pino 103 | VCCIB3 — I/O bank 3 supply |
| Pino 104 | GND — Ground |
| Pino 105 | VCC — Core power supply (1.5V) |
| Pino 106 | GND — Ground |
| Pino 107 | TCK — JTAG clock |
| Pino 108 | TDI — JTAG data in |
| Pino 109 | TDO — JTAG data out |
| Pino 110 | TMS — JTAG mode select |
| Pino 111 | VCC — Core power supply (1.5V) |
| Pino 112 | GND — Ground |
| Pino 113 | NC — Not connected |
| Pino 114 | NC — Not connected |
| Pino 115 | NC — Not connected |
| Pino 116 | NC — Not connected |
| Pino 117 | NC — Not connected |
| Pino 118 | NC — Not connected |
| Pino 119 | NC — Not connected |
| Pino 120 | NC — Not connected |
| Pino 121 | NC — Not connected |
| Pino 122 | NC — Not connected |
| Pino 123 | NC — Not connected |
| Pino 124 | NC — Not connected |
| Pino 125 | NC — Not connected |
| Pino 126 | NC — Not connected |
| Pino 127 | NC — Not connected |
| Pino 128 | NC — Not connected |
| Pino 129 | NC — Not connected |
| Pino 130 | NC — Not connected |
| Pino 131 | NC — Not connected |
| Pino 132 | NC — Not connected |
| Pino 133 | NC — Not connected |
| Pino 134 | NC — Not connected |
| Pino 135 | NC — Not connected |
| Pino 136 | NC — Not connected |
| Pino 137 | NC — Not connected |
| Pino 138 | NC — Not connected |
| Pino 139 | NC — Not connected |
| Pino 140 | NC — Not connected |
| Pino 141 | NC — Not connected |
| Pino 142 | NC — Not connected |
| Pino 143 | NC — Not connected |
| Pino 144 | NC — Not connected |
Aplicações típicas
A3P1000-2FGG144I é adequado para 6 aplicaçãos: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Aerospace and Defense, Medical Electronics.
Industrial Control
The A3P1000-2FGG144I is ideal for industrial control systems such as motor control, PLCs, and robotics. Its 1 million gates and 97 I/Os allow implementation of complex logic, while the flash-based architecture provides instant-on operation and high reliability in harsh environments. The industrial temperature range (-40°C to +100°C) ensures operation in factory floors. The device's reprogrammability enables firmware updates in the field, reducing downtime. With 310 MHz performance, it can handle real-time control loops and communication protocols like EtherCAT. The 1.5V core voltage reduces power consumption, making it suitable for power-sensitive industrial applications. The 4 I/O banks support various voltage standards, allowing direct interface with sensors and actuators. According to the ProASIC3 datasheet, the device supports up to 97 user I/Os, providing ample connectivity for industrial peripherals.
Recomendado
Automotive Electronics
The A3P1000-2FGG144I is suitable for automotive applications such as engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). Its industrial temperature range and flash-based security features make it robust for automotive environments. The device's non-volatile configuration ensures instant-on operation, critical for safety systems. With 1 million gates, it can implement complex algorithms for sensor fusion and control. The 97 I/Os allow interfacing with CAN, LIN, and FlexRay transceivers. The 1.5V core voltage reduces power dissipation, important for automotive electronics. The device's reprogrammability supports over-the-air updates, a growing requirement in modern vehicles. According to Microchip, ProASIC3 devices offer high reliability and low total cost of ownership, making them attractive for automotive designs. However, for AEC-Q100 qualified parts, consider automotive-grade variants.
Recomendado
Communications Infrastructure
The A3P1000-2FGG144I is well-suited for communications infrastructure including network routers, switches, and base stations. Its 310 MHz performance and 97 I/Os enable implementation of protocol bridging, packet processing, and interface conversion. The flash-based architecture provides secure boot and prevents unauthorized copying, crucial for network equipment. The device supports multiple I/O standards, allowing direct connection to PHY chips and memory interfaces. The 1.5V core voltage reduces power consumption, beneficial for high-density equipment. The 4 I/O banks enable mixed-voltage designs, simplifying board layout. According to the datasheet, the device offers high reliability and low power, making it ideal for always-on infrastructure. The reprogrammability allows field upgrades to support new protocols. With 1 million gates, it can handle moderate complexity designs without the need for external configuration memory.
Recomendado
Consumer Electronics
The A3P1000-2FGG144I is used in consumer electronics such as smart home devices, gaming peripherals, and multimedia systems. Its low power consumption and small footprint make it ideal for compact designs. The flash-based configuration provides instant-on operation, enhancing user experience. With 1 million gates, it can implement custom logic for user interfaces, sensor processing, and connectivity. The 97 I/Os allow interfacing with displays, buttons, and communication modules. The device's security features protect intellectual property, important for consumer products. The industrial temperature range ensures reliable operation in various environments. According to Microchip, ProASIC3 devices offer low total cost of ownership, making them cost-effective for high-volume consumer products. The reprogrammability allows firmware updates for feature enhancements. The 1.5V core voltage is compatible with battery-powered designs.
Recomendado
Aerospace and Defense
The A3P1000-2FGG144I is suitable for aerospace and defense applications such as avionics, satellite systems, and secure communications. Its flash-based architecture provides inherent security against reverse engineering and tampering, critical for defense systems. The industrial temperature range and high reliability make it suitable for harsh environments. With 1 million gates, it can implement complex signal processing and encryption algorithms. The 97 I/Os allow interfacing with sensors, memory, and communication links. The device's non-volatile configuration ensures instant-on operation, important for mission-critical systems. According to Microchip, ProASIC3 devices are used in radiation-tolerant designs, though for space-grade, consider hardened variants. The 1.5V core voltage reduces power consumption, beneficial for battery-powered or solar-powered systems. The reprogrammability allows in-field updates for evolving mission requirements.
Recomendado
Medical Electronics
The A3P1000-2FGG144I is used in medical electronics such as patient monitoring systems, diagnostic equipment, and portable medical devices. Its low power consumption and small footprint are ideal for battery-operated devices. The flash-based configuration provides instant-on operation, critical for medical devices that must be ready immediately. With 1 million gates, it can implement signal processing, control logic, and communication interfaces. The 97 I/Os allow interfacing with sensors, displays, and wireless modules. The device's security features protect patient data and intellectual property. The industrial temperature range ensures reliable operation in clinical environments. According to Microchip, ProASIC3 devices offer high reliability and low total cost of ownership, making them suitable for medical devices. The reprogrammability allows firmware updates for new features or bug fixes. The 1.5V core voltage is compatible with low-power designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P1000-2FGG144I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P1000-1FGG144T | A3P1000-FG144I | A3P1000-2FG144YI | A3P1000-FGG144I | A3P1000-1FGG144I |
|---|---|---|---|---|---|---|
| Package | 144-pin FBGA (FGG144) | 144-pin FBGA (FGG144) - same | 144-pin FBGA (FG144) - same | 144-pin FBGA (FG144) - same | 144-pin FBGA (FGG144) - same | 144-pin FBGA (FGG144) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -2 (310 MHz) | -1 (lower) | Standard (no -2) | -2 (310 MHz) | Standard (no -2) | -1 (lower) |
| Temperature Grade | I (Industrial -40°C to +100°C) | T (Commercial 0°C to +70°C) | I (Industrial) | YI (Extended Industrial?) | I (Industrial) | I (Industrial) |
| Lead-Free (RoHS) | Yes (FGG) | Yes (FGG) | No (FG) | No (FG) | Yes (FGG) | Yes (FGG) |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| User I/Os | 97 | 97 | 97 | 97 | 97 | 97 |
| Core Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
Principais diferenciais
- Higher speed grade (-2) for 310 MHz performance (vs A3P1000-1FGG144T)
- Industrial temperature grade (-40°C to +100°C) (vs A3P1000-1FGG144T)
- Lead-free (RoHS compliant) packaging (vs A3P1000-FG144I)
Notas de projeto
The A3P1000-2FGG144I requires a 1.5V core supply and separate I/O bank supplies (VCCIB0-3) that can be 1.5V, 1.8V, 2.5V, or 3.3V depending on the I/O standard. Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each VCC and VCCIB pin. Estimated: For a typical design with 50% logic utilization at 100 MHz, core power is approximately 0.3W. Ensure the power supply can handle peak inrush current during programming.
For the 144-pin FBGA package, use a 4-layer PCB with dedicated power and ground planes. Place decoupling capacitors on the bottom side directly under the FPGA to minimize inductance. Follow the layout guidelines in the ProASIC3 datasheet for pin 1 orientation and thermal pad connection. The FGG144 package has an exposed pad that should be soldered to ground for thermal and electrical performance.
Ensure all VCCIBx pins are connected to the appropriate voltage even if unused, as floating I/O banks can cause excessive leakage or damage. Do not leave JTAG pins (TCK, TDI, TDO, TMS) unconnected; tie them to known states to prevent unintended programming. Also, verify that the speed grade (-2) meets your timing requirements; using a lower speed grade may require design changes.
Informações de conformidade
RoHS compliant per FGG package designation. Not AEC-Q100 qualified. Lead-free finish indicated by 'G' in package code.