A3PE3000L-PQG208I - ProASIC3L Flash FPGA 3M Gates | Microchip
N.º da peça: A3PE3000L-PQG208I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $68.5 | $68,50 |
| 10 | $63.2 | $632,00 |
| 100 | $57.8 | $5.780,00 |
| 500 | $52.4 | $26.200,00 |
| 1.000 | $48.9 | $48.900,00 |
A3PE3000L-PQG208I Visão geral
A flash FPGA is a field-programmable gate array that stores its configuration in non-volatile on-chip flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, the A3PE3000L sits in the ProASIC3L family of flash FPGAs, under the broader FPGA and programmable logic device category, and functions as a single-chip system logic solution for power-sensitive designs.
Key features include FlashFreeze technology, which dynamically cuts dynamic and static power with no external components and near-instant wake-up; a 1.2 V core option that yields roughly 40% dynamic and 50% static power savings versus the standard ProASIC3 at equivalent density; single-chip operation requiring no boot PROM; and reprogrammability with security features inherent to flash-based configuration. Maximum operating frequency reaches 781.25 MHz in high-speed I/O contexts per distributor data.
The device is fabricated on a 130 nm flash process and uses a fine-grained architecture of Versatile logic elements organized into Versatile tiles, with embedded flash blocks (516 kbits) usable as dual-port SRAM or flash ROM. The low-power core variant and Power Driven Layout support in Libero SoC can deliver up to 30% additional power reduction over standard timing-driven place-and-route.
Typical applications include industrial automation controllers, portable and battery-powered instrumentation, medical monitoring equipment, and secure communications interfaces - anywhere non-volatile, single-chip logic with low static power is required. Flash configuration also eliminates configuration data readout, improving design security against cloning.
A key design consideration is thermal management: at 208-BFQFP with a plastic thermal-enhanced body, verify junction temperature stays below +100C at maximum switching activity, using ground-plane copper pour under the exposed die-attach area. Also budget the 1.14 V to 1.575 V supply window against the chosen core voltage setting.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes not found in the manufacturer datasheet, based on data verified as of 2026-09-01.
Alternativas drop-in para A3PE3000L-PQG208I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3PE3000L-PQG208I (mesmo formato e footprint) — diferindo em Package, System Gates, Operating Temperature, Family, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3PE3000-PQG208I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3PE3000-1PQG208I
✅ Drop-In✓ Em estoque
$59.9 / unidade
Ver ficha técnica →A3PE1500-PQG208I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$60.2 / unidade
Ver ficha técnica →A3P1000-2PQG208
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$65.67 / unidade
Ver ficha técnica →A3P600-PQG208I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$68.08 / unidade
Ver ficha técnica →M1AFS250-1PQG208I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$28.75 / unidade
Ver ficha técnica →A3PE3000L-PQG208I Classificações máximas e características elétricas
| Family | ProASIC3L |
| System Gates | 3000000 |
| Total RAM Bits | 516096 |
| Number of I/O | 147 |
| Supply Voltage Range | 1.14 V to 1.575 V |
| Core Voltage | 1.2 V (low-power option), 1.2 V to 1.5 V range |
| Temperatura de operação | -40C to +100C (TJ) |
| Encapsulamento | 208-BFQFP (PQFP 28x28 mm) |
| Tipo de montagem | Surface Mount |
| Technology | 130 nm flash process |
| Maximum Operating Frequency | 781.25 MHz |
| Configuration Memory | On-chip flash, single-chip (no external boot device) |
| Special Features | FlashFreeze technology, Power Driven Layout support |
| Moisture Sensitivity | MSL rated (Yes per distributor data) |
| Packaging | Tray, factory pack quantity 24 |
| Status RoHS | Lead free (per Microchip/Mouser listing of family) |
| Height | 3.4 mm |
| Length x Width | 28 mm x 28 mm |
Guia de Configuração de Pinos do A3PE3000L-PQG208I 208-bfqfp (pqfp 28x28 mm)
Configuração de pinos para A3PE3000L-PQG208I (pacote 208-bfqfp (pqfp 28x28 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3PE3000L-PQG208I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3PE3000L-PQG208I é adequado para 6 aplicaçãos: Industrial Automation Controllers, Portable and Battery-Powered Instrumentation, Medical Monitoring Equipment, Secure Communications Interfaces, Aerospace and Defense Subsystems, Test and Measurement Equipment.
Industrial Automation Controllers
The A3PE3000L-PQG208I fits industrial automation controllers that need large glueless logic integration, 516 kbits of on-chip flash for buffers and lookup tables, and reliable non-volatile configuration in electrically noisy environments. Its 147 user I/Os interface PLC backplanes, motor-control feedback, and fieldbus transceivers directly, while the industrial -40C to +100C junction rating covers cabinet temperature extremes. The 1.2 V core keeps static power low in always-on control cabinets, and single-chip flash configuration removes boot PROM components that add failure points in vibration-prone installations. Designers should budget I/O standards (3.3 V LVCMOS/LVTTL) and verify timing closure at target clock rates in Libero SoC with Power Driven Layout enabled for additional power margin.
Recomendado
Portable and Battery-Powered Instrumentation
For handheld meters, data loggers, and battery-powered test instruments, the A3PE3000L-PQG208I is attractive because its 1.2 V core cuts static power by roughly 50% versus standard ProASIC3, and FlashFreeze technology places the device in an ultra-low-power state that preserves SRAM and register state with near-instant wake-up. The single-chip flash configuration eliminates the energy and board area of a configuration PROM. The PQFP-208 package is larger than chip-scale alternatives but simplifies prototyping and rework for low-volume portable products. Battery designers should duty-cycle via the FlashFreeze pin and verify that I/O pull currents in sleep mode match sensor loading; per the Microchip datasheet, FlashFreeze operation requires no external components, simplifying the power tree.
Recomendado
Medical Monitoring Equipment
Patient monitors and diagnostic peripherals benefit from the A3PE3000L-PQG208I's combination of 3M gates for signal-conditioning state machines, 516 kbits of flash for waveform buffering, and deterministic, single-chip configuration that avoids configuration-fetch glitches during power events. The device processes ECG/SpO2 front-end streams into display interfaces over its 147 I/Os using LVCMOS and LVDS-capable banks. The low 1.2 V core reduces heat inside enclosed bedside housings, easing convection-only thermal design. Medical designers should note that flash FPGAs also improve design security because configuration memory cannot be trivially read out, protecting proprietary algorithms. Verify IEC 60601-related system isolation externally; the FPGA itself is not a safety-certified device and compliance is a system-level activity.
Recomendado
Secure Communications Interfaces
The A3PE3000L-PQG208I suits bridge and interface functions in communication equipment where configuration confidentiality matters: flash-based configuration is stored on-chip and, unlike SRAM FPGAs, is not streamed from an external memory that can be intercepted or cloned. With 3M gates, designers can implement protocol conversion, DES/AES-supporting data paths, and multi-port UART/SPI/I2C aggregation across 147 I/Os, while 516 kbits of embedded flash hold parameter tables. The industrial temperature range and robust PQFP-208 package fit telecom rack cards. Power-sensitive lines cards benefit from the 1.2 V core option. Timing closure should be verified for the target interface rates in Libero SoC, and high-speed I/O standards should respect the family's supported standards list from the ProASIC3L datasheet.
Recomendado
Aerospace and Defense Subsystems
ProASIC3L flash FPGAs are widely used in defense-grade subsystems because flash configuration resists single-event configuration upset mechanisms that affect SRAM cells, and the single-chip solution removes external configuration memory from the bill of materials. The A3PE3000L-PQG208I provides 3M gates for sensor aggregation, bus bridging (MIL-STD-1553-style interfaces implemented in fabric), and reconfigurable compute, with 516 kbits of on-chip memory. Its -40C to +100C junction range supports conduction-cooled enclosures. Note that this commercial-grade PQG208I ordering code is not radiation-tolerant; Microchip offers separate RT variants for space missions. System engineers should consult Microchip's aerospace product line for qualified equivalents and apply system-level mitigation for terrestrial high-reliability programs.
Recomendado
Test and Measurement Equipment
Bench instruments, logic analyzers, and protocol testers use the A3PE3000L-PQG208I as a flexible interconnect fabric between front-end acquisition circuitry and back-end processors. The 147 user I/Os cover channel banks and trigger lines, 516 kbits of flash memory buffers captured data, and in-field reprogrammability allows instrument feature updates after shipment - a key commercial advantage of flash FPGAs. The PQFP-208 package's 0.5 mm pitch and gull-wing leads simplify prototyping and board rework in low-volume test platforms. Timing paths for capture clocking should be constrained carefully in Libero SoC, and the 1.2 V core helps keep internal instrument temperature rise low in fanless enclosures. As of 2026-09-01, the device remains an active Microchip product with distributor stock.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3PE3000L-PQG208I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3PE3000-PQG208I | A3PE1500-PQG208I | A3P600-PQG208I | M1AFS250-1PQG208I |
|---|---|---|---|---|---|
| Package | 208-PQFP (BFQFP, 28x28 mm) | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | ~1,500,000 | 600,000 | 250,000 |
| User I/O | 147 | 147 | 147 | 147 | 147 |
| Core Voltage | 1.2 V low-power (1.14-1.575 V supply) | 1.5 V standard core | 1.5 V (non-L) | 1.5 V ProASIC3 | 1.5 V Fusion |
| FlashFreeze Technology | Yes | No (standard ProASIC3) | No | No | No (Fusion analog features instead) |
| Static Power (relative) | Baseline (~50% lower vs standard) | ~2x higher than L | Lower absolute (smaller die) | Lowest absolute (smallest die) | Low (small die + analog) |
| Family / Toolchain | ProASIC3L / Libero SoC | ProASIC3E / Libero SoC | ProASIC3E / Libero SoC | ProASIC3 / Libero SoC | Fusion / Libero SoC |
Principais diferenciais
- Low-power 1.2 V core with FlashFreeze (vs A3PE3000-PQG208I)
- Highest density in the PQFP-208 footprint within this family list (vs A3PE1500-PQG208I)
- Better density-per-cost than ProASIC3 at same footprint (vs A3P600-PQG208I)
- Pure digital flash FPGA simplicity (vs M1AFS250-1PQG208I)
Notas de projeto
Estimated: versus the standard A3PE3000 (1.5 V core), the L variant's 1.2 V core delivers roughly 40% dynamic and 50% static power savings per the Microchip ProASIC3L datasheet. Budget the 1.14 V to 1.575 V supply window against your regulator tolerance; a 1.2 V core with +/-3% regulation sits comfortably inside the window. Enable FlashFreeze for duty-cycled systems and verify wake-up latency in your state machine, since I/O states are held during FlashFreeze.
Estimated: the 208-PQFP (28x28 mm) theta_JA is typically on the order of 30-40 C/W with a solid ground-plane copper pour (consult the datasheet thermal table for the exact value). At moderate switching activity the 1.2 V core keeps dissipation low, but verify junction temperature stays under the +100C maximum with your actual toggle rates using SmartPower analysis in Libero SoC. Use at least a 4-layer stackup with a continuous ground plane beneath the die-attach area.
Do not assume bitstream or pinout portability from A3PE3000 to A3PE3000L without recompiling: while packages match, core voltage settings and I/O bank rules must be re-verified in Libero SoC. Assign configuration and JTAG pins before routing, and respect the datasheet power-up sequencing requirements for the 1.2 V core and I/O rails. Also note MSL rating: PQFP devices require proper bake/dry-pack handling before reflow.
Informações de conformidade
Lead-free per Mouser listing of the family (A3PE3000-PQG208I described as LEAD FREE). RoHS status inferred from current Microchip production; REACH and halogen-free status not stated in the provided data.
