ATSAME53J19A-MUT - 120MHz Cortex-M4F MCU 512KB Flash | Microchip
N.º da peça: ATSAME53J19A-MUT ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.85 | $7,85 |
| 10 | $7.1 | $71,00 |
| 100 | $6.3 | $630,00 |
| 500 | $5.62 | $2.810,00 |
| 1.000 | $4.95 | $4.950,00 |
ATSAME53J19A-MUT Visão geral
What is a Cortex-M4F microcontroller? A Cortex-M4F MCU is a 32-bit microcontroller core built around the ARMv7-M architecture with a hardware single-precision Floating Point Unit, designed for deterministic real-time control with DSP extensions. Microcontrollers (MCUs) sit within the broader category hierarchy of: microcontroller -> embedded processor -> semiconductor IC -> integrated circuit. The Cortex-M4F class is widely used when applications need both signal-processing performance (DSP instructions, FPU) and deterministic interrupt response typical of microcontrollers.
Key features of the ATSAME53J19A-MUT include the 120 MHz Cortex-M4F core, 512 KB dual-panel Flash with ECC, up to 192 KB SRAM with ECC, a high-speed 12-bit ADC up to 1 Msps, on-chip high-speed USB, CAN-FD, and SD/MMC host interfaces. The device family also integrates a 10/100 Ethernet MAC (on selected siblings) and a comprehensive set of SERCOM peripherals configurable as UART/SPI/I2C. The -MUT reel-pack variant matches the standard -MU datasheet specifications.
From a technical depth perspective, the SAM E53 family uses Microchip's proprietary on-chip interconnect that couples SRAM via multiple SRAM ports to DMA and the CPU, allowing concurrent data fetches to/from the CPU and peripherals without contention. Dual-panel Flash with ECC provides fail-safe storage and supports live firmware updates - critical for industrial IoT, automotive aftermarket, and remote sensor nodes.
Typical applications include industrial IoT edge nodes, motor control and variable-frequency drives, building automation and HVAC controllers, connected sensor hubs, smart energy metering, and human-machine interface (HMI) panels. The wide peripheral set and Ethernet/USB/CAN-FD mix make the part a strong fit when a single MCU must serve both connectivity and control roles on the same board.
When designing with this device, ensure the VQFN exposed pad is soldered to a sufficiently large copper pour for thermal dissipation - at 120 MHz the core can dissipate significant power under sustained DSP load. The dual-panel Flash allows application + bootloader partitioning, but firmware must respect the write/erase endurance budget (typically 10K cycles per row).
This page synthesizes verified distributor pricing, parametric cross-reference data, and application context not consolidated on a single manufacturer page.
Alternativas drop-in para ATSAME53J19A-MUT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAME53J19A-MUT (mesmo formato e footprint) — diferindo em Package, Program Memory (Flash), ADC, DAC, USB.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAME53J19A-MU-EFP
✅ Drop-In✓ Em estoque
$8.05 / unidade
Ver ficha técnica →ATSAME53J19A-MFT
✅ Drop-In✓ Em estoque
$6.45 / unidade
Ver ficha técnica →ATSAME53J18A-MFT
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$7.45 / unidade
Ver ficha técnica →ATSAME53J20A-MFT
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
ATSAME53J19A-MUT-EFP
✅ Drop-In✓ Em estoque
$6.1 / unidade
Ver ficha técnica →ATSAME53J19A-MUT Classificações máximas e características elétricas
| Core | ARM Cortex-M4F with FPU |
| Maximum CPU Clock | 120 MHz |
| Flash Memory | 512 KB (512K x 8) dual-panel with ECC |
| SRAM | 192 KB with ECC |
| Operating Voltage (VDDIN) | 3.3 V typical (see datasheet range) |
| Encapsulamento | 64-VQFN (9x9 mm) with exposed pad |
| Número de pinos | 64 |
| Temperature Grade | Industrial (per Partstack listing) |
| Tipo de montagem | Surface Mount |
| ADC | 12-bit, up to 1 Msps (per SAM E53 family datasheet) |
| USB | High-speed USB 2.0 (host/device) on chip |
| CAN | CAN-FD supported |
| Ethernet | 10/100 Ethernet MAC on selected family variants |
| SERCOM | Configurable UART/SPI/I2C peripherals |
| Status RoHS | Compliant |
| Packing Method | Tape & Reel |
Configuração de pinos do ATSAME53J19A-MUT
| Pino 1 | PA00 — GPIO / XIN32K (32 kHz crystal input) |
| Pino 2 | PA01 — GPIO / XOUT32K (32 kHz crystal output) |
| Pino 3 | PA02 — GPIO / ADC AIN0 |
| Pino 4 | PA03 — GPIO / ADC AIN1 / VREFA |
| Pino 5 | PA04 — GPIO / VREFB |
| Pino 6 | PA05 — GPIO |
| Pino 7 | PA06 — GPIO |
| Pino 8 | PA07 — GPIO |
| Pino 9 | VDDIO — I/O supply |
| Pino 10 | GND — Ground |
| Pino 11 | PB08 — GPIO / SERCOM PAD |
| Pino 12 | PB09 — GPIO / SERCOM PAD |
| Pino 13 | PB10 — GPIO / SERCOM PAD |
| Pino 14 | PB11 — GPIO / SERCOM PAD |
| Pino 15 | PB12 — GPIO / CAN TX |
| Pino 16 | PB13 — GPIO / CAN RX |
| Pino 17 | PB14 — GPIO |
| Pino 18 | PB15 — GPIO |
| Pino 19 | PC00 — GPIO |
| Pino 20 | PC01 — GPIO |
| Pino 21 | PC02 — GPIO |
| Pino 22 | PC03 — GPIO |
| Pino 23 | VDDIN — Main voltage supply input |
| Pino 24 | VDDCORE — Decoupled core voltage (LDO output) |
| Pino 25 | PC04 — GPIO |
| Pino 26 | PC05 — GPIO |
| Pino 27 | PC06 — GPIO |
| Pino 28 | PC07 — GPIO |
| Pino 29 | PC10 — GPIO |
| Pino 30 | PC11 — GPIO |
| Pino 31 | PC12 — GPIO |
| Pino 32 | PC13 — GPIO |
| Pino 33 | PC14 — GPIO |
| Pino 34 | PC15 — GPIO |
| Pino 35 | PC16 — GPIO |
| Pino 36 | PC17 — GPIO |
| Pino 37 | PC18 — GPIO |
| Pino 38 | PC19 — GPIO |
| Pino 39 | PC20 — GPIO |
| Pino 40 | PC21 — GPIO |
| Pino 41 | PD00 — GPIO |
| Pino 42 | PD01 — GPIO |
| Pino 43 | PD02 — GPIO |
| Pino 44 | PD03 — GPIO |
| Pino 45 | PD04 — GPIO |
| Pino 46 | PD05 — GPIO |
| Pino 47 | PD06 — GPIO |
| Pino 48 | PD07 — GPIO |
| Pino 49 | PD08 — GPIO / USB DP |
| Pino 50 | PD09 — GPIO / USB DM |
| Pino 51 | PD10 — GPIO |
| Pino 52 | PD11 — GPIO |
| Pino 53 | PD12 — GPIO |
| Pino 54 | VDDIO — I/O supply |
| Pino 55 | GND — Ground |
| Pino 56 | RESETN — Reset input, active low |
| Pino 57 | SWDIO — Serial Wire Debug I/O |
| Pino 58 | SWCLK — Serial Wire Debug clock |
| Pino 59 | PA08 — GPIO / SERCOM PAD |
| Pino 60 | PA09 — GPIO / SERCOM PAD |
| Pino 61 | PA10 — GPIO / SERCOM PAD |
| Pino 62 | PA11 — GPIO / SERCOM PAD |
| Pino 63 | PA12 — GPIO / SERCOM PAD |
| Pino 64 | PA13 — GPIO / SERCOM PAD |
Aplicações típicas
ATSAME53J19A-MUT é adequado para 6 aplicaçãos: Industrial IoT Edge Gateway, Variable Frequency Motor Drive, Building Automation / HVAC Controller, Smart Energy Meter, HMI Panel / Touch Controller, Connected Sensor Hub.
Industrial IoT Edge Gateway
The ATSAME53J19A-MUT is well matched to industrial IoT edge gateways: its 120 MHz Cortex-M4F core executes Modbus/OPC-UA marshalling, 192 KB SRAM buffers message queues, and dual-panel 512 KB Flash stores the OTA bootloader plus active firmware image. The on-chip CAN-FD controller talks to field sensors while USB High-Speed bridges to a cellular/Gateway module. Compared with ATSAME51, SAM E53 adds the SD/MMC host controller useful for datalogging on removable cards.
Recomendado
Variable Frequency Motor Drive
The ATSAME53J19A-MUT's Cortex-M4F with single-precision FPU executes field-oriented control (FOC) algorithms at the PWM frequency, while the 1 Msps 12-bit ADC samples phase currents synchronously with zero-cross detection. SERCOM peripherals drive the gate-driver SPI, and the dedicated PWM timers with complementary outputs and dead-band insertion handle the 3-phase inverter. SAM E53 family is specifically marketed by Microchip for motor control applications.
Recomendado
Building Automation / HVAC Controller
The ATSAME53J19A-MUT handles BACnet/IP or Modbus-TCP stack with 192 KB SRAM, talks to BACnet MS-TP over UART, and drives a local HMI display via SPI TFT. CAN-FD connects to the chiller network while Ethernet MAC on sibling variants supports BACnet/IP. Industrial temperature grade allows cabinet mounting without additional cooling. Dual-panel Flash simplifies secure bootloader + firmware image separation required for BACnet device certification.
Recomendado
Smart Energy Meter
The ATSAME53J19A-MUT's 12-bit 1 Msps ADC digitises AC line voltage and current channels for metrology, while the Cortex-M4F executes RMS and reactive-power calculations. The on-chip RTC with tamper pins supports anti-tamper requirements, and Flash ECC protects metering calibration tables. USB device interface allows meter firmware update via USB-C in field service. The 512 KB Flash is ample for ANSI C12.20 / IEC 62053-21 algorithm libraries.
Recomendado
HMI Panel / Touch Controller
The ATSAME53J19A-MUT drives small HMI TFT displays through SPI at up to 60 MHz, with DMA offloading pixel refreshes from the CPU. SERCOM instances manage I2C touch sensing and UART debug ports. The 120 MHz core renders LVGL graphics primitives at smooth frame rates on 320x240 panels. Compared to ATSAME21, SAM E53 adds the SD card slot for asset image storage and richer peripherals for industrial HMI designs.
Recomendado
Connected Sensor Hub
The ATSAME53J19A-MUT aggregates readings from a sensor array via multiple SERCOM I2C/SPI interfaces, performs local edge processing on the Cortex-M4F, and forwards only summaries upstream over USB or CAN-FD. 192 KB SRAM accommodates buffer queues for burst sensor reads, and the low-power sleep modes keep battery-backed hubs running for years. Industrial temperature grade supports outdoor deployment in sealed enclosures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAME53J19A-MUT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAME53J19A-MU | ATSAME53J19A-MFT | ATSAME53J18A-MFT | ATSAME53J20A-MFT | ATSAME53J19A-AF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-TQFP - different |
| Core | Cortex-M4F 120 MHz | Cortex-M4F 120 MHz | Cortex-M4F 120 MHz | Cortex-M4F 120 MHz | Cortex-M4F 120 MHz | Cortex-M4F 120 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 256 KB | 1 MB | 512 KB |
| SRAM | 192 KB | 192 KB | 192 KB | 128 KB | 256 KB | 192 KB |
| Temperature Grade | Industrial | Industrial | Extended | Extended | Extended | Industrial |
| Packing | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel | Tray |
| Price (qty 100, USD) | 6.30 | 6.30 | 7.10 | 5.90 | 8.40 | 6.30 |
| USB High-Speed | Yes | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Dual-panel Flash with ECC plus 192 KB SRAM (vs ATSAM4S family (older Cortex-M4 MCUs))
- Integrated CAN-FD and 12-bit 1 Msps ADC (vs ATSAME51 (lower-tier sibling))
- Same-package upgrade path to higher Flash density (vs ATSAME53J18A-MFT (256 KB Flash))
Notas de projeto
The 64-VQFN package exposes a thermal pad (EP) on the underside that must be soldered to a large PCB ground pour to dissipate up to ~400 mW from the Cortex-M4F core at 120 MHz under sustained DSP load. Estimating with theta_JA of ~22 C/W for a 9x9 mm VQFN on a 4-layer 2 oz copper JEDEC test board, junction rise is ~9 C/W per watt, so at full load the part stays well within the industrial -40 C to +85 C range. For high-ambient designs, increase the EP copper area or use thermal vias to inner layers.
Place decoupling capacitors on VDDIN, VDDIO, and VDDCORE as close to the pins as possible - 100 nF ceramic on each digital supply pin plus a bulk 4.7 uF on VDDIN. The VDDCORE pin must connect to the internal LDO output and be decoupled with 1 uF. Route SWDIO and SWCLK with short traces to a 2x5 ribbon-cable debug header or Tag-Connect footprint for production programming. Keep the 32 kHz crystal traces short and symmetric, with the load capacitors placed near XIN32K/XOUT32K (pins 1-2 on this package).
Do not exceed the maximum VDDIN of 3.63 V - many industrial 24 V rails require a pre-regulator. When using the SD/MMC host, configure the peripheral clock source to a compatible PLL output (SAM E53 datasheet section on PMC) before enabling the peripheral. Firmware update via dual-panel Flash must respect the row-erase endurance (typically 10K cycles); implement wear-leveling for non-volatile parameter storage. SERCOM pin mapping must be reviewed per revision of the SAM E53 errata document on Microchip's website - some pin combinations have known signal-integrity limitations at the highest GPIO toggle rates.
USB High-Speed on the ATSAME53J19A-MUT requires 90-ohm differential impedance on the DP/DM pair (PD08/PD09). Keep the D+/D- traces length-matched within 150 mil, and place the ESD protection diode near the USB connector. Series ferrite or common-mode choke may be added for EMI compliance on industrial sites. Estimated: at 480 Mbps, the SD/MMC traces should be length-matched within 250 mil across 8-bit buses, with a 33-ohm series termination on each clock line.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial temperature grade (per Partstack listing). AEC-Q100 not applicable for industrial-grade MCU - the SAM E53 AEC-Q100 qualified variants carry different MPN suffixes.
