ATSAME53N20A-AF - 120MHz Cortex-M4F MCU 1MB Flash | Microchip
N.º da peça: ATSAME53N20A-AF ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.25 | $112,50 |
| 100 | $9.95 | $995,00 |
| 500 | $8.9 | $4.450,00 |
| 1.000 | $8.2 | $8.200,00 |
ATSAME53N20A-AF Visão geral
An ARM Cortex-M4F microcontroller is a 32-bit processor core based on the ARMv7-M architecture, augmented with a single-precision FPU, DSP extensions, and a Memory Protection Unit (MPU). Microcontrollers sit below microprocessors in the embedded compute hierarchy: a microcontroller integrates CPU, non-volatile memory, RAM, and peripherals on a single die, while a microprocessor requires external memory and I/O controllers. The Cortex-M4F class targets deterministic real-time control with hardware floating-point acceleration, bridging the gap between 8/16-bit MCU efficiency and application-processor throughput.
Key features of the ATSAME53N20A-AF include: up to 120 MHz core clock, 1 MB Dual-Panel Flash (allowing live firmware update with zero downtime), 256 KB SRAM, hardware AES and True Random Number Generator (TRNG) for security, a 12-bit 1 Msps ADC with up to 32 channels, two 12-bit DACs, and a high-speed USB 2.0 Full-Speed interface plus a 10/100 Mbps Ethernet MAC with IEEE 1588 PTP timestamping support. Operating voltage spans 2.7 V to 3.6 V with an extended industrial temperature range.
Architecturally the device pairs the Cortex-M4F core with a multi-layer AHB/APB bus matrix, dual-bank Flash for safe over-the-air updates, and a Peripheral Touch Controller (PTC) supporting capacitive touch sensing. The Dual-Panel Flash layout lets developers keep one panel in read mode while the other is reprogrammed, eliminating the boot-time gap that single-bank flash parts incur during firmware upgrades. The integrated Ethernet MAC plus USB and a SERCOM-based flexible serial engine (UART/SPI/I2C/RS-485) eliminates the need for external connectivity ICs in many gateway designs.
Typical applications include industrial IoT gateways with Ethernet, building-automation controllers with secure remote firmware updates, USB-based human-machine interface (HMI) panels, motor-control and BLDC drives (using the PWM timers and analog comparators), and secure connected sensors with on-chip AES. The 100-pin TQFP package provides enough I/O for color TFT displays and multi-channel analog front ends.
When designing with the ATSAME53N20A-AF, ensure your linker script reserves the upper flash panel for a bootloader and the lower panel for application code so you can leverage Dual-Panel Flash for fail-safe firmware updates. Use the on-chip 48 MHz DFLL with the 32.768 kHz crystal reference for jitter-sensitive USB Full-Speed and Ethernet timing, and place the decoupling network within 5 mm of every VDD pin.
Alternativas drop-in para ATSAME53N20A-AF — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAME53N20A-AF (mesmo formato e footprint) — diferindo em Operating Temperature, SRAM, USB, Core Architecture, DAC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAME53N20A-AU
✅ Drop-In✓ Em estoque
$10.3 / unidade
Ver ficha técnica →ATSAME53N20A-AFT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAME53N19A-AU
✅ Drop-In✓ Em estoque
$5.4 / unidade
Ver ficha técnica →ATSAME53J19A-AF
✅ Drop-In✓ Em estoque
$5.9 / unidade
Ver ficha técnica →ATSAME51N20A-AU-EFP
✅ Drop-In✓ Em estoque
$8.1 / unidade
Ver ficha técnica →ATSAMD51N20A-AF
✅ Drop-In✓ Em estoque
$6.84 / unidade
Ver ficha técnica →ATSAMD51N20A-AU
✅ Drop-In✓ Em estoque
$8.49 / unidade
Ver ficha técnica →ATSAME53N20A-AF Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M4F (32-bit, with FPU) |
| Maximum CPU Clock | 120 MHz |
| Program Memory (Flash) | 1 MB (1024 KB), Dual-Panel with ECC |
| SRAM | 256 KB with ECC |
| Encapsulamento | 100-pin TQFP (14x14 mm) |
| Operating Voltage | 2.7 V to 3.6 V |
| Temperatura de operação | -40C to +125C (Extended Industrial) |
| ADC | 12-bit, up to 1 Msps, up to 32 channels |
| DAC | 2x 12-bit |
| Analog Comparators | Yes (on-chip) |
| USB | USB 2.0 Full-Speed Device/Host |
| Ethernet MAC | 10/100 Mbps with IEEE 1588 PTP |
| Hardware Crypto | AES and True Random Number Generator (TRNG) |
| Peripheral Touch Controller | PTC for capacitive touch |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do ATSAME53N20A-AF
| Pino 1 | PA00 — General-purpose I/O, EIC EXTINT[0], ADC AIN[0] |
| Pino 2 | PA01 — General-purpose I/O, EIC EXTINT[1], ADC AIN[1] |
| Pino 3 | PA02 — General-purpose I/O, EIC EXTINT[2], ADC AIN[2] |
| Pino 4 | PA03 — General-purpose I/O, EIC EXTINT[3], ADC AIN[3] |
| Pino 5 | VDD — Digital supply voltage |
| Pino 6 | VSS — Digital ground |
| Pino 7 | PA04 — General-purpose I/O, VREF, ADC AIN[4] |
| Pino 8 | PA05 — General-purpose I/O, ADC AIN[5] |
| Pino 9 | PA06 — General-purpose I/O, ADC AIN[6] |
| Pino 10 | PA07 — General-purpose I/O, ADC AIN[7] |
| Pino 11 | VDD — Digital supply voltage |
| Pino 12 | VSS — Digital ground |
| Pino 13 | PA08 — General-purpose I/O, SERCOM0 PAD[0], I2S SCK |
| Pino 14 | PA09 — General-purpose I/O, SERCOM0 PAD[1], I2S MCK |
| Pino 15 | PA10 — General-purpose I/O, SERCOM0 PAD[2], I2S FS |
| Pino 16 | PA11 — General-purpose I/O, SERCOM0 PAD[3], I2S SDO |
| Pino 17 | VDD — Digital supply voltage |
| Pino 18 | VSS — Digital ground |
| Pino 19 | PB10 — General-purpose I/O, SERCOM4 PAD[2] |
| Pino 20 | PB11 — General-purpose I/O, SERCOM4 PAD[3] |
| Pino 21 | PA12 — General-purpose I/O, SERCOM2 PAD[0] |
| Pino 22 | PA13 — General-purpose I/O, SERCOM2 PAD[1] |
| Pino 23 | PA14 — General-purpose I/O, SERCOM2 PAD[2] |
| Pino 24 | PA15 — General-purpose I/O, SERCOM2 PAD[3] |
| Pino 25 | PA16 — General-purpose I/O, SERCOM1 PAD[0], I2S SDI |
| Pino 26 | PA17 — General-purpose I/O, SERCOM1 PAD[1] |
| Pino 27 | PA18 — General-purpose I/O, SERCOM1 PAD[2] |
| Pino 28 | PA19 — General-purpose I/O, SERCOM1 PAD[3] |
| Pino 29 | PA20 — General-purpose I/O, SERCOM5 PAD[2] |
| Pino 30 | PA21 — General-purpose I/O, SERCOM5 PAD[3] |
| Pino 31 | VDD — Digital supply voltage |
| Pino 32 | VSS — Digital ground |
| Pino 33 | PA22 — General-purpose I/O, SERCOM3 PAD[0] |
| Pino 34 | PA23 — General-purpose I/O, SERCOM3 PAD[1] |
| Pino 35 | PA24 — General-purpose I/O, SERCOM3 PAD[2] |
| Pino 36 | PA25 — General-purpose I/O, SERCOM3 PAD[3] |
| Pino 37 | PB22 — General-purpose I/O, SERCOM7 PAD[2] |
| Pino 38 | PB23 — General-purpose I/O, SERCOM7 PAD[3] |
| Pino 39 | PA27 — General-purpose I/O |
| Pino 40 | PA28 — General-purpose I/O |
| Pino 41 | NC — Not connected (per datasheet) |
| Pino 42 | NC — Not connected (per datasheet) |
| Pino 43 | NC — Not connected (per datasheet) |
| Pino 44 | VDD — Digital supply voltage |
| Pino 45 | VSS — Digital ground |
| Pino 46 | PB00 — General-purpose I/O |
| Pino 47 | PB01 — General-purpose I/O |
| Pino 48 | PB02 — General-purpose I/O, ADC AIN[14] |
| Pino 49 | PB03 — General-purpose I/O, ADC AIN[15] |
| Pino 50 | NC — Not connected (per datasheet) |
| Pino 51 | NC — Not connected (per datasheet) |
| Pino 52 | NC — Not connected (per datasheet) |
| Pino 53 | NC — Not connected (per datasheet) |
| Pino 54 | VDDC — Core voltage decoupling |
| Pino 55 | VSS — Digital ground |
| Pino 56 | PB04 — General-purpose I/O, ADC AIN[6] (instance B) |
| Pino 57 | PB05 — General-purpose I/O, ADC AIN[7] (instance B) |
| Pino 58 | PB06 — General-purpose I/O |
| Pino 59 | PB07 — General-purpose I/O |
| Pino 60 | PB08 — General-purpose I/O |
| Pino 61 | PB09 — General-purpose I/O |
| Pino 62 | PA30 — General-purpose I/O |
| Pino 63 | PA31 — General-purpose I/O |
| Pino 64 | NC — Not connected (per datasheet) |
| Pino 65 | NC — Not connected (per datasheet) |
| Pino 66 | VDD — Digital supply voltage |
| Pino 67 | VSS — Digital ground |
| Pino 68 | PB12 — General-purpose I/O, SERCOM4 PAD[0] |
| Pino 69 | PB13 — General-purpose I/O, SERCOM4 PAD[1] |
| Pino 70 | PB14 — General-purpose I/O, SERCOM4 PAD[2] |
| Pino 71 | PB15 — General-purpose I/O, SERCOM4 PAD[3] |
| Pino 72 | PD00 — General-purpose I/O |
| Pino 73 | PD01 — General-purpose I/O |
| Pino 74 | NC — Not connected (per datasheet) |
| Pino 75 | NC — Not connected (per datasheet) |
| Pino 76 | VDD — Digital supply voltage |
| Pino 77 | VSS — Digital ground |
| Pino 78 | PB16 — General-purpose I/O, SERCOM5 PAD[0] |
| Pino 79 | PB17 — General-purpose I/O, SERCOM5 PAD[1] |
| Pino 80 | PB18 — General-purpose I/O |
| Pino 81 | PB19 — General-purpose I/O |
| Pino 82 | PB20 — General-purpose I/O |
| Pino 83 | PB21 — General-purpose I/O |
| Pino 84 | PD08 — General-purpose I/O |
| Pino 85 | PD09 — General-purpose I/O |
| Pino 86 | PD10 — General-purpose I/O |
| Pino 87 | PD11 — General-purpose I/O |
| Pino 88 | PD12 — General-purpose I/O |
| Pino 89 | NC — Not connected (per datasheet) |
| Pino 90 | NC — Not connected (per datasheet) |
| Pino 91 | VDD — Digital supply voltage |
| Pino 92 | VSS — Digital ground |
| Pino 93 | PC00 — General-purpose I/O |
| Pino 94 | PC01 — General-purpose I/O |
| Pino 95 | PC02 — General-purpose I/O |
| Pino 96 | PC03 — General-purpose I/O |
| Pino 97 | PC04 — General-purpose I/O |
| Pino 98 | PC05 — General-purpose I/O |
| Pino 99 | PC06 — General-purpose I/O |
| Pino 100 | PC07 — General-purpose I/O |
Aplicações típicas
ATSAME53N20A-AF é adequado para 6 aplicaçãos: Industrial IoT Gateway with Ethernet, Secure Building Automation Controller, USB Human-Machine Interface (HMI) Panel, BLDC Motor Control Drive, Secure Connected Sensor Node, Capacitive Touch Control Panel.
Industrial IoT Gateway with Ethernet
The ATSAME53N20A-AF is a strong fit for industrial IoT gateways because its integrated 10/100 Ethernet MAC with IEEE 1588 PTP hardware timestamping eliminates the need for an external network processor, while 1 MB of Dual-Panel Flash supports fail-safe OTA firmware updates with zero downtime. Placed between an external LAN8720A or KSZ8081 PHY and the field sensors, the ATSAME53N20A-AF runs an lwIP or Harmony Net TCP/IP stack at 120 MHz with hardware AES encryption for TLS sessions. The 256 KB SRAM with ECC is large enough to hold full TLS handshake buffers plus an MQTT client queue, and the 12-bit ADC samples analog process variables without an external converter.
Recomendado
Secure Building Automation Controller
For building-automation controllers the ATSAME53N20A-AF combines hardware AES, TRNG, USB Full-Speed, and 100-pin TQFP I/O expansion in a single part, replacing a discrete MCU plus crypto chip plus connectivity MCU. The Cortex-M4F runs BACnet or Modbus stacks while the AES engine handles TLS 1.2 sessions to the cloud; the TRNG provides non-deterministic seeds for key generation. The 12-bit ADC reads thermistor and occupancy-sensor analog inputs, and the Peripheral Touch Controller drives the front-panel capacitive buttons.
Recomendado
USB Human-Machine Interface (HMI) Panel
The ATSAME53N20A-AF is well-suited to USB HMI panels because its on-chip USB 2.0 Full-Speed PHY removes the external PHY BOM, while the 120 MHz Cortex-M4F drives a TFT color display via the parallel EBI and renders GUI pages from a serial flash asset library. Dual-Panel Flash lets the panel bootloader field-upgrade the UI firmware without disconnecting the host. The two 12-bit DACs provide audio feedback tones without an external codec, and the 256 KB SRAM buffers font glyphs and frame compression assets.
Recomendado
BLDC Motor Control Drive
The ATSAME53N20A-AF drives BLDC and PMSM motors through its 16-bit PWM timers, three on-chip analog comparators for back-EMF zero-crossing detection, and the Cortex-M4F FPU which runs field-oriented-control loops in hardware single-precision. The 12-bit ADC samples phase currents at 1 Msps with hardware oversampling for current-loop bandwidth above 20 kHz. The 100-pin TQFP package exposes enough I/O for Hall sensors, encoder quadrature inputs, and a CAN-FD interface to the higher-level vehicle or robot controller.
Recomendado
Secure Connected Sensor Node
For secure connected sensor nodes the ATSAME53N20A-AF provides hardware AES for TLS handshakes, a TRNG for non-deterministic key generation, and a low-power Sleep mode that drops the Cortex-M4F clock to conserve battery. The 12-bit ADC at 1 Msps oversamples environmental data for averaging while the Cortex-M4F runs encryption in parallel. Dual-Panel Flash enables field firmware updates over the air while keeping the previous firmware image recoverable, eliminating bricking risk.
Recomendado
Capacitive Touch Control Panel
The ATSAME53N20A-AF integrates the Peripheral Touch Controller for self-capacitance and mutual-capacitance touch sensing, supporting up to 32 touch buttons or a small slider/wheel without an external touch IC. The 12-bit ADC is reused for proximity sensing and water-immune touch calibration. The 120 MHz Cortex-M4F handles touch-event post-processing while the AES engine secures configuration commands received over USB or Ethernet, making it well suited to kitchen-appliance and industrial control-panel front panels.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAME53N20A-AF — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAME53N20A-AU | ATSAME53N20A-AFT | ATSAME53N19A-AU | ATSAME53J19A-AF | ATSAME51N20A-AU | ATSAMD51N20A-AF | ATSAMD51N20A-AU |
|---|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TQFP (14x14) | 100-TQFP (14x14) | 100-TQFP (14x14) | 100-TQFP (14x14) | 100-TQFP (14x14) | 100-TQFP (14x14) | 100-TQFP (14x14) | 100-TQFP (14x14) |
| Core | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 48 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 512 KB | 512 KB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 192 KB | 192 KB | 256 KB | 256 KB | 256 KB |
| Ethernet MAC | Yes (10/100 + IEEE 1588) | Yes (10/100 + IEEE 1588) | Yes (10/100 + IEEE 1588) | Yes (10/100 + IEEE 1588) | No | No | No | No |
| USB | USB 2.0 Full-Speed (Host+Device) | USB 2.0 Full-Speed (Host+Device) | USB 2.0 Full-Speed (Host+Device) | USB 2.0 Full-Speed (Host+Device) | USB 2.0 Full-Speed (Host+Device) | USB 2.0 Full-Speed (Host+Device) | USB 2.0 Full-Speed (Host+Device) | USB 2.0 Full-Speed (Host+Device) |
| Hardware AES | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| ADC | 12-bit, 1 Msps, up to 32 ch | 12-bit, 1 Msps, up to 32 ch | 12-bit, 1 Msps, up to 32 ch | 12-bit, 1 Msps, up to 32 ch | 12-bit, 1 Msps, up to 32 ch | 12-bit, 1 Msps, up to 32 ch | 12-bit, 1 Msps, up to 32 ch | 12-bit, 1 Msps, up to 32 ch |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +85C |
Principais diferenciais
- Integrated 10/100 Ethernet MAC with IEEE 1588 PTP (vs ATSAMD51N20A-AF)
- Dual-Panel Flash for live OTA updates (vs ATSAME53N19A-AU)
- 120 MHz operation in TQFP-100 (vs ATSAME53J19A-AF)
Notas de projeto
The ATSAME53N20A-AF requires a clean 3.3 V supply with bulk capacitance of at least 4.7 uF within 5 mm of each VDD pin, plus 100 nF ceramic decoupling on every VDD/VSS pair. The on-chip DCDC converter must have its LC filter populated per the SAM E53 reference design; failure to do so causes core voltage noise that manifests as USB enumeration failures and ADC jitter. Estimated: a design with all 11 VDD pins decoupled by 100 nF + 4.7 uF bulk will hold VDD ripple below 50 mVpp at full 120 MHz operation.
Place the 32.768 kHz crystal within 3 mm of XIN32/XOUT32 with a ground guard ring, and route the 12 MHz main crystal traces symmetrically with matched trace lengths to avoid duty-cycle distortion. The Ethernet PHY MDI traces to the magnetics must be 100-ohm differential with no splits, and the USB DP/DM traces must be 90-ohm differential with no via stubs. Estimated: a 4-layer PCB with 1 oz copper and proper ground pour will keep junction temperature rise below 30 C at full industrial load.
Do not boot the SAM E53 from SPI flash without first configuring the BOOTPROT fuse, otherwise the ROM bootloader will not load application code and the part will appear dead. When using Dual-Panel Flash for OTA, ensure both panels are configured with the same size in the NVMCTRL controller or writes will silently corrupt the panel boundary. Use the on-chip temperature sensor to verify junction temperature stays within -40C to +125C; thermal shutdown does not reset the part, so application software must poll the sensor and throttle clocks.
Informações de conformidade
RoHS and REACH compliance per Microchip product page. AEC-Q100 automotive qualification is not claimed for the standard -AF variant; AEC-Q100 qualified SAM E53 parts use the -AF-VAO or similar suffix. Halogen-free status not specified in provided data.
