ATSAME53N20A-AF - 120MHz Cortex-M4F MCU 1MB Flash | Microchip
부품 번호: ATSAME53N20A-AF ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.25 | $112.50 |
| 100 | $9.95 | $995.00 |
| 500 | $8.9 | $4,450.00 |
| 1,000 | $8.2 | $8,200.00 |
ATSAME53N20A-AF 개요
An ARM Cortex-M4F microcontroller is a 32-bit processor core based on the ARMv7-M architecture, augmented with a single-precision FPU, DSP extensions, and a Memory Protection Unit (MPU). Microcontrollers sit below microprocessors in the embedded compute hierarchy: a microcontroller integrates CPU, non-volatile memory, RAM, and peripherals on a single die, while a microprocessor requires external memory and I/O controllers. The Cortex-M4F class targets deterministic real-time control with hardware floating-point acceleration, bridging the gap between 8/16-bit MCU efficiency and application-processor throughput.
Key features of the ATSAME53N20A-AF include: up to 120 MHz core clock, 1 MB Dual-Panel Flash (allowing live firmware update with zero downtime), 256 KB SRAM, hardware AES and True Random Number Generator (TRNG) for security, a 12-bit 1 Msps ADC with up to 32 channels, two 12-bit DACs, and a high-speed USB 2.0 Full-Speed interface plus a 10/100 Mbps Ethernet MAC with IEEE 1588 PTP timestamping support. Operating voltage spans 2.7 V to 3.6 V with an extended industrial temperature range.
Architecturally the device pairs the Cortex-M4F core with a multi-layer AHB/APB bus matrix, dual-bank Flash for safe over-the-air updates, and a Peripheral Touch Controller (PTC) supporting capacitive touch sensing. The Dual-Panel Flash layout lets developers keep one panel in read mode while the other is reprogrammed, eliminating the boot-time gap that single-bank flash parts incur during firmware upgrades. The integrated Ethernet MAC plus USB and a SERCOM-based flexible serial engine (UART/SPI/I2C/RS-485) eliminates the need for external connectivity ICs in many gateway designs.
Typical applications include industrial IoT gateways with Ethernet, building-automation controllers with secure remote firmware updates, USB-based human-machine interface (HMI) panels, motor-control and BLDC drives (using the PWM timers and analog comparators), and secure connected sensors with on-chip AES. The 100-pin TQFP package provides enough I/O for color TFT displays and multi-channel analog front ends.
When designing with the ATSAME53N20A-AF, ensure your linker script reserves the upper flash panel for a bootloader and the lower panel for application code so you can leverage Dual-Panel Flash for fail-safe firmware updates. Use the on-chip 48 MHz DFLL with the 32.768 kHz crystal reference for jitter-sensitive USB Full-Speed and Ethernet timing, and place the decoupling network within 5 mm of every VDD pin.
드롭인 대체품: ATSAME53N20A-AF — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAME53N20A-AF (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, SRAM, USB, Core Architecture, DAC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAME53N20A-AU
✅ 드롭인✓ 재고 있음
$10.3 / 개
데이터시트 보기 →ATSAME53N20A-AFT
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAME53N19A-AU
✅ 드롭인✓ 재고 있음
$5.4 / 개
데이터시트 보기 →ATSAME53J19A-AF
✅ 드롭인✓ 재고 있음
$5.9 / 개
데이터시트 보기 →ATSAME51N20A-AU-EFP
✅ 드롭인✓ 재고 있음
$8.1 / 개
데이터시트 보기 →ATSAMD51N20A-AF
✅ 드롭인✓ 재고 있음
$6.84 / 개
데이터시트 보기 →ATSAMD51N20A-AU
✅ 드롭인✓ 재고 있음
$8.49 / 개
데이터시트 보기 →ATSAME53N20A-AF 최대 정격 & 전기적 특성
| Core Architecture | ARM Cortex-M4F (32-bit, with FPU) |
| Maximum CPU Clock | 120 MHz |
| Program Memory (Flash) | 1 MB (1024 KB), Dual-Panel with ECC |
| SRAM | 256 KB with ECC |
| 패키지 | 100-pin TQFP (14x14 mm) |
| Operating Voltage | 2.7 V to 3.6 V |
| 동작 온도 | -40C to +125C (Extended Industrial) |
| ADC | 12-bit, up to 1 Msps, up to 32 channels |
| DAC | 2x 12-bit |
| Analog Comparators | Yes (on-chip) |
| USB | USB 2.0 Full-Speed Device/Host |
| Ethernet MAC | 10/100 Mbps with IEEE 1588 PTP |
| Hardware Crypto | AES and True Random Number Generator (TRNG) |
| Peripheral Touch Controller | PTC for capacitive touch |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
ATSAME53N20A-AF 핀 구성
| 핀 1 | PA00 — General-purpose I/O, EIC EXTINT[0], ADC AIN[0] |
| 핀 2 | PA01 — General-purpose I/O, EIC EXTINT[1], ADC AIN[1] |
| 핀 3 | PA02 — General-purpose I/O, EIC EXTINT[2], ADC AIN[2] |
| 핀 4 | PA03 — General-purpose I/O, EIC EXTINT[3], ADC AIN[3] |
| 핀 5 | VDD — Digital supply voltage |
| 핀 6 | VSS — Digital ground |
| 핀 7 | PA04 — General-purpose I/O, VREF, ADC AIN[4] |
| 핀 8 | PA05 — General-purpose I/O, ADC AIN[5] |
| 핀 9 | PA06 — General-purpose I/O, ADC AIN[6] |
| 핀 10 | PA07 — General-purpose I/O, ADC AIN[7] |
| 핀 11 | VDD — Digital supply voltage |
| 핀 12 | VSS — Digital ground |
| 핀 13 | PA08 — General-purpose I/O, SERCOM0 PAD[0], I2S SCK |
| 핀 14 | PA09 — General-purpose I/O, SERCOM0 PAD[1], I2S MCK |
| 핀 15 | PA10 — General-purpose I/O, SERCOM0 PAD[2], I2S FS |
| 핀 16 | PA11 — General-purpose I/O, SERCOM0 PAD[3], I2S SDO |
| 핀 17 | VDD — Digital supply voltage |
| 핀 18 | VSS — Digital ground |
| 핀 19 | PB10 — General-purpose I/O, SERCOM4 PAD[2] |
| 핀 20 | PB11 — General-purpose I/O, SERCOM4 PAD[3] |
| 핀 21 | PA12 — General-purpose I/O, SERCOM2 PAD[0] |
| 핀 22 | PA13 — General-purpose I/O, SERCOM2 PAD[1] |
| 핀 23 | PA14 — General-purpose I/O, SERCOM2 PAD[2] |
| 핀 24 | PA15 — General-purpose I/O, SERCOM2 PAD[3] |
| 핀 25 | PA16 — General-purpose I/O, SERCOM1 PAD[0], I2S SDI |
| 핀 26 | PA17 — General-purpose I/O, SERCOM1 PAD[1] |
| 핀 27 | PA18 — General-purpose I/O, SERCOM1 PAD[2] |
| 핀 28 | PA19 — General-purpose I/O, SERCOM1 PAD[3] |
| 핀 29 | PA20 — General-purpose I/O, SERCOM5 PAD[2] |
| 핀 30 | PA21 — General-purpose I/O, SERCOM5 PAD[3] |
| 핀 31 | VDD — Digital supply voltage |
| 핀 32 | VSS — Digital ground |
| 핀 33 | PA22 — General-purpose I/O, SERCOM3 PAD[0] |
| 핀 34 | PA23 — General-purpose I/O, SERCOM3 PAD[1] |
| 핀 35 | PA24 — General-purpose I/O, SERCOM3 PAD[2] |
| 핀 36 | PA25 — General-purpose I/O, SERCOM3 PAD[3] |
| 핀 37 | PB22 — General-purpose I/O, SERCOM7 PAD[2] |
| 핀 38 | PB23 — General-purpose I/O, SERCOM7 PAD[3] |
| 핀 39 | PA27 — General-purpose I/O |
| 핀 40 | PA28 — General-purpose I/O |
| 핀 41 | NC — Not connected (per datasheet) |
| 핀 42 | NC — Not connected (per datasheet) |
| 핀 43 | NC — Not connected (per datasheet) |
| 핀 44 | VDD — Digital supply voltage |
| 핀 45 | VSS — Digital ground |
| 핀 46 | PB00 — General-purpose I/O |
| 핀 47 | PB01 — General-purpose I/O |
| 핀 48 | PB02 — General-purpose I/O, ADC AIN[14] |
| 핀 49 | PB03 — General-purpose I/O, ADC AIN[15] |
| 핀 50 | NC — Not connected (per datasheet) |
| 핀 51 | NC — Not connected (per datasheet) |
| 핀 52 | NC — Not connected (per datasheet) |
| 핀 53 | NC — Not connected (per datasheet) |
| 핀 54 | VDDC — Core voltage decoupling |
| 핀 55 | VSS — Digital ground |
| 핀 56 | PB04 — General-purpose I/O, ADC AIN[6] (instance B) |
| 핀 57 | PB05 — General-purpose I/O, ADC AIN[7] (instance B) |
| 핀 58 | PB06 — General-purpose I/O |
| 핀 59 | PB07 — General-purpose I/O |
| 핀 60 | PB08 — General-purpose I/O |
| 핀 61 | PB09 — General-purpose I/O |
| 핀 62 | PA30 — General-purpose I/O |
| 핀 63 | PA31 — General-purpose I/O |
| 핀 64 | NC — Not connected (per datasheet) |
| 핀 65 | NC — Not connected (per datasheet) |
| 핀 66 | VDD — Digital supply voltage |
| 핀 67 | VSS — Digital ground |
| 핀 68 | PB12 — General-purpose I/O, SERCOM4 PAD[0] |
| 핀 69 | PB13 — General-purpose I/O, SERCOM4 PAD[1] |
| 핀 70 | PB14 — General-purpose I/O, SERCOM4 PAD[2] |
| 핀 71 | PB15 — General-purpose I/O, SERCOM4 PAD[3] |
| 핀 72 | PD00 — General-purpose I/O |
| 핀 73 | PD01 — General-purpose I/O |
| 핀 74 | NC — Not connected (per datasheet) |
| 핀 75 | NC — Not connected (per datasheet) |
| 핀 76 | VDD — Digital supply voltage |
| 핀 77 | VSS — Digital ground |
| 핀 78 | PB16 — General-purpose I/O, SERCOM5 PAD[0] |
| 핀 79 | PB17 — General-purpose I/O, SERCOM5 PAD[1] |
| 핀 80 | PB18 — General-purpose I/O |
| 핀 81 | PB19 — General-purpose I/O |
| 핀 82 | PB20 — General-purpose I/O |
| 핀 83 | PB21 — General-purpose I/O |
| 핀 84 | PD08 — General-purpose I/O |
| 핀 85 | PD09 — General-purpose I/O |
| 핀 86 | PD10 — General-purpose I/O |
| 핀 87 | PD11 — General-purpose I/O |
| 핀 88 | PD12 — General-purpose I/O |
| 핀 89 | NC — Not connected (per datasheet) |
| 핀 90 | NC — Not connected (per datasheet) |
| 핀 91 | VDD — Digital supply voltage |
| 핀 92 | VSS — Digital ground |
| 핀 93 | PC00 — General-purpose I/O |
| 핀 94 | PC01 — General-purpose I/O |
| 핀 95 | PC02 — General-purpose I/O |
| 핀 96 | PC03 — General-purpose I/O |
| 핀 97 | PC04 — General-purpose I/O |
| 핀 98 | PC05 — General-purpose I/O |
| 핀 99 | PC06 — General-purpose I/O |
| 핀 100 | PC07 — General-purpose I/O |
일반적인 애플리케이션
ATSAME53N20A-AF 적합 용도: 6 애플리케이션s: Industrial IoT Gateway with Ethernet, Secure Building Automation Controller, USB Human-Machine Interface (HMI) Panel, BLDC Motor Control Drive, Secure Connected Sensor Node, Capacitive Touch Control Panel.
Industrial IoT Gateway with Ethernet
The ATSAME53N20A-AF is a strong fit for industrial IoT gateways because its integrated 10/100 Ethernet MAC with IEEE 1588 PTP hardware timestamping eliminates the need for an external network processor, while 1 MB of Dual-Panel Flash supports fail-safe OTA firmware updates with zero downtime. Placed between an external LAN8720A or KSZ8081 PHY and the field sensors, the ATSAME53N20A-AF runs an lwIP or Harmony Net TCP/IP stack at 120 MHz with hardware AES encryption for TLS sessions. The 256 KB SRAM with ECC is large enough to hold full TLS handshake buffers plus an MQTT client queue, and the 12-bit ADC samples analog process variables without an external converter.
추천
Secure Building Automation Controller
For building-automation controllers the ATSAME53N20A-AF combines hardware AES, TRNG, USB Full-Speed, and 100-pin TQFP I/O expansion in a single part, replacing a discrete MCU plus crypto chip plus connectivity MCU. The Cortex-M4F runs BACnet or Modbus stacks while the AES engine handles TLS 1.2 sessions to the cloud; the TRNG provides non-deterministic seeds for key generation. The 12-bit ADC reads thermistor and occupancy-sensor analog inputs, and the Peripheral Touch Controller drives the front-panel capacitive buttons.
추천
USB Human-Machine Interface (HMI) Panel
The ATSAME53N20A-AF is well-suited to USB HMI panels because its on-chip USB 2.0 Full-Speed PHY removes the external PHY BOM, while the 120 MHz Cortex-M4F drives a TFT color display via the parallel EBI and renders GUI pages from a serial flash asset library. Dual-Panel Flash lets the panel bootloader field-upgrade the UI firmware without disconnecting the host. The two 12-bit DACs provide audio feedback tones without an external codec, and the 256 KB SRAM buffers font glyphs and frame compression assets.
추천
BLDC Motor Control Drive
The ATSAME53N20A-AF drives BLDC and PMSM motors through its 16-bit PWM timers, three on-chip analog comparators for back-EMF zero-crossing detection, and the Cortex-M4F FPU which runs field-oriented-control loops in hardware single-precision. The 12-bit ADC samples phase currents at 1 Msps with hardware oversampling for current-loop bandwidth above 20 kHz. The 100-pin TQFP package exposes enough I/O for Hall sensors, encoder quadrature inputs, and a CAN-FD interface to the higher-level vehicle or robot controller.
추천
Secure Connected Sensor Node
For secure connected sensor nodes the ATSAME53N20A-AF provides hardware AES for TLS handshakes, a TRNG for non-deterministic key generation, and a low-power Sleep mode that drops the Cortex-M4F clock to conserve battery. The 12-bit ADC at 1 Msps oversamples environmental data for averaging while the Cortex-M4F runs encryption in parallel. Dual-Panel Flash enables field firmware updates over the air while keeping the previous firmware image recoverable, eliminating bricking risk.
추천
Capacitive Touch Control Panel
The ATSAME53N20A-AF integrates the Peripheral Touch Controller for self-capacitance and mutual-capacitance touch sensing, supporting up to 32 touch buttons or a small slider/wheel without an external touch IC. The 12-bit ADC is reused for proximity sensing and water-immune touch calibration. The 120 MHz Cortex-M4F handles touch-event post-processing while the AES engine secures configuration commands received over USB or Ethernet, making it well suited to kitchen-appliance and industrial control-panel front panels.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAME53N20A-AF — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAME53N20A-AU | ATSAME53N20A-AFT | ATSAME53N19A-AU | ATSAME53J19A-AF | ATSAME51N20A-AU | ATSAMD51N20A-AF | ATSAMD51N20A-AU |
|---|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TQFP (14x14) | 100-TQFP (14x14) | 100-TQFP (14x14) | 100-TQFP (14x14) | 100-TQFP (14x14) | 100-TQFP (14x14) | 100-TQFP (14x14) | 100-TQFP (14x14) |
| Core | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 48 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 512 KB | 512 KB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 192 KB | 192 KB | 256 KB | 256 KB | 256 KB |
| Ethernet MAC | Yes (10/100 + IEEE 1588) | Yes (10/100 + IEEE 1588) | Yes (10/100 + IEEE 1588) | Yes (10/100 + IEEE 1588) | No | No | No | No |
| USB | USB 2.0 Full-Speed (Host+Device) | USB 2.0 Full-Speed (Host+Device) | USB 2.0 Full-Speed (Host+Device) | USB 2.0 Full-Speed (Host+Device) | USB 2.0 Full-Speed (Host+Device) | USB 2.0 Full-Speed (Host+Device) | USB 2.0 Full-Speed (Host+Device) | USB 2.0 Full-Speed (Host+Device) |
| Hardware AES | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| ADC | 12-bit, 1 Msps, up to 32 ch | 12-bit, 1 Msps, up to 32 ch | 12-bit, 1 Msps, up to 32 ch | 12-bit, 1 Msps, up to 32 ch | 12-bit, 1 Msps, up to 32 ch | 12-bit, 1 Msps, up to 32 ch | 12-bit, 1 Msps, up to 32 ch | 12-bit, 1 Msps, up to 32 ch |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +85C |
주요 차별점
- Integrated 10/100 Ethernet MAC with IEEE 1588 PTP (vs ATSAMD51N20A-AF)
- Dual-Panel Flash for live OTA updates (vs ATSAME53N19A-AU)
- 120 MHz operation in TQFP-100 (vs ATSAME53J19A-AF)
설계 노트
The ATSAME53N20A-AF requires a clean 3.3 V supply with bulk capacitance of at least 4.7 uF within 5 mm of each VDD pin, plus 100 nF ceramic decoupling on every VDD/VSS pair. The on-chip DCDC converter must have its LC filter populated per the SAM E53 reference design; failure to do so causes core voltage noise that manifests as USB enumeration failures and ADC jitter. Estimated: a design with all 11 VDD pins decoupled by 100 nF + 4.7 uF bulk will hold VDD ripple below 50 mVpp at full 120 MHz operation.
Place the 32.768 kHz crystal within 3 mm of XIN32/XOUT32 with a ground guard ring, and route the 12 MHz main crystal traces symmetrically with matched trace lengths to avoid duty-cycle distortion. The Ethernet PHY MDI traces to the magnetics must be 100-ohm differential with no splits, and the USB DP/DM traces must be 90-ohm differential with no via stubs. Estimated: a 4-layer PCB with 1 oz copper and proper ground pour will keep junction temperature rise below 30 C at full industrial load.
Do not boot the SAM E53 from SPI flash without first configuring the BOOTPROT fuse, otherwise the ROM bootloader will not load application code and the part will appear dead. When using Dual-Panel Flash for OTA, ensure both panels are configured with the same size in the NVMCTRL controller or writes will silently corrupt the panel boundary. Use the on-chip temperature sensor to verify junction temperature stays within -40C to +125C; thermal shutdown does not reset the part, so application software must poll the sensor and throttle clocks.
규정 준수 정보
RoHS and REACH compliance per Microchip product page. AEC-Q100 automotive qualification is not claimed for the standard -AF variant; AEC-Q100 qualified SAM E53 parts use the -AF-VAO or similar suffix. Halogen-free status not specified in provided data.
