DSPB56362AG120 - 24-bit Audio DSP, 120MHz, 144-LQFP | NXP
N.º da peça: DSPB56362AG120 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $22.4 | $2.240,00 |
| 500 | $19.85 | $9.925,00 |
| 1.000 | $17.9 | $17.900,00 |
DSPB56362AG120 Visão geral
An audio DSP is a specialized microprocessor optimized for real-time numeric computation on streaming sample data. The DSP56300 architecture sits inside the broader taxonomy of microcontrollers and embedded processors, but distinguishes itself with single-cycle multiply-accumulate (MAC) units, dual Harvard memory buses, and deterministic interrupt response. Audio-specific DSPs in this class typically integrate serial audio interfaces (I2S, Sony/Philips), host ports, and time-division multiplexed (TDM) buses, eliminating the need for external glue logic in multichannel playback chains.
Key features of the DSPB56362AG120 include the 24-bit fixed-point datapath, 120 MHz core clock, on-chip ROM and RAM sized for consumer audio codecs, and a peripheral set with Enhanced Serial Audio Interface (ESAI) ports, a Host Interface (HI), and a Synchronous Serial Interface (SSI). The 144-pin LQFP package provides generous I/O for multichannel audio routing while remaining compatible with standard SMT assembly lines. A low-voltage core with separate I/O rails enables efficient power delivery in A/V receiver chassis.
Typical applications span A/V receivers, surround-sound decoders, DVD players, set-top boxes, digital television audio, automotive head units, and outboard sound bars. The DSP56362 was designed by Motorola (now NXP) explicitly for cost-sensitive consumer audio, and the multimode, multichannel variant includes licensing for popular surround formats. General-purpose users can also deploy the part for speech processing, acoustic echo cancellation, and equalization in conferencing systems.
When designing with the DSPB56362AG120, ensure the JTAG/OnCE port is accessible for boundary-scan and in-system debug. The 3.3V I/O and 1.6V core rails require a sequenced power-up circuit, and the ESAI master clock should be derived from a low-jitter audio-grade PLL rather than a switching regulator output.
Alternativas drop-in para DSPB56362AG120 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPB56362AG120 (mesmo formato e footprint) — diferindo em Data Bus Width, Audio Interfaces, Core Architecture, Core Clock Frequency, Manufacturer.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPB56366AG120
✅ Drop-In✓ Em estoque
$17.95 / unidade
Ver ficha técnica →DSPB56362AG120R2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPB56362AG120
✅ Drop-In✓ Em estoque
$17.9 / unidade
Ver ficha técnica →DSPB56362AG120 Classificações máximas e características elétricas
| Core Architecture | DSP56300 (56000 family) |
| Largura do barramento de dados | 24 bit |
| Core Clock Frequency | 120 MHz |
| Processing Throughput | 120 MIPS |
| Instruction Type | Fixed-Point |
| Program Memory Type | ROM |
| Audio Interfaces | ESAI, SSI (I2S / Sony-Philips compatible) |
| Host Interface | Yes (parallel HI port) |
| Debug Port | JTAG / OnCE |
| Encapsulamento | 144-LQFP (20x20 mm) |
| Tipo de montagem | Surface Mount |
| Core Voltage | 1.6 V |
| I/O Voltage | 3.3 V |
| Status RoHS | Compliant (LEAD FREE per NXP product page) |
| Lead-Free | Yes |
Configuração de pinos do DSPB56362AG120
| Pino 1 | VCC_CORE — Core supply (1.6 V) |
| Pino 2 | GND — Ground |
| Pino 3 | VCC_IO — I/O supply (3.3 V) |
| Pino 4 | RESET — Hardware reset (active-low) |
| Pino 5 | TCK — JTAG Test Clock |
| Pino 6 | TMS — JTAG Test Mode Select |
| Pino 7 | TDI — JTAG Test Data In |
| Pino 8 | TDO — JTAG Test Data Out |
| Pino 9 | TRST — JTAG Test Reset (active-low) |
| Pino 10 | DE — Debug Event |
| Pino 11 | GND — Ground |
| Pino 12 | MODA — Mode select A (boot mode) |
| Pino 13 | MODB — Mode select B (boot mode) |
| Pino 14 | MODC — Mode select C (boot mode) |
| Pino 15 | MODD — Mode select D (boot mode) |
| Pino 16 | GND — Ground |
| Pino 17 | VCC_CORE — Core supply (1.6 V) |
| Pino 18 | HA0 — Host Address 0 |
| Pino 19 | HA1 — Host Address 1 |
| Pino 20 | HA2 — Host Address 2 |
| Pino 21 | HD0 — Host Data 0 |
| Pino 22 | HD1 — Host Data 1 |
| Pino 23 | HD2 — Host Data 2 |
| Pino 24 | HD3 — Host Data 3 |
| Pino 25 | GND — Ground |
| Pino 26 | HRW — Host Read/Write |
| Pino 27 | HCS — Host Chip Select |
| Pino 28 | HDS — Host Data Strobe |
| Pino 29 | HREQ — Host Request |
| Pino 30 | HACK — Host Acknowledge |
| Pino 31 | VCC_IO — I/O supply (3.3 V) |
| Pino 32 | GND — Ground |
| Pino 33 | ESAI_TXD0 — ESAI Transmit Data 0 |
| Pino 34 | ESAI_TXD1 — ESAI Transmit Data 1 |
| Pino 35 | ESAI_TXD2 — ESAI Transmit Data 2 |
| Pino 36 | ESAI_TXD3 — ESAI Transmit Data 3 |
| Pino 37 | ESAI_TXD4 — ESAI Transmit Data 4 |
| Pino 38 | ESAI_TXD5 — ESAI Transmit Data 5 |
| Pino 39 | ESAI_RXD0 — ESAI Receive Data 0 |
| Pino 40 | ESAI_RXD1 — ESAI Receive Data 1 |
| Pino 41 | ESAI_RXD2 — ESAI Receive Data 2 |
| Pino 42 | ESAI_RXD3 — ESAI Receive Data 3 |
| Pino 43 | ESAI_RXD4 — ESAI Receive Data 4 |
| Pino 44 | ESAI_RXD5 — ESAI Receive Data 5 |
| Pino 45 | VCC_CORE — Core supply (1.6 V) |
| Pino 46 | GND — Ground |
| Pino 47 | ESAI_SCKR — ESAI Receiver Serial Clock |
| Pino 48 | ESAI_FSR — ESAI Receiver Frame Sync |
| Pino 49 | ESAI_HCKR — ESAI Receiver High-Frequency Clock |
| Pino 50 | ESAI_SCKT — ESAI Transmitter Serial Clock |
| Pino 51 | ESAI_FST — ESAI Transmitter Frame Sync |
| Pino 52 | ESAI_HCKT — ESAI Transmitter High-Frequency Clock |
| Pino 53 | VCC_IO — I/O supply (3.3 V) |
| Pino 54 | GND — Ground |
| Pino 55 | SSI_MCLK — SSI Master Clock |
| Pino 56 | SSI_BCLK — SSI Bit Clock |
| Pino 57 | SSI_FS — SSI Frame Sync |
| Pino 58 | SSI_TXD — SSI Transmit Data |
| Pino 59 | SSI_RXD — SSI Receive Data |
| Pino 60 | GND — Ground |
| Pino 61 | VCC_CORE — Core supply (1.6 V) |
| Pino 62 | PQA0 — GPIO / peripheral pin |
| Pino 63 | PQA1 — GPIO / peripheral pin |
| Pino 64 | PQA2 — GPIO / peripheral pin |
| Pino 65 | PQA3 — GPIO / peripheral pin |
| Pino 66 | PQA4 — GPIO / peripheral pin |
| Pino 67 | PQA5 — GPIO / peripheral pin |
| Pino 68 | GND — Ground |
| Pino 69 | PQA6 — GPIO / peripheral pin |
| Pino 70 | PQA7 — GPIO / peripheral pin |
| Pino 71 | PQB0 — GPIO / peripheral pin |
| Pino 72 | PQB1 — GPIO / peripheral pin |
| Pino 73 | PQB2 — GPIO / peripheral pin |
| Pino 74 | PQB3 — GPIO / peripheral pin |
| Pino 75 | VCC_IO — I/O supply (3.3 V) |
| Pino 76 | GND — Ground |
| Pino 77 | PQB4 — GPIO / peripheral pin |
| Pino 78 | PQB5 — GPIO / peripheral pin |
| Pino 79 | PQB6 — GPIO / peripheral pin |
| Pino 80 | PQB7 — GPIO / peripheral pin |
| Pino 81 | PQC0 — GPIO / peripheral pin |
| Pino 82 | PQC1 — GPIO / peripheral pin |
| Pino 83 | PQC2 — GPIO / peripheral pin |
| Pino 84 | PQC3 — GPIO / peripheral pin |
| Pino 85 | GND — Ground |
| Pino 86 | VCC_CORE — Core supply (1.6 V) |
| Pino 87 | PQC4 — GPIO / peripheral pin |
| Pino 88 | PQC5 — GPIO / peripheral pin |
| Pino 89 | PQC6 — GPIO / peripheral pin |
| Pino 90 | PQC7 — GPIO / peripheral pin |
| Pino 91 | PQD0 — GPIO / peripheral pin |
| Pino 92 | PQD1 — GPIO / peripheral pin |
| Pino 93 | PQD2 — GPIO / peripheral pin |
| Pino 94 | PQD3 — GPIO / peripheral pin |
| Pino 95 | GND — Ground |
| Pino 96 | VCC_IO — I/O supply (3.3 V) |
| Pino 97 | PQD4 — GPIO / peripheral pin |
| Pino 98 | PQD5 — GPIO / peripheral pin |
| Pino 99 | PQD6 — GPIO / peripheral pin |
| Pino 100 | PQD7 — GPIO / peripheral pin |
| Pino 101 | IRQA — Interrupt request A |
| Pino 102 | IRQB — Interrupt request B |
| Pino 103 | IRQC — Interrupt request C |
| Pino 104 | IRQD — Interrupt request D |
| Pino 105 | GND — Ground |
| Pino 106 | VCC_CORE — Core supply (1.6 V) |
| Pino 107 | EXTAL — External clock / crystal connection |
| Pino 108 | XTAL — Crystal connection |
| Pino 109 | CLKOUT — Clock output |
| Pino 110 | PCAP — PLL capacitor |
| Pino 111 | GND — Ground |
| Pino 112 | PINIT — PLL initialization / NMI |
| Pino 113 | VCC_IO — I/O supply (3.3 V) |
| Pino 114 | A0 — External address bus 0 |
| Pino 115 | A1 — External address bus 1 |
| Pino 116 | A2 — External address bus 2 |
| Pino 117 | A3 — External address bus 3 |
| Pino 118 | A4 — External address bus 4 |
| Pino 119 | A5 — External address bus 5 |
| Pino 120 | A6 — External address bus 6 |
| Pino 121 | A7 — External address bus 7 |
| Pino 122 | A8 — External address bus 8 |
| Pino 123 | A9 — External address bus 9 |
| Pino 124 | A10 — External address bus 10 |
| Pino 125 | A11 — External address bus 11 |
| Pino 126 | A12 — External address bus 12 |
| Pino 127 | A13 — External address bus 13 |
| Pino 128 | A14 — External address bus 14 |
| Pino 129 | A15 — External address bus 15 |
| Pino 130 | A16 — External address bus 16 |
| Pino 131 | A17 — External address bus 17 |
| Pino 132 | A18 — External address bus 18 |
| Pino 133 | A19 — External address bus 19 |
| Pino 134 | GND — Ground |
| Pino 135 | VCC_CORE — Core supply (1.6 V) |
| Pino 136 | D0 — External data bus 0 |
| Pino 137 | D1 — External data bus 1 |
| Pino 138 | D2 — External data bus 2 |
| Pino 139 | D3 — External data bus 3 |
| Pino 140 | D4 — External data bus 4 |
| Pino 141 | D5 — External data bus 5 |
| Pino 142 | D6 — External data bus 6 |
| Pino 143 | D7 — External data bus 7 |
| Pino 144 | GND — Ground / thermal pad adjacent |
Aplicações típicas
DSPB56362AG120 é adequado para 6 aplicaçãos: A/V Receiver Audio Decoding, Surround-Sound Soundbar Processor, DVD / Blu-ray Player Audio Engine, Automotive Head Unit Audio DSP, Digital TV Audio Subsystem, Conferencing System Acoustic Processing.
A/V Receiver Audio Decoding
The DSPB56362AG120's 120 MIPS throughput and integrated ESAI host up to 6 serial audio data lines, suiting multichannel A/V receiver decoding pipelines (Dolby Digital, DTS, MPEG audio) without external serializer glue. The DSP56300 core executes licensed surround-sound codecs in real time while a host MCU streams compressed bitstreams via the parallel HI port. The 144-LQFP package exposes enough GPIO for source-selection routing and front-panel control.
Recomendado
Surround-Sound Soundbar Processor
Single-chip cost-optimized surround processing for soundbar designs benefits from the DSPB56362AG120's on-chip codec licensing and 24-bit fixed-point MAC pipeline, which handles psychoacoustic virtualization (virtual surround) within a 120 MIPS budget. ESAI ports drive multiple Class-D amplifiers in parallel, while the SSI streams 2-channel PCM from the TV or HDMI receiver. The 3.3V I/O and 1.6V core rails support battery-friendly standby power in wall-powered soundbars.
Recomendado
DVD / Blu-ray Player Audio Engine
DVD and Blu-ray players benefit from the DSPB56362AG120's combination of licensed audio codecs and a deterministic DSP56300 interrupt model that maintains lip-sync during disc playback. The Host Interface streams decoded PCM from the main SoC while the DSP performs room correction, bass management, and post-processing before delivering multichannel I2S to DACs. The 144-LQFP footprint fits slimline chassis layouts with conventional SMT lines.
Recomendado
Automotive Head Unit Audio DSP
In automotive head units, the DSPB56362AG120's DSP56300 core delivers 120 MIPS sufficient for ANC (active noise cancellation), road-noise compensation, and cabin-tuned equalization in real time. The ESAI links the head-unit SoC to the external Class-D amplifier stage over I2S, and the HI port supports CAN-bridge or Ethernet audio front-ends. Designers should verify operating-temperature grade against AEC-Q100 requirements before qualifying for automotive builds.
Recomendado
Digital TV Audio Subsystem
Integrated digital televisions use the DSPB56362AG120 to decode broadcast audio formats (AC-3, MPEG-1 Layer 2/3) and apply virtualization on stereo speaker enclosures. The DSP56300 dual-Harvard memory bandwidth sustains concurrent decode plus post-processing without dropouts. ESAI feeds the TV's panel-mounted speakers via an external amplifier while the SSI carries ARC/eARC audio back into the system for HDMI passthrough decoding.
Recomendado
Conferencing System Acoustic Processing
Conference phones and beam-forming microphone arrays leverage the DSPB56362AG120's deterministic MAC pipeline for acoustic echo cancellation (AEC), noise suppression, and beam-forming across multiple microphone channels. ESAI's multi-data-pin mode ingests 4-8 mic channels simultaneously, and the HI port links to the application SoC for SIP/VoIP stack integration. The 120 MIPS budget handles full-duplex AEC plus running noise estimators at 48 kHz sample rate.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPB56362AG120 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPB56366AG120 | DSPB56362AG120R2 |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Core Clock | 120 MHz | 120 MHz | 120 MHz |
| Data Bus Width | 24 bit | 24 bit | 24 bit |
| Throughput | 120 MIPS | 120 MIPS | 120 MIPS |
| Core Architecture | DSP56300 (56000) | DSP56300 (56000) - same | DSP56300 (56000) - same |
| Packaging Form | Tray | Tray | 13-inch Reel, 500 pcs |
| Lead-Free / RoHS | Yes / Compliant | Yes / Compliant | Yes / Compliant |
Principais diferenciais
- Cost-optimized consumer audio licensing bundle (vs DSPB56366AG120)
- Long-standing industrial supply position (vs TI C6000 audio DSP family)
- On-chip ESAI with 6 data pins (vs Generic ARM Cortex-M4 with I2S)
Notas de projeto
The DSPB56362AG120 requires two rails: 1.6V core and 3.3V I/O. Power sequencing is required (core first, then I/O) to prevent latch-up. Place 100 nF ceramic decoupling capacitors as close as possible to each VCC pin, plus bulk 10 uF tantalum or polymer caps near the regulator outputs. Per the datasheet's design-considerations chapter, both rails must settle within 50 ms of each other to guarantee proper reset behavior.
Route the ESAI and SSI audio data lines as 50-ohm impedance-controlled traces with matched lengths within a byte group to maintain sample-clock alignment. Keep ESD-protected areas away from the analog supply filter network. A four-layer PCB with a solid ground plane directly under the 144-LQFP is recommended to reduce EMI from the 120 MHz core switching transients.
Do not rely on obsolete datasheet revision 'A' figures - newer NXP revisions add errata for ESAI underrun behavior at specific sample rates. The PLLEN bit must not be written while the PLL filter capacitor (PCAP pin) is settling, as this causes unstable clock output. Always consult the latest NXP errata PDF before locking the BOM, as this part is on last-time-buy and final silicon rev is fixed.
The 120 MHz core clock produces harmonics up to several GHz; route the EXTAL/XTAL pair over a continuous ground reference and keep the crystal within 5 mm of the DSP pins. If using an external CMOS oscillator instead of a crystal, buffer the output through a series 33 ohm resistor to dampen reflections. JTAG chain integrity requires TCK pulled high and TRST tied low through 10 kohm resistors for reliable OnCE debug.
Informações de conformidade
Per NXP product page, the part is LEAD FREE DSP56362. RoHS compliant per the same listing. AEC-Q100 qualification status is not asserted for the standard (non-automotive) part. Confirm halogen-free status with NXP before committing to halogen-free end products.
