EP1K30QC208-1 - 30K Gates ACEX-1K FPGA, 208-PQFP | Intel (Altera)
N.º da peça: EP1K30QC208-1 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $14.05 | $1.405,00 |
| 500 | $12.3 | $6.150,00 |
| 1.000 | $10.85 | $10.850,00 |
EP1K30QC208-1 Visão geral
A field-programmable gate array (FPGA) is a reconfigurable semiconductor device built from an array of programmable logic blocks, programmable interconnect, and configurable I/O cells. Within the broader taxonomy it sits under programmable logic (PLD) -> programmable logic IC -> digital logic IC -> integrated circuit -> semiconductor. FPGAs enable hardware-level parallelism and in-system reprogrammability, distinguishing them from fixed-function ASICs and from low-density SPLDs/CPLDs.
Key features of the EP1K30QC208-1 include a maximum operating frequency quoted around 250 MHz in the ACEX-1K family, in-system programmability via SRAM configuration cells, embedded array blocks (EABs) for efficient memory and DSP-style functions, dual-port RAM support, JTAG (IEEE 1149.1) boundary-scan test, and multi-volt I/O supporting 2.5 V and 3.3 V interfaces. The architecture is built on a 2.5 V CMOS process for low power dissipation relative to legacy 5 V FPGA families.
Typical applications include glue-logic consolidation, bus-bridging and protocol-translation interfaces, low-density digital signal processing pre-processing, industrial control boards, telecom line-card glue logic, and cost-sensitive prototyping where a hard ASIC is not yet justified. The wide 0 to 70 °C commercial temperature grade suits office, lab, and factory-floor environments.
When designing with this part, note that ACEX-1K FPGAs are volatile and require configuration at every power-up; plan a configuration PROM (EPC2/EPC4/EPC8) or microcontroller host. Use the Quartus II (or legacy MAX+PLUS II) toolchain for synthesis, place-and-route, and bitstream generation. Because the PQFP package has relatively long leads, apply standard PQFP PCB layout guidelines - ground plane, decoupling, and short-trace fanout - to meet signal-integrity budgets above 100 MHz.
Alternativas drop-in para EP1K30QC208-1 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1K30QC208-1 (mesmo formato e footprint) — diferindo em Process Technology, RoHS Status, Speed Grade, Operating Temperature, Total RAM Bits.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1K30QC208-1N
✅ Drop-In✓ Em estoque
$29.88 / unidade
Ver ficha técnica →EP1K30QC208-2
✅ Drop-In✓ Em estoque
$7.9 / unidade
Ver ficha técnica →EP1K30QC208-3
✅ Drop-In✓ Em estoque
$9.75 / unidade
Ver ficha técnica →EP1K30QC208-3N
✅ Drop-In✓ Em estoque
$15.9 / unidade
Ver ficha técnica →EP1K30QI208-2
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →EP1K100QC208-1
✅ Drop-In✓ Em estoque
$20.85 / unidade
Ver ficha técnica →EP1K30QC208-1 Classificações máximas e características elétricas
| Device Family | ACEX-1K |
| Logic Elements (LEs) | 1,728 |
| Equivalent Gates | 30,000 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory (EAB) | 24,576 bits |
| Maximum User I/O | 147 |
| Core Supply Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) |
| Encapsulamento | 208-BFQFP (Plastic Quad Flat Pack, PQFP208) |
| Terminal Pitch | 0.500 mm |
| Tipo de montagem | Surface Mount (gull-wing leads) |
| Temperatura de operação | 0 °C to +70 °C (commercial) |
| Maximum Operating Frequency | up to 250 MHz (family typical) |
| Process Technology | 2.5 V CMOS |
| Configuration Method | SRAM, in-system reconfigurable (volatile) |
| Boundary-Scan Test | JTAG IEEE 1149.1 |
| I/O Voltage Support | 2.5 V / 3.3 V (multi-volt I/O) |
| Configuration Device Support | EPC2, EPC4, EPC8 Enhanced Configuration Devices |
| Status RoHS | Compliant (lead-free) |
Guia de Configuração de Pinos do EP1K30QC208-1 208-bfqfp (plastic quad flat pack, pqfp208)
Configuração de pinos para EP1K30QC208-1 (pacote 208-bfqfp (plastic quad flat pack, pqfp208)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1K30QC208-1.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1K30QC208-1 é adequado para 7 aplicaçãos: Industrial Control Board Glue Logic, Telecom Line-Card Protocol Bridging, Low-Density Digital Signal Pre-Processing, Legacy Bus-Bridge and Protocol Translator, Cost-Sensitive Prototyping Before ASIC Taping Out, Test & Measurement Instrumentation Front-End, Automotive Infotainment / Aftermarket Display Controllers (Legacy Designs Only).
Industrial Control Board Glue Logic
The EP1K30QC208-1 fits industrial control boards because its 1,728 logic elements, 24,576 bits of embedded RAM, and 147 user I/O pins deliver enough capacity to consolidate multiple 74-series glue-logic functions into a single reconfigurable device. Industrial PLCs, motor controllers, and sensor-interface boards benefit from in-system SRAM programmability for late-stage firmware updates without respinning the PCB. The commercial 0 to 70 °C operating range suits factory-floor enclosures; for harsher environments, migrate to the industrial-grade EP1K30QI208-2 variant. The 208-PQFP footprint remains a familiar, hand-solderable package for low-volume industrial boards.
Recomendado
Telecom Line-Card Protocol Bridging
The EP1K30QC208-1 serves telecom line-card protocol-bridging applications where it translates between backplane buses (such as H.110 or proprietary PCM highways) and per-channel framer ICs. Its 30K-gate capacity handles multiple channel glue-logic instances, while the embedded array blocks provide efficient FIFO and small-buffer implementations without external SRAM. The 2.5 V core with 3.3 V-tolerant I/O simplifies interfacing to legacy 3.3 V framers and PHYs. JTAG boundary-scan enables in-system test access, critical for high-density line cards with limited physical probe access. The PQFP208 footprint keeps per-line-card cost low compared to BGA packages of similar density.
Recomendado
Low-Density Digital Signal Pre-Processing
The EP1K30QC208-1 is suited to low-density DSP pre-processing tasks such as FIR filtering, sample-rate conversion, or simple modulation/demodulation in instrumentation and software-defined-radio front-ends. Each embedded array block provides 4 Kbits of dual-port RAM, enabling small coefficient tables and sample-line buffers without external memory. The 250 MHz-class internal performance is sufficient for moderate IF-stage processing at sample rates up to ~80 MSPS with 8-bit datapaths. For higher sample rates or wider datapaths, migrate to a dedicated DSP IC or a higher-density ACEX-1K device. The PQFP package is easy to inspect and rework on prototype DSP boards.
Recomendado
Legacy Bus-Bridge and Protocol Translator
The EP1K30QC208-1 excels as a bus-bridge and protocol-translator device when integrating legacy peripherals (ISA, VME, parallel ports) with modern processors or backplanes. Its 1,728 logic elements are sufficient for state-machine-based protocol converters at bus speeds up to ~50 MHz, and the embedded RAM holds command/status FIFOs. Multi-volt I/O supports 2.5 V and 3.3 V directly; 5 V tolerance is not native, so add external resistors or level shifters. For cost-sensitive industrial retrofits where the existing PCB cannot be reworked, the 208-PQFP footprint remains a drop-in upgrade path from 74LS glue logic to reconfigurable logic.
Recomendado
Cost-Sensitive Prototyping Before ASIC Taping Out
The EP1K30QC208-1 is widely used as a cost-effective FPGA prototype platform before committing to an ASIC tape-out. Engineers validate algorithms, peripheral interfaces, and timing closure in silicon with the same HDL code that will be re-targeted to a lower-cost ASIC. The 208-PQFP is easy to socket or hand-rework on prototype boards, accelerating iteration cycles. In-system SRAM programmability means design changes compile to a new bitstream in minutes rather than respinning masked ASICs. For production volumes above ~50K units per year, migrate the verified design to an ASIC or a smaller CPLD such as MAX II.
Recomendado
Test & Measurement Instrumentation Front-End
The EP1K30QC208-1 supports test-and-measurement front-ends such as logic-analyzer pods, pattern generators, and switching matrices, where its 147 user I/O pins can be routed to dense test-point arrays. Embedded RAM holds pattern sequences and capture buffers without external memory, simplifying the BOM. JTAG boundary-scan enables built-in self-test for production test fixtures, reducing external ATE time. The 2.5 V core with multi-volt I/O simplifies interfacing to legacy 3.3 V and 2.5 V analog front-ends. For handheld or battery-powered instruments, note the 2.5 V core's relatively modest power budget compared to newer Cyclone devices.
Recomendado
Automotive Infotainment / Aftermarket Display Controllers (Legacy Designs Only)
The EP1K30QC208-1 has been used in legacy aftermarket and pre-2010 automotive infotainment display controllers, where its 147 I/O pins drive RGB panels, key-scan matrices, and audio routing logic. The 0 to 70 °C commercial temperature grade is the critical limitation for automotive use - production automotive designs must use the industrial-grade EP1K30QI208-2 or migrate to AEC-Q100-qualified modern FPGAs such as Cyclone IV GX automotive variants. The 208-PQFP footprint is large but acceptable for head-unit mainboards where PCB real estate is not the dominant constraint. For new automotive designs, do not use ACEX-1K; choose a current AEC-Q100 qualified part.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1K30QC208-1 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1K30QC208-1N | EP1K30QC208-2 | EP1K30QC208-3 | EP1K30QC208-3N | EP1K30QI208-2 | EP1K100QC208-1 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 208-BFQFP (PQFP208) | 208-BFQFP (PQFP208) - same | 208-BFQFP (PQFP208) - same | 208-BFQFP (PQFP208) - same | 208-BFQFP (PQFP208) - same | 208-PQFP - same footprint family | 208-BFQFP (PQFP208) - same |
| Logic Elements (LEs) | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 4,992 |
| Embedded Memory | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 40,960 bits |
| Maximum User I/O | 147 | 147 | 147 | 147 | 147 | 147 | 147 |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -1 (slowest) | -1 (same as target) | -2 (faster) | -3 (fastest) | -3 (fastest) | -2 | -1 |
| Operating Temperature | 0 °C to +70 °C (commercial) | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | -40 °C to +85 °C (industrial) | 0 °C to +70 °C |
| Lifecycle Status | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND |
Principais diferenciais
- Same 208-PQFP pinout as the rest of the EP1K30 family (vs EP1K30QC208-3)
- Lead-free / RoHS-compliant terminal finish available as -N suffix (vs EP1K30QC208-1N)
- Industrial-temperature variant available in same package (vs EP1K30QI208-2)
- Higher-density pin-compatible migration path in same package (vs EP1K100QC208-1)
Notas de projeto
The EP1K30QC208-1 requires a 2.5 V core supply (VCCINT) within 2.375 V to 2.625 V, plus VCCIO bank supplies for I/O voltages (typically 2.5 V or 3.3 V). Per the ACEX-1K datasheet, place 0.1 µF decoupling capacitors within 5 mm of every VCCINT and VCCIO pin, and add bulk capacitors (10 µF to 47 µF tantalum or polymer) at the regulator output. During configuration, the device draws brief high transient currents; ensure the regulator can source at least 500 mA peak. Power-rail sequencing is not required, but VCCINT must be stable before nCONFIG is released.
The ACEX-1K family is SRAM-based and volatile, so configuration is lost on every power-down - a configuration PROM (EPC2/EPC4/EPC8) or JTAG host must reload the bitstream at every power-up. According to the ACEX-1K datasheet, CONF_DONE must rise within the specified timeout or the device enters a fail state requiring reconfiguration. Do not assume persistent logic state across reset events. Plan configuration storage in your BOM from day one - retrofitting an EPC device on a dense PQFP board is painful.
The 208-PQFP with 0.500 mm pitch requires careful PCB layout: keep trace lengths short on clock and global-buffer nets, use a continuous ground plane on the layer beneath the device, and route differential pairs with matched lengths within 50 mil. The exposed leads of the PQFP are gull-wing and visible for inspection, but the 0.500 mm pitch is near the practical limit for hand-soldering - use a hot-air rework station or send boards to a contract assembler. Plan at least 4-layer PCB (signal / ground / power / signal) for designs switching above 50 MHz to control return-path impedance.
The EP1K30QC208-1 can source/sink 8 mA or 24 mA per I/O pin depending on drive-strength setting; use series termination (22 to 33 Ω) on high-speed outputs driving traces longer than ~50 mm to dampen reflections. Multi-volt I/O banks mean you can mix 2.5 V and 3.3 V peripherals on the same device by tying VCCIO of each bank to the appropriate voltage - the datasheet pin table identifies which pins belong to which bank. Avoid 5 V signals directly connected to ACEX-1K I/O; they exceed absolute-max ratings and will damage the device. Use external level-shifters (e.g., SN74LVC4245A) for 5 V interfaces.
Estimated: at 250 MHz internal toggle rate, full 147 I/O activity, and typical 30 to 40 percent logic utilization, the EP1K30QC208-1 dissipates roughly 0.5 W to 1.0 W. The 208-PQFP with no exposed thermal pad relies on lead-frame-to-PCB thermal conduction; recommended copper-pour area on top and bottom layers beneath the device is at least 1 square inch to keep junction temperature rise below 20 °C above ambient. Add airflow if ambient exceeds 50 °C or utilization exceeds 70 percent. For industrial-temperature designs in enclosures, verify thermal margin at worst-case operating conditions.
Informações de conformidade
RoHS and lead-free status confirmed for -N suffix variants per distributor data; standard -1 suffix may carry SnPb finish on older date codes. ACEX-1K family is not AEC-Q100 qualified - do not use in automotive safety-critical designs.
