EP1K30QC208-3N - ACEX-1K FPGA, 30K Gates, 208-PQFP | Altera
MPN: EP1K30QC208-3N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.75 | $2,175.00 |
| 500 | $18.4 | $9,200.00 |
| 1,000 | $15.9 | $15,900.00 |
Drop-in alternatives for EP1K30QC208-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K30QC208-2N
✅ Drop-In✓ In Stock
$22.1 / Unit
View Datasheet →EP1K30QC208-1N
✅ Drop-In✓ In Stock
$29.88 / Unit
View Datasheet →EP1K30QC208-3
✅ Drop-In✓ In Stock
$9.75 / Unit
View Datasheet →EP1K30QC208-2
✅ Drop-In✓ In Stock
$7.9 / Unit
View Datasheet →EP1K30QC208-1
✅ Drop-In✓ In Stock
$10.85 / Unit
View Datasheet →EP1K30QC208-02
✅ Drop-In📋 Reference alternative (not in catalog)
EP1K30QC208-3N Maximum Ratings & Electrical Characteristics
| Family | ACEX-1K |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Logic Array Blocks (LABs) | 172 |
| Embedded Array Blocks (EABs) | 6 (24 Kbits total) |
| Maximum User I/O | 147 |
| Package | 208-BQFP / 208-PQFP |
| Mounting Type | Surface Mount |
| Operating Temperature | Industrial (N suffix) |
| Speed Grade | -3 (fastest) |
| Process Technology | 0.18 µm CMOS, SRAM-based LUT |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage (VCCIO) | 3.3 V (5 V tolerant I/O supported) |
| Configuration Interface | Serial / Parallel / JTAG (IEEE 1149.1) |
| RoHS Status | Compliant (lead-free / Pb-free) |
EP1K30QC208-3N 208-bqfp / 208-pqfp Pin Configuration Guide
Complete pinout information for EP1K30QC208-3N (208-bqfp / 208-pqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K30QC208-3N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K30QC208-3N is suitable for 6 applications: Telecommunications Line-Card Glue Logic, Industrial Control & Instrumentation, Network Router & Switch Backplane Bridging, Glue-Logic Replacement & ASIC Prototyping, Military & Aerospace Avionics Interfaces, Medical Diagnostic Equipment I/O Controllers.
Telecommunications Line-Card Glue Logic
The EP1K30QC208-3N's 1,728 logic elements and 147 user I/O pins make it well-suited for telecom line-card glue logic, where the device bridges legacy 5 V TTL buses to 3.3 V LVCMOS ASICs and ASSPs. Its 5 V tolerant I/O on selected banks simplifies direct interfacing to legacy backplanes. The 6 EABs provide enough dual-port RAM for small FIFO buffers between TDM time-slots. Compared with a CPLD alternative, the EP1K30 offers finer-grained state-machine density. Designers typically place the EP1K30 between a T1/E1 framer and an FPGA-based protocol engine.
Recommended
Industrial Control & Instrumentation
In industrial control and instrumentation designs, the EP1K30QC208-3N's industrial temperature grade (N suffix), 24,576 bits of on-chip RAM, and 208-PQFP package provide a robust platform for motor-control glue logic, encoder-interface decoding, and HMI front-panel controllers. The device's 30,000-gate capacity is sufficient to absorb encoder counters, PWM modulators, and serial-protocol bridges (RS-485, CAN, SPI) in a single chip. The 208-PQFP package is also easy to inspect and rework on industrial production lines. Designed-in 2002-2010, the part remains widely deployed in long-lifecycle industrial equipment.
Recommended
Network Router & Switch Backplane Bridging
The EP1K30QC208-3N is widely used in mid-2000s network router and switch designs as a bus-bridging device between PCI / VME backplanes and proprietary ASIC data paths. Its support for the PCI (3.3 V) I/O standard at up to 33 MHz and its 24 Kbits of embedded dual-port RAM make it ideal for buffer management and protocol muxing. The 208-PQFP package also keeps the BOM cost low compared with BGA alternatives, important for cost-sensitive enterprise network gear. Designers typically pair the EP1K30 with a PHY or switch ASIC for full line-card functionality.
Recommended
Glue-Logic Replacement & ASIC Prototyping
The EP1K30QC208-3N serves as a drop-in programmable replacement for legacy discrete 74LS / 74F glue-logic packages, consolidating dozens of small MSI parts into a single device. Its 1,728 logic elements typically replace 50-100 standard SSI/MSI packages, simplifying PCB routing and improving signal integrity by eliminating long point-to-point traces. The 6 EABs also provide 24 Kbits of distributed memory for small LUT tables used in protocol decoding. Engineers also use the part as an ASIC prototype target before committing to a masked gate-array spin.
Recommended
Military & Aerospace Avionics Interfaces
Although not formally MIL-PRF-38535 qualified, the EP1K30QC208-3N is used in commercial-off-the-shelf (COTS) avionics and military systems for non-critical functions such as display controllers, navigation-data formatting, and discrete I/O expansion. Its industrial temperature grade, lead-free construction, and 147 I/O pins provide enough margin for ruggedized enclosures. Long-lifecycle programs often rely on last-time-buy stock of this part rather than redesign. Designers should perform their own reliability analysis before deploying in flight-critical paths.
Recommended
Medical Diagnostic Equipment I/O Controllers
In medical diagnostic equipment such as ultrasound carts, patient monitors, and lab analyzers, the EP1K30QC208-3N functions as a front-panel I/O controller, managing push-buttons, rotary encoders, LCD displays, and serial-port fan-out. Its 5 V tolerant I/O simplifies interface to legacy medical sensors, and the 24 Kbits of on-chip RAM handle small waveform buffers. The 208-PQFP package is preferred by medical OEMs for ease of rework during field service. Lifecycle alignment with long medical product cycles makes the EP1K30 a natural fit.
Recommended
Recommended Products Summary
Engineering reference data for EP1K30QC208-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K30QC208-2N | EP1K30QC208-1N | EP1K30QC208-3 | EP1K30QC208-2 |
|---|---|---|---|---|---|
| Package | 208-PQFP | 208-PQFP | 208-PQFP | 208-PQFP | 208-PQFP |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Speed Grade | -3 (fastest) | -2 | -1 | -3 | -2 |
| Operating Temperature | Industrial (N suffix) | Industrial (N suffix) | Industrial (N suffix) | Commercial | Commercial |
| Plating / RoHS | Pb-free / RoHS | Pb-free / RoHS | Pb-free / RoHS | Tin-lead | Tin-lead |
| User I/O Pins | 147 | 147 | 147 | 147 | 147 |
| Embedded Array Blocks | 6 (24 Kbit RAM) | 6 (24 Kbit RAM) | 6 (24 Kbit RAM) | 6 (24 Kbit RAM) | 6 (24 Kbit RAM) |
Key Differentiators
- Fastest speed grade in ACEX-1K PQFP family (vs EP1K30QC208-2N)
- Industrial temperature with RoHS Pb-free plating (vs EP1K30QC208-3 (non-N))
- 208-PQFP footprint with 147 user I/O pins (vs EP1K30FC256-3 (256-FBGA))
Design Notes
The EP1K30QC208-3N requires two separate supply rails: VCCINT = 2.5 V for the core logic and VCCIO = 3.3 V for the I/O banks. Place a 0.1 µF decoupling capacitor as close as possible to every VCCINT and VCCIO pin, with bulk 10 µF tantalum or ceramic capacitors at each supply plane entry. Failure to keep the two rails independent can cause latch-up or permanent damage. According to the ACEX-1K datasheet, the I/O banks can be configured for 5 V tolerance but the VCCIO rail must still be set to 3.3 V.
The 208-PQFP package has 0.5 mm lead pitch and gull-wing leads; provide at least 0.5 mm of pad-to-trace clearance for proper solder fillet formation. Use a 4-layer PCB with continuous power and ground planes directly under the device for controlled impedance and EMI suppression. Avoid running high-speed traces beneath the PQFP leads - route them on the opposite side or use buried vias. Keep configuration EEPROM traces short and add 4.7 kΩ pull-ups on JTAG TMS and TDI lines per IEEE 1149.1.
Estimated: configuration bitstream size for the EP1K30QC208-3N is approximately 0.6 Mbit when fully utilized; designers should select a configuration EPROM (e.g., EPC2, EPC4, or EPC8) with at least 2× this capacity to allow future design revisions. Do not hot-swap the FPGA without proper power sequencing - the JTAG TAP controller state may latch up if VCCINT rises before VCCIO. For new designs, consider migrating to the EP1K100QC208-3N (same package, 100K gates) for additional logic headroom.
Compliance Information
RoHS-compliant Pb-free plating confirmed per DigiKey product listing. The N-suffix is required for industrial temperature. Halogen-free status not explicitly stated in the provided data; left as unknown. AEC-Q100 not applicable - this is a commercial/industrial FPGA.
