EP1K30QC208-1 - 30K Gates ACEX-1K FPGA, 208-PQFP | Intel (Altera)
MPN: EP1K30QC208-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $14.05 | $1,405.00 |
| 500 | $12.3 | $6,150.00 |
| 1,000 | $10.85 | $10,850.00 |
Drop-in alternatives for EP1K30QC208-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1K30QC208-1N
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$29.88 / Unit
View Datasheet →EP1K30QC208-2
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$7.9 / Unit
View Datasheet →EP1K30QC208-3
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$9.75 / Unit
View Datasheet →EP1K30QC208-3N
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$15.9 / Unit
View Datasheet →EP1K30QI208-2
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View Datasheet →EP1K100QC208-1
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$20.85 / Unit
View Datasheet →EP1K30QC208-1 Maximum Ratings & Electrical Characteristics
| Device Family | ACEX-1K |
| Logic Elements (LEs) | 1,728 |
| Equivalent Gates | 30,000 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory (EAB) | 24,576 bits |
| Maximum User I/O | 147 |
| Core Supply Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) |
| Package | 208-BFQFP (Plastic Quad Flat Pack, PQFP208) |
| Terminal Pitch | 0.500 mm |
| Mounting Type | Surface Mount (gull-wing leads) |
| Operating Temperature | 0 °C to +70 °C (commercial) |
| Maximum Operating Frequency | up to 250 MHz (family typical) |
| Process Technology | 2.5 V CMOS |
| Configuration Method | SRAM, in-system reconfigurable (volatile) |
| Boundary-Scan Test | JTAG IEEE 1149.1 |
| I/O Voltage Support | 2.5 V / 3.3 V (multi-volt I/O) |
| Configuration Device Support | EPC2, EPC4, EPC8 Enhanced Configuration Devices |
| RoHS Status | Compliant (lead-free) |
EP1K30QC208-1 208-bfqfp (plastic quad flat pack, pqfp208) Pin Configuration Guide
Complete pinout information for EP1K30QC208-1 (208-bfqfp (plastic quad flat pack, pqfp208) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K30QC208-1.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K30QC208-1 is suitable for 7 applications: Industrial Control Board Glue Logic, Telecom Line-Card Protocol Bridging, Low-Density Digital Signal Pre-Processing, Legacy Bus-Bridge and Protocol Translator, Cost-Sensitive Prototyping Before ASIC Taping Out, Test & Measurement Instrumentation Front-End, Automotive Infotainment / Aftermarket Display Controllers (Legacy Designs Only).
Industrial Control Board Glue Logic
The EP1K30QC208-1 fits industrial control boards because its 1,728 logic elements, 24,576 bits of embedded RAM, and 147 user I/O pins deliver enough capacity to consolidate multiple 74-series glue-logic functions into a single reconfigurable device. Industrial PLCs, motor controllers, and sensor-interface boards benefit from in-system SRAM programmability for late-stage firmware updates without respinning the PCB. The commercial 0 to 70 °C operating range suits factory-floor enclosures; for harsher environments, migrate to the industrial-grade EP1K30QI208-2 variant. The 208-PQFP footprint remains a familiar, hand-solderable package for low-volume industrial boards.
Recommended
Telecom Line-Card Protocol Bridging
The EP1K30QC208-1 serves telecom line-card protocol-bridging applications where it translates between backplane buses (such as H.110 or proprietary PCM highways) and per-channel framer ICs. Its 30K-gate capacity handles multiple channel glue-logic instances, while the embedded array blocks provide efficient FIFO and small-buffer implementations without external SRAM. The 2.5 V core with 3.3 V-tolerant I/O simplifies interfacing to legacy 3.3 V framers and PHYs. JTAG boundary-scan enables in-system test access, critical for high-density line cards with limited physical probe access. The PQFP208 footprint keeps per-line-card cost low compared to BGA packages of similar density.
Recommended
Low-Density Digital Signal Pre-Processing
The EP1K30QC208-1 is suited to low-density DSP pre-processing tasks such as FIR filtering, sample-rate conversion, or simple modulation/demodulation in instrumentation and software-defined-radio front-ends. Each embedded array block provides 4 Kbits of dual-port RAM, enabling small coefficient tables and sample-line buffers without external memory. The 250 MHz-class internal performance is sufficient for moderate IF-stage processing at sample rates up to ~80 MSPS with 8-bit datapaths. For higher sample rates or wider datapaths, migrate to a dedicated DSP IC or a higher-density ACEX-1K device. The PQFP package is easy to inspect and rework on prototype DSP boards.
Recommended
Legacy Bus-Bridge and Protocol Translator
The EP1K30QC208-1 excels as a bus-bridge and protocol-translator device when integrating legacy peripherals (ISA, VME, parallel ports) with modern processors or backplanes. Its 1,728 logic elements are sufficient for state-machine-based protocol converters at bus speeds up to ~50 MHz, and the embedded RAM holds command/status FIFOs. Multi-volt I/O supports 2.5 V and 3.3 V directly; 5 V tolerance is not native, so add external resistors or level shifters. For cost-sensitive industrial retrofits where the existing PCB cannot be reworked, the 208-PQFP footprint remains a drop-in upgrade path from 74LS glue logic to reconfigurable logic.
Recommended
Cost-Sensitive Prototyping Before ASIC Taping Out
The EP1K30QC208-1 is widely used as a cost-effective FPGA prototype platform before committing to an ASIC tape-out. Engineers validate algorithms, peripheral interfaces, and timing closure in silicon with the same HDL code that will be re-targeted to a lower-cost ASIC. The 208-PQFP is easy to socket or hand-rework on prototype boards, accelerating iteration cycles. In-system SRAM programmability means design changes compile to a new bitstream in minutes rather than respinning masked ASICs. For production volumes above ~50K units per year, migrate the verified design to an ASIC or a smaller CPLD such as MAX II.
Recommended
Test & Measurement Instrumentation Front-End
The EP1K30QC208-1 supports test-and-measurement front-ends such as logic-analyzer pods, pattern generators, and switching matrices, where its 147 user I/O pins can be routed to dense test-point arrays. Embedded RAM holds pattern sequences and capture buffers without external memory, simplifying the BOM. JTAG boundary-scan enables built-in self-test for production test fixtures, reducing external ATE time. The 2.5 V core with multi-volt I/O simplifies interfacing to legacy 3.3 V and 2.5 V analog front-ends. For handheld or battery-powered instruments, note the 2.5 V core's relatively modest power budget compared to newer Cyclone devices.
Recommended
Automotive Infotainment / Aftermarket Display Controllers (Legacy Designs Only)
The EP1K30QC208-1 has been used in legacy aftermarket and pre-2010 automotive infotainment display controllers, where its 147 I/O pins drive RGB panels, key-scan matrices, and audio routing logic. The 0 to 70 °C commercial temperature grade is the critical limitation for automotive use - production automotive designs must use the industrial-grade EP1K30QI208-2 or migrate to AEC-Q100-qualified modern FPGAs such as Cyclone IV GX automotive variants. The 208-PQFP footprint is large but acceptable for head-unit mainboards where PCB real estate is not the dominant constraint. For new automotive designs, do not use ACEX-1K; choose a current AEC-Q100 qualified part.
Recommended
Recommended Products Summary
Engineering reference data for EP1K30QC208-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K30QC208-1N | EP1K30QC208-2 | EP1K30QC208-3 | EP1K30QC208-3N | EP1K30QI208-2 | EP1K100QC208-1 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 208-BFQFP (PQFP208) | 208-BFQFP (PQFP208) - same | 208-BFQFP (PQFP208) - same | 208-BFQFP (PQFP208) - same | 208-BFQFP (PQFP208) - same | 208-PQFP - same footprint family | 208-BFQFP (PQFP208) - same |
| Logic Elements (LEs) | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 4,992 |
| Embedded Memory | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 40,960 bits |
| Maximum User I/O | 147 | 147 | 147 | 147 | 147 | 147 | 147 |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -1 (slowest) | -1 (same as target) | -2 (faster) | -3 (fastest) | -3 (fastest) | -2 | -1 |
| Operating Temperature | 0 °C to +70 °C (commercial) | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | -40 °C to +85 °C (industrial) | 0 °C to +70 °C |
| Lifecycle Status | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND |
Key Differentiators
- Same 208-PQFP pinout as the rest of the EP1K30 family (vs EP1K30QC208-3)
- Lead-free / RoHS-compliant terminal finish available as -N suffix (vs EP1K30QC208-1N)
- Industrial-temperature variant available in same package (vs EP1K30QI208-2)
- Higher-density pin-compatible migration path in same package (vs EP1K100QC208-1)
Design Notes
The EP1K30QC208-1 requires a 2.5 V core supply (VCCINT) within 2.375 V to 2.625 V, plus VCCIO bank supplies for I/O voltages (typically 2.5 V or 3.3 V). Per the ACEX-1K datasheet, place 0.1 µF decoupling capacitors within 5 mm of every VCCINT and VCCIO pin, and add bulk capacitors (10 µF to 47 µF tantalum or polymer) at the regulator output. During configuration, the device draws brief high transient currents; ensure the regulator can source at least 500 mA peak. Power-rail sequencing is not required, but VCCINT must be stable before nCONFIG is released.
The ACEX-1K family is SRAM-based and volatile, so configuration is lost on every power-down - a configuration PROM (EPC2/EPC4/EPC8) or JTAG host must reload the bitstream at every power-up. According to the ACEX-1K datasheet, CONF_DONE must rise within the specified timeout or the device enters a fail state requiring reconfiguration. Do not assume persistent logic state across reset events. Plan configuration storage in your BOM from day one - retrofitting an EPC device on a dense PQFP board is painful.
The 208-PQFP with 0.500 mm pitch requires careful PCB layout: keep trace lengths short on clock and global-buffer nets, use a continuous ground plane on the layer beneath the device, and route differential pairs with matched lengths within 50 mil. The exposed leads of the PQFP are gull-wing and visible for inspection, but the 0.500 mm pitch is near the practical limit for hand-soldering - use a hot-air rework station or send boards to a contract assembler. Plan at least 4-layer PCB (signal / ground / power / signal) for designs switching above 50 MHz to control return-path impedance.
The EP1K30QC208-1 can source/sink 8 mA or 24 mA per I/O pin depending on drive-strength setting; use series termination (22 to 33 Ω) on high-speed outputs driving traces longer than ~50 mm to dampen reflections. Multi-volt I/O banks mean you can mix 2.5 V and 3.3 V peripherals on the same device by tying VCCIO of each bank to the appropriate voltage - the datasheet pin table identifies which pins belong to which bank. Avoid 5 V signals directly connected to ACEX-1K I/O; they exceed absolute-max ratings and will damage the device. Use external level-shifters (e.g., SN74LVC4245A) for 5 V interfaces.
Estimated: at 250 MHz internal toggle rate, full 147 I/O activity, and typical 30 to 40 percent logic utilization, the EP1K30QC208-1 dissipates roughly 0.5 W to 1.0 W. The 208-PQFP with no exposed thermal pad relies on lead-frame-to-PCB thermal conduction; recommended copper-pour area on top and bottom layers beneath the device is at least 1 square inch to keep junction temperature rise below 20 °C above ambient. Add airflow if ambient exceeds 50 °C or utilization exceeds 70 percent. For industrial-temperature designs in enclosures, verify thermal margin at worst-case operating conditions.
Compliance Information
RoHS and lead-free status confirmed for -N suffix variants per distributor data; standard -1 suffix may carry SnPb finish on older date codes. ACEX-1K family is not AEC-Q100 qualified - do not use in automotive safety-critical designs.
