EP1K50FC484-2N - 50K-Gate ACEX 1K FPGA, 249 I/O, 484-BGA | Intel
N.º da peça: EP1K50FC484-2N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $42 | $420,00 |
| 100 | $35.2 | $3.520,00 |
| 500 | $29.8 | $14.900,00 |
| 1.000 | $26.4 | $26.400,00 |
EP1K50FC484-2N Visão geral
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (LBs), programmable interconnect, and I/O cells that engineers can program after manufacture to implement arbitrary digital circuits. FPGAs sit hierarchically between CPLDs (smaller, non-volatile, lower density) and ASICs (custom-fabricated, highest density), and are the workhorse of digital prototyping, glue logic, signal processing pre/post-processing, and small-to-medium volume custom compute. ACEX 1K specifically belongs to the 2.5 V low-cost SRAM-based FPGA tier, optimized for high-volume consumer and communications glue logic rather than highest-performance signal processing.
Key differentiating features include the on-chip dual-port RAM block (EAB-equivalent) of 40,960 bits, hot-swappable 5 V-tolerant I/O buffers (when configured as inputs), in-system programmability via JTAG, and a robust 249 I/O count in a fine-pitch BGA. The device supports multiple I/O standards (LVTTL, LVCMOS, PCI) and offers per-pin tri-state control, making it suitable as a bridge between disparate logic families on a single board.
Typical applications for EP1K50FC484-2N include telecom line-card glue logic, industrial control boards requiring 5 V I/O compatibility, display controllers, custom peripheral interfaces for embedded CPUs, and ASIC prototyping. With 50K gates and 360 LABs, designers typically fit 8- to 16-bit microcontrollers, custom bus bridges, or modest DSP pre-processing on a single device.
When designing with this part, verify 2.5 V core regulation tolerance (older ACEX 1K parts require precise 2.5 V, not 3.3 V), and confirm the BGA rework process capability. ACEX 1K is mature and now classified as EOL/Last Time Buy by Intel, so designers targeting new designs should evaluate Cyclone or MAX families unless legacy support is required.
This page synthesizes distributor availability, drop-in ACEX 1K alternative MPNs, parametric comparison data, and legacy-design practical guidance not consolidated in the original datasheet.
Alternativas drop-in para EP1K50FC484-2N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1K50FC484-2N (mesmo formato e footprint) — diferindo em Package, Speed Grade, Operating Temperature, Process Technology, Configuration Method.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1K50FC484-2
✅ Drop-In✓ Em estoque
$21.8 / unidade
Ver ficha técnica →EP1K50FC484-1N
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EP1K50FC484-1
✅ Drop-In✓ Em estoque
$26.4 / unidade
Ver ficha técnica →EP1K100FC484-2N
✅ Drop-In✓ Em estoque
$58.4 / unidade
Ver ficha técnica →EP1K100FC484-2
✅ Drop-In✓ Em estoque
$33.4 / unidade
Ver ficha técnica →EP1K100FI484-2N
✅ Drop-In✓ Em estoque
$65 / unidade
Ver ficha técnica →EP1K50FC484-2N Classificações máximas e características elétricas
| Family | ACEX 1K |
| Logic Elements / Cells | 2,880 |
| Total Gates | 50,000 |
| Logic Array Blocks (LABs) | 360 |
| Embedded Memory (bits) | 40,960 |
| Number of User I/O | 249 |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 µm |
| Speed Grade | -2 |
| Operating Temperature Grade | Commercial |
| Maximum Operating Frequency | 200 MHz |
| Encapsulamento | 484-ball FBGA (FineLine BGA) |
| Tipo de montagem | Surface Mount (BGA) |
| Programmability | SRAM-based, in-system via JTAG |
| I/O Standards Supported | LVTTL, LVCMOS, PCI (per family datasheet) |
| Tipo de memória | Dual-port embedded array blocks (EABs) |
Guia de Configuração de Pinos do EP1K50FC484-2N 484-ball fbga (fineline bga)
Configuração de pinos para EP1K50FC484-2N (pacote 484-ball fbga (fineline bga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1K50FC484-2N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1K50FC484-2N é adequado para 6 aplicaçãos: Telecom Line-Card Glue Logic, Industrial Control Board I/O Bridging, Display Controller / Timing Generator, Custom Peripheral Interface for Embedded CPUs, ASIC Prototyping, Legacy Board Repair and Sustainment.
Telecom Line-Card Glue Logic
The EP1K50FC484-2N fits telecom line-card glue logic because its 50K-gate capacity and 249 I/O pins comfortably bridge legacy TDM buses (T1/E1, H.110) to modern framers and network processors. The device's dual-port embedded RAM (40,960 bits) implements elastic stores, jitter attenuators, and small protocol-state FIFOs without external memory. Per the ACEX 1K family datasheet, the 2.5 V core with 5 V-tolerant I/O banks allows direct interface to legacy 5 V logic on backplane interfaces without level shifters. At 200 MHz internal frequency with speed grade -2, the device easily meets typical 8-66 MHz telecom bus timing requirements while leaving timing margin for protocol conversion. Engineers historically deployed EP1K50FC484-2N at the line-interface side of Class-5 switches and DLC equipment where a moderate-density, low-cost, 5 V-tolerant programmable device outperforms CPLDs.
Recomendado
Industrial Control Board I/O Bridging
The EP1K50FC484-2N suits industrial control boards as a programmable I/O bridge between MCUs (often 3.3 V CMOS) and legacy 5 V industrial peripherals (relay drivers, opto-isolated inputs, 24 V-tolerant buffers). With 249 I/O pins, a single device can manage an entire front-panel or backplane interface including keypad scan, LCD control, RS-232/422/485 multiplexing, and discrete I/O expansion. The ACEX 1K 2.5 V core with banked I/O supports mixed-voltage design (one bank at 3.3 V to MCU, another at 5 V to legacy). Per the family datasheet, in-system JTAG programmability allows field firmware updates without removing the control board from the chassis — important for installed industrial systems. SRAM-based programmability requires a configuration EEPROM (typically EPC2 or EPC4) for cold-start; this is the main design consideration vs non-volatile FPGAs.
Recomendado
Display Controller / Timing Generator
The EP1K50FC484-2N is well-matched to LCD and CRT timing controller roles where 50K gates and 249 I/O handle pixel-clock generation, sync processing, color-space conversion, and OSD overlay. The device's 200 MHz internal frequency supports pixel clocks up to ~80 MHz when using 2x oversampling, covering XGA (60 Hz) and SXGA-resolution panels. Dual-port embedded RAM is ideal for frame-buffer line storage and pixel-rate lookup tables (gamma correction). Per the ACEX 1K family datasheet, PCI-compliant I/O banks allow direct connection to PCI graphics cards or video-capture ASICs. Designers typically pair the FPGA with an external SDRAM for full frame buffering; the EP1K50FC484-2N manages timing and color pipeline while SDRAM stores pixel data.
Recomendado
Custom Peripheral Interface for Embedded CPUs
The EP1K50FC484-2N is frequently deployed as a peripheral expander for embedded microprocessors and DSPs that lack specific bus interfaces. With 249 I/O, the FPGA can implement multiple interfaces simultaneously — e.g., a single device bridges an EMIF to a Camera Link, an SPI bus to a NAND flash controller, and a parallel port to an FPGA mezzanine card (FMC). The 50K-gate fabric comfortably handles 8-bit microcontroller cores (NIOS or custom), bus arbiters, DMA controllers, and protocol encoders in one device. Per ACEX 1K family documentation, the JTAG-based in-system programmability simplifies firmware updates in production and field. Designers benefit from the ability to add/modify peripherals late in the product cycle without respinning the host CPU board.
Recomendado
ASIC Prototyping
The EP1K50FC484-2N served as a workhorse ASIC prototyping vehicle in the early-2000s design community, providing 50K-gate capacity sufficient to model ASIC blocks at 5-10× RTL gate-equivalent density. The 249 I/O and 484-ball FBGA expose most internal signals to logic-analyzer or scope probing for validation. Per ACEX 1K family documentation, the Quartus II toolchain supports incremental compilation and partition-based synthesis workflows useful for multi-engineer prototyping teams. Engineers can debug logic in-system at near-ASIC clock speeds (limited to ~200 MHz vs typical ASICs at 300-500 MHz), then port validated RTL to a foundry ASIC. The trade-off: SRAM-based configuration requires external boot EEPROM and is volatile — a consideration for prototype reliability testing.
Recomendado
Legacy Board Repair and Sustainment
The EP1K50FC484-2N remains in active demand for sustaining legacy telecom, industrial, and military equipment originally designed with ACEX 1K FPGAs in the 2000-2010 timeframe. End-customers in defense, railway signaling, and power-grid control cannot easily redesign boards rated for 20-30 year service lives, so replacement EP1K50FC484-2N devices must be sourced to repair fielded systems. The 484-ball FBGA requires BGA rework stations for installation, but the footprint matches existing board layouts. Per ACEX 1K family documentation, identical pinout across speed grades and N/non-N finish variants allows flexibility in matching original bill-of-material. Lead time is 2-4 weeks via distributor stock, and franchised brokers (Rochester Electronics, Lantek) sometimes hold bonded inventory.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1K50FC484-2N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1K50FC484-2 | EP1K50FC484-1N | EP1K50FC484-1 | EP1K100FC484-2N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA | 484-ball FBGA — same | 484-ball FBGA — same | 484-ball FBGA — same | 484-ball FBGA — same |
| Family | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K |
| Total System Gates | 50,000 | 50,000 — same | 50,000 — same | 50,000 — same | 100,000 (+100%) |
| Logic Elements / Cells | 2,880 | 2,880 — same | 2,880 — same | 2,880 — same | 4,992 (+73%) |
| Speed Grade | -2 | -2 — same | -1 (slower) | -1 (slower) | -2 — same |
| Ball Finish | Lead-free (N suffix) | Lead-based (no N) | Lead-free | Lead-based | Lead-free |
| Number of User I/O | 249 | 249 — same | 249 — same | 249 — same | 333 (+34%) |
| Embedded Memory (bits) | 40,960 | 40,960 — same | 40,960 — same | 40,960 — same | 49,920 (+22%) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Higher gate density than EP1K30FC256-2N in same 484-ball FBGA-class family (vs EP1K30FC256-2N)
- Smaller BGA package and 84 fewer I/O than EP1K100FC484-2N (vs EP1K100FC484-2N)
- Faster speed grade than EP1K50FC484-1N (vs EP1K50FC484-1N)
- ACEX 1K architecture is now obsolete — modern designs should evaluate Cyclone series (vs Cyclone II EP2C50F484 (modern Altera/Intel))
Notas de projeto
The EP1K50FC484-2N requires a precise 2.5 V core supply (VCCINT). Estimated: at typical utilization (~70% LEs, 50% RAM blocks) the core draws approximately 200-300 mA; add I/O bank current (typically 50-150 mA per active bank at high toggle rates) to size the LDO. Do NOT substitute a 3.3 V regulator — exceeding 2.7 V on VCCINT damages the device. Use a TPS7A45xx-class LDO or equivalent with 1% set-point accuracy and bulk-decouple each VCCINT ball with a 0.1 µF X7R ceramic placed within 3 mm of the ball.
The 484-ball FBGA uses 1.0 mm ball pitch, requiring 4-6 layer PCB with microvia or via-in-pad construction for reliable BGA breakout. Per ACEX 1K family datasheet, all VCCINT and GND balls must be connected; floating power pins cause latch-up or unstable configuration. Route all signals in inner layers between BGA pads using microvia, and provide a continuous ground plane beneath the device to control impedance and reduce SSO (simultaneously-switching output) noise. BGA rework requires X-ray inspection or cross-sectioning to verify joint integrity.
ACEX 1K is SRAM-based and volatile — on power-up the FPGA loads configuration from an external serial EEPROM (EPC2, EPC4, or compatible). Estimated: typical configuration time for EP1K50 is 100-300 ms depending on data-compression settings. Designers must include the EPC2/EPC4 footprint even if only one bitstream is needed, or the board will fail to come up at power-on. Also: never leave JTAG TCK floating during board bring-up — a floating TCK can latch the FPGA into unintended test mode. Tie TCK low through a 1 kΩ pull-down if JTAG is unused.
ACEX 1K FPGAs in 484-ball FBGA have a typical θJA of ~15 C/W with proper PCB layout (continuous ground plane, thermal vias under the package). Estimated: at 200 MHz with 70% utilization, junction temperature rises 15-25 °C above ambient. For sealed enclosures without airflow, derate clock frequency or move to the lower-density EP1K30 to keep Tj below 125 °C commercial limit. Industrial-temperature variants (-1N, -2N with I suffix) extend operation to -40 to +100 °C but are increasingly scarce.
Informações de conformidade
N suffix in EP1K50FC484-2N indicates lead-free (Pb-free) ball composition per Altera/Intel legacy naming convention. RoHS compliance assumed for N-suffix ACEX 1K parts per Intel/Altera Pb-free transition programs; explicit RoHS certificate [DATA_NEEDED: request from franchised distributor]. AEC-Q100 not applicable — this is a commercial-grade FPGA; industrial-temp variants exist (e.g., EP1K50FI484-2N) but are not automotive-qualified.