EP1S60F1020C7 - Stratix FPGA 57K LE, 5.2Mbit, 1020-BBGA | Altera
N.º da peça: EP1S60F1020C7 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2596.12 | $2.596,12 |
| 10 | $2380 | $23.800,00 |
| 25 | $2200 | $55.000,00 |
| 100 | $1950 | $195.000,00 |
| 500 | $1750 | $875.000,00 |
EP1S60F1020C7 Visão geral
A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, routing, and I/O can be programmed after manufacture to implement any digital function - from glue logic and I/O bridging to full processor subsystems and high-throughput DSP pipelines. FPGAs sit hierarchically between fixed-function ASICs and software-driven microcontrollers, offering hardware-timed determinism with software-like design iteration. The Stratix family specifically targets ASIC prototyping, telecom line cards, and high-end DSP applications where ASIC NRE costs are prohibitive.
Key features of the EP1S60F1020C7 include 57,120 logic elements arranged in logic array blocks (LABs), 5,215,104 bits of on-chip RAM distributed across TriMatrix memory structures, embedded DSP blocks supporting 9-bit / 18-bit / 36-bit arithmetic, up to 773 user I/O pins supporting LVDS, HSTL, SSTL, and PCI signaling, and integrated high-speed serial transceiver interfaces on selected package variants. The device includes up to 12 enhanced PLLs per die and supports multiple I/O banks with independent voltage references.
The Stratix architecture implements four-input look-up tables (LUTs), embedded RAM blocks of M512, M4K, and M-RAM sizes, dedicated multiplier / adder tree DSP blocks, and a rich clock network with up to 16 dedicated clock pins per device. Configuration is via serial or parallel EPROM / flash, with built-in decompression and encryption capabilities. The 33 x 33 mm 1020-BBGA package uses a 1.0 mm ball pitch and is the largest in the EP1S60 family, supporting the maximum I/O count.
Typical applications include ASIC prototyping and emulation, high-speed DSP for wireless baseband, telecom line-card bridging, military / aerospace signal processing, broadcast video processing, and high-performance industrial imaging. The combination of high logic density, generous embedded memory, and dedicated DSP blocks makes it well-suited for parallel algorithm acceleration and pre-silicon hardware validation.
When designing with this device, ensure the PCB accommodates the 33 x 33 mm FCBGA footprint and the 1.0 mm ball pitch - this typically demands 4-6 layer PCB with microvia or via-in-pad technology. Thermal management requires attention because the high logic count can produce non-uniform die heating. Plan JTAG / configuration chain accessibility before layout.
This page synthesizes distributor stock levels, same-package drop-in alternatives, and design considerations for the EP1S60F1020C7 - information not consolidated on the Altera / Intel product page or any single distributor listing.
Alternativas drop-in para EP1S60F1020C7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1S60F1020C7 (mesmo formato e footprint) — diferindo em Speed Grade, Package, Family, Operating Temperature, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1S60F1020C6N
✅ Drop-In✓ Em estoque
$195 / unidade
Ver ficha técnica →EP1S60F1020C6
✅ Drop-In✓ Em estoque
$105 / unidade
Ver ficha técnica →EP1S60F1020C5N
✅ Drop-In✓ Em estoque
$2050 / unidade
Ver ficha técnica →EP1S60F1020C5
✅ Drop-In✓ Em estoque
$171 / unidade
Ver ficha técnica →EP1S60F1020
✅ Drop-In✓ Em estoque
$3995 / unidade
Ver ficha técnica →EP1S60F1020I6N
✅ Drop-In✓ Em estoque
$3650 / unidade
Ver ficha técnica →EP1S60F1020I6
✅ Drop-In✓ Em estoque
$3845.2 / unidade
Ver ficha técnica →EP1S60F1020C7 Classificações máximas e características elétricas
| Series | Stratix |
| Family | Stratix (EP1S60) |
| Logic Elements | 57,120 |
| Total Memory Bits | 5,215,104 |
| Maximum User I/O | 773 |
| Encapsulamento | 1020-BBGA, FCBGA, 33 x 33 mm, 1.0 mm pitch |
| Tipo de montagem | Surface Mount |
| Logic Family | CMOS |
| Temperatura de operação | 0C to +85C (Commercial) |
| Core Supply Voltage | 1.5 V |
| Speed Grade | 7 |
| Logic Cells / Logic Blocks | 6,570 (per datasheet Section I nomenclature) |
| DSP Blocks | Embedded dedicated multiplier / adder blocks |
| PLLs | Up to 12 enhanced PLLs per die |
| Configuration Method | Serial or parallel with optional decompression |
| Nível MSL | 3 (per BGA moisture-sensitivity norms) |
| Status RoHS | Compliant (lead-free) |
Configuração de pinos do EP1S60F1020C7
| Pino Multiple | User I/O — Up to 773 user I/O pins supporting LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI signaling standards across multiple I/O banks |
| Pino Multiple | VCCINT — Core 1.5 V supply pins |
| Pino Multiple | VCCIO — Per-bank I/O supply pins (1.5 V, 1.8 V, 2.5 V, 3.3 V selectable per bank) |
| Pino Multiple | VCC_PLL — Dedicated PLL analog supply pins |
| Pino Multiple | GND — Ground reference pins |
| Pino Multiple | CLK[0..15] — Dedicated clock input pins routed to global clock network |
| Pino Multiple | MSEL[0..2] — Configuration mode select pins (AS, PS, JTAG) |
| Pino Multiple | nCONFIG — Configuration reset input (active low) |
| Pino Multiple | nSTATUS — Configuration status output (active low during error) |
| Pino Multiple | CONF_DONE — Configuration complete indicator (open drain) |
| Pino Multiple | DATA0-DATA7 — Parallel configuration data input pins (PS mode) |
| Pino Multiple | TCK, TMS, TDI, TDO — JTAG IEEE 1149.1 boundary-scan pins |
Aplicações típicas
EP1S60F1020C7 é adequado para 6 aplicaçãos: ASIC Prototyping and Emulation, High-Speed DSP for Wireless Baseband, Telecom Line-Card Bridging, Broadcast Video Processing, Industrial Imaging and Machine Vision, Military and Aerospace Signal Processing.
ASIC Prototyping and Emulation
The EP1S60F1020C7's 57,120 logic elements and 5.2 Mbit of embedded TriMatrix memory make it a strong choice for ASIC prototyping and pre-silicon validation. Its high logic density allows engineers to map large SoC blocks including embedded CPUs, peripherals, and interconnect into a single device. The 773 user I/O pins support wide memory and bus interfaces typically needed for ASIC bring-up, while the Stratix DSP blocks enable parallel emulation of DSP-heavy ASIC paths. Industrial users frequently use the C7 speed grade to maximize Fmax, allowing emulation at or near the target ASIC clock frequency. Per the Stratix datasheet, the Quartus II toolchain supports pin assignment, timing analysis, and incremental compile flows that map directly to ASIC verification workflows.
Recomendado
High-Speed DSP for Wireless Baseband
The EP1S60F1020C7 is well-suited for wireless baseband DSP because its dedicated DSP blocks implement 9-bit, 18-bit, and 36-bit signed multiplication, accumulation, and adder trees in parallel. Combined with 5.2 Mbit of TriMatrix memory that buffers I/Q samples and channelization data, the device can sustain multi-channel rake receivers, equalizers, and FFT pipelines. The 1.5 V core and up to 12 PLLs support the multiple clock domains required for antenna interfaces, baseband processing, and backhaul links. The 1020-BBGA package supports 773 user I/O - sufficient for parallel ADC / DAC interfaces such as LVDS at hundreds of MHz. Per the Stratix datasheet, the embedded DSP block pipeline depth supports >250 MHz operation in the C7 speed grade.
Recomendado
Telecom Line-Card Bridging
Telecom line cards rely on FPGAs for packet classification, traffic shaping, and protocol bridging between TDM and packet networks. The EP1S60F1020C7 supports this role with 57,120 logic elements for parallel classifier engines, 5.2 Mbit of memory to buffer descriptor rings and statistics counters, and 773 user I/O for SGMII, SFI, and POS-PHY interfaces. Its 1.5 V core plus multiple I/O bank voltages enable direct connection to ASICs and PHY devices operating at 1.5 V, 1.8 V, 2.5 V, and 3.3 V. The C7 speed grade ensures critical path timing closure on synchronous packet pipelines. Industrial users typically use the commercial C7 part; extended-temperature systems may select EP1S60F1020I6N as a drop-in alternative with lower speed grade.
Recomendado
Broadcast Video Processing
Broadcast video systems, including SDI routers, format converters, and watermarking engines, require substantial pixel-rate parallel processing. The EP1S60F1020C7 provides 57,120 logic elements and 5.2 Mbit of embedded memory for line buffers, frame stores, and lookup tables used in color space conversion and chroma keying. The 773 user I/O pins accommodate multiple parallel SDI inputs / outputs, while the 1.0 mm pitch FCBGA supports dense PCB layout typical of rack-mounted video routers. The C7 speed grade is essential for SDI at 3 Gbps and emerging 6 Gbps / 12 Gbps formats where pixel clocks exceed 150 MHz. Per the Stratix datasheet, the device's LVDS I/O supports >1 Gbps data rates suitable for SDI serial links.
Recomendado
Industrial Imaging and Machine Vision
Industrial machine vision systems use the EP1S60F1020C7 to implement Bayer demosaicing, edge detection, and feature extraction in real time at line-scan rates. Its DSP blocks accelerate Sobel, Laplacian, and FFT pipelines; its 5.2 Mbit memory buffers pixel rows for neighborhood operations; and its 773 I/O pins interface with multiple CoaXPress, Camera Link, and LVDS sensors. The commercial 0C to +85C range covers most factory-floor enclosures, while the industrial-grade EP1S60F1020I6N drop-in variant supports harsher environments. The C7 speed grade enables real-time processing at full Camera Link Full bandwidth (~680 MB/s aggregate). Per the Stratix datasheet, the TriMatrix M-RAM blocks serve as efficient frame-line storage for line-scan cameras.
Recomendado
Military and Aerospace Signal Processing
Defense and aerospace applications use the EP1S60F1020C7 for radar signal processing, electronic warfare, and software-defined radio implementations. The device's high logic density and DSP throughput enable real-time pulse compression, MTI filtering, and beamforming pipelines. While the C7 part operates over 0C to +85C, aerospace integrators typically derate this part or select extended-temperature variants for unmanned platforms. Obsolescence makes the EP1S60F1020C7 a candidate for last-time-buy programs targeting legacy avionics and EW systems. Per the Stratix datasheet, the device's embedded RAM and DSP architecture support 18-bit and 36-bit word widths aligned to common radar datapath bit widths.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1S60F1020C7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1S60F1020C6N | EP1S60F1020C6 | EP1S60F1020C5N | EP1S60F1020 | EP1S60F1020I6N |
|---|---|---|---|---|---|---|
| Package | 1020-BBGA (FCBGA) 33 x 33 mm | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | C7 | C6 (slower) | C6 (slower) | C5 (slower) | No suffix (lowest) | I6 (industrial, slower) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C |
| Logic Elements | 57,120 | 57,120 | 57,120 | 57,120 | 57,120 | 57,120 |
| Embedded Memory Bits | 5,215,104 | 5,215,104 | 5,215,104 | 5,215,104 | 5,215,104 | 5,215,104 |
| Maximum User I/O | 773 | 773 | 773 | 773 | 773 | 773 |
Principais diferenciais
- Highest speed grade available in commercial EP1S60 family (vs EP1S60F1020C6N)
- Largest package in the Stratix family supporting maximum I/O (vs EP1S60F780C7)
- Same-package drop-in industrial option available (vs EP1S60F1020I6N)
Notas de projeto
The 1020-BBGA FCBGA at 1.0 mm ball pitch requires 4 to 6 layer PCB with 0.8 mm pitch microvia or via-in-pad technology to escape the inner balls. Standard 1.6 mm FR-4 with 0.2 mm via diameter supports this pitch only with sequential lamination. Surface finish should be ENIG or immersion silver for BGA reliability. Per Altera packaging guidelines, recommended pad diameter is 0.5 mm with non-solder-mask-defined (NSMD) pads to improve joint yield.
Estimated: At 1.5 V core and worst-case junction utilization, the EP1S60F1020C7 may dissipate 3 to 5 W depending on toggle rate and utilization. With typical theta_JA of 18 to 22 C/W on a 1020-BBGA with minimal PCB cooling, junction-to-ambient rise is 54 to 110 C above 25C ambient. The commercial temperature rating tops out at +85C, leaving only ~30-50C margin at worst-case. Recommend thermal vias under the central ball array and at least 4 thermal vias per GND ball to the inner ground plane.
Do not assume that all EP1S60F1020 speed grades are interchangeable - the C5, C6, and C7 grades differ in Fmax by 10-20% each, so a Quartus II Static Timing Analysis must be re-run after any speed-grade swap. Configuration mode pins (MSEL0-MSEL2) must match the chosen configuration source (AS serial flash, PS parallel, or JTAG). Leave nCONFIG pulled to VCCIO via a 1 kohm resistor and CONF_DONE pulled up to ensure clean startup. BGA moisture sensitivity requires MSL3 baking or pre-dry before reflow.
Stratix LVDS outputs run at >1 Gbps and demand controlled-impedance routing (100 ohm differential) with length matching to within 150 ps. Use the Quartus II pin planner to assign differential pairs and let the tool enforce length matching during routing. Adjacent single-ended signals should maintain 3W spacing from LVDS pairs to minimize crosstalk. Per the Stratix datasheet, SSTL and HSTL memory interfaces also benefit from matched-length byte-lane routing.
Informações de conformidade
RoHS compliance confirmed per Altera product documentation. The N-suffixed variants explicitly denote lead-free packaging. AEC-Q100 not applicable for FPGA grade. Halogen-free status not specifically documented in available data - assumed standard but unverified.
