EP1SGX40FF1020C7 - Stratix GX FPGA 41,250 LE | Intel | 1020-BGA
N.º da peça: EP1SGX40FF1020C7 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $980 | $980,00 |
| 10 | $925 | $9.250,00 |
| 100 | $860 | $86.000,00 |
| 500 | $805 | $402.500,00 |
| 1.000 | $750 | $750.000,00 |
EP1SGX40FF1020C7 Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic fabric, interconnect, and I/O cells are configured by the user after manufacture. Within the broader taxonomy, an FPGA belongs to the programmable logic device family, sitting alongside CPLDs (complex programmable logic devices); high-end FPGAs such as the Stratix GX family additionally integrate dedicated hard IP such as transceivers, DSP blocks, and embedded memory controllers. The 'GX' suffix indicates the transceiver-rich variant, optimized for serial connectivity in communication, broadcast, and storage systems.
Key features of the EP1SGX40FF1020C7 include: 20 full-duplex 3.1875 Gbps transceiver channels supporting CPRI, OBSAI, XAUI, SerialLite II, PCI Express, and Serial RapidIO protocols; 14 dedicated full-duplex 1.25 Gbps channels on the same fabric; 4 PLL-per-transceiver block plus 8 enhanced PLLs; 176 9-bit DSP blocks; and embedded memory with true dual-port RAM, FIFO, and shift-register modes. The 1020-pin FC-FBGA package has a 1.00 mm ball pitch, ~33 mm × 33 mm body, and supports commercial-grade 0°C to 85°C junction operation.
The architecture combines a TriMatrix memory hierarchy (MLABs, M512, M4K, M-RAM blocks) with row- and column-based I/O structures (Banks 1-12), four enhanced PLLs for clock management, and a configuration controller supporting passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), JTAG, and active serial (AS) modes. Hard PCI Express PIPE endpoints and external memory interfaces (DDR/DDR2/QDRII/QDRII+SRAM/RLDRAM II) make it well-suited for high-throughput bridging applications.
Typical applications include: (1) base-station protocol bridging between CPRI/OBSAI fronthaul and Ethernet backhaul; (2) broadcast video routers and cross-point switches using Serial RapidIO or XAUI; (3) high-speed test and measurement equipment with multi-channel serial capture; (4) defence and radar signal preprocessing using embedded DSP blocks; (5) storage controllers aggregating Fibre Channel or SATA links. Its combination of 20 fast transceivers and 624 user I/O enables single-chip aggregation of multiple serial lanes plus parallel control-plane logic.
When designing with this device, pay close attention to PCB power integrity: the FC-FBGA requires a multi-layer stack-up with continuous VCC, VTT, and GND planes, plus extensive decoupling per the Stratix GX PowerPlay early-power estimator. Transceiver channels need 100 Ω differential routing with controlled 100 Ω ± 10% impedance and length matching of ± 0.13 mm (5 mil) within a pair. Use the Altera Quartus II (now Intel Quartus Prime) design suite for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in alternatives, parametric comparisons and practical PCB-layout guidance not found in the manufacturer datasheet alone, helping procurement engineers and FPGA designers evaluate the EP1SGX40FF1020C7 against modern alternatives.
Alternativas drop-in para EP1SGX40FF1020C7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1SGX40FF1020C7 (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Speed Grade, Family, Series.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1SGX40FF1020C6
✅ Drop-In✓ Em estoque
$195 / unidade
Ver ficha técnica →EP1SGX40FF1020C5
✅ Drop-In✓ Em estoque
$1245 / unidade
Ver ficha técnica →EP1SGX40F1020C6
✅ Drop-In✓ Em estoque
$142 / unidade
Ver ficha técnica →EP1SGX40F1020C5N
✅ Drop-In✓ Em estoque
$195 / unidade
Ver ficha técnica →EP1SGX40F1020
✅ Drop-In✓ Em estoque
$102.1 / unidade
Ver ficha técnica →EP1S60F1020C7
✅ Drop-In✓ Em estoque
$1750 / unidade
Ver ficha técnica →EP1SGX40FF1020C7 Classificações máximas e características elétricas
| Series | Stratix GX |
| Family | Stratix GX (EP1SGX40) |
| Logic Elements (LE) | 41,250 |
| Configurable Logic Blocks (CLB) | 4,125 |
| Embedded Memory (bits) | 3,423,744 |
| User I/O Pins | 624 |
| Number of Logic Array Blocks (LAB) | 4,125 |
| Number of I/O Banks | 12 |
| Core Supply Voltage (VCCINT) | 1.425 V to 1.575 V (nominal 1.5 V) |
| Speed Grade | 7 (-7, mid-speed) |
| Process Technology | CMOS |
| Temperatura de operação | 0 °C to 85 °C (commercial) |
| Encapsulamento | 1020-ball FC-FBGA (S-PBGA-B1020) |
| Package Dimensions | 33 mm × 33 mm |
| Ball Pitch | 1.00 mm |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Configuration Modes | PS, PPS, PPA, JTAG, AS |
| DSP Blocks (9-bit) | 176 |
| Transceiver Channels | 20 full-duplex 3.1875 Gbps + 14 dedicated full-duplex 1.25 Gbps |
| PLLs | 8 enhanced + per-transceiver PLLs |
Guia de Configuração de Pinos do EP1SGX40FF1020C7 33 mm × 33 mm
Configuração de pinos para EP1SGX40FF1020C7 (pacote 33 mm × 33 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1SGX40FF1020C7.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1SGX40FF1020C7 é adequado para 7 aplicaçãos: Wireless Base Station Protocol Bridging, Broadcast Video Routers and Cross-Point Switches, High-Speed Test and Measurement Equipment, Defence and Radar Signal Preprocessing, Storage Controllers and SAS/SATA Aggregation, Industrial Imaging and Machine Vision, Medical Imaging and Diagnostic Equipment.
Wireless Base Station Protocol Bridging
The EP1SGX40FF1020C7's 20 × 3.1875 Gbps transceivers and 14 dedicated 1.25 Gbps full-duplex channels make it ideal for base-station protocol bridging between CPRI/OBSAI fronthaul links and Ethernet backhaul. Its hardened PCI Express PIPE endpoint allows direct aggregation into a baseband ASIC over PIPE without soft IP overhead. The 41,250 logic elements provide ample headroom for CPRI re-mapping, OBSAI RP3-01 framing, and Ethernet MAC/PCS processing on a single chip. Stratix GX error-correcting transceivers meet the 1e-12 BER requirements for cellular fronthaul, and the 1020-ball BGA supports thermal dissipation for hot outdoor enclosures when paired with adequate heatsinking. Compared with two-chip solutions using separate PHY and ASSP, this single-chip approach reduces BOM, board area, and inter-chip latency.
Recomendado
Broadcast Video Routers and Cross-Point Switches
The EP1SGX40FF1020C7 supports multiple broadcast video interfaces via Serial RapidIO, XAUI, and SerialLite II protocols running on its 20 transceivers. With 624 user I/Os it can interface to parallel SDI crosspoints, HDMI receivers, and control-plane Ethernet simultaneously, replacing multiple ASSPs in a video-routing frame. Its 3,423,744 bits of embedded RAM (distributed across MLAB, M512, M4K, and M-RAM blocks) hold video frame buffers for de-embedding, frame-store conversion, and audio de-embedding without external memory. The 1020-ball FC-FBGA supports the high pin density required for broadcast chassis designs, and the commercial 0 °C to 85 °C junction range suits air-conditioned studio racks. Quartus II IP cores (Triple-Speed Ethernet, XAUI PHY, SDI encoder/decoder) accelerate integration for broadcast OEMs.
Recomendado
High-Speed Test and Measurement Equipment
Test and measurement platforms such as logic analysers, protocol analysers, and BERT testers leverage the EP1SGX40FF1020C7's 20 transceivers to capture and generate multi-channel serial traffic at 3.1875 Gbps, supporting standards like XAUI, SATA, Serial RapidIO, and PCI Express Gen1. The 176 dedicated 9-bit DSP blocks enable real-time CRC/checksum computation and pattern matching at line rate, while the 41,250 logic elements host a soft multi-lane trigger engine. Its 624 I/O pins drive LVDS parallel probes and synchronisation interfaces, and the 1020-ball FC-FBGA fits within the standard instrumentation chassis footprint. Embedded memory (3,423,744 bits) supports deep state-counters and pattern-history buffers, while the FPGA's JTAG interface simplifies in-system debug for the test set's own firmware. The mid-speed -7 grade is typical for these instrumentation workloads where deterministic latency outweighs absolute throughput.
Recomendado
Defence and Radar Signal Preprocessing
Radar and electronic-warfare subsystems use the EP1SGX40FF1020C7 for front-end DSP preprocessing: the 176 9-bit DSP blocks execute FIR/FFT kernels on wide-bandwidth digital downconversion data streams, while the 20 transceivers ingest multi-element antenna array samples at 3.1875 Gbps per channel. The 3,423,744 bits of distributed RAM act as a circular sample buffer, enabling coherent integration without external memory in some configurations. Its hardened PCI Express PIPE block transmits pre-processed data to a downstream processor (DSP or GPP) over Gen1 PCIe. The 1020-ball FC-FBGA with 1.00 mm pitch supports ruggedised military board assemblies and is qualified for the commercial 0-85 °C temperature range typical of air-cooled defence subsystems. Quartus II DSP Builder and Megacore IP accelerate FFT and FIR development for radar OEMs.
Recomendado
Storage Controllers and SAS/SATA Aggregation
Storage-area network (SAN) controllers and RAID-on-chip designs use the EP1SGX40FF1020C7 to aggregate multiple 3 Gbps SATA or SAS links: each of the 20 transceivers drives a SATA II/SAS port, and the embedded PCI Express PIPE block uplinks to a host CPU at Gen1 rates. The 41,250 logic elements host RAID-6 XOR engines, NCQ schedulers, and disk-state caches, while the 3,423,744 bits of RAM provide write-coalescing buffers and metadata caches. Hot-plug hot-swap and surprise-removal logic is hardened in the FPGA's hot-socketing controller, simplifying board design. The 1020-ball FC-FBGA fits within standard ATCA/AMC storage module footprints. Compared with discrete PHY + ASSP solutions, the integrated transceivers reduce board layers and BOM cost while delivering better signal integrity.
Recomendado
Industrial Imaging and Machine Vision
High-speed industrial camera systems use the EP1SGX40FF1020C7 to aggregate multiple CoaXPress, Camera Link, or GigE Vision channels at 3.1875 Gbps per transceiver. Its 624 user I/Os interface to parallel CCD/CMOS sensor arrays and trigger synchronisation buses, while the 176 DSP blocks handle real-time Bayer demosaicing, white-balance, and gamma correction at line rate. The 3,423,744 bits of embedded RAM hold multi-frame buffers for line-scan camera reconstruction. Hardened PCI Express PIPE blocks enable direct image transfer to a host PC at Gen1 rates with minimal latency. The commercial 0-85 °C junction range suits factory-floor enclosures with appropriate airflow. Quartus II IP cores for Camera Link, CoaXPress, and GigE Vision accelerate integration for vision-system OEMs.
Recomendado
Medical Imaging and Diagnostic Equipment
Medical imaging modalities (ultrasound, CT, MRI, X-ray digitiser) leverage the EP1SGX40FF1020C7's 20 transceivers to ingest high-frequency data from multi-channel probe arrays and digitiser boards. The 176 9-bit DSP blocks execute beamforming, FFT, and back-projection algorithms in real time, while the 3,423,744 bits of embedded RAM hold image reconstruction tiles without external memory in some configurations. Its 624 I/O pins interface to legacy parallel imaging buses and LVDS channels from front-end ADCs, and the PCI Express PIPE endpoint transfers reconstructed images to the host workstation. The commercial 0-85 °C range suits the controlled environments of hospital equipment rooms. Quartus II supports IEC 62304 / IEC 61508 design flows and DO-254 documentation packages required for medical / safety-critical certification.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1SGX40FF1020C7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1SGX40FF1020C6 | EP1SGX40FF1020C5 | EP1SGX40F1020C6 | EP1SGX40F1020C5N | EP1SGX40F1020 | EP1S60F1020C7 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) |
| Speed Grade | -7 (mid) | -6 (slower) | -5 (slowest) | -6 (slower) | -5 (slowest) | no suffix (default) | -7 (mid) |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 57,120 |
| Embedded Memory (bits) | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 5,138,016 |
| User I/O Pins | 624 | 624 | 624 | 624 | 624 | 624 | 624 |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Principais diferenciais
- 20 × 3.1875 Gbps transceiver channels in a single device (vs EP1SGX25FF1020C7)
- Mid-speed -7 grade balances cost and timing margin (vs EP1SGX40FF1020C6)
- Hardened PCI Express PIPE endpoint (vs EP1S60F1020C7)
- 3,423,744 bits of embedded RAM via TriMatrix architecture (vs EP1SGX40DF1020C7)
Notas de projeto
Estimated: The Stratix GX PowerPlay early-power estimator is required before PCB layout because the EP1SGX40FF1020C7 can dissipate 10-25 W depending on transceiver utilisation, logic activity, and clock tree. A typical base-station design with 16 active 3.1875 Gbps channels at 80% utilisation draws approximately 18 W from VCCINT (1.5 V) plus 4-6 W from VCCIO banks and 3-5 W from VCCA/VCCP/VCCR transceiver rails. Design a 6-layer board with dedicated VCCINT, VCCIO, VCCA/VCCP/VCCR and GND planes to minimise return-path impedance, and place 0402/0201 ceramic decoupling within 1-2 mm of every supply ball per Stratix GX layout guidelines.
Each 3.1875 Gbps transceiver channel needs 100 Ω differential routing with controlled 100 Ω ± 10% impedance, intra-pair length matching of ± 0.13 mm (5 mil), and inter-pair matching of ± 0.64 mm (25 mil). Use a 4-PCB layer stack-up for the transceiver region with a stripline geometry; the Stratix GX device-handbook layout chapter (Chapter 7) provides stack-up recommendations for the 1020-ball FC-FBGA package. Maintain 100 Ω reference ground impedance with continuous ground underneath each differential pair, and stitch vias every λ/20 of the operating frequency (about every 50 mm at 3.125 GHz). Transmitter pre-emphasis and receiver equalisation settings are configured via the ALTGX megafunction in Quartus II.
Do not assume 5 V tolerance on user I/O pins - the Stratix GX supports VCCIO levels of 1.5 V, 1.8 V, 2.5 V, and 3.3 V, and exceeding the per-bank VCCIO range will damage the device. The configuration controller must observe VCCINT/VCCA power-sequencing rules; configure the MSEL pins correctly for your boot mode (AS, PS, JTAG) before applying power. Hot-socketing is supported but you must tri-state outputs during insertion - the Stratix GX hot-socketing feature requires dedicated board-level sequencing. Lastly, do not forget the JTAG TCK pull-down and TMS pull-up resistors specified in the device handbook - missing these will cause configuration failures.
Estimated: At full 20-transceiver utilisation the EP1SGX40FF1020C7 may dissipate 20-25 W. With the 1020-ball FC-FBGA's θJA of approximately 8 °C/W on a standard JEDEC test board, the junction-to-ambient rise would be 160-200 °C, which exceeds the 85 °C commercial junction limit at 25 °C ambient. Use a thermal enhanced test board with thermal vias and a heatsink, or design a cold-plate assembly for chassis with forced airflow ≥ 200 LFM. The Stratix GX AN-463 application note provides detailed thermal modelling examples for the 1020-ball BGA package.
At 3.1875 Gbps transceiver rates, signal-integrity simulation (pre-layout and post-layout) is mandatory. Use HyperLynx, SiSoft QCD, or Ansys SIwave with the Stratix GX IBIS-AMI models available from Intel's website. Pre-emphasis, de-emphasis, and receiver CTLE settings must be tuned per channel based on the simulated channel loss at the Nyquist frequency. The ALTGX megafunction in Quartus II also exports per-lane eye-diagram measurements via SignalTap II for in-system validation.
Informações de conformidade
Stratix GX devices comply with RoHS 6/6 and are lead-free. No AEC-Q100 qualification (commercial temperature range only).
