EP1S60F1020C6N - Stratix FPGA, 57K Logic Elements, FBGA-1020 | Intel
MPN: EP1S60F1020C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 100 | $240 | $24,000.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $195 | $195,000.00 |
Drop-in alternatives for EP1S60F1020C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1S60F1020C6N Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Family | Stratix (EP1S) |
| Logic Elements (LEs) | 57,120 |
| Logic Cells | 6,570 blocks (per chipdig datasheet summary) |
| Embedded RAM (Total Bits) | 5,215,104 bits |
| Embedded Multipliers | 773 (18x18) |
| Maximum User I/O Pins | Per datasheet, package-dependent (F1020 variant) |
| Package Type | 1020-ball FBGA (FineLine BGA), 33 x 33 mm, 1 mm pitch |
| Logic Family / Process | CMOS, 0.13 µm |
| Operating Temperature | 0°C to +85°C (Commercial) |
| Supply Voltage | Per datasheet (Stratix Device Handbook Vol. 1) |
| Speed Grade | C6 (mid-tier) |
| Lead-Free / Pb-Free | Yes (suffix 'N') |
| RoHS Status | Compliant (per 'N' suffix) |
| Mounting Type | Surface Mount (BGA) |
| Configuration | JTAG / Passive Serial / Fast Passive Parallel via MSEL pins |
| PLL Count | 12 (per Stratix family datasheet) |
| Memory Block Types | TriMatrix (M512, M4K, M-RAM) |
EP1S60F1020C6N 1020-ball fbga (fineline bga), 33 x 33 mm, 1 mm pitch Pin Configuration Guide
Complete pinout information for EP1S60F1020C6N (1020-ball fbga (fineline bga), 33 x 33 mm, 1 mm pitch package) with Per datasheet, package-dependent (F1020 variant) pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S60F1020C6N.
Refer to the datasheet for full pin configuration.
Estimated pin count: Per datasheet, package-dependent (F1020 variant) pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S60F1020C6N is suitable for 6 applications: 10G/40G Telecom Line Card Processing, Software Defined Radio (SDR) Baseband, High-Definition Video Processing, ASIC Prototyping and Emulation, Medical Imaging Reconstruction, Industrial Automation Motion Control.
10G/40G Telecom Line Card Processing
The EP1S60F1020C6N fits 10G/40G telecom line card processing because its 57,120 logic elements, 5.2 Mbits of TriMatrix embedded RAM, and 773 18x18 multipliers deliver the throughput required for packet classification, traffic management, and forward error correction. The 12 PLLs and high-speed LVDS I/O (up to 840 Mbps per channel) enable clean clocking of multi-rate SerDes and switch-fabric interfaces. Placed on a line card between the network processor and the framer, the part performs layer-2/3 header parsing and Reed-Solomon FEC at line rate. The trade-off versus an ASIC is lower per-unit throughput but much faster NRE turnaround for evolving protocol standards like OTU2 and FlexE.
Recommended
Software Defined Radio (SDR) Baseband
The EP1S60F1020C6N is well suited to SDR baseband processing, where its 773 dedicated 18x18 multipliers and large embedded memory deliver the FIR filter taps, FFT butterfly operations, and channelization buffers required for wideband digital down-conversion. Combined with external high-speed ADCs and DACs, the device can implement 100+ MHz instantaneous bandwidth waveforms such as LTE, WiMAX, or proprietary military waveforms. The TriMatrix M-RAM blocks (512 Kbit each) are ideal for storing FFT window coefficients. Unlike a DSP processor, the FPGA achieves deterministic latency critical for TDD half-duplex switching, at the cost of higher power consumption.
Recommended
High-Definition Video Processing
The EP1S60F1020C6N suits high-definition video processing pipelines including 1080p60 broadcast format conversion, scaling, deinterlacing, and color-space conversion. Its 5.2 Mbits of embedded RAM holds multiple video line buffers (M4K and M-RAM blocks) needed for 2D FIR filtering and motion-adaptive deinterlacing, while the 773 multipliers handle polyphase scaler taps at full HD rates. The high LVDS bandwidth is sufficient for dual-channel DVI/HDMI input bridges at 1.65 Gbps per link. Designers pair this part with external DDR SDRAM for frame store and use the Stratix ALM fabric for the scaler state machine.
Recommended
ASIC Prototyping and Emulation
The EP1S60F1020C6N is frequently used in ASIC prototyping platforms where its 57K LEs and abundant multipliers map a sizeable portion of a mid-complexity ASIC block. Multiple Stratix FPGAs can be cascaded via LVDS to emulate multi-million-gate ASICs, with the JTAG chain providing unified programming. The embedded TriMatrix memory and PLL count permit accurate emulation of clock trees and SRAM macros. Compared with dedicated emulation systems like Cadence Palladium, the Stratix array offers lower per-cycle cost but slower debug visibility. Designers map timing-critical paths first and use TimeQuest SDC constraints to verify setup/hold across the array.
Recommended
Medical Imaging Reconstruction
The EP1S60F1020C6N fits medical imaging reconstruction algorithms such as CT filtered back-projection and MRI FFT-based reconstruction. The 773 multipliers perform parallel ray summation and voxel interpolation at diagnostic frame rates, while the embedded memory buffers 512x512 image slices with sufficient bandwidth. The commercial temperature range (0 to +85°C) is adequate for controlled-room imaging cabinets, though the EP1S60F1020I6N variant should be selected for mobile cart or bedside platforms. Compared with GPU implementations, the FPGA delivers deterministic per-patient scan latency, critical for synchronized X-ray source triggering.
Recommended
Industrial Automation Motion Control
The EP1S60F1020C6N supports industrial automation motion control with multi-axis servo loops and high-speed deterministic response. The 57K LEs handle PID loops for 16+ axes simultaneously at 32 kHz loop rates, while the LVDS I/O interfaces directly to resolver-to-digital converters and incremental encoder inputs. The 12 PLLs generate synchronized PWMs for IGBT-based motor drivers and the TriMatrix memory stores trajectory tables. The 1020-ball BGA provides sufficient user I/O for parallel axis expansion. Compared with a microcontroller, the FPGA delivers deterministic multi-axis latency below 1 µs at the cost of higher quiescent power.
Recommended
Recommended Products Summary
Engineering reference data for EP1S60F1020C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S60F1020C5N | EP1S60F1020C6 | EP1S60F1020C5 | EP1S60F1020I6N | EP1S40F1020C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-1020 (33x33 mm, 1 mm pitch) | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same (verify I/O mapping) |
| Logic Elements | 57,120 | 57,120 (same) | 57,120 (same) | 57,120 (same) | 57,120 (same) | ~41,250 (-28%) |
| Embedded RAM (bits) | 5,215,104 | 5,215,104 (same) | 5,215,104 (same) | 5,215,104 (same) | 5,215,104 (same) | 3,423,744 (-34%) |
| Embedded Multipliers (18x18) | 773 | 773 (same) | 773 (same) | 773 (same) | 773 (same) | 448 (-42%) |
| Speed Grade | C6 (commercial) | C5 (slower) | C6 (same) | C5 (slower) | I6 (industrial) | C6 (same) |
| Operating Temperature | 0°C to +85°C (Commercial) | 0°C to +85°C (Commercial) | 0°C to +85°C (Commercial) | 0°C to +85°C (Commercial) | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) |
| Lead-Free (Pb-Free) | Yes (N suffix) | Yes | No (leaded) | No (leaded) | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- C6 speed grade offers higher Fmax than the C5 variant for timing-critical DSP paths (vs EP1S60F1020C5N)
- Lead-free (Pb-free) termination suitable for RoHS-compliant assemblies (vs EP1S60F1020C6)
- Full 57,120-LE density vs 41,250 LEs in the EP1S40 package twin (vs EP1S40F1020C6N)
Design Notes
Estimated: At typical Stratix EP1S60 utilization of 70% LEs and 50% RAM switching at 200 MHz, total power consumption is approximately 4-6 W. Decouple all VCCINT balls with 0.1 µF X7R ceramics placed within 50 mils of each ball cluster, and add four bulk 220 µF tantalum capacitors around the package perimeter. Separate VCCINT and VCCIO planes must be split under the BGA escape to avoid simultaneous switching noise coupling into the core logic. Follow the Stratix Device Handbook PowerPlay section for accurate early-stage power estimation.
The 1020-ball FBGA at 1 mm pitch requires at least 12 PCB layers with 1 oz copper power planes. Use laser-drilled microvias (4-6 mil pad) with 0.5 oz signal layers and 1 oz power/ground layers. Fan-out routing should follow a dog-bone or via-in-pad escape pattern, and all 1020 balls should be connected with 0.5 oz copper traces minimum. Reference Intel AN-224 (Stratix Board Design Guidelines) for via-in-pad recommendations and matched-length LVDS pair routing within 5 mil tolerance.
Three common pitfalls when bringing up the EP1S60F1020C6N: (1) leaving MSEL configuration pins floating - they MUST be tied high or low per the desired configuration mode (AS, PS, JTAG); (2) using a non-1.8V VCCPD supply with the wrong JTAG voltage causing programming failure - verify VCCPD matches the I/O bank reference; (3) ignoring nCONFIG and nSTATUS reset sequencing - hold nCONFIG low for at least 2 µs after power stable. Always use the latest Quartus II Service Pack and the matching BSDL file for boundary-scan testing.
Estimated: At 5 W dissipation and the FBGA-1020 theta-JA of approximately 12-15 °C/W (still air, JEDEC 4-layer board), junction-to-ambient rise is 60-75 °C. For commercial-temperature (0-85°C) operation, internal junction temperature must remain below 85°C, so ambient must stay under 10-25°C without airflow. Add 200 LFM forced-air cooling, or a heat spreader (e.g., 30 x 30 mm copper pad bonded to the BGA top with thermal epoxy), to keep junction below 100°C. For industrial applications using the EP1S60F1020I6N variant, thermal headroom is even tighter.
Compliance Information
RoHS compliance inferred from 'N' suffix per Altera/Intel legacy packaging convention. REACH, halogen-free, and conflict-minerals status not stated in verified data and should be requested from the supplier. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC.
