EP1S60F1508C7N - Stratix 57K LE FPGA, 1022 I/O, 1508-FCBGA | Intel
N.º da peça: EP1S60F1508C7N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $485 | $485,00 |
| 10 | $460 | $4.600,00 |
| 100 | $420 | $42.000,00 |
| 500 | $380 | $190.000,00 |
| 1.000 | $350 | $350.000,00 |
EP1S60F1508C7N Visão geral
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated silicon resources such as embedded memory, DSP blocks, and high-speed transceivers. Stratix FPGAs sit within the broader hierarchy of programmable logic devices -> complex programmable logic devices (CPLDs) -> FPGAs -> ASIC prototyping platforms, and they are commonly used as a bridge between concept and volume ASIC production.
Key features include 6,570 logic blocks / 5,712 LABs, 252 18x18 multipliers / DSP blocks, twelve 400 MHz PLLs, and up to 12 high-speed transceivers at 3.125 Gbps depending on die variant. The 1508-FCBGA package uses a 1.0 mm ball pitch on a 40 x 40 mm substrate, providing the routing density required for the Stratix memory-rich architecture and 521 Mbits of TriMatrix on-chip memory.
Technically, the Stratix architecture employs adaptive logic modules (ALMs) with 8 inputs each, an 18-bit DSP block capable of 420 MHz operation, and dedicated high-speed I/O support for LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI standards. The part is suitable for prototyping and production in telecom, networking, and high-performance digital signal processing where 57K LEs and 1,022 I/O are required.
Typical applications include high-speed data acquisition, software-defined radio, ASIC prototyping, image processing pipelines, and networking line-card logic. The wide I/O count makes it useful for memory-rich designs that connect to multiple DDR/QDR SRAM banks.
When designing with this part, ensure 4-layer PCB stack-up with controlled impedance for high-speed I/O, and follow Altera Stratix reference design guidelines for power rail sequencing. The 1508-ball package demands precise BGA layout and refabrication processes.
This page synthesizes distributor pricing, package-die drop-in alternatives from the same Altera Stratix family, and practical design notes that go beyond the manufacturer datasheet to help engineers qualify second sources for long-lifecycle programs.
Alternativas drop-in para EP1S60F1508C7N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1S60F1508C7N (mesmo formato e footprint) — diferindo em Family, Operating Temperature, PLLs, Package, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1S60F1508C7
✅ Drop-In✓ Em estoque
$171 / unidade
Ver ficha técnica →EP1S60F1508C6N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP1S60F1508C7N Classificações máximas e características elétricas
| Series | Stratix |
| Family | Stratix (EP1S60) |
| Logic Elements (LEs) | 57,120 |
| Logic Blocks / LABs | 5,712 LABs (6,570 CLBs) |
| Total Embedded RAM | 5,215,104 bits (521 Kbits) |
| User I/O Pins | 1,022 |
| DSP / Multiplier Blocks | 18-bit DSP blocks |
| PLLs | 12 (up to 400 MHz) |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Temperatura de operação | 0 °C to 85 °C (Commercial) |
| Encapsulamento | 1508-ball FC-FBGA, 1.0 mm pitch, 40 x 40 mm |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Lead-free / RoHS compliant per datasheet |
| Lead-Free | Yes |
| Lifecycle | Obsolete - Stratix family EOL |
Guia de Configuração de Pinos do EP1S60F1508C7N 1508-ball fc-fbga, 1.0 mm pitch, 40 x 40 mm
Configuração de pinos para EP1S60F1508C7N (pacote 1508-ball fc-fbga, 1.0 mm pitch, 40 x 40 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1S60F1508C7N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1S60F1508C7N é adequado para 6 aplicaçãos: Telecom Line-Card ASIC Prototyping, High-Performance DSP and Image Processing, Software-Defined Radio (SDR) Baseband, Networking Switch Fabric, Military / Aerospace Legacy Avionics, Industrial Test and Measurement Instrumentation.
Telecom Line-Card ASIC Prototyping
The EP1S60F1508C7N's 57,120 logic elements and 1,022 user I/O pins make it a strong fit for telecom line-card ASIC prototyping, where engineers emulate custom packet-processing chips before taping out silicon. Its 521 Kbits of TriMatrix on-chip RAM support wide packet buffers and lookup tables without external SRAM for many control-plane tasks. The 12 PLLs and 420 MHz DSP blocks handle serializer/deserializer and framer logic at line rates. Compared to ASIC, it allows same-day RTL iteration, but consumes more power at the 1.5 V core.
Recomendado
High-Performance DSP and Image Processing
With 18-bit DSP blocks clocked at up to 420 MHz and 521 Kbits of embedded RAM, the EP1S60F1508C7N is well suited to high-performance DSP and real-time image processing pipelines, including FFTs, FIR filters, and convolution accelerators. The 1,022 user I/O pins let designers attach multiple DDR/QDR SRAM banks and high-resolution video ADCs in parallel. The 130 nm CMOS process trades off against newer 65 nm / 28 nm FPGAs in power efficiency, but remains adequate for fixed-function DSP cards in industrial imaging. Altera's DSP Builder and Quartus II toolchain support direct MATLAB-to-FPGA flow for image-processing teams.
Recomendado
Software-Defined Radio (SDR) Baseband
The EP1S60F1508C7N's combination of 57,120 LEs, dedicated 18-bit DSP blocks, 12 PLLs, and up to 12 high-speed serial transceivers (3.125 Gbps) depending on die variant positions it as a viable SDR baseband engine for sub-6 GHz waveforms. The 1,022 user I/O pins route digital baseband to RF front-end ADCs/DACs and provide ample GPIO for control and synchronization. Embedded TriMatrix memory supports waveform sample buffers and channelization tables at baseband. Designers should budget for the 130 nm process's higher static power vs modern Arria 10 / Stratix 10 alternatives when sizing thermal solutions.
Recomendado
Networking Switch Fabric
In networking switch-fabric designs, the EP1S60F1508C7N's wide I/O count (1,022) and 521 Kbits of TriMatrix RAM enable multi-queue packet schedulers and CAM-like lookup engines for 10G / 40G aggregate line cards. The 12 PLLs generate independent clocks for SERDES lanes and backplane SerDes links. Pin-compatible Stratix variants such as EP1S40F1020C7N allow right-sizing of fabric capacity per port count. The 130 nm die delivers proven reliability for long-lifecycle telecom programs where re-qualification cost outweighs the power-efficiency advantage of newer nodes.
Recomendado
Military / Aerospace Legacy Avionics
The EP1S60F1508C7N's commercial-grade operating range (0 °C to 85 °C) and high logic density have made it a go-to prototyping FPGA for legacy avionics and military signal-processing subsystems where long-qualified Altera toolchains are required. The 1508-ball FC-FBGA withstands the mechanical shock and vibration profile of airborne platforms when paired with underfilled PCB assemblies. TriMatrix memory and DSP blocks accelerate radar and SIGINT pre-processing algorithms. Designers should note the part is EOL and must qualify Stratix II EP2S60F1508C5N or industrial-grade EP1S60F1508I7N as second sources.
Recomendado
Industrial Test and Measurement Instrumentation
Test and measurement instruments - oscilloscopes, logic analyzers, protocol testers, and arbitrary waveform generators - leverage the EP1S60F1508C7N's 1,022 user I/O and 521 Kbits of embedded memory to implement parallel acquisition channels and deep sample buffers. The 12 PLLs synchronize multiple ADC clock domains within a single device. Compared with newer FPGAs, the 130 nm Stratix die consumes more watts per MHz, but its mature Altera Quartus II design flow and abundant reference designs accelerate time to market for niche instrumentation products. Pin-compatible Stratix variants let designers right-size cost per channel.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1S60F1508C7N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1S60F1508C7 | EP1S60F1508C6N |
|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1508-ball FC-FBGA | 1508-ball FC-FBGA - identical | 1508-ball FC-FBGA - identical |
| Logic Elements | 57,120 LEs | 57,120 LEs | 57,120 LEs |
| Embedded RAM | 5,215,104 bits | 5,215,104 bits | 5,215,104 bits |
| User I/O | 1,022 | 1,022 | 1,022 |
| Speed Grade | -7 | -7 | -6 (slower Fmax) |
| Temperature Grade | Commercial (0 to 85 C) | Commercial (0 to 85 C) | Commercial (0 to 85 C) |
| Lead-Free (N suffix) | Yes (N suffix) | No (non-N variant) | Yes (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Highest-density member of the original Stratix family with 1,022 user I/O (vs EP1S60F1020C7N)
- Faster speed grade than the -6 variant (vs EP1S60F1508C6N)
- Lead-free (N suffix) compliance for modern RoHS designs (vs EP1S60F1508C7)
Notas de projeto
The EP1S60F1508C7N 1508-ball FC-FBGA package is rated at a theta-JA of approximately 15 C/W with appropriate thermal via arrays under the BGA. Designers must use a 4-layer PCB with a solid ground/power plane and a full array of thermal vias under the central die region to keep the junction below 100 C at 1.5 V core and 0.5 to 0.8 A typical core current. Stratix power calculator files in Altera Quartus II estimate worst-case power at ~5 W, so a small heatsink or 6-Layer PCB stack-up is recommended for forced-air-cooled chassis.
Use a high-density BGA fan-out with microvia-in-pad or via-on-pad construction to escape the 1.0 mm pitch FC-FBGA; standard 0.8 mm laser-drilled microvias on a 4-layer 1 oz copper stack-up are typical. Match trace impedance to 50 ohm single-ended / 100 ohm differential for high-speed LVDS lanes. Decouple VCCINT with 0.1 uF, 1 uF, and 10 uF ceramic capacitors distributed beneath the package, plus bulk tantalum/polymer capacitors on the 1.5 V and 3.3 V rails per the Stratix hardware reference.
Estimated: with 130 nm CMOS and 1.5 V core, VCCINT decoupling must be placed within 50 mils of each BGA power pin and use low-ESL ceramics; missing decoupling causes PLL jitter and LVDS eye-pattern degradation. Always configure unused user I/O as tri-stated inputs with internal weak pull-up enabled in the Quartus pin planner. Finally, because this part is EOL, do not start new high-volume designs on the EP1S60F1508C7N - qualify the EP1S60F1508C7 or the EP1S60F1508C6N as second source and migrate to Stratix II EP2S60F1508C5N for new programs.
Informações de conformidade
Lead-free / RoHS compliant per the Altera datasheet (N suffix indicates lead-free terminal finish). REACH, halogen-free, and conflict-mineral status were not explicitly stated in the verified data and remain unknown.
