EP1S60F1020C7N - Stratix 60 FPGA, 57120 LEs, 1020-BGA | Intel
MPN: EP1S60F1020C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2227.38 | $2,227.38 |
| 10 | $2050 | $20,500.00 |
| 100 | $1850 | $185,000.00 |
| 500 | $1700 | $850,000.00 |
| 1,000 | $1580 | $1,580,000.00 |
Drop-in alternatives for EP1S60F1020C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1S60F1020C7N Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Family | Stratix (EP1S) |
| Logic Elements (LE) | 57120 |
| Logic Array Blocks (LABs) | 5712 |
| Embedded Memory (bits) | 5,215,104 |
| Maximum User I/O | 773 |
| Package | 1020-ball FC-FBGA |
| Package Size | 33 mm x 33 mm, 1.0 mm pitch |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Operating Temperature | 0 °C to 85 °C (Commercial) |
| Speed Grade | C7 |
| Maximum Internal Frequency | 420.17 MHz |
| Embedded PLLs | 6 |
| DSP Blocks (18x18 multipliers) | Yes |
| Configuration Modes | PS, PPS, PPA, JTAG |
| Mounting Type | Surface Mount |
EP1S60F1020C7N 33 mm x 33 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1S60F1020C7N (33 mm x 33 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S60F1020C7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S60F1020C7N is suitable for 6 applications: Telecommunications Line Cards, Military / Aerospace Signal Processing, ASIC Prototyping, High-Performance Industrial Imaging, High-Throughput Data Acquisition, Software Defined Radio Baseband.
Telecommunications Line Cards
The EP1S60F1020C7N fits telecom line-card applications because it combines 57,120 LEs with 5,215,104 bits of embedded memory and 773 user I/Os, all on a 130 nm Stratix fabric that runs at Fmax up to 420 MHz. In a typical line card, the FPGA implements packet classification, traffic shaping, and SERDES framer glue logic between network processors and optical transceivers. The 6 on-chip PLLs provide the multiple low-jitter clock domains needed for TDM, SONET/SDH, and Ethernet backplanes, while the dedicated 18x18 multipliers accelerate Reed-Solomon and CRC offload. Compared to ASIC turn, the Stratix approach gives carriers a reprogrammable platform that survives evolving protocol stacks without board respin.
Recommended
Military / Aerospace Signal Processing
The EP1S60F1020C7N is widely deployed in military signal-processing boards because of its high logic density, commercial-temperature qualification path, and the long-term availability commitment from Intel/Altera for the Stratix family. With 5,712 LABs, embedded DSP blocks, and 12 transceiver channels, the device can implement radar pulse compression, electronic-warfare channelizers, and secure communications encryption on a single die. The 1020-ball FC-FBGA package is ruggedized by the customer's substrate and underfill process for vibration and thermal cycling. The wide operating-temperature screening path (commercial 0 °C to 85 °C here; industrial variants available as EP1S60F1020I7N) lets the same design support COTS military and aerospace platforms.
Recommended
ASIC Prototyping
The EP1S60F1020C7N's combination of 57,120 LEs, 5 Mbit of embedded memory, and 773 user I/Os makes it a strong vehicle for ASIC prototyping where the target ASIC has up to ~3-5 M gates. Designers map their ASIC RTL into one or more Stratix FPGAs, validate functional and timing behavior at near-real speeds, and produce a working hardware platform months before tape-out. The 1020-ball FC-FBGA exposes enough I/O to bring out wide processor buses, DDR memory interfaces, and SERDES links to daughter cards for full system bring-up. Compared to ASIC emulation boxes, the EP1S60 offers lower per-unit cost for small-volume prototypes, at the trade-off of lower MHz and split synthesis flows.
Recommended
High-Performance Industrial Imaging
The EP1S60F1020C7N is suitable for industrial machine-vision and high-speed imaging because it can absorb multi-channel Camera Link or LVDS camera streams into on-chip memory and process pixels in real time. The 12 LVDS channels support up to 840 Mbps per pair, allowing multiple 10-tap Camera Link cameras to be ingested in parallel. The 5 Mbit of TriMatrix memory provides line buffers, frame buffers, and histogram accumulators without external SRAM, while the 18x18 DSP blocks accelerate Bayer demosaic, edge detection, and FFT preprocessing. The 1020-ball BGA's 773 I/Os route directly to camera connectors, DDR SDRAM, and high-speed serializer outputs.
Recommended
High-Throughput Data Acquisition
For data-acquisition systems (DAS) that aggregate multiple ADC channels into a single processing engine, the EP1S60F1020C7N's high pin count and large memory make it a natural fit. The 1020-ball FC-FBGA brings in 16-bit parallel LVDS ADC buses from several converters simultaneously, while 5 Mbit of embedded memory serves as a deep FIFO between the ADC clock domain and the back-end processing clock. The 6 on-chip PLLs de-skew the ADC clocks and synthesize the back-end processing clocks at independent frequencies, allowing simultaneous sampling and DSP at different rates. Designers use the 18x18 multipliers for FIR filtering and the LABs for custom trigger logic, all on one Stratix die.
Recommended
Software Defined Radio Baseband
The EP1S60F1020C7N's combination of 5 Mbit embedded memory, 18x18 DSP blocks, and high LVDS bandwidth makes it useful for software-defined radio (SDR) baseband processing, particularly in legacy military radio programs. The DSP blocks implement up to hundreds of taps of polyphase FIR filtering and FFT butterflies, while the LABs handle state-machine control and protocol framing. The 1020-ball FC-FBGA exposes 773 user I/Os to interface with RF front-end ADCs/DACs and back-end Ethernet or Aurora links. Compared to DSP processor clusters, the Stratix approach delivers deterministic latency and higher throughput per watt for the same DSP workload.
Recommended
Recommended Products Summary
Engineering reference data for EP1S60F1020C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S60F1020C7 | EP1S60F1020C6N | EP1S60F1020C5N | EP1S60F1020 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-ball FC-FBGA (33x33 mm) | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements | 57,120 | 57,120 | 57,120 | 57,120 | 57,120 |
| Embedded Memory (bits) | 5,215,104 | 5,215,104 | 5,215,104 | 5,215,104 | 5,215,104 |
| Maximum User I/O | 773 | 773 | 773 | 773 | 773 |
| Speed Grade | C7 | C7 | C6 (slower) | C5 (fastest) | Not specified |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
| Terminal Finish Suffix | 'N' (lead-free) | No 'N' (standard) | 'N' (lead-free) | 'N' (lead-free) | Not specified |
Key Differentiators
- C7 commercial speed grade - cost-optimized for legacy timing margins (vs EP1S60F1020C6N)
- Lead-free terminal finish ('N' suffix) (vs EP1S60F1020C7)
- High pin-count 1020-ball FC-FBGA - maximizes user I/O to 773 (vs EP1S60F1020C7 in same package)
Design Notes
The 1020-ball FC-FBGA has a 1.0 mm pitch and 33 mm x 33 mm body, which requires a high-layer-count PCB (at least 8-10 layers) with fine-line escape routing and microvia stack-ups (laser-drilled vias are mandatory). Use 50 ohm controlled-impedance routing for LVDS pairs and length-match within 150 mil for high-speed byte lanes. Provide a continuous ground plane under the BGA and stitch vias around the perimeter to suppress return-path discontinuities. The thermal pad/balls on the underside of the FC-FBGA must be soldered to a thermal pad pattern to achieve the 31 C/W theta-JA specification.
Stratix EP1S60 devices have multiple supply rails: VCCINT (1.5 V core), VCCIO (1.5/1.8/2.5/3.3 V per bank), VCC_PLL (1.5 V for PLL analog), VCCA (1.5 V analog) and VCCD_PLL. Estimated: a fully-utilized EP1S60 design with all 57,120 LEs toggling at 200 MHz can pull 3-5 A on VCCINT. Use a star-ground topology, place decoupling capacitors as close as possible to each BGA ball pair, and provide a bulk 330 uF tantalum plus 100 uF ceramic on each rail. Voltage tolerance is +/-5% on VCCINT and +/-3% on VCCA/VCC_PLL per the Stratix Handbook.
Do not migrate EP1S60F1020C7N bitstreams to EP2S60 or EP4CE parts: the silicon is different and the configuration bitstream will not load. Use only Altera Quartus II version 13.0 or earlier for the EP1S60 family - newer Quartus versions removed Stratix 130 nm support. When generating configuration bitstreams, ensure the configuration mode (AS, PS, PPS, PPA, JTAG) matches the EPC or EPCS device on the board; a mismatch will leave the FPGA unconfigured. Always check the 'N' suffix on the part number for lead-free terminal finish if RoHS compliance is required by the end-customer.
LVDS inputs on the EP1S60 require 100 ohm differential termination across each LVDS pair at the receiver BGA ball. Series-coupling capacitors should be placed close to the driver side for AC-coupled interfaces. For DDR SDRAM interfaces, use the Altera DDR controller megafunction and follow the Stratix External Memory Interface Handbook for read/write leveling; failing to enable DQS delay chains results in intermittent read errors. For multi-FPGA designs, Aurora or LVDS-based chip-to-chip links should be length-matched within +/-10 ps to avoid eye-margin degradation.
Compliance Information
'N' suffix in part number indicates lead-free terminal finish per Altera/Intel ordering information. RoHS, REACH, halogen-free and conflict-minerals status not explicitly stated in the verified web data - set to 'unknown'. AEC-Q100 not applicable - this is a commercial-grade FPGA.
