EP1S80F1508C7 - Stratix 80K LEs, 1203 I/O FPGA BGA-1508 | Intel
N.º da peça: EP1S80F1508C7 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $139.85 | $139,85 |
| 10 | $132.5 | $1.325,00 |
| 100 | $124.2 | $12.420,00 |
| 500 | $115.8 | $57.900,00 |
| 1.000 | $108.4 | $108.400,00 |
EP1S80F1508C7 Visão geral
What is a Stratix FPGA? A Stratix FPGA (Field-Programmable Gate Array) is a high-performance programmable logic device built on SRAM lookup-table architecture. As an FPGA, it sits in the broader hierarchy of programmable logic (PLD) -> programmable logic device -> semiconductor IC, and combines configurable logic blocks (LABs), embedded RAM blocks (M512/M4K/M-RAM), DSP blocks, and high-speed transceivers on a single die. Stratix was Intel/Altera's flagship high-density family before Cyclone/Stratix successors.
Key features of the EP1S80F1508C7 include 28 DSP blocks with up to 224 (9-bit x 9-bit) embedded multipliers optimized for DSP applications, embedded TriMatrix memory architecture for variable-width RAM/ROM, dedicated external memory interface circuitry (DDR SDRAM, QDR SRAM, ZBT SRAM, SDR SDRAM), and up to 12 high-speed transceiver channels depending on device variant. The 'C7' speed grade and 'C' temperature grade (commercial, 0C to 85C) place this part in the mainstream performance bin.
Architecture depth: the TriMatrix memory hierarchy uses M512 (512-bit), M4K (4-Kbit), and M-RAM (512-Kbit) blocks to give designers a granular trade-off between density and width. The DSP blocks each contain eight 9x9 multipliers, an adder tree, and accumulators supporting arithmetic operations on signed/unsigned data, accelerating FIR filters, FFTs, and complex mixers.
Typical applications for the EP1S80F1508C7 include telecom base-station channel cards, high-speed data-acquisition backplanes, ASIC prototyping, and DSP-intensive signal-processing boards. The 1203 user I/O count allows large parallel bus aggregation, while the abundant 7.4 Mbit on-chip RAM buffers high-throughput packet or image data without resorting to external memory for first-level FIFOs.
Design tip: Stratix FPGAs need a configuration controller (EPC or MAX series) for SRAM-based configuration; the device is volatile at power-up. Multi-voltage I/O banks require per-bank VCCIO supply routing, and the joint Altera/Intel toolchains (Quartus II, then Quartus Prime) are required for synthesis, place-and-route, and timing closure.
This page consolidates distributor pricing, same-family Stratix drop-in alternatives, and practical design guidance beyond what is in the manufacturer datasheet, helping engineers quickly assess fit, supply risk, and PCB-impact-free replacement options.
Alternativas drop-in para EP1S80F1508C7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1S80F1508C7 (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade, Family, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1S80F1508C7N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP1S80F1508C6
✅ Drop-In✓ Em estoque
$148.2 / unidade
Ver ficha técnica →EP1S80F1508C5
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP1S80F1508I7N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP1S80F1508C6AA
✅ Drop-In✓ Em estoque
$175 / unidade
Ver ficha técnica →EP1S80F1508C7 Classificações máximas e características elétricas
| Family | Stratix |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 79,040 |
| Total LABs/CLBs | 7,904 |
| Total Memory Bits | 7,427,520 |
| Number of I/O | 1203 |
| DSP Blocks | 28 |
| Embedded Multipliers (9x9) | 224 |
| Process Technology | 0.13 um, all-layer copper SRAM |
| Core Voltage | 1.5 V |
| Speed Grade | C7 |
| Temperatura de operação | 0C to +85C (Commercial) |
| Encapsulamento | 1508-BBGA, FCBGA |
| Package Body Size | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Tipo de montagem | Surface Mount (Flip-Chip BGA) |
| Configuration Memory | SRAM (volatile, requires external config device) |
| Status RoHS | Compliant (lead-free) |
Guia de Configuração de Pinos do EP1S80F1508C7 33 x 33 mm
Configuração de pinos para EP1S80F1508C7 (pacote 33 x 33 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1S80F1508C7.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1S80F1508C7 é adequado para 6 aplicaçãos: Telecom Base-Station Channel Card, High-Speed Data Acquisition Backplane, ASIC Prototyping Platform, DSP-Intensive Signal Processing Card, Image and Video Processing Pipeline, Industrial Control and Automation.
Telecom Base-Station Channel Card
The EP1S80F1508C7's 79,040 LEs and 28 DSP blocks with 224 9x9 multipliers make it a strong fit for multi-carrier baseband processing in WCDMA/LTE channel cards, supporting parallel demodulation paths and channel coding. The 7.4 Mbit TriMatrix embedded RAM buffers symbol-rate data between DSP blocks and external QDR SRAM/DDR SDRAM with sub-10 ns access latency, reducing off-chip bandwidth pressure. Its 1203 user I/O pins aggregate parallel RapidIO/CPRI links to baseband backplanes without external bus expander logic, while Altera's hard IP for DDR SDRAM and QDR SRAM controllers simplifies timing closure for memory-intensive line cards. Power estimation must consider ~1.5W quiescent plus dynamic power that scales with toggle rate; the FCBGA package requires a 12-layer PCB with continuous ground and power planes under the BGA.
Recomendado
High-Speed Data Acquisition Backplane
The EP1S80F1508C7's 1203 user I/O enables aggregation of 16+ LVDS data lanes at 1 Gbps each, feeding the 7.4 Mbit embedded RAM for first-level FIFO buffering before DMA to host processors via PCIe hard IP. The 28 DSP blocks support real-time decimation filtering and FFT pre-processing on streaming ADC samples at rates of 250-500 MSPS, offloading computational burden from software. Commercial-grade 0C to +85C operation matches most lab-instrument environments, and the 1.5V core with multiple VCCIO banks allows direct interfacing to 3.3V, 2.5V, and 1.8V ADC/DAC companion parts without level shifters. Estimated dynamic power for a 70%-toggle-rate design is approximately 8-10W; a heatsink or 6+ square inch copper pour is recommended for sustained operation.
Recomendado
ASIC Prototyping Platform
The EP1S80F1508C7's 79,040 LEs make it a common building block for ASIC prototyping platforms that stitch multiple FPGAs together for multi-million-gate emulation. Designers map gate-equivalent ASIC RTL into the Stratix LUTs, M4K/M-RAM blocks, and DSP blocks, with the 1203 I/O pins providing high-fanout TDM traces between FPGAs on the prototyping board. The 1.5V core and 0.13-micrometer process deliver predictable timing closure for prototype bring-up and software validation ahead of ASIC tape-out. Quartus II / Quartus Prime software supports incremental compilation and LogicLock regions for incremental prototyping iterations, dramatically shortening bring-up cycles versus a full re-synthesis.
Recomendado
DSP-Intensive Signal Processing Card
Each of the EP1S80F1508C7's 28 DSP blocks contains eight 9x9 multipliers plus an adder tree and accumulators, totaling 224 multipliers and enabling up to 56 GMACs of 18x18-equivalent throughput in parallel FIR/FFT pipelines. For radar pulse compression, the device supports >250 MHz DSP-block clock rates, comfortably handling 4096-point FFTs at >60k transforms per second. The 7.4 Mbit embedded RAM is partitioned to hold FFT twiddle factors and FIR coefficients without external memory access, reducing latency. The device's 1.5V core voltage keeps dynamic power moderate for radar-class workloads, while the 0C to +85C commercial range matches indoor and sheltered outdoor enclosures typical of signal-intelligence installations.
Recomendado
Image and Video Processing Pipeline
The EP1S80F1508C7's 7.4 Mbit embedded RAM holds multiple full HD video frame lines (1920x1080x10-bit = ~20.7 Mbit) at high frame rates when distributed across M-RAM blocks, supporting real-time image processing such as Bayer demosaicing, edge detection, and histogram equalization in pipeline form. The 1203 I/O pins accommodate parallel camera-sensor interfaces (LVDS sub-LVDS, HiSPi) and HDMI/DVI output pipelines without external serializers. The 28 DSP blocks accelerate 2D convolution operations for image filters at clock rates up to 250 MHz. Commercial temperature grade is acceptable for indoor medical-imaging and broadcast equipment, where ambient temperature is controlled, while the FCBGA's 1 mm pitch simplifies PCB routing compared to finer-pitch Stratix variants.
Recomendado
Industrial Control and Automation
The EP1S80F1508C7's 79,040 LEs implement complex state machines for multi-axis motion control, while the 28 DSP blocks execute high-rate PI/PID loops and field-oriented control (FOC) algorithms for servo drives. The 1203 I/O pins aggregate multiple encoder interfaces (EnDat, BiSS, SSI), PWM outputs for motor inverters, and EtherCAT/PROFINET fieldbus links to controllers. With 7.4 Mbit embedded RAM, designers store commutation tables and trajectory profiles for fast access during multi-axis coordination cycles. Designers requiring extended-temperature operation should select the EP1S80F1508I7N industrial variant (same package) for -40C to +100C operation in factory-floor enclosures without thermal derating. The FCBGA package's 1 mm ball pitch allows standard PCB manufacturing processes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1S80F1508C7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1S80F1508C7N | EP1S80F1508C6 | EP1S80F1508C5 | EP1S80F1508I7N | EP1S80F1508C6AA |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1508-BBGA, FCBGA (33x33 mm, 1.0 mm pitch) | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same |
| Speed Grade | C7 | C7 | C6 (slower) | C5 (slowest) | I7 (industrial, equivalent speed) | C6 (with AA customer screening) |
| Logic Elements | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 |
| Embedded Memory Bits | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 |
| User I/O Pins | 1203 | 1203 | 1203 | 1203 | 1203 | 1203 |
| DSP Blocks / Multipliers | 28 / 224 (9x9) | 28 / 224 | 28 / 224 | 28 / 224 | 28 / 224 | 28 / 224 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Obsolete / NRND | Last-time-buy | Last-time-buy |
Principais diferenciais
- Faster C7 speed grade than C6/C5 alternatives (vs EP1S80F1508C6)
- Commercial temperature versus industrial variant (vs EP1S80F1508I7N)
- Standard ball finish versus lead-free ball finish (vs EP1S80F1508C7N)
- Same 1508-FCBGA package across entire speed/temp matrix (vs EP1S80F1508C5)
Notas de projeto
Estimated: at 70% toggle rate and 250 MHz logic clock, dynamic power for EP1S80F1508C7 is approximately 8-10W on top of ~1.5W quiescent. The 1508-FCBGA package has limited top-side heat dissipation; place a thermal interface material and heatsink or use at least 6 square inches of copper pour on the top-side inner plane with thermal vias to the bottom layer. Ensure junction temperature stays below 100C in commercial temperature applications.
The 1508-BBGA package requires 12+ layer PCB with continuous ground and power planes routed to all four BGA quadrants. Use 0.8 mm micro-via-in-pad with staggered 1.0 mm outer-pitch escape routing; ball-pad diameter 0.5 mm requires 0.15 mm trace width with 0.15 mm clearance per IPC-6012 Class 3 for reliability. Decoupling: place 0.1 uF X7R capacitors within 1 mm of every VCCIO ball, plus 10 uF bulk capacitors every 10 balls along power rails.
The Stratix family uses volatile SRAM configuration - the device WILL NOT boot without an external configuration device (EPC16, EPC64, or MAX-II CPLD). For production designs, also add a 1 ms POR delay and verify CONF_DONE rises correctly. For JTAG programming, ensure TCK frequency stays below 33 MHz; pull TDI/TDO/TMS to known states via 10K resistors when unused. Never run VCCINT at less than 1.5V nominal during configuration or the device may have brown-out logic corruption.
Stratix LVDS pairs require matched-length routing within 0.5 mm and 100-ohm differential impedance with reference plane continuity - never route LVDS over plane splits. For DDR SDRAM interfaces, follow Altera's external memory interface guidelines for t-dwell matching (CK-to-DQS within 50 ps); use the Memory Interface Generator (MIG) tool inside Quartus to generate constraint files. Place the configuration flash within 50 mm of the FPGA's MSEL[2:0] and DCLK pins to minimize noise on the configuration bus.
Informações de conformidade
Per Intel/Altera product page, the EP1S80F1508C7 is RoHS-compliant but uses standard (non-lead-free) ball finish; for lead-free RoHS-compliant ball finish choose EP1S80F1508C7N. AEC-Q100 not applicable for non-automotive FPGA. Halogen-free status not explicitly stated in verified data - marked unknown.