EP1SGX40GF1020I6 - Stratix GX FPGA, 41,250 LEs, 624 I/O | Intel
N.º da peça: EP1SGX40GF1020I6 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 500 | $199.5 | $99.750,00 |
| 1.000 | $175 | $175.000,00 |
EP1SGX40GF1020I6 Visão geral
What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs/LABs), programmable interconnects, and dedicated hard IP blocks (memory, DSP, transceivers, PLLs). FPGAs occupy the middle ground between fixed-function ASICs and software-programmable processors: they are hardware-reconfigurable, parallel by design, and ideal for data-path-intensive workloads. Stratix GX specifically extends the Stratix family with multi-gigabit transceivers, targeting high-speed serial I/O such as Serial RapidIO, PCI Express, XAUI, and Fibre Channel.
Key features of the EP1SGX40GF1020I6 include embedded transceivers supporting 3.125 Gbps data rates, up to 3.4 Mbits of RAM distributed across TriMatrix memory blocks, dedicated DSP blocks for high-throughput multiply-accumulate operations, and Stratix GX SignalTap embedded logic analysis. The 1020-ball FC-FBGA at 33x33 mm with 1 mm pitch supports high-pin-count designs where board-level signal integrity and power-delivery plane access are critical.
Architecturally, the device combines 4125 LABs organized into rows and columns, surrounded by I/O elements (IOEs) on all four sides, and includes dedicated transceiver channels and phase-locked loops (PLLs) for clock synthesis. Compared with a hard-wired ASIC, the EP1SGX40GF1020I6 allows in-system reprogrammability, shorter time-to-prototype, and field upgradability, at the cost of slightly higher unit price and lower raw clock frequency per logic block.
Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, XAUI), communications backplane aggregation, military radar and signal intelligence front-ends, broadcast video processing, and high-performance ASIC prototyping. The integrated 3.125 Gbps transceivers make the part particularly attractive for line-card designs where discrete PHY chips are not cost-effective.
When designing with the EP1SGX40GF1020I6, pay close attention to PCB stack-up, BGA break-out escape routing, and decoupling of the 1.5 V core rail, since the device can draw significant transient current. Quartus II software (versions 5.0 and later) is the supported design flow; pre-synthesis pin assignments and SignalTap II logic analyzer cores are recommended for bring-up. This page synthesizes distributor stock, drop-in same-package alternatives, and design notes that complement the Intel Stratix GX datasheet.
Alternativas drop-in para EP1SGX40GF1020I6 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1SGX40GF1020I6 (mesmo formato e footprint) — diferindo em Operating Temperature, Speed Grade, Family, Package, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1SGX40GF1020C6
✅ Drop-In✓ Em estoque
$360 / unidade
Ver ficha técnica →EP1SGX40DF1020C6
✅ Drop-In✓ Em estoque
$1620 / unidade
Ver ficha técnica →EP1SGX40DF1020I6
✅ Drop-In✓ Em estoque
$198 / unidade
Ver ficha técnica →EP1SGX40FF1020I6
✅ Drop-In✓ Em estoque
$950 / unidade
Ver ficha técnica →EP1SGX40GF1020C5
✅ Drop-In✓ Em estoque
$120 / unidade
Ver ficha técnica →EP1SGX40GF1020C7N
✅ Drop-In✓ Em estoque
$285 / unidade
Ver ficha técnica →EP1SGX40GF1020I6 Classificações máximas e características elétricas
| Family | Stratix GX |
| Number of Logic Elements (LEs) | 41,250 |
| Number of Logic Array Blocks (LABs) | 4,125 |
| Total Embedded Memory | 3,423,744 bits (3.4 Mbit) |
| Number of User I/O Pins | 624 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Internal Frequency | 5000 MHz |
| Transceiver Data Rate | Up to 3.125 Gbps |
| Package Type | FC-FBGA-1020 |
| Package Dimensions | 33 mm x 33 mm |
| Ball Pitch | 1.0 mm |
| Temperatura de operação | 0C to +85C (Industrial I6 grade) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do EP1SGX40GF1020I6 33 mm x 33 mm
Configuração de pinos para EP1SGX40GF1020I6 (pacote 33 mm x 33 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1SGX40GF1020I6.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1SGX40GF1020I6 é adequado para 6 aplicaçãos: PCI Express Gen1 Endpoint, Serial RapidIO Backplane Aggregation, XAUI 10 Gbps Network Interface, ASIC Prototyping and Emulation, High-Speed Data Acquisition, Broadcast Video Processing.
PCI Express Gen1 Endpoint
The EP1SGX40GF1020I6 is well-suited for PCI Express Gen1 endpoint designs because its integrated multi-gigabit transceivers operate at 2.5 Gbps, matching the PCIe Gen1 line rate exactly. With 41,250 logic elements, the device can host the PCIe IP core plus a complete application layer (for example, a DMA engine or protocol bridge) on a single chip. Place the EP1SGX40 in the PCIe x1/x4/x8 slot footprint; the 1020-ball FC-FBGA exposes all required transceiver and reference-clock balls. The device's 3.4 Mbit of embedded memory buffers transaction-layer packets efficiently, reducing the need for external SRAM. Quartus II includes the PCIe Compiler IP, which provides TLP handling, configuration space, and interrupt logic ready for this die. Total board-level integration is significantly higher than a discrete PHY plus an FPGA approach.
Recomendado
Serial RapidIO Backplane Aggregation
The EP1SGX40GF1020I6's 3.125 Gbps transceivers and 41,250-LE fabric make it an ideal aggregator for Serial RapidIO (SRIO) backplanes. Each transceiver lane can carry SRIO at 1.25, 2.5, or 3.125 Gbps with full 8b/10b encoding, and the high LE count is sufficient to terminate multiple SRIO ports, run a switching fabric, and perform DMA into local memory. The 1020-ball FC-FBGA exposes 16+ transceiver channels, allowing 4x or 8x SRIO port configurations with redundancy. Industrial temperature grade (I6, -40C to +85C) is critical for outdoor and ruggedized backplane applications. Altera's Serial RapidIO MegaCore function is supported in Quartus II and provides full Logical/Transport/Physical layer stacks for this die.
Recomendado
XAUI 10 Gbps Network Interface
The EP1SGX40GF1020I6 supports XAUI (10 Gigabit Attachment Unit Interface) at 4x 3.125 Gbps lanes, exactly matching the XAUI line rate. With its 41,250 logic elements, the device can implement the XGXS (XGMII Extender Sublayer) PCS, 8b/10b encoding, lane alignment, and clock compensation, plus a 10G MAC above the PHY. The 624 user I/Os are sufficient for XGMII plus management interface (MDIO/MDC) and external memory. Industrial temperature grade (I6) is suitable for switch line-card deployments. Pairing the EP1SGX40 with an external 10GBASE-T or 10GBASE-R PHY (such as an XFP/SFP+ module) yields a complete XAUI-to-optical interface. Quartus II includes the XAUI MegaCore IP for this die.
Recomendado
ASIC Prototyping and Emulation
The EP1SGX40GF1020I6's combination of 41,250 logic elements, 3.4 Mbit of embedded memory, and 624 user I/Os makes it a strong ASIC prototyping vehicle for mid-complexity ASICs. Designers can partition a multi-million-gate ASIC into multiple Stratix GX devices using the 3.125 Gbps transceivers as high-speed chip-to-chip links, eliminating the need for expensive multi-FPGA debug boards. The 1020-ball FC-FBGA exposes enough I/O to map peripheral buses (DDR, Ethernet MAC, etc.) directly. Industrial temperature grade (I6) is appropriate for in-vehicle and industrial ASIC emulation. Quartus II design partitioning tools support multi-device compilation flows targeting this die.
Recomendado
High-Speed Data Acquisition
The EP1SGX40GF1020I6 serves high-speed data acquisition systems where multi-gigabit serial links (3.125 Gbps transceivers) feed parallel DSP pipelines implemented in FPGA fabric. The 41,250 logic elements host FIR filters, FFT engines, and channelizers; the 3.4 Mbit embedded memory serves as sample buffer; and the 624 user I/Os connect to parallel ADC/DAC devices. Industrial temperature grade (I6) is suitable for test and measurement, radar, and electronic-warfare front-ends. Quartus II DSP Builder integrates with MATLAB/Simulink, enabling floating-point-to-fixed-point conversion directly into the FPGA fabric. The 1020-ball FC-FBGA exposes sufficient high-speed LVDS pairs for ADC/DAC interfaces.
Recomendado
Broadcast Video Processing
The EP1SGX40GF1020I6's high logic density, embedded memory, and 624 I/Os suit professional broadcast video processing where SDI (Serial Digital Interface) at 270 Mbps, 1.485 Gbps, or 3 Gbps must be aggregated, de-embedded, and re-formatted. The 3.125 Gbps transceivers support 3G-SDI directly, while the 41,250 LEs can implement audio de-embedding, frame synchronizers, and up/down/cross converters. Industrial temperature grade (I6) is required for studio and outside-broadcast equipment. The 1020-ball FC-FBGA accommodates multiple SDI channels plus parallel video and audio buses. Quartus II includes video and image processing IP suites (VIP) compatible with this die.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1SGX40GF1020I6 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1SGX40GF1020C6 | EP1SGX40DF1020C6 | EP1SGX40DF1020I6 | EP1SGX40FF1020I6 | EP1SGX40GF1020C5 | EP1SGX40GF1020C7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FC-FBGA-1020 (33x33 mm) | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Number of LABs | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 |
| Embedded Memory | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits |
| User I/Os | 624 | 624 | 624 | 624 | 624 | 624 | 624 |
| Speed Grade | I6 (industrial) | C6 (commercial) | C6 (commercial) | I6 (industrial) | I6 (industrial) | C5 (slower, commercial) | C7N (faster, commercial) |
| Transceiver Type | GF (Gigabit) | GF (Gigabit) | DF (Standard) | DF (Standard) | FF (Enhanced Feature) | GF (Gigabit) | GF (Gigabit) |
Principais diferenciais
- Highest-density Stratix GX in 1020-ball FC-FBGA with integrated multi-gigabit transceivers (vs EP1S40B956I6 (Stratix, BGA-956, no transceivers))
- Industrial temperature grade (I6) for -40C to +85C operation (vs EP1SGX40GF1020C6 (commercial C6, 0C to 85C))
- Pin-compatible drop-in across the EP1SGX40 speed grade and transceiver family (vs EP1SGX25FF1020C7 (Stratix GX 25,660 LEs, 1020-ball FC-FBGA))
Notas de projeto
The 1020-ball FC-FBGA at 1.0 mm pitch requires a high-density PCB stack-up. Use at least 6 layers with microvia (laser-drilled) technology or HDI (Any-Layer via) for fan-out escape routing. Allocate dedicated power and ground planes under the BGA; the 1.5 V core rail can draw significant transient current, so place 0402-size 0.1 uF decoupling capacitors on every 4 to 6 power balls, plus bulk 10 uF ceramics around the package perimeter. Matched-length differential routing is mandatory for the 3.125 Gbps transceiver lanes - target 100 ohm differential impedance with 5 mil trace width and 7 mil gap on a standard 4-mil dielectric. Reference Intel/Altera application note AN224 for detailed routing guidelines.
Estimated: At 100% logic utilization, the EP1SGX40GF1020I6 can dissipate 5-8 W, and the 33x33 mm FC-FBGA has a typical theta_JA of approximately 8-12 C/W with adequate PCB copper. Calculate junction temperature as TJ = TA + (PD * theta_JA); for industrial applications at 85C ambient, the device budget is roughly 8 W before derating is required. Use thermal vias under the exposed die pad and provide forced-air cooling if the design runs at high toggle rates or in a sealed enclosure. Thermal simulation is recommended during PCB layout, not after.
Critical pitfalls to avoid when designing with the EP1SGX40GF1020I6: (1) Do not use Quartus Prime newer than 18.1 without legacy device support - the Stratix GX family is only fully supported in Quartus II (not Quartus Prime). (2) The configuration scheme (Passive Serial, Fast Passive Parallel, or JTAG) must match the board's EPCS or EPC configuration PROM; mismatch is a common source of bring-up failures. (3) Leave at least 2 transceiver channel banks unused if you do not need all 16+ channels - this simplifies PCB routing and reduces crosstalk. (4) Verify the I/O standard (LVTTL, LVCMOS, LVDS, SSTL) per bank; banks cannot mix standards arbitrarily. (5) Industrial I6 grade parts must be used for -40C to +85C environments; commercial C-grade parts will fail outside 0C to 85C.
The 3.125 Gbps transceiver channels require careful signal-integrity management. Use a continuous reference plane beneath the transceiver traces; avoid crossing plane splits. DC-blocking capacitors (typically 100 nF 0402 X7R) must be placed close to the TX outputs per the Intel Stratix GX handbook. Reference clock inputs (typically 156.25 MHz for 3.125 Gbps operation) must be routed with controlled impedance and isolated from switching noise; use a dedicated clock generator such as an Si5317 or CDCE62005 for low-jitter operation. Pre-emphasis and equalization settings should be tuned per channel using the Quartus II Transceiver Toolkit.
Informações de conformidade
RoHS compliance per Altera/Intel product page. The Stratix GX family is not AEC-Q100 qualified (FPGA, not automotive-grade). Lead-free per JEDEC J-STD-020 reflow compatibility. Halogen-free status unknown - consult Intel directly. Lifecycle status obsolete as of 2026-09-07; last-time-buy windows closed years ago.