EP1SGX40GF1020C6 - Stratix GX FPGA 41250 Cells 624 IO | Altera
MPN: EP1SGX40GF1020C6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $449.57 | $449.57 |
| 10 | $425 | $4,250.00 |
| 25 | $405 | $10,125.00 |
| 50 | $380 | $19,000.00 |
| 100 | $360 | $36,000.00 |
Drop-in alternatives for EP1SGX40GF1020C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX40GF1020C6 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements (LEs) | 41,250 |
| Logic Array Blocks (LABs) | 4,125 |
| Total RAM Bits | 3,423,744 |
| User I/O Count | 624 |
| Embedded DSP Blocks | 14 |
| Core Supply Voltage | 1.425 V – 1.575 V (1.5 V nominal) |
| Operating Temperature | 0 °C to +85 °C (Commercial) |
| Package | 1020-ball FC-FBGA (33 × 33 mm, 1.0 mm pitch) |
| Speed Grade | C6 |
| Logic Family | CMOS |
| Process Node | 0.13 µm |
| Mounting Type | Surface Mount (BGA) |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG |
EP1SGX40GF1020C6 Pin Configuration
| Pin A1 | GND — Ground |
| Pin B1 | VCCIO1 — I/O bank 1 supply voltage |
| Pin C1 | IO[0] — User I/O pin (bank 1) |
| Pin D1 | IO[1] — User I/O pin (bank 1) |
| Pin E1 | GXB_RX0_N — Transceiver channel 0 receive (negative) |
| Pin F1 | GXB_RX0_P — Transceiver channel 0 receive (positive) |
| Pin G1 | VCC — Core 1.5 V supply |
| Pin H1 | GXB_TX0_N — Transceiver channel 0 transmit (negative) |
| Pin J1 | GXB_TX0_P — Transceiver channel 0 transmit (positive) |
| Pin K1 | IO[2] — User I/O pin (bank 2) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40GF1020C6 is suitable for 6 applications: PCI Express Endpoint Card, Telecom Line-Card Aggregation, ASIC Prototyping Platform, Radar Signal Processing, Test and Measurement Instrumentation, Video Broadcast Processing.
PCI Express Endpoint Card
The EP1SGX40GF1020C6 is well suited to PCI Express ×4/×8 endpoint designs thanks to its integrated multi-gigabit transceivers and hard PCI Express IP block. The 41,250 LEs host a soft Nios II processor, DMA engines, and user logic, while the 624 user I/Os connect to memory and peripheral buses. The 1020-ball FC-FBGA package exposes enough transceiver and I/O pins to support a ×8 PCIe Gen1 link plus parallel fabric interfaces. Designers leverage the C6 speed grade to meet PCIe Gen1 2.5 Gbps timing closure with margin.
Recommended
Telecom Line-Card Aggregation
Used in central-office line cards, the EP1SGX40GF1020C6 aggregates multiple lower-rate serial links (e.g., GbE, OC-12) into higher-speed uplinks via its multi-gigabit transceivers. The 3,423,744 bits of embedded RAM act as packet buffers, while the 14 DSP blocks perform traffic-shaping calculations. The commercial 0–85 °C operating range suits temperature-controlled CO environments. The 1020-ball FC-FBGA provides ample I/O for SGMII, XAUI, and backplane serial interfaces simultaneously, which is essential for line-card designs that must support multiple PHY types.
Recommended
ASIC Prototyping Platform
The EP1SGX40GF1020C6 is widely used for ASIC and SoC prototyping because of its 41,250-LE capacity, large embedded memory, and abundant user I/Os that map cleanly to ASIC pin-outs. Designers partition their ASIC RTL across multiple FPGAs; the FC-FBGA-1020 package provides the high pin count needed for inter-FPGA connections. The multi-gigabit transceivers handle high-speed chip-to-chip serial links on the prototyping board. Quartus II synthesis supports partition-based prototyping flows tailored to the Stratix GX architecture.
Recommended
Radar Signal Processing
The 14 embedded DSP blocks of the EP1SGX40GF1020C6 deliver hundreds of 18×18 multipliers for radar FFT and pulse-compression pipelines. Combined with the multi-gigabit transceivers for ADADC data ingest and the 3.4 Mbit block RAM for sample buffering, the device can implement real-time radar baseband processing on a single chip. The commercial temperature grade suits ground-based and naval radar platforms. The large FBGA package enables dense routing for high-speed LVDS ADC interfaces.
Recommended
Test and Measurement Instrumentation
High-end logic analyzers, BERTs, and protocol analyzers use the EP1SGX40GF1020C6 to drive multi-channel high-speed serial capture and pattern generation. The transceivers handle data rates up to multi-gigabit speeds required by USB 3.0, SATA, and PCIe Gen2 receivers, while the abundant block RAM captures long records at full line rate. The 624 I/Os drive parallel test buses and display backplanes. The C6 speed grade ensures deterministic timing for protocol compliance testing in lab environments.
Recommended
Video Broadcast Processing
Broadcast studios use the EP1SGX40GF1020C6 for SD/HD/3G-SDI routing, up/down/cross-conversion, and overlay processing. The DSP blocks implement 4:2:2 chroma interpolation and scaling filters in real time, and the multi-gigabit transceivers receive SDI streams at 2.97 Gbps (3G-SDI) directly. The 624 I/Os expose enough pins for multiple SDI input/output channels plus audio embedding and GPI control. The large FC-BGA package supports the signal-integrity layout required by SDI jitter specifications.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF1020C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF1020C5 | EP1SGX40GF1020C5N | EP1SGX40DF1020C6 | EP1SGX40FF1020C6 | EP1SGX25FF1020C6 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel FPGA) | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-ball FC-FBGA (33×33 mm) | 1020-ball FC-FBGA (33×33 mm) — same | 1020-ball FC-FBGA (33×33 mm) — same | 1020-ball FC-FBGA (33×33 mm) — same | 1020-ball FC-FBGA (33×33 mm) — same | 1020-ball FC-FBGA (33×33 mm) — same |
| Logic Elements | 41,250 | 41,250 (same) | 41,250 (same) | 41,250 (same) | 41,250 (same) | 25,750 (~38% lower) |
| Speed Grade | C6 | C5 (slower) | C5 (slower) | C6 (same) | C6 (same) | C6 (same) |
| Embedded Transceivers | Yes (multi-gigabit) | Yes (same) | Yes (same) | Yes (same) | No (base Stratix) | Yes (same) |
| Total RAM Bits | 3,423,744 | 3,423,744 (same) | 3,423,744 (same) | 3,423,744 (same) | 3,423,744 (same) | 1,944,576 (~43% lower) |
| User I/O Count | 624 | 624 (same) | 624 (same) | 624 (same) | 624 (same) | [DATA_NEEDED] |
| Core Voltage | 1.425 V – 1.575 V | 1.425 V – 1.575 V (same) | 1.425 V – 1.575 V (same) | 1.425 V – 1.575 V (same) | 1.425 V – 1.575 V (same) | 1.425 V – 1.575 V (same) |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (same) | 0 °C to +85 °C (same) | 0 °C to +85 °C (same) | 0 °C to +85 °C (same) | 0 °C to +85 °C (same) |
Key Differentiators
- Higher logic density (41,250 LEs) than the EP1SGX25 family (vs EP1SGX25FF1020C6)
- Integrated multi-gigabit transceivers versus base Stratix (vs EP1SGX40FF1020C6)
- Faster C6 speed grade versus C5 (vs EP1SGX40GF1020C5)
Design Notes
Estimated: The 1020-ball FC-FBGA uses a 1.0 mm pitch on a 33 × 33 mm substrate; this demands microvia (laser-drilled) PCB technology, high-IPC-6012 Class 3 manufacturing, and a high-layer-count stack-up (8+ layers recommended) to fan out the inner balls. Use a 1 oz copper outer layer plus 0.5 oz inner layers for power delivery; controlled-impedance routing for transceiver differential pairs must be modeled against the transceiver channel spec of 100 Ω differential.
Estimated: The Stratix GX core draws substantial current at 1.5 V; budget at least 20 A on the core supply rail for typical 41,250-LE designs with active transceivers. Use a multi-phase buck regulator with output accuracy ±3% across load transients, and decouple with a mix of 470 µF bulk, 22 µF ceramic, and 0.1 µF/0.01 µF high-frequency capacitors placed as close as possible to each VCC/GND ball pair.
Estimated: Transceiver channels must be routed with length-matched (within 150 µm) 100 Ω differential pairs, no more than two vias per Tx or Rx pair, and continuous reference planes on adjacent layers. Series AC-coupling capacitors (typically 100 nF) must be placed on each transmit pair per the Stratix GX handbook; verify DC blocking tolerance against your protocol (PCIe, XAUI, etc.).
The C6 speed grade is the production-grade bin and should not be substituted with I-grade parts on the same board without re-running the Quartus II timing analysis. Industrial-grade (I6/I7) parts differ only in temperature range and require explicit ordering. Mixing FPGA temperature grades on a single JTAG chain can confuse configuration; do not chain C-grade and I-grade parts unless the design is re-validated.
Compliance Information
RoHS/REACH compliance was not stated in the verified web data; the EP1SGX40GF1020C6 is a legacy Altera part predating widespread RoHS documentation. RoHS-compliant N-suffixed variants (e.g. EP1SGX40GF1020C5N) are recommended for new designs requiring lead-free assembly.
