EP1SGX40GF1020C7N - Stratix GX FPGA, 41,250 LEs, 624 I/O | Altera
MPN: EP1SGX40GF1020C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $412 | $412.00 |
| 10 | $380 | $3,800.00 |
| 50 | $348 | $17,400.00 |
| 100 | $315 | $31,500.00 |
| 500 | $285 | $142,500.00 |
Drop-in alternatives for EP1SGX40GF1020C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX40GF1020C7L
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View Datasheet →EP1SGX40GF1020C7N Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Family | Stratix (1st generation, GX sub-family) |
| Logic Elements (LEs) | 41,250 |
| Logic Array Blocks (LABs) | 4,125 |
| Total RAM Bits | 3,423,744 |
| User I/O Count | 624 |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Logic Family | CMOS |
| Process Technology | 0.13 um CMOS |
| Operating Temperature | 0 C to 85 C (Commercial) |
| Package Type | 1020-ball FineLine BGA (FBGA) |
| Package Dimensions | 33 x 33 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Configuration Modes | Active Serial, Passive Serial, JTAG |
| Speed Grade | C7 (commercial, fastest) |
EP1SGX40GF1020C7N 33 x 33 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1SGX40GF1020C7N (33 x 33 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40GF1020C7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40GF1020C7N is suitable for 6 applications: Multi-Gigabit Serial Interface Bridging, Telecom Backplane Aggregation, ASIC Prototyping and Emulation, DSP Co-Processing in Test & Measurement, Industrial Control and High-Speed Data Acquisition, Legacy Avionics and Defense Subsystems.
Multi-Gigabit Serial Interface Bridging
The EP1SGX40GF1020C7N's integrated high-speed SERDES transceivers support multi-gigabit protocols including XAUI, PCIe, and Serial RapidIO at line rates up to 3.125 Gbps per channel. With 41,250 Logic Elements available, the fabric can implement PCS/PMA bridging between proprietary backplane formats and standard interconnect, eliminating external PHY chips. The 1020-FBGA package's controlled-impedance escape routing preserves signal integrity for serializer outputs, while 624 user I/Os leave ample headroom for parallel side-band management interfaces. This combination of transceiver count and logic density is the primary reason design teams selected Stratix GX for line-card aggregation in 2004-2008 generation telecom infrastructure.
Recommended
Telecom Backplane Aggregation
Stratix GX devices including the EP1SGX40GF1020C7N were the workhorse of telecom line-card aggregation in the 2004-2010 era, combining high-density logic for protocol conversion with embedded SERDES for backplane interconnect. The 3,423,744 bits of TriMatrix memory serve as packet buffering between ingress and egress ports, while 4,125 LABs provide the state machine and forwarding logic resources. Operating from 1.5 V core reduces board-level power dissipation compared to legacy 2.5 V FPGAs, and the commercial 0-85 C temperature range matches central-office deployment requirements. Design teams typically pair this FPGA with external PHY and clock synthesizer ICs to build complete multi-port aggregation cards.
Recommended
ASIC Prototyping and Emulation
The EP1SGX40GF1020C7N's 41,250 LEs and 3.4 Mbit of block RAM make it well-suited as an ASIC prototyping vehicle for designs targeting 100K-200K gate ASICs, particularly for serial-interface-rich SoCs. Quartus II synthesis maps RTL directly to the Stratix GX architecture, with the integrated transceivers providing realistic I/O behavior for SerDes blocks in the emulated ASIC. The 1020-FBGA package's high I/O count (624) gives prototyping platforms ample signal access. Engineers commonly used multiple EP1SGX40 devices in a multi-FPGA partitioning setup for validation of full-custom ASICs before tape-out.
Recommended
DSP Co-Processing in Test & Measurement
With 4,125 LABs and dedicated multiplier blocks, the EP1SGX40GF1020C7N can implement high-throughput DSP functions such as FIR filters, FFT engines, and digital down-converters for instrumentation. The 1.5 V core and integrated transceivers enable direct digitization of IF signals followed by FPGA-side baseband processing. The 624 user I/Os accommodate parallel ADC/DAC interfaces alongside serial control channels. This application was common in software-defined radio platforms and high-end oscilloscope designs of the late 2000s, where the Stratix GX served as both the data path and the protocol interface controller.
Recommended
Industrial Control and High-Speed Data Acquisition
The EP1SGX40GF1020C7N finds use in industrial control systems where 624 user I/Os are required for multi-axis motor control or parallel data acquisition across many channels. The 33 x 33 mm FBGA package, while requiring advanced PCB technology, provides the I/O density that discrete microcontrollers cannot match. TriMatrix memory serves as sample buffering at multi-MHz sampling rates, while the embedded transceivers enable real-time distribution of acquired data to downstream processors. Industrial users should note the commercial 0-85 C temperature grade; for harsher environments, the EP1SGX40FF1020 industrial family is recommended.
Recommended
Legacy Avionics and Defense Subsystems
Defense and avionics programs that adopted the Stratix GX family between 2005 and 2012 continue to use EP1SGX40GF1020C7N in long-life subsystems. The commercial temperature range, while not full military-spec, is sufficient for many sheltered avionics bays. The integrated transceivers support MIL-STD-1553 bridging and high-speed sensor data links. Because the part is NRND, long-term supply contracts through Rochester Electronics authorize continued procurement, and XAIPART can source inventory for legacy sustainment programs through authorized aftermarket channels.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF1020C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF1020C7L | EP1SGX40GF1020C7ES | EP1SGX40DF1020C7N | EP1SGX40FF1020C7 | EP1SGX40CF1020I5 |
|---|---|---|---|---|---|---|
| Package | 1020-FBGA (33x33 mm) | 1020-FBGA (33x33 mm) - same | 1020-FBGA (33x33 mm) - same | 1020-FBGA (33x33 mm) - same | 1020-FBGA (33x33 mm) - same | 1020-FBGA (33x33 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Total RAM Bits | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 |
| User I/O Count | 624 | 624 | 624 | 624 | 624 | 624 |
| Core Voltage | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | -40 C to 85 C (Industrial) | -40 C to 85 C (Industrial) |
| Integrated Transceivers | Yes (Stratix GX multi-gigabit) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Approx. Unit Price (qty 1) | $412.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest logic density in Stratix GX family (vs EP1SGX25FF1020C7N)
- Integrated multi-gigabit transceivers (vs EP1S40F1020C7N)
- Commercial speed grade C7 (fastest) (vs EP1SGX40GF1020C7L)
Design Notes
The 1020-FBGA package at 33 x 33 mm with 1.0 mm ball pitch requires multilayer PCB stackup with microvia or via-in-pad technology. Estimated: per Altera packaging guidelines, a 1-6-1 or 2-4-2 stackup with controlled-impedance layers is required for the high-speed transceiver traces. Fanout routing should escape from the inner rows using via-in-pad to maintain signal integrity on SERDES channels; designers should plan 6+ PCB layers and allocate dedicated ground returns under BGA escape routes.
The 1.5 V core supply at 41,250 LEs can draw significant transient current during logic switching events. Estimated: per Stratix GX power calculator, peak core current can exceed 3 A under full-utilization switching activity. Decoupling requires at least 40 low-ESL ceramic capacitors (0.1 uF and 0.01 uF mix) placed directly under the BGA footprint plus bulk polymer or tantalum capacitors at the voltage regulator output. Multi-phase voltage regulators are recommended for designs exceeding 30 W of FPGA power.
The 1020-FBGA package dissipates heat primarily through the BGA balls into the PCB inner-plane copper. Estimated: per typical Stratix GX thermal models, theta_JA for the 1020-FBGA with adequate copper pour is approximately 4-6 C/W at still air. Designs using the EP1SGX40GF1020C7N in a chassis with limited airflow should add a heatsink or thermal interface material to the package top, especially in industrial environments where ambient temperatures approach 85 C. The commercial temperature grade should not be exceeded at any measurement point.
High-speed transceiver channels must be routed with controlled differential impedance (100 ohm +/- 10%) and matched length within the budget specified by the Stratix GX handbook. Reference clock jitter must remain below 1 ps RMS for 3.125 Gbps SERDES operation; use a dedicated low-jitter clock synthesizer rather than distributing FPGA-derived clocks. AC-coupling capacitors are required on all SERDES transmit outputs and must be placed close to the FPGA balls. IBIS models from Altera/Intel are essential for signal-integrity simulation.
Configuration mode selection must be set via MSEL pins before power-up; using the wrong mode (e.g., passive serial when active serial is required) prevents the FPGA from configuring. The EP1SGX40GF1020C7N is NRND, so confirm long-term supply with Altera/Intel distributors or Rochester Electronics before committing to new production schedules. Bitstream generation requires Quartus II software; legacy designs using older Quartus versions may need tool upgrades to compile for current PC environments.
Compliance Information
RoHS, lead-free, halogen-free, REACH, and conflict-mineral status were not present in the verified web data and are marked [DATA_NEEDED] elsewhere. As a legacy 0.13 um Altera/Intel FPGA introduced circa 2003-2004, the part predates strict RoHS enforcement; consult the specific date code and manufacturer documentation for compliance status of any specific inventory lot.
