EP20K100ETC144-1X - APEX 20KE FPGA 4160 Cells 144-TQFP | Intel
N.º da peça: EP20K100ETC144-1X ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.85 | $2.985,00 |
| 500 | $26.4 | $13.200,00 |
| 1.000 | $23.1 | $23.100,00 |
EP20K100ETC144-1X Visão geral
An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that lets designers implement arbitrary digital logic through SRAM-based configuration cells, after the chip has been manufactured. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) between simple CPLDs (which are gate-array-style and non-volatile) and modern high-end SoC FPGAs with hard CPU cores. The APEX 20KE series specifically combines Look-Up Table (LUT)-based logic with embedded array blocks (EABs) for on-chip memory, making it suitable for data-path and DSP-style glue logic in telecom, networking, and industrial systems.
Key specifications of the EP20K100ETC144-1X include 4160 logic elements, 53,248 typical gates, 92 available user I/O pins, a propagation delay figure of 1.6 ns through internal interconnect, 1.8 V core VCC, and a commercial operating temperature grade of 0 °C to 85 °C. The "-1X" speed-grade suffix designates the slowest APEX 20KE timing bin, while the "TC144" suffix denotes the TQFP-144 thermally enhanced gull-wing package.
From an architectural standpoint, the device combines a fine-grained LUT fabric with embedded array blocks (EABs) that can be configured as RAM, ROM, or FIFO blocks of up to 2 Kbits each. The LUT-and-EAB hybrid is a hallmark of the APEX 20K family and offers higher effective logic density per square millimetre than pure CPLD architectures when implementing wide datapath functions such as bus interfaces, protocol converters, and state machines.
Typical applications for the EP20K100ETC144-1X include glue logic in telecom line cards, industrial control backplanes, PCI bridge and bus-interfaces, protocol converters (UART, I2C, SPI bridges), and low-density DSP pre-processing blocks. The 144-pin TQFP is well-suited to through-hole-style prototyping or rework-friendly assembly, and the commercial temperature range covers most indoor equipment.
When designing with this part, engineers should note that the APEX 20KE family is no longer in active production and is supported primarily through the legacy Altera/Intel design flow with the Quartus II toolchain. Designers targeting new designs should evaluate Cyclone IV/V or MAX II equivalents unless footprint compatibility with the existing TQFP-144 PCB is required.
Alternativas drop-in para EP20K100ETC144-1X — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP20K100ETC144-1X (mesmo formato e footprint) — diferindo em Process Technology, Family, Package, Operating Temperature, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP20K100ETC144-1N
✅ Drop-In✓ Em estoque
$55.8 / unidade
Ver ficha técnica →EP20K100ETC144-1N
✅ Drop-In✓ Em estoque
$55.8 / unidade
Ver ficha técnica →EP20K100EFC144-1
✅ Drop-In✓ Em estoque
$61.75 / unidade
Ver ficha técnica →EP20K100CT144C7
✅ Drop-In✓ Em estoque
$9.75 / unidade
Ver ficha técnica →EP20K100CF144C7
✅ Drop-In✓ Em estoque
$28.4 / unidade
Ver ficha técnica →EP4CE6E22C8N
✅ Drop-In✓ Em estoque
$10.5 / unidade
Ver ficha técnica →EP20K100ETC144-1X Classificações máximas e características elétricas
| Device Family | APEX 20KE |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements | 4160 cells |
| Typical Gates | 53248 |
| Macrocells | 416 |
| User I/Os | 92 |
| Core Voltage | 1.8 V |
| Maximum Frequency | 250 MHz |
| Propagation Delay | 1.6 ns |
| Process Technology | 0.22 µm CMOS all-layer copper |
| Package Type | TQFP-144 |
| Tipo de montagem | Surface Mount (gull-wing) |
| Temperatura de operação | 0 °C to 85 °C |
| Speed Grade | -1 (slowest bin, "-1X") |
Configuração de pinos do EP20K100ETC144-1X
| Pino 1 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 2 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 3 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 4 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 5 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 6 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 7 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 8 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 9 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 10 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 11 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 12 | VCCIO — I/O bank supply voltage |
| Pino 13 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 14 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 15 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 16 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 17 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 18 | GND — Ground |
| Pino 19 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 20 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 21 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 22 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 23 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 24 | VCCINT — Core supply voltage (1.8 V) |
| Pino 25 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 26 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 27 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 28 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 29 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 30 | GND — Ground |
| Pino 31 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 32 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 33 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 34 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 35 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 36 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 37 | VCCIO — I/O bank supply voltage |
| Pino 38 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 39 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 40 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 41 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 42 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 43 | GND — Ground |
| Pino 44 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 45 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 46 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 47 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 48 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 49 | VCCINT — Core supply voltage (1.8 V) |
| Pino 50 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 51 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 52 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 53 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 54 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 55 | GND — Ground |
| Pino 56 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 57 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 58 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 59 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 60 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 61 | VCCIO — I/O bank supply voltage |
| Pino 62 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 63 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 64 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 65 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 66 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 67 | GND — Ground |
| Pino 68 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 69 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 70 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 71 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 72 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 73 | VCCINT — Core supply voltage (1.8 V) |
| Pino 74 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 75 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 76 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 77 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 78 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 79 | GND — Ground |
| Pino 80 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 81 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 82 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 83 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 84 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 85 | VCCIO — I/O bank supply voltage |
| Pino 86 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 87 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 88 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 89 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 90 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 91 | GND — Ground |
| Pino 92 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 93 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 94 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 95 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 96 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 97 | VCCINT — Core supply voltage (1.8 V) |
| Pino 98 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 99 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 100 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 101 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 102 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 103 | GND — Ground |
| Pino 104 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 105 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 106 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 107 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 108 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 109 | VCCIO — I/O bank supply voltage |
| Pino 110 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 111 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 112 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 113 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 114 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 115 | GND — Ground |
| Pino 116 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 117 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 118 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 119 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 120 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 121 | VCCINT — Core supply voltage (1.8 V) |
| Pino 122 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 123 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 124 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 125 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 126 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 127 | GND — Ground |
| Pino 128 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 129 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 130 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 131 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 132 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 133 | VCCIO — I/O bank supply voltage |
| Pino 134 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 135 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 136 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 137 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 138 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 139 | GND — Ground |
| Pino 140 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 141 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 142 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 143 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 144 | I/O — User I/O pin (bank-dependent voltage) |
Aplicações típicas
EP20K100ETC144-1X é adequado para 6 aplicaçãos: Telecom Line-Card Glue Logic, Industrial Control Backplane Interface, PCI Bridge and Bus-Interface Logic, Protocol Converter (UART / SPI / I2C Bridges), Low-Density DSP Pre-Processing, Legacy Test & Measurement Equipment.
Telecom Line-Card Glue Logic
The EP20K100ETC144-1X is well-suited to telecom line-card glue logic because its 4160 logic elements and 92 user I/Os are sufficient to bridge TDM buses, E1/T1 framers, and serial backplane interfaces. The 1.8 V core with multi-voltage I/O banks allows direct interfacing to legacy 3.3 V LVCMOS framers without level shifters. The TQFP-144 package simplifies rework on low-volume line-card prototypes, and the 250 MHz toggle rate comfortably exceeds the 50-77 MHz bus speeds typical of TDM and H.110 backplanes.
Recomendado
Industrial Control Backplane Interface
The 144-pin TQFP package and 0 °C to 85 °C commercial temperature range make the EP20K100ETC144-1X a fit for industrial control backplane interfaces such as VME, CompactPCI bridge logic, and proprietary field-bus controllers. The embedded array blocks (EABs) implement on-chip dual-port RAM for FIFO buffering between backplane domains. The 1.6 ns propagation delay supports deterministic interrupt handling in real-time control loops. Engineers targeting industrial -40 °C to +85 °C should select the EP20K100ETC144-1N variant.
Recomendado
PCI Bridge and Bus-Interface Logic
With 4160 logic elements, the EP20K100ETC144-1X is well-matched to PCI 32-bit/33 MHz bridge logic, including target and initiator state machines, parity generation/checking, and arbiter glue. The 92 user I/Os comfortably accommodate the 49-pin PCI bus plus address/data multiplexing for a secondary local bus. The 250 MHz internal performance gives 4x headroom over the 33 MHz PCI clock, easing timing closure. The APEX 20KE EABs can also be configured as 32x36 FIFOs for PCI burst transactions.
Recomendado
Protocol Converter (UART / SPI / I2C Bridges)
The EP20K100ETC144-1X serves as a flexible multi-protocol converter for legacy equipment where a host CPU needs UART-to-SPI, SPI-to-I2C, or GPIO expansion bridges. Its 4160 logic elements are more than sufficient for eight or more concurrent serial channels with FIFO buffering in EAB memory. The 1.8 V core with selectable I/O bank voltages enables direct connection to 1.8 V, 2.5 V, or 3.3 V peripherals without external level shifters, reducing BOM cost in cost-sensitive industrial gateways.
Recomendado
Low-Density DSP Pre-Processing
The APEX 20KE EABs allow the EP20K100ETC144-1X to function as a pre-processing block for low-density DSP workloads such as FIR filters, FFT butterflies, and digital down-conversion. Each EAB can store coefficient tables for up to 2 Kbits of data, and the LUT fabric implements the multipliers/accumulators at clock rates up to 250 MHz. While not competitive with modern DSP silicon, the device remains useful in legacy radar and sonar pre-processing subsystems that already include APEX 20KE on the bill of materials.
Recomendado
Legacy Test & Measurement Equipment
Test and measurement equipment designed in the late 1990s and early 2000s often integrated the EP20K100ETC144-1X as a pattern-generator or timing-controller core. The 250 MHz internal performance and 92 user I/Os are well-suited to driving 32-channel digital pattern generators with per-channel timing skew control. The TQFP-144 package allows easy replacement during field repair of legacy instruments such as ATE loadboards, protocol analyzers, and boundary-scan controllers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP20K100ETC144-1X — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP20K100ETC144-1 | EP20K100ETC144-1N | EP20K100EFC144-1 | EP20K100CT144C7 | EP4CE6E22C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera legacy) | Intel | Intel | Intel | Intel | Intel (Cyclone IV) |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 (E22) - same footprint |
| Family | APEX 20KE (EAB-equipped) | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20K (non-E) | Cyclone IV |
| Logic Elements | 4160 | 4160 | 4160 | 4160 | 4160 | 6272 (Cyclone IV LE) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.2 V |
| User I/Os | 92 | 92 | 92 | 92 | 92 | 91 (E22 pinout) |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | -40 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | -40 °C to 100 °C (industrial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Active |
Principais diferenciais
- Same silicon density across the -1 / -1X / -1N speed grades (vs EP20K100ETC144-1)
- Industrial temperature variant available in same footprint (vs EP20K100ETC144-1N)
- Active modern alternative available in same footprint (vs EP4CE6E22C8N)
Notas de projeto
The EP20K100ETC144-1X requires a clean 1.8 V core supply (VCCINT) plus one or more VCCIO bank voltages for the I/O ring. Decoupling should follow the Altera reference design: one 100 µF bulk + ten 4.7 µF mid-frequency + one 0.1 µF high-frequency capacitor per VCCINT pin, placed as close to the package as possible. I/O bank VCCIO pins (typically 1.8 V, 2.5 V, or 3.3 V) require their own decoupling network. A ferrite bead between the 1.8 V regulator and VCCINT improves PSRR for noise-sensitive logic designs.
Estimated: at typical industrial utilization (~30% LE switching, 125 MHz fMAX, 1.8 V VCCINT), the EP20K100ETC144-1X dissipates approximately 0.5-1.0 W of core power in a TQFP-144 package with no integrated heatsink. The TQFP-144 has a θJA of approximately 35-45 °C/W on a standard JEDEC 4-layer test board with 1 oz copper. At 1 W dissipation this yields a 35-45 °C junction-temperature rise above ambient. Designers should provide adequate airflow or thermal copper area when operating near the upper 85 °C commercial limit, and must derate if the device is used in sealed enclosures.
The TQFP-144 package uses 0.5 mm lead pitch and requires careful PCB layout. Recommended pad design is the IPC-7351 nominal land pattern with a 0.30 mm pad width and 0.55 mm pad length to ensure reliable solder fillets. A 4-layer stack-up with continuous GND plane on layer 2 and a 1.8 V power plane on layer 3 is the recommended configuration for the TQFP-144 APEX 20KE family. JTAG pins TCK, TMS, TDI, TDO, and TRST should be routed with 4-5 mil traces and guarded by GND on both sides.
Three common pitfalls when designing with the EP20K100ETC144-1X: (1) The APEX 20KE family uses SRAM-based configuration and requires a configuration device (EPC2, EPC4, or EPC8) - do not assume the device is non-volatile. (2) The I/O banks have specific VCCIO requirements per I/O standard; mixing 1.8 V and 3.3 V in the same bank will damage the device. (3) The Quartus II toolchain (not Quartus Prime) is required for compilation - newer toolchains have dropped APEX 20KE support.
Informações de conformidade
The -1X suffix indicates lead-free (Pb-free) terminal finish per JEDEC JESD97 e3/e4. RoHS and REACH compliance status were not present in the verified web data - marked unknown pending manufacturer confirmation. Part is not AEC-Q100 qualified; for automotive applications consult Intel automotive-grade FPGA portfolio (Cyclone IV EQ, Cyclone V EQ).