EP20K100QC208-2X - APEX 20KE 100K Gates FPGA 208PQFP | Intel
N.º da peça: EP20K100QC208-2X ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $85 | $85,00 |
| 10 | $72 | $720,00 |
| 100 | $58.5 | $5.850,00 |
| 500 | $47.2 | $23.600,00 |
| 1.000 | $39.8 | $39.800,00 |
EP20K100QC208-2X Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the user can re-program after manufacture to implement arbitrary digital logic. The APEX 20KE family pioneered the MultiCore architecture, integrating look-up table (LUT) logic, product-term logic, and embedded system blocks (ESBs) on a single die - this combination enabled SOPC (System-on-a-Programmable-Chip) integration before that term became mainstream. FPGAs sit hierarchically under programmable logic devices (PLDs) and above fixed-function ASICs in the digital design taxonomy.
Key features of the EP20K100QC208-2X include the MultiCore architecture combining LUT and product-term logic, 53248 bits of embedded SRAM distributed across embedded system blocks, four Phase-Locked Loops (PLLs) for clock management, and LVDS-compatible I/O support at 1.8 V. The 0.22-micron CMOS process node and 2.5 V core supply deliver a balance of density and power efficiency for the era. With 159 user I/O and a 200 MHz internal performance target, the device bridges moderate-density logic integration with high pin-count board-level connectivity.
Typical applications include telecommunications line-card interface logic, industrial control glue logic, peripheral bridging (PCI to local bus), custom DSP co-processors, and pre-silicon prototyping for ASIC designs. Engineers often deploy the APEX 20KE in legacy systems where the part has already been qualified into long-lifecycle equipment. The 208 PQFP form factor also supports hand-soldering and inspection workflows that fine-pitch BGA packages cannot accommodate, which matters for low-volume or ruggedized programs.
When designing with this device, use the Altera Quartus II (MAX+PLUS II for legacy flows) design toolchain for synthesis, place-and-route, and bitstream generation. Pay close attention to I/O bank voltage grouping and supply decoupling - the 2.5 V core and multiple I/O voltages each require their own bypass network. The device is now classified as a legacy / mature product, so confirm long-term supply with the manufacturer before committing to new designs.
This page synthesizes distributor pricing, package cross-reference, and practical design considerations drawn from the original APEX 20KE datasheet family - context that manufacturer datasheets alone do not aggregate into a single comparison view.
Alternativas drop-in para EP20K100QC208-2X — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP20K100QC208-2X (mesmo formato e footprint) — diferindo em Operating Temperature, Core Supply Voltage, Device Type, Package, Logic Elements / Cells.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP20K100QC208-2
✅ Drop-In✓ Em estoque
$29.9 / unidade
Ver ficha técnica →EP20K100QC208-1N
✅ Drop-In✓ Em estoque
$51 / unidade
Ver ficha técnica →EP20K100QC208-1
✅ Drop-In✓ Em estoque
$21.2 / unidade
Ver ficha técnica →EP20K100EQC208-2
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →EP20K100EQC208-3
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →EP20K100QC208-2X Classificações máximas e características elétricas
| Family | APEX 20KE |
| Series | APEX-20K |
| Core Voltage | 2.375 V to 2.625 V |
| I/O Voltage | 1.71 V to 1.89 V (1.8 V LVDS variant) |
| Process Node | 0.22 um CMOS |
| System Gates | 100,000 |
| Logic Elements / Cells | 4,160 |
| Number of LABs/CLBs | 416 |
| Total RAM Bits | 53,248 |
| Number of User I/O | 159 |
| Number of PLLs | 4 |
| Internal Performance | 200 MHz |
| Encapsulamento / Caixa | 208-BQFP (PQFP) |
| Supplier Device Package | 208-PQFP (28x28 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0 C to 85 C (TJ) |
Configuração de pinos do EP20K100QC208-2X
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | VCCINT — Core supply voltage (2.5 V) |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | I/O — User I/O pin (bank 1) |
| Pino 12 | I/O — User I/O pin (bank 1) |
| Pino 13 | I/O — User I/O pin (bank 1) |
| Pino 14 | I/O — User I/O pin (bank 1) |
| Pino 15 | I/O — User I/O pin (bank 1) |
| Pino 16 | I/O — User I/O pin (bank 1) |
| Pino 17 | I/O — User I/O pin (bank 1) |
| Pino 18 | I/O — User I/O pin (bank 1) |
| Pino 19 | GND — Ground |
| Pino 20 | I/O — User I/O pin (bank 2) |
| Pino 21 | I/O — User I/O pin (bank 2) |
| Pino 22 | I/O — User I/O pin (bank 2) |
| Pino 23 | I/O — User I/O pin (bank 2) |
| Pino 24 | I/O — User I/O pin (bank 2) |
| Pino 25 | I/O — User I/O pin (bank 2) |
| Pino 26 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 27 | I/O — User I/O pin (bank 2) |
| Pino 28 | I/O — User I/O pin (bank 2) |
| Pino 29 | I/O — User I/O pin (bank 2) |
| Pino 30 | I/O — User I/O pin (bank 2) |
| Pino 31 | I/O — User I/O pin (bank 2) |
| Pino 32 | I/O — User I/O pin (bank 2) |
| Pino 33 | I/O — User I/O pin (bank 2) |
| Pino 34 | I/O — User I/O pin (bank 2) |
| Pino 35 | I/O — User I/O pin (bank 2) |
| Pino 36 | I/O — User I/O pin (bank 2) |
| Pino 37 | I/O — User I/O pin (bank 2) |
| Pino 38 | VCCINT — Core supply voltage (2.5 V) |
| Pino 39 | I/O — User I/O pin (bank 3) |
| Pino 40 | I/O — User I/O pin (bank 3) |
| Pino 41 | I/O — User I/O pin (bank 3) |
| Pino 42 | I/O — User I/O pin (bank 3) |
| Pino 43 | I/O — User I/O pin (bank 3) |
| Pino 44 | I/O — User I/O pin (bank 3) |
| Pino 45 | I/O — User I/O pin (bank 3) |
| Pino 46 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 47 | I/O — User I/O pin (bank 3) |
| Pino 48 | I/O — User I/O pin (bank 3) |
| Pino 49 | I/O — User I/O pin (bank 3) |
| Pino 50 | I/O — User I/O pin (bank 3) |
| Pino 51 | I/O — User I/O pin (bank 3) |
| Pino 52 | I/O — User I/O pin (bank 3) |
| Pino 53 | I/O — User I/O pin (bank 3) |
| Pino 54 | I/O — User I/O pin (bank 3) |
| Pino 55 | I/O — User I/O pin (bank 3) |
| Pino 56 | I/O — User I/O pin (bank 3) |
| Pino 57 | I/O — User I/O pin (bank 3) |
| Pino 58 | GND — Ground |
| Pino 59 | I/O — User I/O pin (bank 4) |
| Pino 60 | I/O — User I/O pin (bank 4) |
| Pino 61 | I/O — User I/O pin (bank 4) |
| Pino 62 | I/O — User I/O pin (bank 4) |
| Pino 63 | I/O — User I/O pin (bank 4) |
| Pino 64 | I/O — User I/O pin (bank 4) |
| Pino 65 | I/O — User I/O pin (bank 4) |
| Pino 66 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 67 | I/O — User I/O pin (bank 4) |
| Pino 68 | I/O — User I/O pin (bank 4) |
| Pino 69 | I/O — User I/O pin (bank 4) |
| Pino 70 | I/O — User I/O pin (bank 4) |
| Pino 71 | I/O — User I/O pin (bank 4) |
| Pino 72 | I/O — User I/O pin (bank 4) |
| Pino 73 | I/O — User I/O pin (bank 4) |
| Pino 74 | I/O — User I/O pin (bank 4) |
| Pino 75 | I/O — User I/O pin (bank 4) |
| Pino 76 | I/O — User I/O pin (bank 4) |
| Pino 77 | I/O — User I/O pin (bank 4) |
| Pino 78 | VCCINT — Core supply voltage (2.5 V) |
| Pino 79 | I/O — User I/O pin (bank 5) |
| Pino 80 | I/O — User I/O pin (bank 5) |
| Pino 81 | I/O — User I/O pin (bank 5) |
| Pino 82 | I/O — User I/O pin (bank 5) |
| Pino 83 | I/O — User I/O pin (bank 5) |
| Pino 84 | I/O — User I/O pin (bank 5) |
| Pino 85 | I/O — User I/O pin (bank 5) |
| Pino 86 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 87 | I/O — User I/O pin (bank 5) |
| Pino 88 | I/O — User I/O pin (bank 5) |
| Pino 89 | I/O — User I/O pin (bank 5) |
| Pino 90 | I/O — User I/O pin (bank 5) |
| Pino 91 | I/O — User I/O pin (bank 5) |
| Pino 92 | I/O — User I/O pin (bank 5) |
| Pino 93 | I/O — User I/O pin (bank 5) |
| Pino 94 | I/O — User I/O pin (bank 5) |
| Pino 95 | I/O — User I/O pin (bank 5) |
| Pino 96 | I/O — User I/O pin (bank 5) |
| Pino 97 | I/O — User I/O pin (bank 5) |
| Pino 98 | GND — Ground |
| Pino 99 | I/O — User I/O pin (bank 6) |
| Pino 100 | I/O — User I/O pin (bank 6) |
| Pino 101 | I/O — User I/O pin (bank 6) |
| Pino 102 | I/O — User I/O pin (bank 6) |
| Pino 103 | I/O — User I/O pin (bank 6) |
| Pino 104 | I/O — User I/O pin (bank 6) |
| Pino 105 | I/O — User I/O pin (bank 6) |
| Pino 106 | VCCIO5 — I/O bank 5 supply voltage |
| Pino 107 | I/O — User I/O pin (bank 6) |
| Pino 108 | I/O — User I/O pin (bank 6) |
| Pino 109 | I/O — User I/O pin (bank 6) |
| Pino 110 | I/O — User I/O pin (bank 6) |
| Pino 111 | I/O — User I/O pin (bank 6) |
| Pino 112 | I/O — User I/O pin (bank 6) |
| Pino 113 | I/O — User I/O pin (bank 6) |
| Pino 114 | I/O — User I/O pin (bank 6) |
| Pino 115 | I/O — User I/O pin (bank 6) |
| Pino 116 | I/O — User I/O pin (bank 6) |
| Pino 117 | I/O — User I/O pin (bank 6) |
| Pino 118 | VCCINT — Core supply voltage (2.5 V) |
| Pino 119 | I/O — User I/O pin (bank 7) |
| Pino 120 | I/O — User I/O pin (bank 7) |
| Pino 121 | I/O — User I/O pin (bank 7) |
| Pino 122 | I/O — User I/O pin (bank 7) |
| Pino 123 | I/O — User I/O pin (bank 7) |
| Pino 124 | I/O — User I/O pin (bank 7) |
| Pino 125 | I/O — User I/O pin (bank 7) |
| Pino 126 | VCCIO6 — I/O bank 6 supply voltage |
| Pino 127 | I/O — User I/O pin (bank 7) |
| Pino 128 | I/O — User I/O pin (bank 7) |
| Pino 129 | I/O — User I/O pin (bank 7) |
| Pino 130 | I/O — User I/O pin (bank 7) |
| Pino 131 | I/O — User I/O pin (bank 7) |
| Pino 132 | I/O — User I/O pin (bank 7) |
| Pino 133 | I/O — User I/O pin (bank 7) |
| Pino 134 | I/O — User I/O pin (bank 7) |
| Pino 135 | I/O — User I/O pin (bank 7) |
| Pino 136 | I/O — User I/O pin (bank 7) |
| Pino 137 | I/O — User I/O pin (bank 7) |
| Pino 138 | GND — Ground |
| Pino 139 | I/O — User I/O pin (bank 8) |
| Pino 140 | I/O — User I/O pin (bank 8) |
| Pino 141 | I/O — User I/O pin (bank 8) |
| Pino 142 | I/O — User I/O pin (bank 8) |
| Pino 143 | I/O — User I/O pin (bank 8) |
| Pino 144 | I/O — User I/O pin (bank 8) |
| Pino 145 | I/O — User I/O pin (bank 8) |
| Pino 146 | VCCIO7 — I/O bank 7 supply voltage |
| Pino 147 | I/O — User I/O pin (bank 8) |
| Pino 148 | I/O — User I/O pin (bank 8) |
| Pino 149 | I/O — User I/O pin (bank 8) |
| Pino 150 | I/O — User I/O pin (bank 8) |
| Pino 151 | I/O — User I/O pin (bank 8) |
| Pino 152 | I/O — User I/O pin (bank 8) |
| Pino 153 | I/O — User I/O pin (bank 8) |
| Pino 154 | I/O — User I/O pin (bank 8) |
| Pino 155 | I/O — User I/O pin (bank 8) |
| Pino 156 | I/O — User I/O pin (bank 8) |
| Pino 157 | I/O — User I/O pin (bank 8) |
| Pino 158 | VCCINT — Core supply voltage (2.5 V) |
| Pino 159 | I/O — User I/O pin (bank 8) |
| Pino 160 | TDI — JTAG Test Data In |
| Pino 161 | TMS — JTAG Test Mode Select |
| Pino 162 | TCK — JTAG Test Clock |
| Pino 163 | TDO — JTAG Test Data Out |
| Pino 164 | nCONFIG — Configuration start (active low) |
| Pino 165 | nSTATUS — Configuration status (active low) |
| Pino 166 | CONF_DONE — Configuration complete |
| Pino 167 | DCLK — Configuration clock |
| Pino 168 | DATA0 — Configuration data input |
| Pino 169 | nCE — Chip enable (active low) |
| Pino 170 | nWS — Active-low write strobe |
| Pino 171 | CLK0 — Dedicated clock input 0 |
| Pino 172 | CLK1 — Dedicated clock input 1 |
| Pino 173 | CLK2 — Dedicated clock input 2 |
| Pino 174 | CLK3 — Dedicated clock input 3 |
| Pino 175 | GND — Ground |
| Pino 176 | I/O — User I/O pin (bank 1) |
| Pino 177 | I/O — User I/O pin (bank 1) |
| Pino 178 | I/O — User I/O pin (bank 1) |
| Pino 179 | I/O — User I/O pin (bank 1) |
| Pino 180 | I/O — User I/O pin (bank 1) |
| Pino 181 | I/O — User I/O pin (bank 1) |
| Pino 182 | I/O — User I/O pin (bank 1) |
| Pino 183 | I/O — User I/O pin (bank 1) |
| Pino 184 | I/O — User I/O pin (bank 1) |
| Pino 185 | I/O — User I/O pin (bank 1) |
| Pino 186 | VCCIO8 — I/O bank 8 supply voltage |
| Pino 187 | I/O — User I/O pin (bank 1) |
| Pino 188 | I/O — User I/O pin (bank 1) |
| Pino 189 | I/O — User I/O pin (bank 1) |
| Pino 190 | I/O — User I/O pin (bank 1) |
| Pino 191 | I/O — User I/O pin (bank 1) |
| Pino 192 | I/O — User I/O pin (bank 1) |
| Pino 193 | I/O — User I/O pin (bank 1) |
| Pino 194 | I/O — User I/O pin (bank 1) |
| Pino 195 | I/O — User I/O pin (bank 1) |
| Pino 196 | I/O — User I/O pin (bank 1) |
| Pino 197 | I/O — User I/O pin (bank 1) |
| Pino 198 | GND — Ground |
| Pino 199 | I/O — User I/O pin (bank 2) |
| Pino 200 | I/O — User I/O pin (bank 2) |
| Pino 201 | I/O — User I/O pin (bank 2) |
| Pino 202 | I/O — User I/O pin (bank 2) |
| Pino 203 | I/O — User I/O pin (bank 2) |
| Pino 204 | I/O — User I/O pin (bank 2) |
| Pino 205 | I/O — User I/O pin (bank 2) |
| Pino 206 | — Core supply voltage (2.5 V) |
| Pino 207 | I/O — User I/O pin (bank 2) |
| Pino 208 | I/O — User I/O pin (bank 2) |
Aplicações típicas
EP20K100QC208-2X é adequado para 6 aplicaçãos: Telecommunications Line-Card Glue Logic, Industrial Control and Factory Automation, ASIC Pre-Silicon Prototyping, Peripheral Bridging and Bus Interface Logic, Custom DSP Co-Processor, Legacy Avionics and Defense Equipment.
Telecommunications Line-Card Glue Logic
The EP20K100QC208-2X fits telecom line-card interface logic where moderate-density programmable logic bridges backplane ASICs, framer ICs, and TDM buses. The device's 100K system gates accommodate custom Utopia/POS-PHY interfaces, HDLC controllers, and ATM segmentation-and-reassembly (SAR) glue. Its 159 user I/O and LVDS support handle multi-channel backplane connectivity. The 200 MHz internal performance meets OC-3/STM-1 line-rate processing. Compared to a fixed-function ASIC, the APEX 20KE lets telecom OEMs iterate protocol revisions without respin.
Recomendado
Industrial Control and Factory Automation
The EP20K100QC208-2X serves industrial PLC and motor-control boards that need flexible I/O mapping, deterministic glue logic, and long-lifecycle parts. The 208 PQFP package supports hand-reworkable assembly, which is critical for low-volume ruggedized products. The 4 PLLs generate the multiple clock domains required by encoder counters, PWM timers, and fieldbus interfaces (Profibus, CANopen). Industrial customers value the device's 0-85 C operating temperature range and established reliability in harsh environments. Migration to a current Cyclone IV would require PCB redesign.
Recomendado
ASIC Pre-Silicon Prototyping
The EP20K100QC208-2X is commonly used for ASIC prototyping and emulation where 100K gates of LUT-based logic give engineers visibility into architectural decisions before committing to mask costs. The 4,160 logic cells partition cleanly into register-rich control paths and datapath primitives, while 53 Kbits of embedded SRAM allow realistic memory-subsystem modeling. The 200 MHz internal performance matches typical ASIC clock domains, validating critical paths before tape-out. Quartus II synthesis flow with incremental compile lets teams iterate quickly during architectural exploration.
Recomendado
Peripheral Bridging and Bus Interface Logic
The EP20K100QC208-2X fits peripheral bridging applications such as PCI-to-local-bus adapters, custom DMA engines, and legacy ISA-bus glue. With 159 user I/O and 2.5 V core plus multi-voltage I/O, the device bridges 3.3 V PCI, 5 V legacy bus, and 1.8 V point-to-point links on a single chip. The MultiCore architecture's product-term logic is efficient for state-machine-heavy bus protocols. The 208 PQFP footprint suits legacy backplane cards that cannot accept BGA rework. This remains one of the device's strongest legacy use cases.
Recomendado
Custom DSP Co-Processor
The EP20K100QC208-2X can act as a DSP co-processor for FFT, FIR filtering, or codec acceleration alongside a host processor or DSP chip. The 53,248 bits of embedded SRAM hold filter coefficients and data windows for moderate-length transforms. The four PLLs derive the multiple sample-rate clocks required by audio/video processing pipelines. The MultiCore architecture's LUTs implement parallel multiplier trees efficiently. The 200 MHz fabric enables real-time processing at audio sample rates. Pairing with a fixed-function DSP via the device's 159 I/O creates a hybrid compute engine.
Recomendado
Legacy Avionics and Defense Equipment
The EP20K100QC208-2X is qualified into numerous long-lifecycle defense and avionics programs where re-design is prohibitively expensive. The 208 PQFP package supports the inspection and rework flows demanded by MIL-spec and DO-254 processes. The device's mature silicon (0.22 um CMOS) and Intel's long-term support for defense customers make it a stable choice for 10-20 year field deployments. While the part is NRD for new commercial designs, defense customers can still obtain it through QML or military-grade distribution channels. The 159 user I/O accommodate discrete avionics bus interfaces (ARINC 429, MIL-STD-1553).
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP20K100QC208-2X — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP20K100QC208-2 | EP20K100QC208-1N | EP20K100QC208-1 | EP20K100EQC208-2 | EP20K100EQC208-3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 208-PQFP (28x28 mm) | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Family | APEX 20KE | APEX 20KE - same | APEX 20KE - same | APEX 20KE - same | APEX 20KE - same | APEX 20KE - same |
| System Gates | 100,000 | 100,000 - same | 100,000 - same | 100,000 - same | 100,000 - same | 100,000 - same |
| Logic Elements | 4,160 | 4,160 - same | 4,160 - same | 4,160 - same | 4,160 - same | 4,160 - same |
| Speed Grade | -2X (mid, Pb-free) | -2 (mid, non-Pb-free) | -1N (slower, industrial temp) | -1 (slower) | -2 (mid) | -3 (slowest) |
| User I/O | 159 | 159 - same | 159 - same | 159 - same | 159 - same | 159 - same |
| Core Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V - same | 2.375 V to 2.625 V - same | 2.375 V to 2.625 V - same | 2.375 V to 2.625 V - same | 2.375 V to 2.625 V - same |
Principais diferenciais
- Pb-free terminal finish (X suffix) for RoHS-compliant builds (vs EP20K100QC208-2)
- Mid speed grade (-2X) for highest 200 MHz timing margin (vs EP20K100QC208-1N)
- Same die as APEX 20K 100K-gate silicon family across the entire QC208 PQFP line (vs EP20K100FC324-2X)
Notas de projeto
Estimated: The EP20K100QC208-2X requires separate core (VCCINT 2.5 V) and per-bank I/O (VCCIO 1.8 V / 2.5 V / 3.3 V) supplies. Decouple each VCCINT pin with 0.1 uF ceramic plus 10 uF bulk, and each VCCIO bank with 0.1 uF plus 4.7 uF. Place bulk capacitors within 5 mm of the package pins. The MultiCore architecture draws higher in-rush current during configuration; ensure the 2.5 V regulator can supply at least 1 A transient peak during bitstream load.
The 208-pin PQFP at 0.5 mm pitch requires careful escape routing. Use 0.15 mm (6 mil) traces with 0.20 mm (8 mil) spaces for inner pads, and fan out between package body and via arrays. Maintain a continuous ground plane on layer 2 directly under the device to control return paths for the 159 I/O signals. For LVDS signaling, match trace lengths to within 0.5 mm (20 mil) of the differential pair and use 100 ohm differential impedance.
Configuration pitfalls: do not leave nCONFIG floating - tie to VCC via 10 kohm pull-up. The nSTATUS pin must be monitored by the host or pulled high if unused. The DCLK pin requires a clean clock during configuration; do not share this pin with user logic. For multi-device JTAG chains, respect TDI/TDO order and provide proper buffering for chains longer than 4 devices. The CONF_DONE pin must ramp cleanly - add a 10 kohm pull-up to VCCIO.
Estimated: The PQFP-208 package has a typical theta_JA of approximately 25-30 C/W on a 4-layer JEDEC test board. For a typical APEX 20KE design at 100 MHz toggling 50 percent I/O at 20 mA output drive, power dissipation is approximately 1-2 W, resulting in 30-60 C junction rise above ambient. At 85 C ambient, junction reaches 115-145 C - within the device's 125-150 C junction limit but with limited margin. Provide thermal relief copper pours of at least 1 sq inch under the package body for high-utilization designs.
Informações de conformidade
RoHS compliance inferred from the 'X' suffix and the part's commercial introduction date. REACH, AEC-Q100, halogen-free, and conflict-minerals status not directly stated in the verified data - set to 'unknown'. Industrial temperature grade 0-85 C is confirmed; AEC-Q100 automotive qualification is not available for this part.
