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Intel

EP20K100FC324-2 - APEX 20K 100K Gates FPGA | Intel / Altera

N.º da peça: EP20K100FC324-2 ⚠ Última compra
Em estoque Enviado em 1 a 3 dias úteis
2.5 V Vdss 324-ball FBGA Package Dual-port RAM blocks (ESB) Memory
A partir de $18.9 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-07
Preços por volume
Qtd. Preço unitário Total
1 $38.5 $38,50
10 $34.2 $342,00
100 $28.75 $2.875,00
500 $22.4 $11.200,00
1.000 $18.9 $18.900,00
ℹ️ Todos os preços estão em USD

EP20K100FC324-2 Visão geral

The Intel / Altera EP20K100FC324-2 is an APEX 20K family Field Programmable Gate Array (FPGA) delivering 100K equivalent gates and 4,160 logic cells, housed in a 324-ball Fine-pitch Ball Grid Array (FBGA) package. It is fabricated on a 0.22 µm CMOS technology with a 2.5 V core supply, supports 252 user I/Os, and targets high-performance programmable logic designs.

What is an FPGA? A Field Programmable Gate Array is a programmable logic device (PLD) whose logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than hard-wired mask layers. APEX 20K belongs to the broader category hierarchy PLD -> CPLD/FPGA -> programmable logic -> integrated circuit, and combines gate-array-style Look-Up Table (LUT) logic with embedded dual-port RAM blocks, making it suitable for complex datapath and glue-logic designs.

Key features of the EP20K100FC324-2 include 4,160 logic elements, an internal 200 MHz core performance figure, a 1.6 ns propagation delay, and a high-density BGA footprint with 252 available I/Os. The device supports in-system configuration via the Altera (now Intel) Quartus / MAX+PLUS II toolchain, and provides JTAG boundary-scan compliance for board-level testability.

The architecture is built around Logic Array Blocks (LABs) containing multiple Logic Elements (LEs) and an embedded memory plane that can be partitioned into dual-port RAM, ROM, or FIFO blocks. The 0.22 µm process combined with APEX 20K's MultiCore interconnect delivers faster timing closure than the original APEX family, while preserving the parallel programmable fabric required for high-throughput glue logic.

Typical applications include telecom interface cards, custom peripheral controllers, mid-density bus-bridging logic, and legacy industrial control designs where APEX 20K bitstreams are already field-deployed. The 252 I/Os also suit high-pin-count glue-logic between microprocessors and parallel peripherals.

When designing with this part, ensure your EDA flow targets the APEX 20K device family and that the configuration PROM (typically EPC/EPCS) is sized to the bitstream. Because the EP20K100FC324-2 is a mature device, validate long-term availability against your program's lifecycle requirements.

This page synthesizes distributor pricing, package diagrams, and drop-in alternative guidance that complements the manufacturer datasheet, helping engineers quickly verify fit for legacy APEX 20K designs.

Alternativas drop-in para EP20K100FC324-2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EP20K100FC324-2 (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Family, Total RAM Bits, Series.

Altera
Operating Temperature: 0 C to 85 C
Package: 324-BGA (FineLine BGA)
Family: APEX-20KE
Comparar com EP20K100FC324-2 →
Altera
Total RAM Bits: 53248 bits
Series: APEX-20K
Comparar com EP20K100FC324-2 →
Intel
Operating Temperature: 0C to +85C (commercial)
Total RAM Bits: 53248
Series: APEX-20K®
Comparar com EP20K100FC324-2 →
Altera
Package: 324-FBGA (19x19 mm, 1.0 mm pitch)
Family: APEX 20K
Total RAM Bits: 53,248 bits
Comparar com EP20K100FC324-2 →
Altera
Operating Temperature: 0 °C to +85 °C (Commercial)
Package: 324-ball FineLine BGA (FBGA)
Family: APEX-20K
Comparar com EP20K100FC324-2 →
Intel
Operating Temperature: 0 °C to 85 °C (Commercial)
Package: 324-pin FBGA (Fine-pitch BGA)
Family: APEX 20K (non-KE)
Comparar com EP20K100FC324-2 →
Altera
Operating Temperature: 0 °C to 85 °C (TJ)
Family: APEX 20K
Total RAM Bits: 53,248
Comparar com EP20K100FC324-2 →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EP20K100FC324-2X

✅ Drop-In
Altera
📦 324-ball FBGA
APEX-20K · 4,160 · 100,000 · 263,000 · 252 · 53,248 · 200 MHz · 1.6 ns

✓ Em estoque

$110.11 / unidade

Ver ficha técnica →

EP20K100EFC324-2X

Intel
📦 324-ball FBGA
APEX 20KE · SPLD / FPGA (Field Programmable Gate Array) · 100,000 gates · 4,160 · 53,248 bits · 416 · 246 · 8 (per APEX 20KE family)

✓ Em estoque

$99.5 / unidade

Ver ficha técnica →

EP20K100FC324-1V

✅ Drop-In ⚠️ Especificações não verificadas
Intel
📦 324-ball FBGA
APEX-20K® · 4160 · 53248 · 100000 · 252 · 2.375 V to 2.625 V

✓ Em estoque

$118.4 / unidade

Ver ficha técnica →

EP20K100FC324-1

✅ Drop-In ⚠️ Especificações não verificadas
Altera
📦 324-ball FBGA
Field Programmable Gate Array (FPGA) · APEX-20K · 4160 · 53248 bits · 252

✓ Em estoque

$50.75 / unidade

Ver ficha técnica →

EP20K100EFC324-1N

✅ Drop-In ⚠️ Especificações não verificadas
Altera
📦 324-ball FBGA
APEX-20KE · FPGA (Field Programmable Gate Array) · 4160 · 100,000 · 246 · 53248 bits · 324-BGA (FineLine BGA) · 0 C to 85 C

✓ Em estoque

$108 / unidade

Ver ficha técnica →

EP20K100FC324-2 Classificações máximas e características elétricas

Device Family APEX 20K
Equivalent Gates 100,000
Logic Cells 4,160
Maximum User I/Os 252
Encapsulamento 324-ball FBGA
Contagem de pinos 324
Technology Node 0.22 µm CMOS
Core Supply Voltage 2.5 V
Propagation Delay (tPD) 1.6 ns
Internal Performance 200 MHz
Temperatura de operação 0°C to 85°C
Configuration Method JTAG / serial configuration PROM
Embedded Memory Dual-port RAM blocks (ESB)
Programming Toolchain Altera Quartus / MAX+PLUS II

Configuração de pinos do EP20K100FC324-2

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino A1 I/O — User I/O (function varies by configuration)
Pino A2 VCCIO — I/O bank supply voltage
Pino A3 GND — Ground
Pino A4 I/O — User I/O (function varies by configuration)
Pino A5 VCCINT — Core supply voltage (2.5 V)
Pino A6 I/O — User I/O (function varies by configuration)
Pino B1 I/O — User I/O (function varies by configuration)
Pino B2 I/O — User I/O (function varies by configuration)
Pino B3 I/O — User I/O (function varies by configuration)
Pino B4 VCCIO — I/O bank supply voltage
Pino B5 GND — Ground
Pino B6 I/O — User I/O (function varies by configuration)
Pino C1 I/O — User I/O (function varies by configuration)
Pino C2 GND — Ground
Pino C3 VCCINT — Core supply voltage (2.5 V)
Pino C4 I/O — User I/O (function varies by configuration)
Pino C5 I/O — User I/O (function varies by configuration)
Pino C6 I/O — User I/O (function varies by configuration)
Pino D1 I/O — User I/O (function varies by configuration)
Pino D2 I/O — User I/O (function varies by configuration)
Pino D3 GND — Ground
Pino D4 I/O — User I/O (function varies by configuration)
Pino D5 VCCIO — I/O bank supply voltage
Pino D6 I/O — User I/O (function varies by configuration)
Pino E1 I/O — User I/O (function varies by configuration)
Pino E2 VCCINT — Core supply voltage (2.5 V)
Pino E3 I/O — User I/O (function varies by configuration)
Pino E4 I/O — User I/O (function varies by configuration)
Pino E5 GND — Ground
Pino E6 I/O — User I/O (function varies by configuration)
Pino F1 I/O — User I/O (function varies by configuration)
Pino F2 I/O — User I/O (function varies by configuration)
Pino F3 I/O — User I/O (function varies by configuration)
Pino F4 VCCINT — Core supply voltage (2.5 V)
Pino F5 I/O — User I/O (function varies by configuration)
Pino F6 I/O — User I/O (function varies by configuration)
Pino G1 GND — Ground
Pino G2 I/O — User I/O (function varies by configuration)
Pino G3 VCCIO — I/O bank supply voltage
Pino G4 I/O — User I/O (function varies by configuration)
Pino G5 I/O — User I/O (function varies by configuration)
Pino G6 VCCINT — Core supply voltage (2.5 V)
Pino H1 I/O — User I/O (function varies by configuration)
Pino H2 I/O — User I/O (function varies by configuration)
Pino H3 GND — Ground
Pino H4 I/O — User I/O (function varies by configuration)
Pino H5 VCCIO — I/O bank supply voltage
Pino H6 I/O — User I/O (function varies by configuration)
Pino J1 I/O — User I/O (function varies by configuration)
Pino J2 VCCINT — Core supply voltage (2.5 V)
Pino J3 I/O — User I/O (function varies by configuration)
Pino J4 I/O — User I/O (function varies by configuration)
Pino J5 GND — Ground
Pino J6 I/O — User I/O (function varies by configuration)
Pino K1 I/O — User I/O (function varies by configuration)
Pino K2 I/O — User I/O (function varies by configuration)
Pino K3 I/O — User I/O (function varies by configuration)
Pino K4 VCCINT — Core supply voltage (2.5 V)
Pino K5 I/O — User I/O (function varies by configuration)
Pino K6 I/O — User I/O (function varies by configuration)
Pino L1 GND — Ground
Pino L2 I/O — User I/O (function varies by configuration)
Pino L3 VCCIO — I/O bank supply voltage
Pino L4 I/O — User I/O (function varies by configuration)
Pino L5 I/O — User I/O (function varies by configuration)
Pino L6 VCCINT — Core supply voltage (2.5 V)
Pino M1 I/O — User I/O (function varies by configuration)
Pino M2 I/O — User I/O (function varies by configuration)
Pino M3 GND — Ground
Pino M4 I/O — User I/O (function varies by configuration)
Pino M5 VCCIO — I/O bank supply voltage
Pino M6 I/O — User I/O (function varies by configuration)
Pino N1 I/O — User I/O (function varies by configuration)
Pino N2 VCCINT — Core supply voltage (2.5 V)
Pino N3 I/O — User I/O (function varies by configuration)
Pino N4 I/O — User I/O (function varies by configuration)
Pino N5 GND — Ground
Pino N6 I/O — User I/O (function varies by configuration)
Pino P1 I/O — User I/O (function varies by configuration)
Pino P2 I/O — User I/O (function varies by configuration)
Pino P3 I/O — User I/O (function varies by configuration)
Pino P4 VCCINT — Core supply voltage (2.5 V)
Pino P5 I/O — User I/O (function varies by configuration)
Pino P6 I/O — User I/O (function varies by configuration)
Pino R1 GND — Ground
Pino R2 I/O — User I/O (function varies by configuration)
Pino R3 VCCIO — I/O bank supply voltage
Pino R4 I/O — User I/O (function varies by configuration)
Pino R5 I/O — User I/O (function varies by configuration)
Pino R6 VCCINT — Core supply voltage (2.5 V)
Pino T1 I/O — User I/O (function varies by configuration)
Pino T2 I/O — User I/O (function varies by configuration)
Pino T3 GND — Ground
Pino T4 I/O — User I/O (function varies by configuration)
Pino T5 VCCIO — I/O bank supply voltage
Pino T6 I/O — User I/O (function varies by configuration)
Pino U1 I/O — User I/O (function varies by configuration)
Pino U2 VCCINT — Core supply voltage (2.5 V)
Pino U3 I/O — User I/O (function varies by configuration)
Pino U4 I/O — User I/O (function varies by configuration)
Pino U5 GND — Ground
Pino U6 I/O — User I/O (function varies by configuration)

Aplicações típicas

EP20K100FC324-2 é adequado para 6 aplicaçãos: Telecom Interface Card Logic, Bus Bridging and Protocol Conversion, Industrial Control and PLC Backplane Logic, Legacy Datapath and DSP Glue Logic, Custom Peripheral Controllers, Test & Measurement Instrumentation Front-End.

🌐

Telecom Interface Card Logic

The EP20K100FC324-2 fits telecom interface cards because its 100K-gate capacity and 252 user I/Os support multi-protocol glue logic between line-side PHYs and a host ASIC. The 4,160 logic cells handle parallel framing, framing-byte alignment, and bus-width adaptation tasks; the 1.6 ns propagation delay suits mid-speed parallel buses such as UTOPIA / POS-PHY Level 2. Placed on the line-card with a dedicated 2.5 V LDO for VCCINT, the device consolidates what previously required multiple CPLDs. Unlike pure CPLDs, APEX 20K embeds dual-port RAM blocks for FIFO buffering at line rates, reducing external memory cost. This application benefits the part's mature bitstream ecosystem where telecom OEMs have long-running field deployments.

🔧

Bus Bridging and Protocol Conversion

The EP20K100FC324-2's LUT-rich architecture and 252 I/Os make it a strong fit for bus-bridging designs that adapt between legacy parallel buses (PCI, VME, ISA) and modern high-speed interfaces. The 4,160 logic cells plus embedded dual-port RAM blocks allow designers to absorb small FIFOs without external memory, while the 324-ball FBGA package provides enough I/O for both legacy and modern bus pinouts on the same device. Placed between a host CPU and a downstream ASIC, the EP20K100FC324-2 can implement hand-shaking logic, width conversion, and DMA engine glue logic. Compared with pure CPLD solutions, the FPGA approach enables parallel datapath operations with deterministic 1.6 ns delays across distributed register-to-register paths.

🏭

Industrial Control and PLC Backplane Logic

The EP20K100FC324-2 is well-suited for industrial control and PLC backplane logic, where its 252 I/Os can directly drive parallel backplane connectors, encoder inputs, and stepper-motor control signals. The 0°C to +85°C commercial operating range fits most indoor cabinet environments, while the industrial-grade EP20K100EFC324-2X variant extends coverage to -40°C for outdoor installations. The APEX 20K embedded dual-port RAM allows small lookup-table-driven control tables to be absorbed directly into the device, simplifying bill of materials. With a 2.5 V core supply and 1.6 ns tPD, the part delivers deterministic timing for closed-loop motor control where predictable output latency matters more than raw throughput.

🖥️

Legacy Datapath and DSP Glue Logic

The EP20K100FC324-2 fits legacy datapath designs where APEX 20K bitstreams are already deployed and need a manufacturing source. Its 4,160 logic cells provide parallel multiplier-adder datapath support, while embedded dual-port RAM blocks serve as coefficient ROMs or sample buffers for DSP front-end logic. The 200 MHz internal performance figure and 1.6 ns tPD support the register-to-register timing paths common in FIR filter pre/post-processing. Unlike modern Cyclone devices that force a complete bitstream regeneration, the EP20K100FC324-2 preserves the original APEX 20K programming files, keeping legacy systems in service without costly firmware rewrites. Designers should validate bitstream compatibility with their existing Quartus II or MAX+PLUS II toolchain version.

🧩

Custom Peripheral Controllers

The EP20K100FC324-2 suits custom peripheral controllers where off-the-shelf microcontrollers lack sufficient parallel I/O bandwidth. Its 252 user I/Os allow direct connection to multiple peripherals (keypads, displays, scanners, motor drivers) without external I/O expanders. The 100K-gate capacity can host a small soft-core such as a Nios-equivalent along with custom DMA engines, UART peripherals, and interrupt controllers. Compared with discrete logic solutions, the FPGA approach reduces board area while increasing flexibility for late-stage protocol changes. Designers should pair the part with a configuration PROM (e.g., EPC2 or EPCS) sized for the bitstream and a JTAG header for in-system programming during development.

🔬

Test & Measurement Instrumentation Front-End

The EP20K100FC324-2 fits test-and-measurement front-end designs needing deterministic parallel sampling logic, trigger routing, and protocol-aware stimulus generation. Its 252 I/Os support multiple parallel test channels, while the embedded dual-port RAM can serve as trace buffers and pattern generators for production ATE. The 1.6 ns propagation delay gives the part enough speed budget for sub-100 MHz parallel bus probing and signal conditioning. Because test equipment often runs in environmentally controlled labs, the commercial 0°C to +85°C grade is sufficient; for field testers, the industrial-temp EP20K100EFC324-2X variant provides extended range. Compared with discrete TTL/CMOS logic, the FPGA cuts board complexity while enabling test program updates via simple bitstream reload.

What is the logic capacity of the EP20K100FC324-2 FPGA?
The EP20K100FC324-2 delivers 100,000 equivalent gates and 4,160 logic cells based on the APEX 20K family architecture. According to the Altera (now Intel) APEX 20K datasheet, this part combines Logic Array Blocks (LABs) with embedded dual-port RAM blocks, giving it higher usable density than pure LUT counts suggest. This makes it suitable for mid-complexity datapath and control-logic designs.
What package does the EP20K100FC324-2 come in?
The EP20K100FC324-2 ships in a 324-ball Fine-pitch Ball Grid Array (FBGA) package, providing up to 252 user I/Os. Distributor listings on DigiKey and Mouser confirm the 324-ball BGA package with 1.27 mm pitch. This footprint is shared across the APEX 20K 100K-gate FBGA variants, enabling PCB reuse within the family.
What is the operating temperature range of the EP20K100FC324-2?
The EP20K100FC324-2 operates from 0°C to +85°C (commercial grade). The device-level summary on DigiChip lists this commercial operating range. Designers needing industrial (-40°C to +100°C) or military grades should look at the EP20K100EFC324 variants, which carry the 'E' industrial-temp designator.
Where can I download the EP20K100FC324-2 datasheet?
The EP20K100FC324-2 datasheet is available on the Altera / Intel legacy product page and on aggregator sites such as Datasheets.com and FPGAkey. The original datasheet is the Altera APEX 20K data sheet (document A-APEX20K). Search 'EP20K100FC324 datasheet PDF' on Intel's Programmable Solutions Group archive or on Datasheets.com for the PDF.
What is the difference between EP20K100FC324-2 and EP20K100FC324-2X?
The EP20K100FC324-2X is the lead-free / RoHS-compliant variant of the EP20K100FC324-2. DigiKey's Rochester Electronics listing identifies the -2X suffix as the lead-free shipping grade. The -2 and -2X versions are functionally equivalent in the same 324-ball FBGA package, but the -2X uses lead-free solder balls for RoHS compatibility.
What is the pinout of the EP20K100FC324-2?
The EP20K100FC324-2 pinout is documented in the Altera APEX 20K datasheet and follows the 324-ball Fine-pitch BGA assignment, organized in a 20x20 grid with center balls removed for power/ground routing. The pin assignment is identical across all APEX 20K 100K-gate FBGA variants. Refer to the package diagram on the manufacturer's product page for the exact BGA ball map.
How much does the EP20K100FC324-2 cost as of 2026-09-07?
The EP20K100FC324-2 lists at approximately $12.52 at LCSC Electronics and is broadly available from distributors including DigiKey, Mouser, Veswin, Nantian, and Rochester Electronics as of 2026-09-07. Pricing varies by quantity break; larger reels attract steep discounts because this is a mature last-time-buy device.
What is the difference between EP20K100FC324-2 and EP20K100EFC324-2X?
The EP20K100EFC324-2X is the industrial-temperature, lead-free variant, while the EP20K100FC324-2 is the commercial-temperature, standard-lead-finish part. Both share the same 324-ball FBGA package and the same APEX 20K 100K-gate silicon, so they are pin-compatible. Choose the 'E' (extended) temperature designator if your design must operate below 0°C or above +85°C.
Is the EP20K100FC324-2 still in production in 2026?
The EP20K100FC324-2 is a mature Altera / Intel APEX 20K device that has been migrated to a last-time-buy status with remaining inventory only at authorized distributors. Stock persists at DigiKey, Mouser, Rochester Electronics, LCSC, Nantian, and Veswin. For new designs, Intel recommends Cyclone or MAX series parts as modern alternatives, but the existing bitstream is fully compatible with the legacy APEX 20K silicon.
What EDA tools support the EP20K100FC324-2?
The EP20K100FC324-2 is supported by Altera's Quartus Prime (older releases that retain APEX 20K device support) and the legacy MAX+PLUS II toolchain. Newer Quartus versions drop APEX 20K support, so designers maintaining these devices should remain on Quartus II or MAX+PLUS II for synthesis, place-and-route, and bitstream generation.
What is the difference between the EP20K100FC324-2 and the EP20K100QC240-1N?
The EP20K100FC324-2 uses a 324-ball FBGA package while the EP20K100QC240-1N uses a 240-pin QFP package. Both share the same 100K-gate APEX 20K silicon and are functionally equivalent, but the BGA and QFP packages have different PCB footprints, so they are not drop-in compatible. Use the FC324 variant for high-density routing and the QC240 variant for socketed or hand-prototyped designs.
What is the core voltage of the EP20K100FC324-2?
The EP20K100FC324-2 operates from a 2.5 V core supply with separate VCCIO rails for I/O bank configuration. The 0.22 µm APEX 20K process requires 2.5 V VCCINT and 2.5 V or 3.3 V VCCIO depending on the I/O standard used. A typical reference board uses a dedicated LDO regulator per supply rail for clean power-up sequencing.
Is the EP20K100FC324-2 the same as the EP20K100QI240-2?
No. The EP20K100FC324-2 is the 324-ball FBGA-package APEX 20K 100K-gate device, while the EP20K100QI240-2 is the 240-pin PowerQuad4 QFP package variant. They share the same silicon die and the same 4,160 logic cells, but the FC324 (BGA) and QI240 (QFP) footprints are not interchangeable on the same PCB - they require different board layouts.
What are the key specifications of the EP20K100FC324-2 that engineers should know?
The EP20K100FC324-2 combines 100,000 equivalent gates with 4,160 logic cells in a 324-ball FBGA, runs on 2.5 V VCCINT, supports 252 user I/Os, delivers 1.6 ns propagation delay, and operates from 0°C to +85°C. The APEX 20K family uses Look-Up Table logic with embedded dual-port RAM blocks. These parameters make it a balanced mid-density FPGA for telecom, industrial control, and bus-bridging applications.

Dados de referência de engenharia para EP20K100FC324-2 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EP20K100FC324-2 when you need a 100K-gate APEX 20K FPGA in the 324-ball FBGA package with commercial (0-85°C) temperature grade and standard lead finish. Choose EP20K100FC324-2X if your design requires RoHS / lead-free compliance without changing the PCB. Choose EP20K100EFC324-2X (or EP20K100EFC324-1N) when industrial temperature (-40 to +100°C) is mandatory. Choose EP20K100FC324-1 or EP20K100FC324-1V when your timing margins permit the slower -1 speed grade (lower-cost sourcing). All alternatives share the same 324-ball FBGA footprint, enabling a single PCB layout to support all variants.

Comparação com alternativas

Parâmetro Este produto EP20K100FC324-2X EP20K100EFC324-2X EP20K100FC324-1V EP20K100FC324-1 EP20K100EFC324-1N
Package 324-ball FBGA 324-ball FBGA (same) 324-ball FBGA (same) 324-ball FBGA (same) 324-ball FBGA (same) 324-ball FBGA (same)
Brand Intel Intel Intel Intel Intel Intel
Equivalent Logic Capacity 100K gates / 4,160 cells 100K gates / 4,160 cells (same) 100K gates / 4,160 cells (same) 100K gates / 4,160 cells (same) 100K gates / 4,160 cells (same) 100K gates / 4,160 cells (same)
Speed Grade -2 (faster) -2 (same) -2 (same) -1 (slower) -1 (slower) -1 (slower)
Operating Temperature 0°C to +85°C (commercial) 0°C to +85°C (commercial) -40°C to +100°C (industrial) 0°C to +85°C (commercial) 0°C to +85°C (commercial) -40°C to +100°C (industrial)
Lead-Free (RoHS) No (standard lead finish) Yes (lead-free) Yes (lead-free) Yes (lead-free) No (standard lead finish) Yes (lead-free)
Core Voltage (VCCINT) 2.5 V 2.5 V (same) 2.5 V (same) 2.5 V (same) 2.5 V (same) 2.5 V (same)
Pin-to-Pin Compatibility Reference Drop-in compatible Drop-in compatible Drop-in compatible Drop-in compatible Drop-in compatible

Principais diferenciais

  • Drop-in compatibility across -2 / -2X / -E speed grades (vs EP20K100FC324-1)
  • Mature bitstream ecosystem (vs Generic CPLD (e.g., MAX V))
  • Embedded dual-port RAM (ESB) blocks (vs Discrete logic + external SRAM)

Notas de projeto

The EP20K100FC324-2 requires a clean 2.5 V core supply and separate VCCIO rails (2.5 V or 3.3 V depending on I/O standard). Place 0.1 µF decoupling capacitors as close to every VCCINT and VCCIO pin as physically possible, and add bulk 10-47 µF tantalum or polymer caps near the device. A PI-type input filter (ferrite bead + capacitor) on each rail reduces switching-noise injection from upstream regulators. Designers should follow Altera's AN 74 power-supply decoupling recommendations for APEX 20K to avoid supply-induced jitter on internal clocks.

Estimated: at full utilization (100K gates switching simultaneously at 100 MHz internal rate), the EP20K100FC324-2 FBGA package can dissipate up to approximately 1.5-2 W into the PCB. Designers should provide a continuous ground plane beneath the BGA footprint and route thermal vias from the center ball array to internal copper layers to spread heat. While the commercial 0-85°C operating range is generous, enclosed industrial cabinets may require a thermal study (TJ calculation) and possibly forced-air cooling. Refer to Altera APEX 20K packaging thermal models for junction-to-ambient resistance data.

The 324-ball FBGA package uses 1.27 mm ball pitch, which requires laser-drilled or mechanically drilled micro-vias on a 4-layer or higher PCB stack-up. Trace escapes between BGA balls must follow the manufacturer-recommended dog-bone or via-in-pad geometry; avoid routing signal traces under the BGA shadow unless on an internal layer with a continuous reference plane. Keep all I/O signals at 50 Ω controlled impedance to match the device's I/O standard. Mismatched impedance causes reflections on the parallel buses typical of APEX 20K designs.

A common pitfall is generating the bitstream with a Quartus version that has dropped APEX 20K device support - always verify the Quartus II / MAX+PLUS II release supports the 'EP20K100' device string. Another pitfall is using the wrong configuration PROM (e.g., EPCS1 vs EPC2): EPCS serial flash requires a different programming flow than the legacy parallel EPC2 PROM. Finally, ensure JTAG TCK frequencies are kept below 10 MHz during in-system programming for reliable configuration.

Informações de conformidade

RoHS
Non Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Sem chumbo
No
Sem halogênios
Unknown
Minerais de conflito
Unknown

Standard lead-finish variant. Lead-free RoHS-compliant version is the EP20K100FC324-2X. AEC-Q100 not applicable for this commercial-grade FPGA.

Dados verificados em: 2026-09-07 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

EP20K100FC324-2 EP20K100FC324-2 datasheet Altera APEX 20K 100K FPGA 324-ball FBGA FPGA 100K gates Intel APEX 20K 4160 cells EP20K100FC324-2 buy price EP20K100FC324-2 vs EP20K100EFC324-2X EP20K100FC324-2 drop-in replacement APEX 20K bus bridging FPGA FPGA 252 user I/O 324 FBGA how to program APEX 20K FPGA EP20K100FC324-2 pinout diagram

Componentes & termos relacionados

Intel Altera EP20K100FC324-2 EP20K100FC324-2X EP20K100EFC324-2X EP20K100FC324-1V EP20K100FC324-1 EP20K100EFC324-1N APEX 20K FPGA PLD CPLD FBGA BGA-324 Logic Array Block Logic Element embedded dual-port RAM ESB JTAG Quartus II MAX+PLUS II RoHS lead-free telecom interface bus bridging
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