EP20K200RC240-3 - APEX-20K FPGA, 200K Gates, 240-BFQFP | Intel / Altera
N.º da peça: EP20K200RC240-3 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $71.2 | $712,00 |
| 100 | $62.4 | $6.240,00 |
| 500 | $55.1 | $27.550,00 |
| 1.000 | $49.85 | $49.850,00 |
EP20K200RC240-3 Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that the designer can program after manufacturing. FPGAs sit at the top of the programmable logic hierarchy: programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA. They are used to implement arbitrary digital logic, glue logic, signal processing pipelines, and full processor subsystems without fabricating a custom ASIC. The APEX-20K family was Altera's first SOPC (system-on-a-programmable-chip) platform, integrating look-up tables for register-intensive functions and product-term logic for arithmetic paths into a single fabric.
Key features of the EP20K200RC240-3 include 174 maximum user I/O, 4 Embedded System Blocks (ESBs) supporting True Dual-Port RAM at up to 311 MHz in -3 speed grade, an internal MultiTrack interconnect for high-speed routing, and IEEE 1149.1 JTAG boundary-scan support. The 1.8V core (VCCINT) with 2.375V to 2.625V supply tolerance and 3.3V tolerant I/O make it well suited for mixed-voltage board designs.
Typical applications span telecommunications line cards, industrial control, high-speed data processing, DSP co-processing, and legacy ASIC replacement. The wide I/O count and embedded RAM make it effective for bus-bridging, custom peripheral controllers, and parallel DSP pipelines. Designers should configure the device with Quartus II (legacy) or Max+Plus II to generate the configuration bitstream loaded into the on-chip SRAM cells.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone. Engineers comparing this part against modern Cyclone or Lattice alternatives should weigh the 1.8V core supply, BFQFP-240 footprint, and active Altera/Intel legacy support window.
Alternativas drop-in para EP20K200RC240-3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP20K200RC240-3 (mesmo formato e footprint) — diferindo em Package, Speed Grade, Maximum Internal Frequency, Core Supply Voltage, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP20K200RC240-2X
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$240.36 / unidade
Ver ficha técnica →EP20K200RC240-1
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$65 / unidade
Ver ficha técnica →EP20K200EQC240-3N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$45.25 / unidade
Ver ficha técnica →EP20K200EQC240-2
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$14 / unidade
Ver ficha técnica →EP20K200EQC240-1
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →EP20K200RC240-2X
✅ Drop-In✓ Em estoque
$240.36 / unidade
Ver ficha técnica →EP20K200RC240-3 Classificações máximas e características elétricas
| Series | APEX-20K |
| Device Family | Apex 20KE |
| Logic Elements / Cells | 8320 |
| System Gates | 106496 |
| Number of Logic Array Blocks (LABs) | 832 |
| Maximum User I/O | 174 |
| Embedded Memory Blocks (ESBs) | 4 |
| Total Embedded RAM Bits | 53248 bits |
| Number of I/O Banks | 8 |
| Core Supply Voltage (VCCINT) | 1.8 V (typ) |
| I/O Supply Voltage Range | 2.375 V to 2.625 V |
| Speed Grade | -3 (commercial, low-power) |
| Temperatura de operação | 0C to +85C |
| Encapsulamento | 240-BFQFP Exposed Pad (Plastic Quad Flat Pack) |
| Tipo de montagem | Surface Mount |
| Configuration Mode | SRAM-based, JTAG / Passive Serial / Passive Parallel |
| JTAG Support | IEEE 1149.1 Boundary-Scan |
Guia de Configuração de Pinos do EP20K200RC240-3 240-bfqfp exposed pad (plastic quad flat pack)
Configuração de pinos para EP20K200RC240-3 (pacote 240-bfqfp exposed pad (plastic quad flat pack)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP20K200RC240-3.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP20K200RC240-3 é adequado para 7 aplicaçãos: Telecommunications Line Card Interface, Industrial Motor Control and Drive, High-Speed Data Acquisition Front-End, ASIC Replacement and Glue Logic Consolidation, Custom DSP Co-Processor Pipeline, Embedded Industrial Networking Bridge, Legacy Test and Measurement Backplane.
Telecommunications Line Card Interface
The EP20K200RC240-3 fits telecom line cards as a glue-logic and bus-aggregation controller, leveraging its 174 user I/O and 106,496 system gates to interface between TDM backplanes and parallel data paths. Its 1.8V core and 3.3V-tolerant I/O simplify mixed-voltage board designs common in legacy telecom racks. Placed between an upstream PHY and a downstream processor, the device can run custom framing, error correction, and rate-adaptation logic in hardware. Designers should pair it with a 53,248-bit embedded RAM block to buffer packet fragments, and use Quartus II SOPC Builder to instantiate the Avalon bus. Trade-off: the APEX-20K fabric is older than modern Cyclone IV/V and consumes more power per logic element.
Recomendado
Industrial Motor Control and Drive
The EP20K200RC240-3 suits industrial motor drive controllers where deterministic logic and abundant I/O outweigh absolute clock speed. With 174 user I/O it can drive PWM channels, encoder feedback, and Hall-sensor inputs simultaneously while running state machines for commutation and current-loop control. Speed grade -3 (slower, low-power) is acceptable in motor control where PWM frequencies stay below 100 kHz. The 240-BFQFP exposed-pad package offers excellent thermal dissipation for hot control cabinets. Compared to a microcontroller, this FPGA offers deterministic latency and parallel I/O handling at the cost of higher BOM and configuration overhead. Recommended for legacy industrial designs or retrofits where the existing APEX-20K firmware is reused.
Recomendado
High-Speed Data Acquisition Front-End
The EP20K200RC240-3 is well-matched to high-speed data acquisition front-ends that require parallel ADC interfacing, FIFO buffering, and custom DSP pipelines. Its 4 embedded system blocks (ESBs) provide up to 53,248 bits of true dual-port RAM ideal for sample-rate buffers between ADCs and a downstream DSP. The 174 I/O can directly sample 16-bit parallel ADCs running at 80-100 MSPS and perform real-time filtering or decimation. Speed grade -3 supports internal fabric clocks around 150-180 MHz. Pair with the Apex 20KE SignalTap II logic analyzer in Quartus II to verify timing closure during board bring-up. Trade-off: APEX-20K lacks hard DSP blocks, so designers must implement MAC units in LUTs, increasing logic element usage.
Recomendado
ASIC Replacement and Glue Logic Consolidation
The EP20K200RC240-3 is commonly used to replace obsolete ASICs in legacy designs where redesigning the silicon is cost-prohibitive. Its 106,496 system gates can absorb the typical density of a mid-1990s gate-array ASIC, while its reprogrammability enables late-stage bug fixes. The 240-BFQFP package and 1.8V core are pin-compatible with many existing boards, making it a mechanical drop-in upgrade. Designers migrating from a discontinued ASIC benefit from Quartus II SOPC integration to add Nios soft-processors for system control. The NRND status is acceptable for legacy support windows where the design must simply function. Trade-off: not recommended for new high-volume designs given APEX-20K NRND classification.
Recomendado
Custom DSP Co-Processor Pipeline
The EP20K200RC240-3 serves as a co-processor in DSP pipelines where parallel arithmetic and I/O parallelism outperform microcontrollers. Designers can implement custom FIR/IIR filters, FFTs, or codec blocks in LUTs and ESBs while a host processor streams data via the parallel I/O. With 8,320 logic elements and 53,248 bits of embedded RAM, the device can handle a 64-tap FIR filter running at audio bandwidth or a small image-processing pipeline. Speed grade -3 sets internal fabric clocks at roughly 150-180 MHz, sufficient for video-rate processing of moderate complexity. Pair with external SDRAM to extend sample buffers beyond the ESB capacity. Trade-off: APEX-20K uses more power per MAC than modern FPGAs with hard DSP blocks.
Recomendado
Embedded Industrial Networking Bridge
The EP20K200RC240-3 fits embedded industrial networking bridges where it must translate between Ethernet, Profibus, RS-485, and CAN, while presenting a unified register map to a host PLC. The 174 I/O can directly drive multiple isolated transceivers and the 106,496 system gates can host custom frame-formatters for each protocol. The 1.8V core and 3.3V I/O simplify mixed-voltage designs where some PHY chips run at 2.5V. Speed grade -3 keeps power consumption acceptable for always-on industrial installations. Quartus II SOPC Builder can instantiate a Nios II soft-processor to run network management protocols without an external MCU. Trade-off: APEX-20K NRND status makes it suitable only for legacy support of fielded industrial equipment.
Recomendado
Legacy Test and Measurement Backplane
The EP20K200RC240-3 is used in legacy test-and-measurement backplanes where the FPGA performs pattern generation, scan-chain control, and custom stimulus routing. With 174 user I/O and 4 ESBs, it can drive a 16-channel mixed-signal test platform while buffering captured waveforms in embedded RAM. Speed grade -3 supports stimulus patterns at up to 100 MHz which matches most legacy ATE timing requirements. The 240-BFQFP exposed-pad package delivers thermal headroom for continuous full-power operation in test head environments. Designers use SignalTap II for on-chip debugging and Quartus II LogicLock regions to isolate test IP blocks. Trade-off: APEX-20K is supported only by legacy Quartus II 13.0 and earlier, not by modern Intel Quartus Prime Pro.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP20K200RC240-3 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP20K200RC240-2 | EP20K200RC240-1 | EP20K200EQC240-3 | EP20K200EQC240-2 | EP20K200EQC240-1 | EP20K200RC240-2X |
|---|---|---|---|---|---|---|---|
| Package | 240-BFQFP Exposed Pad | 240-BFQFP Exposed Pad (same) | 240-BFQFP Exposed Pad (same) | 240-BFQFP Exposed Pad (same) | 240-BFQFP Exposed Pad (same) | 240-BFQFP Exposed Pad (same) | 240-BFQFP Exposed Pad (same) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | -3 (commercial, low-power) | -2 (faster) | -1 (fastest) | -3 (enhanced, low-power) | -2 (enhanced, faster) | -1 (enhanced, fastest) | -2 RoHS (faster, lead-free) |
| System Gates | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| Maximum User I/O | 174 | 174 | 174 | 174 | 174 | 174 | 174 |
| Embedded RAM (bits) | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 |
| Core Supply (VCCINT) | 1.8 V (2.375-2.625 V I/O) | 1.8 V (same) | 1.8 V (same) | 1.8 V (same) | 1.8 V (same) | 1.8 V (same) | 1.8 V (same) |
| Device Family | APEX-20KE (Standard) | APEX-20KE (Standard) | APEX-20KE (Standard) | APEX-20KE (Enhanced) | APEX-20KE (Enhanced) | APEX-20KE (Enhanced) | APEX-20KE (Standard, lead-free) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Principais diferenciais
- Lowest-power speed grade in APEX-20KE 200K family (vs EP20K200RC240-2)
- Standard fabric vs Enhanced interconnect (vs EP20K200EQC240-3)
- Lead-free / RoHS compliance variant available (vs EP20K200RC240-2X)
Notas de projeto
Estimated: at 1.8V core, with 8320 logic elements running at 50% utilization and 174 I/O at 25 MHz LVCMOS33, the EP20K200RC240-3 typically draws 250-400 mA on VCCINT. Provide a 1.8V rail via an LT1764A-1.8 or equivalent low-noise LDO rated for at least 800 mA, with a 10uF tantalum plus 0.1uF ceramic decoupling network placed within 5 mm of each VCCINT pin. The exposed pad on the 240-BFQFP package must be soldered to a copper pour connected to GND for thermal dissipation. Insufficient decoupling will cause logic glitches and I/O timing violations during high-ESB read/write activity.
The 240-BFQFP exposed-pad package has 0.5 mm pitch leads, which is challenging for hand-soldering and demands reflow assembly. Use a 4-layer PCB stackup with continuous GND planes on layer 2 to minimize ground bounce. Length-match clock traces (CLK0, CLK1) to within 1 mm to avoid duty-cycle distortion; route configuration PROM data lines (DCLK, DATA, nCONFIG, nSTATUS, CONF_DONE) in a single bus with matched lengths to prevent configuration errors. Provide JTAG test points on TCK, TMS, TDI, TDO for in-system programming and boundary-scan diagnostics.
The EP20K200RC240-3 is SRAM-based and loses its configuration on every power-down. You must pair it with an EPC2 or EPC16 configuration PROM or use a microcontroller to load the bitstream via JTAG. Forgetting the configuration PROM is a common engineering error that leaves the device non-functional at first prototype. Additionally, this device is supported only by Quartus II versions up to 13.0 (legacy Intel/Altera tools); modern Quartus Prime does not support APEX-20K. Verify your toolchain compatibility before committing to this FPGA for new development.
Estimated: at 1A VCCINT current and 1.8V supply, the device dissipates ~1.8W internally. The 240-BFQFP exposed-pad package has theta_JA of approximately 18 C/W with a 4-layer 4x4 inch board and a properly soldered exposed pad, giving a junction temperature rise of ~32C above ambient. At the upper commercial limit of 85C ambient, junction temperature reaches ~117C - well within the 125C silicon limit but leaves minimal headroom. For industrial temperature (85C) operation in enclosed cabinets, add forced-air cooling or reduce fabric utilization to maintain margin.
Informações de conformidade
RoHS status not confirmed in verified data; the original EP20K200RC240-3 likely contains lead (standard Altera BFQFP), choose EP20K200RC240-2X for the RoHS-compliant variant. AEC-Q100 not applicable - APEX-20K FPGAs are not automotive-qualified.
