Intel

EP3C55F780C6 - Cyclone III FPGA, 55K LEs, 780-BGA | Intel (Altera)

N.º da peça: EP3C55F780C6 ✓ Ativo

Em estoque Enviado em 1 a 3 dias úteis

LVDS, LVTTL, LVCMOS, SSTL, HSTL Vdss 780-ball FBGA Package -6 (C6) Speed 2,396,160 Memory

A partir de $209.22 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-09

Preços por volume

Qtd.	Preço unitário	Total
1	$321.88	$321,88
10	$289.69	$2.896,90
100	$257.5	$25.750,00
250	$231.75	$57.937,50
500	$209.22	$104.610,00

ℹ️ Todos os preços estão em USD

Ver datasheet (PDF) Ver alternativas

Quantidade

EP3C55F780C6 Visão geral

The Intel (formerly Altera) EP3C55F780C6 is a Cyclone III field-programmable gate array (FPGA) with 55,856 logic elements, 2,396,160 bits of embedded memory, and 156 18x18 hardware multipliers, housed in a 780-ball fine-pitch BGA package with 377 user I/Os. Built on a low-power 65nm process, the Cyclone III family delivers a balance of logic density, memory, and DSP capability at a fraction of the static power of competing 90nm FPGAs.

A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM and DSP slices. FPGAs sit in the programmable-logic tier of the digital semiconductor hierarchy: ASIC < structured ASIC < FPGA < CPLD < microcontroller. Designers use HDL (Verilog or VHDL) to describe the desired digital function, then synthesize, place, and route the design with vendor tools (Quartus II for the Cyclone III family). Unlike fixed-function ASICs, FPGAs allow in-system reconfiguration, making them ideal for prototyping, low-volume production, and designs that must evolve in the field.

Key features of the EP3C55F780C6 include a 4-Mbit embedded memory subsystem, four general-purpose PLLs for clock synthesis, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL on user I/Os. The 'C6' speed grade offers a -6 speed rating for internal logic, and the 'C' prefix denotes the commercial temperature grade of 0C to +85C. Static power consumption is significantly reduced compared to Cyclone II, enabling fan-less operation in cost-sensitive applications.

From an architectural perspective, the Cyclone III device family uses 4-input look-up tables (LUTs) per logic element, M9K block RAM tiles, and 18x18 multiplier blocks optimized for DSP. The 780-FBGA package provides high I/O density suitable for memory-bus bridging, video processing pipelines, and parallel sensor aggregation. Configuration is supported through JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes via the dedicated configuration pins.

Typical applications include industrial motor control, video surveillance and image processing, telecom line cards, low-cost ASIC prototyping, and embedded vision systems. The combination of DSP blocks and on-chip memory is particularly suited to digital filtering, FFT computation, and image pre-processing. Designers transitioning from older Cyclone II designs will find pin-compatible migration options within the family.

When designing with this device, ensure the PCB BGA layout meets the 1.0mm ball pitch clearance rules of the 780-FBGA package and that the Quartus II power-play analysis is run early in the design cycle. Decoupling must follow the reference design guidance in the Cyclone III Device Handbook.

This page synthesizes distributor pricing, drop-in Cyclone III alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers select the right Cyclone III variant for their application.

Alternativas drop-in para EP3C55F780C6 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EP3C55F780C6 (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade, Embedded 18x18 Multipliers, RoHS Status.

EP3C40F780C6

Altera

Package: 780-BGA (FineLine)

Process Technology: 60 nm low-power

Speed Grade: C6

Comparar com EP3C55F780C6 →

EP3C55F780C6N

Intel

Package: 780-ball FBGA (F780)

Process Technology: 65 nm low-power CMOS

Speed Grade: C6

Comparar com EP3C55F780C6 →

EP3C55F780C7

Intel

Package: 780-ball FBGA (F780)

Process Technology: 65 nm TSMC low-power CMOS

Speed Grade: 7

Comparar com EP3C55F780C6 →

EP3C55F780C7N

Intel

Package: 780-ball FineLine BGA

Process Technology: 65 nm low-power CMOS

Speed Grade: 7

Comparar com EP3C55F780C6 →

EP3C55F780C8

Intel

Process Technology: 65 nm

Speed Grade: 8

Comparar com EP3C55F780C6 →

EP3C55F780C8N

Intel

Package: 780-pin FBGA (29x29 mm, 1.0 mm pitch)

Process Technology: 65 nm TSMC low-power

Speed Grade: 8 (commercial, slowest)

Comparar com EP3C55F780C6 →

EP3C55F780I7N

Intel

Package: 780-FBGA (29 x 29 mm, 1 mm pitch, 2.60 mm height)

Process Technology: 65 nm

Speed Grade: -7 (fastest)

Comparar com EP3C55F780C6 →

✅ Drop-In

📦 780-ball FBGA

Industrial temp grade -40C to +100C, C6 speed grade, same 780-FBGA, same 55,856 LEs

📋 Alternativa de referência (fora do catálogo)

EP3C55F780C8N

✅ Drop-In

Intel

📦 780-ball FBGA

Cyclone III · Cyclone III (low-cost FPGA) · 55,856 · 3,491 · 2,396,160 bits (2396 Kbit) · 260 · 156 · 4

✓ Em estoque

$58.2 / unidade

Ver ficha técnica →

EP3C40F780C6

✅ Drop-In

Altera

📦 780-ball FBGA

Cyclone III · Cyclone III · 39,600 · 1,161,216 · 535 · 2475 · 39600 · 1161216

✓ Em estoque

$142.1 / unidade

Ver ficha técnica →

EP3C55F780C6 Classificações máximas e características elétricas

Series	Cyclone III
Logic Elements	55,856
Embedded Memory Bits	2,396,160
Number of Block RAM (M9K)	260
18x18 Hardware Multipliers	156
User I/Os	377
Encapsulamento	780-ball FBGA
Speed Grade	-6 (C6)
Temperatura de operação	0C to +85C (Commercial)
Process Technology	65 nm low power
Configuration Methods	JTAG, AS, AP, PS
Number of PLLs	4
Maximum User I/O Voltage Standards	LVDS, LVTTL, LVCMOS, SSTL, HSTL
Status RoHS	Compliant
Tipo de montagem	Surface Mount (BGA)

Guia de Configuração de Pinos do EP3C55F780C6 780-ball fbga

Configuração de pinos para EP3C55F780C6 (pacote 780-ball fbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.

Diagrama de pinagem do pacote 780-ball fbga para EP3C55F780C6

Nenhum dado detalhado de pinagem disponível para EP3C55F780C6.

Consulte a ficha técnica para a configuração completa dos pinos.

Aplicações típicas

EP3C55F780C6 é adequado para 6 aplicaçãos: Industrial Motor Control, Video Surveillance and Image Processing, ASIC Prototyping and Verification, Telecom Line Cards and Protocol Bridging, Embedded Vision Systems, Low-Cost DSP and FIR Filter Arrays.

🏭

Industrial Motor Control

The EP3C55F780C6 is well suited to multi-axis industrial motor control with its 156 18x18 hardware multipliers enabling high-bandwidth current loop DSP and 2,396,160 bits of block RAM providing headroom for state machines and lookup tables. The 377 user I/Os accommodate multiple encoder inputs, PWM outputs, and gate-driver interfaces. The Cyclone III family's 65nm low-power process reduces thermal dissipation in enclosed industrial cabinets. Designers benefit from Quartus II's Qsys tool for fast integration of the Nios II soft processor for supervisory control.

Recomendado

🎥

Video Surveillance and Image Processing

The 2,396,160 bits of embedded block RAM in the EP3C55F780C6 serve as efficient line buffers for video pipelines, while the 156 dedicated 18x18 multipliers accelerate 2D convolution, Sobel edge detection, and color-space conversion. The 377 user I/Os accept parallel camera data, HDMI, or BT.656 streams, and drive DDR2 memory interfaces for frame buffering. Cyclone III's Video and Image Processing (VIP) megafunctions in Quartus II reduce design time for filters, scalers, and deinterlacers common in surveillance equipment.

Recomendado

EP3C55F780I7N · Intel EP3C55F484C8N · Altera

🖥️

ASIC Prototyping and Verification

The 55,856 logic elements of the EP3C55F780C6 can emulate mid-complexity ASIC RTL with operating frequencies that meet functional verification targets. The 780-FBGA package exposes enough user I/Os to map peripheral interfaces, while the four PLLs provide multiple clock domains matching real ASIC conditions. Quartus II's LogicLock regions and incremental compile enable team-based partitioning of large designs, and the static-power reduction over Cyclone II supports long regression runs in verification farms.

Recomendado

EP3C120F780C8N · Intel EP3C16F484C6N · Intel

🌐

Telecom Line Cards and Protocol Bridging

Telecom line cards use the EP3C55F780C6 to bridge legacy TDM (T1/E1) streams to packet backplanes, with the 156 hardware multipliers handling per-channel HDLC encoding and the 377 user I/Os providing glue-less interfaces to framers and PHYs. The four PLLs synthesize the multiple clock rates required (8 kHz frame sync, 1.544/2.048 MHz data, 19.44 MHz backplane). Block RAM is used for jitter buffers and per-channel state, while the Cyclone III low-power design reduces thermal load in densely packed central-office racks.

Recomendado

EP3C55F780I7N · Intel EP3C40F780C6 · Altera

📺

Embedded Vision Systems

The EP3C55F780C6 provides a balanced resource mix for embedded vision: 55,856 LEs for control logic and feature-extraction pipelines, 2,396,160 bits of block RAM for image and filter taps, and 156 DSP blocks for convolution and optical-flow computation. The 377 user I/Os connect directly to CMOS image sensors, MIPI adapters, and DDR2/DDR3 memory. The 780-FBGA package fits handheld and panel-mounted industrial cameras. Designers use Altera's VIP suite and OpenCL for rapid algorithm implementation.

Recomendado

EP3C25F324C8N · Intel EP3C16F484C6N · Intel

📡

Low-Cost DSP and FIR Filter Arrays

The 156 dedicated 18x18 multipliers of the EP3C55F780C6 implement parallel FIR and IIR filters with throughput rates up to hundreds of MSPS when pipelined. The 2,396,160 bits of block RAM store filter coefficients and delay-line samples, and the four PLLs generate the required sample-rate clocks. The Cyclone III architecture's low static power makes multi-channel filter banks (used in audio processing, software-defined radio, and instrumentation) practical on a single device without active cooling.

Recomendado

EP3C25F324C8N · Intel EP3C40F780C6 · Altera

Resumo dos produtos recomendados

EP3C40F780C6 Altera Usado em: Industrial Motor Control, Telecom Line Cards and Protocol Bridging, Low-Cost DSP and FIR Filter Arrays EP3C120F780C8N Intel Usado em: Industrial Motor Control, ASIC Prototyping and Verification EP3C55F780I7N Intel Usado em: Video Surveillance and Image Processing, Telecom Line Cards and Protocol Bridging EP3C55F484C8N Altera Usado em: Video Surveillance and Image Processing EP3C16F484C6N Intel Usado em: ASIC Prototyping and Verification, Embedded Vision Systems EP3C25F324C8N Intel Usado em: Embedded Vision Systems, Low-Cost DSP and FIR Filter Arrays

What is the EP3C55F780C6?

The EP3C55F780C6 is an Intel (formerly Altera) Cyclone III field-programmable gate array (FPGA) with 55,856 logic elements, 2,396,160 bits of embedded memory, 156 18x18 multipliers, and 377 user I/Os in a 780-ball FBGA package. According to the Altera Cyclone III Device Handbook, it is positioned for low-power, cost-sensitive applications such as industrial control, video processing, and ASIC prototyping.

What is the difference between EP3C55F780C6 and EP3C55F780C6N?

The EP3C55F780C6N is the lead-free (Pb-free) version of the EP3C55F780C6, both in the same 780-ball FBGA package with identical functional specifications. The 'N' suffix indicates compliance with lead-free reflow and RoHS requirements, while the non-N version is the legacy lead-bearing variant. Both share the same -6 (C6) speed grade and commercial 0C to +85C temperature range, making them drop-in compatible for functional purposes.

What is the difference between EP3C55F780C6 and EP3C55F780C7N?

The EP3C55F780C7N uses a faster -7 (C7) internal speed grade compared to the -6 (C6) grade of the EP3C55F780C6, while sharing the same 780-ball FBGA package, 55,856 logic elements, and 377 user I/Os. The C7 variant achieves approximately 15% higher internal Fmax, making it a drop-in upgrade when timing closure is tight, though the C6 typically costs less.

What is the difference between EP3C55F780C6 and EP3C55F484C8N?

The EP3C55F780C6 uses the 780-ball FBGA package with 377 user I/Os, while the EP3C55F484C8N uses a smaller 484-ball FBGA with approximately 327 user I/Os. Both share the same Cyclone III 55,856-logic-element silicon, so migrating between them requires a PCB redesign and pin reassignment, not a drop-in replacement. Choose the 780-ball version when you need maximum I/O count.

How many logic elements does the EP3C55F780C6 have?

The EP3C55F780C6 contains 55,856 logic elements according to the Cyclone III family datasheet. Each logic element is built around a 4-input look-up table (LUT), a register, and a carry chain for arithmetic operations, providing a balanced resource mix for both combinational and sequential logic designs.

How much embedded memory does the EP3C55F780C6 have?

The EP3C55F780C6 integrates 2,396,160 bits of embedded block RAM organized as 260 M9K blocks, each 9 Kbit in capacity. M9K blocks support true dual-port, simple dual-port, and single-port modes with configurable widths up to x36, making them well suited to FIFO buffers, lookup tables, and DSP line buffers in video and signal-processing designs.

How many DSP multipliers are in the EP3C55F780C6?

The EP3C55F780C6 contains 156 dedicated 18x18 hardware multipliers, configurable as 18x18 signed or unsigned multiplication. These blocks support DSP operations such as FIR filters, FFT butterflies, and matrix multiplications without consuming general-purpose logic, enabling high-throughput DSP pipelines at low power.

What is the operating temperature of the EP3C55F780C6?

The EP3C55F780C6 operates over the commercial temperature range of 0C to +85C junction temperature, as indicated by the 'C' grade prefix. For industrial ( -40C to +100C) or extended temperature requirements, designers should select the EP3C55F780I6 variant from the same family. The '6' speed grade suffix is independent of the temperature grade letter.

Where can I buy the EP3C55F780C6?

As of 2026-09-09, the EP3C55F780C6 is available through authorized distributors including DigiKey, Mouser, and Heisener, with Heisener reporting in stock at $321.88 unit price. Lead time for volume orders is typically 4-6 weeks from franchised distributors. We recommend verifying real-time stock and requesting a quote directly on XAIPART for current availability and pricing.

What is the price of the EP3C55F780C6?

As of 2026-09-09, the EP3C55F780C6 unit price is approximately $321.88 at quantity 1 according to Heisener, with volume pricing dropping to around $209 per unit at quantity 500. The price is consistent with the Cyclone III family's mid-range positioning and reflects the high I/O count of the 780-ball FBGA package. Contact XAIPART for an updated quote tailored to your required volume.

What is the lead time for the EP3C55F780C6?

According to distributor listings as of 2026-09-09, the EP3C55F780C6 ships within 4-6 weeks from authorized sources like DigiKey and Mouser, with Heisener estimating delivery between August 5 and August 10 for orders placed through their platform. The Cyclone III family is in active production and is not currently on Intel's discontinuation roadmap, so long-term supply is generally stable.

Is the EP3C55F780C6 a drop-in replacement for other Cyclone III parts?

The EP3C55F780C6 is drop-in compatible with the EP3C55F780C6N (lead-free version) and is pin-compatible with EP3C55F780C7N, which simply provides a faster -7 speed grade in the same 780-FBGA package. It is NOT drop-in with smaller-package Cyclone III variants such as the EP3C55F484C8N (484-ball FBGA), because the ball map and pin assignment differ. Always check the pin-out table in the Cyclone III device handbook before substituting.

What is the best cross-brand equivalent for the EP3C55F780C6?

There is no direct cross-brand drop-in equivalent for the EP3C55F780C6, because it is a 780-ball FBGA Cyclone III FPGA with a unique ball map, configuration interface, and Quartus II toolchain. Cross-brand replacement (e.g., Xilinx Spartan-6 or Lattice ECP3) requires a full HDL re-synthesis, pin reassignment, and new PCB layout. Among FPGA vendors, the closest functional and density match is typically the Xilinx XC6SLX75 in its largest package, but it is not pin-compatible.

Where to download the EP3C55F780C6 datasheet PDF?

The official Cyclone III family datasheet and device handbook are available from the Intel Programmable Solutions Group support page at intel.com/content/www/us/en/programmable/products/fpga/cyclone-series/cyclone-iii/support.html. The datasheet package includes the device overview, DC and switching characteristics, pin-out files, and packaging information for the 780-ball FBGA variant. The Quartus II software also provides device-specific datasheet chapters via the Help menu.

Where to find the EP3C55F780C6 pinout?

The pinout for the EP3C55F780C6 is documented in the Cyclone III Device Handbook, in the package-specific pin-out tables for the 780-ball FBGA. The 780 balls are arranged in a 29x29 array (excluding center depopulated balls), with user I/O organized into 8 I/O banks plus dedicated configuration, clock, and power pins. Quartus II's Pin Planner tool provides an interactive view of the pin assignments once the device is selected for a project.

Dados de referência de engenharia para EP3C55F780C6 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EP3C55F780C6 when you need a 55,856-logic-element Cyclone III FPGA in a 780-ball FBGA with commercial temperature range and a balanced C6 speed grade. Select the EP3C55F780C6N (lead-free) for any RoHS-compliant production build, since it is functionally identical and drop-in compatible. Upgrade to EP3C55F780C7N if your timing analysis shows the C6 grade cannot meet Fmax targets - the C7 offers ~15% higher Fmax at the same ball map. Choose the EP3C55F780I7N variant for industrial deployments down to -40C, again with the same 780-FBGA footprint. If your design only uses 30,000-35,000 LEs, consider the lower-cost EP3C40F780C6 in the same 780-FBGA package, which saves roughly 30% on unit cost. All these variants share the same Quartus II toolchain and configuration modes.

Comparação com alternativas

Parâmetro	Este produto	EP3C55F780C6N	EP3C55F780C7N	EP3C55F780C7	EP3C55F780I7N	EP3C55F780I6	EP3C55F780C8N	EP3C40F780C6
Package	780-ball FBGA	780-ball FBGA - same	780-ball FBGA - same	780-ball FBGA - same	780-ball FBGA - same	780-ball FBGA - same	780-ball FBGA - same	780-ball FBGA - same
Brand	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)
Logic Elements	55,856	55,856 - same	55,856 - same	55,856 - same	55,856 - same	55,856 - same	55,856 - same	39,600 (-29%)
Speed Grade	C6 (-6)	C6 (-6) - same	C7 (-7), ~15% faster	C7 (-7), ~15% faster	C7 (-7) industrial	C6 (-6) industrial	C8 (-8), ~10% slower	C6 (-6) - same
Temperature Grade	Commercial (0C to +85C)	Commercial - same	Commercial	Commercial	Industrial (-40C to +100C)	Industrial (-40C to +100C)	Commercial	Commercial
Embedded Memory Bits	2,396,160	2,396,160 - same	2,396,160 - same	2,396,160 - same	2,396,160 - same	2,396,160 - same	2,396,160 - same	1,161,216 (-51%)
18x18 Multipliers	156	156 - same	156 - same	156 - same	156 - same	156 - same	156 - same	126 (-19%)
User I/Os	377	377 - same	377 - same	377 - same	377 - same	377 - same	377 - same	377 - same
RoHS Compliant	Yes (non-N indicates legacy lead)	Yes	Yes	No (legacy lead)	Yes	No (legacy lead, industrial)	Yes	No (legacy lead)
Series	Cyclone III	Cyclone III - same	Cyclone III - same	Cyclone III - same	Cyclone III - same	Cyclone III - same	Cyclone III - same	Cyclone III - same

Principais diferenciais

Same density and I/O across all speed/temperature variants (vs EP3C55F780C7N)
Industrial temperature option in same package (vs EP3C55F780I7N)
Lead-free RoHS compliance option (vs EP3C55F780C6N)
55,856 LEs vs 39,600 in lower-density 780-FBGA part (vs EP3C40F780C6)

Notas de projeto

The 780-ball FBGA package uses a 1.0mm ball pitch with a 29x29 array (depopulated center). The PCB must support microvia (laser-drilled) stack-up or via-in-pad technology to fan out the inner balls. Maintain a minimum 0.4mm drill-to-copper clearance and use the manufacturer's recommended land pattern. BGA ball collapse during reflow is typically 0.15-0.20mm, so the PCB pad diameter should be 0.45-0.50mm for reliable joint formation. A 6-6-6 or 7-7-7 layer stack-up is recommended for signal integrity on high-speed LVDS pairs.

Cyclone III's 65nm low-power process significantly reduces static power compared to Cyclone II, but at high utilization (above 70% LEs and full DSP engagement) the device can still dissipate 2-4W. For the 780-FBGA package, the thermal resistance is approximately 15 C/W with a 4-layer PCB and adequate thermal vias in the central ball-depopulated region. If junction temperature must stay below 100C in enclosed industrial enclosures, run the Quartus II PowerPlay early estimator and add a small heatsink or airflow.

Configuration failures are the most common bring-up issue. Ensure the MSEL pins are strapped correctly to select the configuration mode (AS, AP, PS, or JTAG), and that the CONF_DONE pin pulls high through an external 10k resistor. The EPCS serial configuration device must match the AS mode data width. Always include a JTAG header on the PCB for in-system programming and debug, and use the Quartus II Programmer with the correct BSDL file for boundary-scan testing.

The Cyclone III I/O banks support multiple voltage standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) but each bank shares a single VCCIO. When designing with mixed-voltage I/O (e.g., 3.3V LVCMOS for legacy peripherals and 1.8V SSTL for DDR2 memory), plan bank assignments carefully so each bank contains only one VCCIO requirement. Use the Quartus II I/O Assignment Analysis tool to catch conflicts before layout, and add 33 ohm series-termination resistors near the FPGA on high-speed LVDS pairs to control reflections.

Informações de conformidade

RoHS

Non Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Sem chumbo

Sem halogênios

Unknown

Minerais de conflito

Compliant

The EP3C55F780C6 (non-N suffix) is a legacy lead-bearing variant; for RoHS-compliant production, use the EP3C55F780C6N (lead-free). AEC-Q100 is not applicable as this is a commercial-grade programmable logic device.

Dados verificados em: 2026-09-09 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Fontes: Distributor, Distributor, Distributor, Octopart, Distributor, Distributor

Buscas relacionadas

EP3C55F780C6 datasheet EP3C55F780C6 price Cyclone III EP3C55F780C6 Altera EP3C55F780C6 buy EP3C55F780C6 vs EP3C55F780C6N EP3C55F780C6 vs EP3C55F780C7N 780-FBGA Cyclone III FPGA 55K logic elements FPGA 377 I/O EP3C55F780C6 industrial motor control EP3C55F780C6 video image processing what is the package of EP3C55F780C6 EP3C55F780C6 drop-in replacement

Componentes & termos relacionados

Intel Altera EP3C55F780C6 EP3C55F780C6N EP3C55F780C7N EP3C55F780C7 EP3C55F780I7N EP3C55F780I6 EP3C55F780C8N EP3C40F780C6 Cyclone III FPGA field-programmable gate array programmable logic logic element 4-input LUT block RAM M9K DSP block 18x18 multiplier FBGA 780-ball BGA fine-pitch BGA JTAG Quartus II RoHS AEC-Q100 LVDS SSTL HSTL industrial control video processing ASIC prototyping PLL