EP3C55F780C6 - Cyclone III FPGA, 55K LEs, 780-BGA | Intel (Altera)
MPN： EP3C55F780C6 ✓ 啟用中EP3C55F780C6 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM and DSP slices. FPGAs sit in the programmable-logic tier of the digital semiconductor hierarchy: ASIC < structured ASIC < FPGA < CPLD < microcontroller. Designers use HDL (Verilog or VHDL) to describe the desired digital function, then synthesize, place, and route the design with vendor tools (Quartus II for the Cyclone III family). Unlike fixed-function ASICs, FPGAs allow in-system reconfiguration, making them ideal for prototyping, low-volume production, and designs that must evolve in the field.
Key features of the EP3C55F780C6 include a 4-Mbit embedded memory subsystem, four general-purpose PLLs for clock synthesis, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL on user I/Os. The 'C6' speed grade offers a -6 speed rating for internal logic, and the 'C' prefix denotes the commercial temperature grade of 0C to +85C. Static power consumption is significantly reduced compared to Cyclone II, enabling fan-less operation in cost-sensitive applications.
From an architectural perspective, the Cyclone III device family uses 4-input look-up tables (LUTs) per logic element, M9K block RAM tiles, and 18x18 multiplier blocks optimized for DSP. The 780-FBGA package provides high I/O density suitable for memory-bus bridging, video processing pipelines, and parallel sensor aggregation. Configuration is supported through JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes via the dedicated configuration pins.
Typical applications include industrial motor control, video surveillance and image processing, telecom line cards, low-cost ASIC prototyping, and embedded vision systems. The combination of DSP blocks and on-chip memory is particularly suited to digital filtering, FFT computation, and image pre-processing. Designers transitioning from older Cyclone II designs will find pin-compatible migration options within the family.
When designing with this device, ensure the PCB BGA layout meets the 1.0mm ball pitch clearance rules of the 780-FBGA package and that the Quartus II power-play analysis is run early in the design cycle. Decoupling must follow the reference design guidance in the Cyclone III Device Handbook.
This page synthesizes distributor pricing, drop-in Cyclone III alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers select the right Cyclone III variant for their application.
直接替換替代品，適用於 EP3C55F780C6 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3C55F780C6 （相同外形與佔位） — 差異在於 Package, Process Technology, Speed Grade, Embedded 18x18 Multipliers, RoHS Status.
EP3C55F780C6N
✅ 直接替換聯絡詢價
查看資料表 →EP3C55F780C7N
✅ 直接替換聯絡詢價
查看資料表 →EP3C55F780C7
✅ 直接替換聯絡詢價
查看資料表 →EP3C55F780I7N
✅ 直接替換聯絡詢價
查看資料表 →EP3C55F780I6
✅ 直接替換📋 參考替代品（不在目錄中）
EP3C55F780C8N
✅ 直接替換聯絡詢價
查看資料表 →EP3C40F780C6
✅ 直接替換聯絡詢價
查看資料表 →EP3C55F780C6 最大額定值與電氣特性
| Series | Cyclone III |
| Logic Elements | 55,856 |
| Embedded Memory Bits | 2,396,160 |
| Number of Block RAM (M9K) | 260 |
| 18x18 Hardware Multipliers | 156 |
| User I/Os | 377 |
| 封裝 | 780-ball FBGA |
| Speed Grade | -6 (C6) |
| 工作溫度 | 0C to +85C (Commercial) |
| Process Technology | 65 nm low power |
| Configuration Methods | JTAG, AS, AP, PS |
| Number of PLLs | 4 |
| Maximum User I/O Voltage Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| RoHS 狀態 | Compliant |
| 安裝類型 | Surface Mount (BGA) |
EP3C55F780C6 780-ball fbga 腳位配置指南
EP3C55F780C6（780-ball fbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3C55F780C6.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3C55F780C6 適用於 6 應用s: Industrial Motor Control, Video Surveillance and Image Processing, ASIC Prototyping and Verification, Telecom Line Cards and Protocol Bridging, Embedded Vision Systems, Low-Cost DSP and FIR Filter Arrays.
Industrial Motor Control
The EP3C55F780C6 is well suited to multi-axis industrial motor control with its 156 18x18 hardware multipliers enabling high-bandwidth current loop DSP and 2,396,160 bits of block RAM providing headroom for state machines and lookup tables. The 377 user I/Os accommodate multiple encoder inputs, PWM outputs, and gate-driver interfaces. The Cyclone III family's 65nm low-power process reduces thermal dissipation in enclosed industrial cabinets. Designers benefit from Quartus II's Qsys tool for fast integration of the Nios II soft processor for supervisory control.
推薦
Video Surveillance and Image Processing
The 2,396,160 bits of embedded block RAM in the EP3C55F780C6 serve as efficient line buffers for video pipelines, while the 156 dedicated 18x18 multipliers accelerate 2D convolution, Sobel edge detection, and color-space conversion. The 377 user I/Os accept parallel camera data, HDMI, or BT.656 streams, and drive DDR2 memory interfaces for frame buffering. Cyclone III's Video and Image Processing (VIP) megafunctions in Quartus II reduce design time for filters, scalers, and deinterlacers common in surveillance equipment.
推薦
ASIC Prototyping and Verification
The 55,856 logic elements of the EP3C55F780C6 can emulate mid-complexity ASIC RTL with operating frequencies that meet functional verification targets. The 780-FBGA package exposes enough user I/Os to map peripheral interfaces, while the four PLLs provide multiple clock domains matching real ASIC conditions. Quartus II's LogicLock regions and incremental compile enable team-based partitioning of large designs, and the static-power reduction over Cyclone II supports long regression runs in verification farms.
推薦
Telecom Line Cards and Protocol Bridging
Telecom line cards use the EP3C55F780C6 to bridge legacy TDM (T1/E1) streams to packet backplanes, with the 156 hardware multipliers handling per-channel HDLC encoding and the 377 user I/Os providing glue-less interfaces to framers and PHYs. The four PLLs synthesize the multiple clock rates required (8 kHz frame sync, 1.544/2.048 MHz data, 19.44 MHz backplane). Block RAM is used for jitter buffers and per-channel state, while the Cyclone III low-power design reduces thermal load in densely packed central-office racks.
推薦
Embedded Vision Systems
The EP3C55F780C6 provides a balanced resource mix for embedded vision: 55,856 LEs for control logic and feature-extraction pipelines, 2,396,160 bits of block RAM for image and filter taps, and 156 DSP blocks for convolution and optical-flow computation. The 377 user I/Os connect directly to CMOS image sensors, MIPI adapters, and DDR2/DDR3 memory. The 780-FBGA package fits handheld and panel-mounted industrial cameras. Designers use Altera's VIP suite and OpenCL for rapid algorithm implementation.
推薦
Low-Cost DSP and FIR Filter Arrays
The 156 dedicated 18x18 multipliers of the EP3C55F780C6 implement parallel FIR and IIR filters with throughput rates up to hundreds of MSPS when pipelined. The 2,396,160 bits of block RAM store filter coefficients and delay-line samples, and the four PLLs generate the required sample-rate clocks. The Cyclone III architecture's low static power makes multi-channel filter banks (used in audio processing, software-defined radio, and instrumentation) practical on a single device without active cooling.
推薦
推薦產品摘要
工程參考資料，適用於 EP3C55F780C6 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3C55F780C6N | EP3C55F780C7N | EP3C55F780C7 | EP3C55F780I7N | EP3C55F780I6 | EP3C55F780C8N | EP3C40F780C6 |
|---|---|---|---|---|---|---|---|---|
| Package | 780-ball FBGA | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 55,856 | 55,856 - same | 55,856 - same | 55,856 - same | 55,856 - same | 55,856 - same | 55,856 - same | 39,600 (-29%) |
| Speed Grade | C6 (-6) | C6 (-6) - same | C7 (-7), ~15% faster | C7 (-7), ~15% faster | C7 (-7) industrial | C6 (-6) industrial | C8 (-8), ~10% slower | C6 (-6) - same |
| Temperature Grade | Commercial (0C to +85C) | Commercial - same | Commercial | Commercial | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial | Commercial |
| Embedded Memory Bits | 2,396,160 | 2,396,160 - same | 2,396,160 - same | 2,396,160 - same | 2,396,160 - same | 2,396,160 - same | 2,396,160 - same | 1,161,216 (-51%) |
| 18x18 Multipliers | 156 | 156 - same | 156 - same | 156 - same | 156 - same | 156 - same | 156 - same | 126 (-19%) |
| User I/Os | 377 | 377 - same | 377 - same | 377 - same | 377 - same | 377 - same | 377 - same | 377 - same |
| RoHS Compliant | Yes (non-N indicates legacy lead) | Yes | Yes | No (legacy lead) | Yes | No (legacy lead, industrial) | Yes | No (legacy lead) |
| Series | Cyclone III | Cyclone III - same | Cyclone III - same | Cyclone III - same | Cyclone III - same | Cyclone III - same | Cyclone III - same | Cyclone III - same |
主要差異化特點
- Same density and I/O across all speed/temperature variants (對比EP3C55F780C7N)
- Industrial temperature option in same package (對比EP3C55F780I7N)
- Lead-free RoHS compliance option (對比EP3C55F780C6N)
- 55,856 LEs vs 39,600 in lower-density 780-FBGA part (對比EP3C40F780C6)
設計說明
The 780-ball FBGA package uses a 1.0mm ball pitch with a 29x29 array (depopulated center). The PCB must support microvia (laser-drilled) stack-up or via-in-pad technology to fan out the inner balls. Maintain a minimum 0.4mm drill-to-copper clearance and use the manufacturer's recommended land pattern. BGA ball collapse during reflow is typically 0.15-0.20mm, so the PCB pad diameter should be 0.45-0.50mm for reliable joint formation. A 6-6-6 or 7-7-7 layer stack-up is recommended for signal integrity on high-speed LVDS pairs.
Cyclone III's 65nm low-power process significantly reduces static power compared to Cyclone II, but at high utilization (above 70% LEs and full DSP engagement) the device can still dissipate 2-4W. For the 780-FBGA package, the thermal resistance is approximately 15 C/W with a 4-layer PCB and adequate thermal vias in the central ball-depopulated region. If junction temperature must stay below 100C in enclosed industrial enclosures, run the Quartus II PowerPlay early estimator and add a small heatsink or airflow.
Configuration failures are the most common bring-up issue. Ensure the MSEL pins are strapped correctly to select the configuration mode (AS, AP, PS, or JTAG), and that the CONF_DONE pin pulls high through an external 10k resistor. The EPCS serial configuration device must match the AS mode data width. Always include a JTAG header on the PCB for in-system programming and debug, and use the Quartus II Programmer with the correct BSDL file for boundary-scan testing.
The Cyclone III I/O banks support multiple voltage standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) but each bank shares a single VCCIO. When designing with mixed-voltage I/O (e.g., 3.3V LVCMOS for legacy peripherals and 1.8V SSTL for DDR2 memory), plan bank assignments carefully so each bank contains only one VCCIO requirement. Use the Quartus II I/O Assignment Analysis tool to catch conflicts before layout, and add 33 ohm series-termination resistors near the FPGA on high-speed LVDS pairs to control reflections.
合規資訊
The EP3C55F780C6 (non-N suffix) is a legacy lead-bearing variant; for RoHS-compliant production, use the EP3C55F780C6N (lead-free). AEC-Q100 is not applicable as this is a commercial-grade programmable logic device.