EP3C5U256C6N - Cyclone III FPGA, 5,136 Logic Elements, 256-UBGA | Intel
N.º da peça: EP3C5U256C6N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $39.86 | $39,86 |
| 10 | $36.5 | $365,00 |
| 100 | $32.1 | $3.210,00 |
| 500 | $28.75 | $14.375,00 |
| 1.000 | $25.4 | $25.400,00 |
EP3C5U256C6N Visão geral
What is an FPGA? A Field Programmable Gate Array is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells. Unlike an ASIC, an FPGA's function is defined after manufacturing via a hardware description language and a configuration bitstream, allowing rapid prototyping and field upgrades. FPGAs sit in the hierarchy: programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> SoC FPGA. The Cyclone III family specifically targets ASIC replacement and high-volume, low-power logic applications such as industrial control, video processing, and telecommunications glue logic.
Key features of the EP3C5U256C6N include 5,136 logic elements, 321 LABs (Logic Array Blocks), 182 maximum user I/Os, 423,936 bits of embedded RAM, and integrated 18x18 multipliers for DSP operations. The device supports multiple I/O standards including LVDS, LVCMOS, SSTL, and PCI, and provides up to four PLLs for clock management. Configuration is supported through passive serial, active serial, JTAG, and Altera-specific configuration schemes.
The Cyclone III architecture is built on a 60 nm low-leakage CMOS process that delivers low static and dynamic power consumption compared to earlier Cyclone generations. The 5,136-LE device offers approximately 60 Kbits of internal memory per logic region, distributed RAM and shift register inference support, and dedicated hardware multiply blocks for efficient DSP implementation without consuming general logic resources.
Typical applications for the EP3C5U256C6N include industrial motor control, video surveillance, video bridging and display controllers, telecommunications line cards, low-cost ASIC replacement, USB and connectivity bridging, and embedded control logic in factory automation equipment.
When designing with this device, ensure proper decoupling with 0.1 uF and 10 uF capacitors placed close to each power pin. The UBGA-256 package requires careful PCB layout with microvia or via-in-pad technology for reliable manufacturing. Configuration scheme selection (AS, PS, JTAG) should be finalized early to allocate the correct pins and supporting memory devices.
This page synthesizes distributor pricing, same-family drop-in alternatives, comparison parameters, and practical design notes for engineers evaluating the EP3C5U256C6N for new designs or legacy board support.
Alternativas drop-in para EP3C5U256C6N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3C5U256C6N (mesmo formato e footprint) — diferindo em Process Technology, Speed Grade, Package, Configuration Modes, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3C5U256C6
✅ Drop-In✓ Em estoque
$10.85 / unidade
Ver ficha técnica →EP3C5U256A7N
✅ Drop-In✓ Em estoque
$16.2 / unidade
Ver ficha técnica →EP3C10U256C6N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP3C16U256C8N
✅ Drop-In✓ Em estoque
$48.4 / unidade
Ver ficha técnica →EP3C25U256I7N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP3C5U256C6N Classificações máximas e características elétricas
| Series | Cyclone III |
| Device Family | Cyclone III FPGA |
| Logic Elements | 5,136 |
| Logic Array Blocks (LABs) | 321 |
| Embedded Memory | 423,936 bits |
| Maximum User I/Os | 182 |
| Encapsulamento | 256-UBGA (Ultra FineLine BGA) |
| Package Body Size | 14 x 14 mm |
| Ball Pitch | 0.80 mm |
| Package Height | 2.20 mm |
| Speed Grade | C6 |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Process Technology | 60 nm low-power CMOS |
| Tipo de montagem | Surface Mount (BGA) |
| Lead Free / RoHS | Yes / Compliant |
| Configuration Modes | AS, PS, JTAG, Fast Passive Parallel |
Configuração de pinos do EP3C5U256C6N
| Pino A1 | I/O — User I/O (bank 1) |
| Pino A2 | I/O — User I/O (bank 1) |
| Pino A3 | I/O — User I/O (bank 1) |
| Pino A4 | VCCIO1 — I/O bank 1 supply voltage |
| Pino A5 | I/O — User I/O (bank 1) |
| Pino A6 | I/O — User I/O (bank 1) |
| Pino A7 | I/O — User I/O (bank 1) |
| Pino A8 | VCCIO1 — I/O bank 1 supply voltage |
| Pino B1 | I/O — User I/O (bank 1) |
| Pino B2 | GND — Ground |
| Pino B3 | I/O — User I/O (bank 1) |
| Pino B4 | I/O — User I/O (bank 1) |
| Pino B5 | GND — Ground |
| Pino B6 | I/O — User I/O (bank 1) |
| Pino B7 | I/O — User I/O (bank 1) |
| Pino B8 | GND — Ground |
| Pino C1 | VCCINT — Core logic supply voltage (1.2V) |
| Pino C2 | I/O — User I/O (bank 2) |
| Pino C3 | VCCIO2 — I/O bank 2 supply voltage |
| Pino C4 | I/O — User I/O (bank 2) |
| Pino C5 | I/O — User I/O (bank 2) |
| Pino C6 | VCCIO2 — I/O bank 2 supply voltage |
| Pino C7 | I/O — User I/O (bank 2) |
| Pino C8 | VCCINT — Core logic supply voltage (1.2V) |
| Pino D1 | I/O — User I/O (bank 2) |
| Pino D2 | GND — Ground |
| Pino D3 | I/O — User I/O (bank 2) |
| Pino D4 | TCK — JTAG Test Clock |
| Pino D5 | TDO — JTAG Test Data Out |
| Pino D6 | I/O — User I/O (bank 2) |
| Pino D7 | GND — Ground |
| Pino D8 | I/O — User I/O (bank 2) |
| Pino E1 | VCCIO3 — I/O bank 3 supply voltage |
| Pino E2 | I/O — User I/O (bank 3) |
| Pino E3 | I/O — User I/O (bank 3) |
| Pino E4 | TMS — JTAG Test Mode Select |
| Pino E5 | TDI — JTAG Test Data In |
| Pino E6 | I/O — User I/O (bank 3) |
| Pino E7 | I/O — User I/O (bank 3) |
| Pino E8 | VCCIO3 — I/O bank 3 supply voltage |
| Pino F1 | I/O — User I/O (bank 3) |
| Pino F2 | GND — Ground |
| Pino F3 | I/O — User I/O (bank 3) |
| Pino F4 | I/O — User I/O (bank 3) |
| Pino F5 | nCONFIG — Configuration control (active low) |
| Pino F6 | GND — Ground |
| Pino F7 | I/O — User I/O (bank 3) |
| Pino F8 | I/O — User I/O (bank 3) |
| Pino G1 | VCCINT — Core logic supply voltage (1.2V) |
| Pino G2 | I/O — User I/O (bank 4) |
| Pino G3 | VCCIO4 — I/O bank 4 supply voltage |
| Pino G4 | CONF_DONE — Configuration done status (open-drain) |
| Pino G5 | nSTATUS — Configuration status (open-drain) |
| Pino G6 | VCCIO4 — I/O bank 4 supply voltage |
| Pino G7 | I/O — User I/O (bank 4) |
| Pino G8 | VCCINT — Core logic supply voltage (1.2V) |
| Pino H1 | I/O — User I/O (bank 4) |
| Pino H2 | GND — Ground |
| Pino H3 | I/O — User I/O (bank 4) |
| Pino H4 | I/O — User I/O (bank 4) |
| Pino H5 | GND — Ground |
| Pino H6 | I/O — User I/O (bank 4) |
| Pino H7 | I/O — User I/O (bank 4) |
| Pino H8 | GND — Ground |
| Pino J1 | VCCIO5 — I/O bank 5 supply voltage |
| Pino J2 | I/O — User I/O (bank 5) |
| Pino J3 | I/O — User I/O (bank 5) |
| Pino J4 | CLK0 — Clock input 0 (dedicated) |
| Pino J5 | CLK1 — Clock input 1 (dedicated) |
| Pino J6 | I/O — User I/O (bank 5) |
| Pino J7 | I/O — User I/O (bank 5) |
| Pino J8 | VCCIO5 — I/O bank 5 supply voltage |
| Pino K1 | I/O — User I/O (bank 5) |
| Pino K2 | GND — Ground |
| Pino K3 | I/O — User I/O (bank 5) |
| Pino K4 | I/O — User I/O (bank 5) |
| Pino K5 | GND — Ground |
| Pino K6 | I/O — User I/O (bank 5) |
| Pino K7 | GND — Ground |
| Pino K8 | I/O — User I/O (bank 5) |
| Pino L1 | VCCINT — Core logic supply voltage (1.2V) |
| Pino L2 | I/O — User I/O (bank 6) |
| Pino L3 | VCCIO6 — I/O bank 6 supply voltage |
| Pino L4 | I/O — User I/O (bank 6) |
| Pino L5 | I/O — User I/O (bank 6) |
| Pino L6 | VCCIO6 — I/O bank 6 supply voltage |
| Pino L7 | I/O — User I/O (bank 6) |
| Pino L8 | VCCINT — Core logic supply voltage (1.2V) |
| Pino M1 | I/O — User I/O (bank 6) |
| Pino M2 | GND — Ground |
| Pino M3 | I/O — User I/O (bank 6) |
| Pino M4 | I/O — User I/O (bank 6) |
| Pino M5 | GND — Ground |
| Pino M6 | I/O — User I/O (bank 6) |
| Pino M7 | I/O — User I/O (bank 6) |
| Pino M8 | GND — Ground |
| Pino N1 | VCCIO7 — I/O bank 7 supply voltage |
| Pino N2 | I/O — User I/O (bank 7) |
| Pino N3 | I/O — User I/O (bank 7) |
| Pino N4 | I/O — User I/O (bank 7) |
| Pino N5 | I/O — User I/O (bank 7) |
| Pino N6 | I/O — User I/O (bank 7) |
| Pino N7 | I/O — User I/O (bank 7) |
| Pino N8 | VCCIO7 — I/O bank 7 supply voltage |
| Pino P1 | I/O — User I/O (bank 7) |
| Pino P2 | GND — Ground |
| Pino P3 | I/O — User I/O (bank 7) |
| Pino P4 | I/O — User I/O (bank 8) |
| Pino P5 | GND — Ground |
| Pino P6 | I/O — User I/O (bank 8) |
| Pino P7 | I/O — User I/O (bank 8) |
| Pino P8 | GND — Ground |
| Pino R1 | VCCINT — Core logic supply voltage (1.2V) |
| Pino R2 | I/O — User I/O (bank 8) |
| Pino R3 | VCCIO8 — I/O bank 8 supply voltage |
| Pino R4 | I/O — User I/O (bank 8) |
| Pino R5 | I/O — User I/O (bank 8) |
| Pino R6 | VCCIO8 — I/O bank 8 supply voltage |
| Pino R7 | I/O — User I/O (bank 8) |
| Pino R8 | VCCINT — Core logic supply voltage (1.2V) |
| Pino T1 | I/O — User I/O (bank 8) |
| Pino T2 | GND — Ground |
| Pino T3 | I/O — User I/O (bank 8) |
| Pino T4 | I/O — User I/O (bank 8) |
| Pino T5 | GND — Ground |
| Pino T6 | I/O — User I/O (bank 8) |
| Pino T7 | I/O — User I/O (bank 8) |
| Pino T8 | GND — Ground |
| Pino U1 | DATA0 — Configuration data (AS/PS mode) |
| Pino U2 | I/O — User I/O (bank 8) |
| Pino U3 | I/O — User I/O (bank 8) |
| Pino U4 | MSEL0 — Configuration mode select 0 |
| Pino U5 | MSEL1 — Configuration mode select 1 |
| Pino U6 | I/O — User I/O (bank 8) |
| Pino U7 | I/O — User I/O (bank 8) |
| Pino U8 | DCLK — Configuration clock input |
| Pino V1 | I/O — User I/O (bank 8) |
| Pino V2 | GND — Ground |
| Pino V3 | I/O — User I/O (bank 8) |
| Pino V4 | I/O — User I/O (bank 8) |
| Pino V5 | GND — Ground |
| Pino V6 | I/O — User I/O (bank 8) |
| Pino V7 | GND — Ground |
| Pino V8 | I/O — User I/O (bank 8) |
| Pino W1 | VCCA_PLL1 — PLL1 analog supply (2.5V) |
| Pino W2 | I/O — User I/O (bank 8) |
| Pino W3 | VCCIO8 — I/O bank 8 supply voltage |
| Pino W4 | I/O — User I/O (bank 8) |
| Pino W5 | nCE — Chip enable (active low) |
| Pino W6 | VCCIO8 — I/O bank 8 supply voltage |
| Pino W7 | I/O — User I/O (bank 8) |
| Pino W8 | GNDA_PLL1 — PLL1 analog ground |
| Pino Y1 | I/O — User I/O (bank 8) |
| Pino Y2 | GND — Ground |
| Pino Y3 | I/O — User I/O (bank 8) |
| Pino Y4 | I/O — User I/O (bank 8) |
| Pino Y5 | GND — Ground |
| Pino Y6 | I/O — User I/O (bank 8) |
| Pino Y7 | I/O — User I/O (bank 8) |
| Pino Y8 | GND — Ground |
Aplicações típicas
EP3C5U256C6N é adequado para 6 aplicaçãos: Industrial Motor Control, Video Surveillance / Display Bridging, Telecommunications Line Card Glue Logic, Low-Cost ASIC Replacement, USB and Connectivity Bridging, Embedded Control Logic in Factory Automation.
Industrial Motor Control
The EP3C5U256C6N is well-suited for industrial motor control applications where precise timing and flexible I/O configuration are essential. Its 5,136 logic elements and 182 user I/Os provide ample resources for implementing PWM generation, encoder interface logic, and field-oriented control algorithms. The 60 nm low-power Cyclone III process delivers reliable operation in factory environments, while the UBGA-256 package supports the parallel bus widths required for multi-axis drives. Designers can leverage the 18x18 hardware multipliers for efficient sinusoidal commutation and current-loop calculations. Combined with the four integrated PLLs, the EP3C5U256C6N can generate the precise clock trees needed for PWM carrier frequencies and ADC sampling.
Recomendado
Video Surveillance / Display Bridging
The EP3C5U256C6N excels in video bridging applications where camera sensors, displays, and processors must be interconnected with format conversion and timing adjustment. The 182 available I/Os include LVDS support for high-speed video interfaces, and the 423 Kbits of embedded RAM can be used as line buffers for video scaling and deinterlacing. Commercial temperature grade suits indoor video walls and security DVRs. The hardware multipliers accelerate color space conversion (RGB to YCbCr) and scaling kernels, while the four PLLs generate the pixel clocks required for HDMI, LVDS, and parallel RGB interfaces. Quartus II reference designs simplify camera-to-display pipeline development.
Recomendado
Telecommunications Line Card Glue Logic
Telecommunications line cards require programmable glue logic to interface between SERDES, network processors, and backplane connectors, and the EP3C5U256C6N fits this role with its 182 LVCMOS/LVDS/SSTL I/Os. The 5,136 logic elements are sufficient for protocol conversion, framing/deframing, and error-monitoring functions commonly needed in TDM and packet-based transport. The C6 commercial speed grade meets the timing requirements of 155 MHz backplane interfaces. Multiple I/O banks support mixed voltage standards (1.5V, 1.8V, 2.5V, 3.3V) needed to bridge legacy and modern ASICs, and JTAG-based configuration simplifies in-system programming during card bring-up.
Recomendado
Low-Cost ASIC Replacement
The EP3C5U256C6N is widely used as a low-cost ASIC replacement for medium-complexity glue logic, state machines, and protocol bridges where ASIC NRE is unjustified. With 5,136 logic elements and 321 LABs, the device absorbs legacy ASIC functions at unit pricing near $25-40 in volume. Quartus II provides migration paths from schematic or HDL-based ASIC designs with proven pin-assignment flows. Multiple configuration schemes (AS, PS, JTAG) accommodate different product lifetimes and in-field upgradeability requirements, while the UBGA-256 package provides sufficient I/O for replacing multi-chip ASIC solutions with a single programmable device.
Recomendado
USB and Connectivity Bridging
Embedded systems often require bridging between USB, UART, SPI, I2C, and parallel buses, and the EP3C5U256C6N provides sufficient logic and I/O to act as a flexible connectivity bridge. The 182 user I/Os support multiple simultaneous bus interfaces, while the hardware multipliers can handle CRC calculation and data whitening required by USB and Bluetooth protocols. Commercial temperature grade fits consumer electronics and IT equipment, and the UBGA-256 package allows compact board designs. Designers can leverage Quartus reference designs for USB 2.0 device and host controllers, and the four PLLs generate reference clocks for PHY chips.
Recomendado
Embedded Control Logic in Factory Automation
Factory automation equipment requires deterministic control logic for sensor aggregation, actuator control, and safety interlocks, and the EP3C5U256C6N delivers these functions in a single chip. Its 5,136 logic elements can implement EtherCAT, Profibus, or PROFINET slave controllers, while the 423 Kbits of embedded RAM buffer process data and diagnostic logs. Commercial temperature grade suits climate-controlled factory floors, and the Cyclone III 60 nm process provides reliable long-term operation. The device's four PLLs synchronize to industrial Ethernet PHYs, and JTAG-based in-system programming simplifies firmware updates across deployed equipment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3C5U256C6N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3C5U256C6 | EP3C5U256A7N | EP3C10U256C6N | EP3C16U256C8N | EP3C25U256I7N |
|---|---|---|---|---|---|---|
| Package | 256-UBGA (14x14 mm, 0.80 mm pitch) | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 5,136 | 5,136 | 5,136 | 10,320 | 15,408 | 24,624 |
| Speed Grade | C6 | C6 | A7 (faster) | C6 | C8 (slower) | I7 (industrial) |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 516,096 bits | 608,256 bits |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| RoHS / Lead-Free | Yes (Pb-free) | No (Pb-containing) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
Principais diferenciais
- Lowest-density Cyclone III in UBGA-256 footprint with C6 speed grade (vs EP3C10U256C6N)
- C6 commercial speed grade optimized for cost-sensitive designs (vs EP3C5U256A7N)
- Commercial temperature grade with RoHS-compliant Pb-free ball finish (vs EP3C25U256I7N)
Notas de projeto
The EP3C5U256C6N requires three supply rails: VCCINT (1.2V core), VCCIOx (per-bank I/O supply, 1.5V-3.3V depending on standards), and VCCA_PLLx (2.5V analog supply for each PLL). Place 0.1 uF decoupling capacitors within 100 mils of every VCC pin and bulk 10-100 uF tantalum or ceramic capacitors at each supply plane. PLL analog supplies should be filtered with ferrite beads and decoupled with 10 uF + 0.1 uF to minimize jitter. Estimated core current at 100 MHz toggle activity is ~150 mA, rising with logic utilization and clock frequency.
The 256-ball UBGA package uses 0.80 mm ball pitch requiring microvia or via-in-pad PCB technology for reliable assembly. Escape routing on inner layers should use 0.4-0.5 mm trace/space and 8-12 mil laser-drilled microvias. Stencil aperture of 1:1 with 4-5 mil reduction produces consistent solder joints. Per IPC-7093, BGA packages require X-ray inspection after reflow and BGA rework capability is recommended for prototype builds.
Differential pairs (LVDS) require 100 ohm differential impedance with matched trace lengths within 20 mil. CLK0/CLK1 dedicated clock inputs should be routed with controlled impedance and isolated from switching signals. Use full ground planes on all layers adjacent to BGA breakout traces; avoid power plane splits beneath the device. JTAG chain (TCK, TMS, TDI, TDO) should be kept short and protected with series termination if chain length exceeds 4 inches.
Configuration mode pins (MSEL0, MSEL1, MSEL2) must match the desired configuration scheme - incorrect MSEL settings cause configuration failure. nCONFIG must see a clean rising edge with appropriate RC time constant (typically 1k resistor + 0.1 uF cap). CONF_DONE and nSTATUS are open-drain and require external 10k pull-ups to VCCIO. Do not leave JTAG pins floating during normal operation if JTAG is unused - tie TCK low and TMS high per IEEE 1149.1.
Informações de conformidade
RoHS and REACH compliant per Cyclone III product family documentation. Halogen-free status not explicitly stated in available data. AEC-Q100 not applicable for commercial-grade FPGAs. Conflict-minerals compliance per Intel program-level disclosures.
