EP3C5U256C6N - Cyclone III FPGA, 5,136 Logic Elements, 256-UBGA | Intel
Référence : EP3C5U256C6N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $39.86 | $39,86 |
| 10 | $36.5 | $365,00 |
| 100 | $32.1 | $3 210,00 |
| 500 | $28.75 | $14 375,00 |
| 1 000 | $25.4 | $25 400,00 |
EP3C5U256C6N Présentation
What is an FPGA? A Field Programmable Gate Array is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells. Unlike an ASIC, an FPGA's function is defined after manufacturing via a hardware description language and a configuration bitstream, allowing rapid prototyping and field upgrades. FPGAs sit in the hierarchy: programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> SoC FPGA. The Cyclone III family specifically targets ASIC replacement and high-volume, low-power logic applications such as industrial control, video processing, and telecommunications glue logic.
Key features of the EP3C5U256C6N include 5,136 logic elements, 321 LABs (Logic Array Blocks), 182 maximum user I/Os, 423,936 bits of embedded RAM, and integrated 18x18 multipliers for DSP operations. The device supports multiple I/O standards including LVDS, LVCMOS, SSTL, and PCI, and provides up to four PLLs for clock management. Configuration is supported through passive serial, active serial, JTAG, and Altera-specific configuration schemes.
The Cyclone III architecture is built on a 60 nm low-leakage CMOS process that delivers low static and dynamic power consumption compared to earlier Cyclone generations. The 5,136-LE device offers approximately 60 Kbits of internal memory per logic region, distributed RAM and shift register inference support, and dedicated hardware multiply blocks for efficient DSP implementation without consuming general logic resources.
Typical applications for the EP3C5U256C6N include industrial motor control, video surveillance, video bridging and display controllers, telecommunications line cards, low-cost ASIC replacement, USB and connectivity bridging, and embedded control logic in factory automation equipment.
When designing with this device, ensure proper decoupling with 0.1 uF and 10 uF capacitors placed close to each power pin. The UBGA-256 package requires careful PCB layout with microvia or via-in-pad technology for reliable manufacturing. Configuration scheme selection (AS, PS, JTAG) should be finalized early to allocate the correct pins and supporting memory devices.
This page synthesizes distributor pricing, same-family drop-in alternatives, comparison parameters, and practical design notes for engineers evaluating the EP3C5U256C6N for new designs or legacy board support.
Alternatives de remplacement direct pour EP3C5U256C6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3C5U256C6N (même facteur de forme et même empreinte) — différant par Process Technology, Speed Grade, Package, Configuration Modes, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3C5U256C6
✅ Remplacement direct✓ En stock
$10.85 / unité
Voir la fiche technique →EP3C5U256A7N
✅ Remplacement direct✓ En stock
$16.2 / unité
Voir la fiche technique →EP3C10U256C6N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP3C16U256C8N
✅ Remplacement direct✓ En stock
$48.4 / unité
Voir la fiche technique →EP3C25U256I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP3C5U256C6N Valeurs maximales et caractéristiques électriques
| Series | Cyclone III |
| Device Family | Cyclone III FPGA |
| Logic Elements | 5,136 |
| Logic Array Blocks (LABs) | 321 |
| Embedded Memory | 423,936 bits |
| Maximum User I/Os | 182 |
| Boîtier | 256-UBGA (Ultra FineLine BGA) |
| Package Body Size | 14 x 14 mm |
| Ball Pitch | 0.80 mm |
| Package Height | 2.20 mm |
| Speed Grade | C6 |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Process Technology | 60 nm low-power CMOS |
| Type de montage | Surface Mount (BGA) |
| Lead Free / RoHS | Yes / Compliant |
| Configuration Modes | AS, PS, JTAG, Fast Passive Parallel |
Configuration des broches de EP3C5U256C6N
| Broche A1 | I/O — User I/O (bank 1) |
| Broche A2 | I/O — User I/O (bank 1) |
| Broche A3 | I/O — User I/O (bank 1) |
| Broche A4 | VCCIO1 — I/O bank 1 supply voltage |
| Broche A5 | I/O — User I/O (bank 1) |
| Broche A6 | I/O — User I/O (bank 1) |
| Broche A7 | I/O — User I/O (bank 1) |
| Broche A8 | VCCIO1 — I/O bank 1 supply voltage |
| Broche B1 | I/O — User I/O (bank 1) |
| Broche B2 | GND — Ground |
| Broche B3 | I/O — User I/O (bank 1) |
| Broche B4 | I/O — User I/O (bank 1) |
| Broche B5 | GND — Ground |
| Broche B6 | I/O — User I/O (bank 1) |
| Broche B7 | I/O — User I/O (bank 1) |
| Broche B8 | GND — Ground |
| Broche C1 | VCCINT — Core logic supply voltage (1.2V) |
| Broche C2 | I/O — User I/O (bank 2) |
| Broche C3 | VCCIO2 — I/O bank 2 supply voltage |
| Broche C4 | I/O — User I/O (bank 2) |
| Broche C5 | I/O — User I/O (bank 2) |
| Broche C6 | VCCIO2 — I/O bank 2 supply voltage |
| Broche C7 | I/O — User I/O (bank 2) |
| Broche C8 | VCCINT — Core logic supply voltage (1.2V) |
| Broche D1 | I/O — User I/O (bank 2) |
| Broche D2 | GND — Ground |
| Broche D3 | I/O — User I/O (bank 2) |
| Broche D4 | TCK — JTAG Test Clock |
| Broche D5 | TDO — JTAG Test Data Out |
| Broche D6 | I/O — User I/O (bank 2) |
| Broche D7 | GND — Ground |
| Broche D8 | I/O — User I/O (bank 2) |
| Broche E1 | VCCIO3 — I/O bank 3 supply voltage |
| Broche E2 | I/O — User I/O (bank 3) |
| Broche E3 | I/O — User I/O (bank 3) |
| Broche E4 | TMS — JTAG Test Mode Select |
| Broche E5 | TDI — JTAG Test Data In |
| Broche E6 | I/O — User I/O (bank 3) |
| Broche E7 | I/O — User I/O (bank 3) |
| Broche E8 | VCCIO3 — I/O bank 3 supply voltage |
| Broche F1 | I/O — User I/O (bank 3) |
| Broche F2 | GND — Ground |
| Broche F3 | I/O — User I/O (bank 3) |
| Broche F4 | I/O — User I/O (bank 3) |
| Broche F5 | nCONFIG — Configuration control (active low) |
| Broche F6 | GND — Ground |
| Broche F7 | I/O — User I/O (bank 3) |
| Broche F8 | I/O — User I/O (bank 3) |
| Broche G1 | VCCINT — Core logic supply voltage (1.2V) |
| Broche G2 | I/O — User I/O (bank 4) |
| Broche G3 | VCCIO4 — I/O bank 4 supply voltage |
| Broche G4 | CONF_DONE — Configuration done status (open-drain) |
| Broche G5 | nSTATUS — Configuration status (open-drain) |
| Broche G6 | VCCIO4 — I/O bank 4 supply voltage |
| Broche G7 | I/O — User I/O (bank 4) |
| Broche G8 | VCCINT — Core logic supply voltage (1.2V) |
| Broche H1 | I/O — User I/O (bank 4) |
| Broche H2 | GND — Ground |
| Broche H3 | I/O — User I/O (bank 4) |
| Broche H4 | I/O — User I/O (bank 4) |
| Broche H5 | GND — Ground |
| Broche H6 | I/O — User I/O (bank 4) |
| Broche H7 | I/O — User I/O (bank 4) |
| Broche H8 | GND — Ground |
| Broche J1 | VCCIO5 — I/O bank 5 supply voltage |
| Broche J2 | I/O — User I/O (bank 5) |
| Broche J3 | I/O — User I/O (bank 5) |
| Broche J4 | CLK0 — Clock input 0 (dedicated) |
| Broche J5 | CLK1 — Clock input 1 (dedicated) |
| Broche J6 | I/O — User I/O (bank 5) |
| Broche J7 | I/O — User I/O (bank 5) |
| Broche J8 | VCCIO5 — I/O bank 5 supply voltage |
| Broche K1 | I/O — User I/O (bank 5) |
| Broche K2 | GND — Ground |
| Broche K3 | I/O — User I/O (bank 5) |
| Broche K4 | I/O — User I/O (bank 5) |
| Broche K5 | GND — Ground |
| Broche K6 | I/O — User I/O (bank 5) |
| Broche K7 | GND — Ground |
| Broche K8 | I/O — User I/O (bank 5) |
| Broche L1 | VCCINT — Core logic supply voltage (1.2V) |
| Broche L2 | I/O — User I/O (bank 6) |
| Broche L3 | VCCIO6 — I/O bank 6 supply voltage |
| Broche L4 | I/O — User I/O (bank 6) |
| Broche L5 | I/O — User I/O (bank 6) |
| Broche L6 | VCCIO6 — I/O bank 6 supply voltage |
| Broche L7 | I/O — User I/O (bank 6) |
| Broche L8 | VCCINT — Core logic supply voltage (1.2V) |
| Broche M1 | I/O — User I/O (bank 6) |
| Broche M2 | GND — Ground |
| Broche M3 | I/O — User I/O (bank 6) |
| Broche M4 | I/O — User I/O (bank 6) |
| Broche M5 | GND — Ground |
| Broche M6 | I/O — User I/O (bank 6) |
| Broche M7 | I/O — User I/O (bank 6) |
| Broche M8 | GND — Ground |
| Broche N1 | VCCIO7 — I/O bank 7 supply voltage |
| Broche N2 | I/O — User I/O (bank 7) |
| Broche N3 | I/O — User I/O (bank 7) |
| Broche N4 | I/O — User I/O (bank 7) |
| Broche N5 | I/O — User I/O (bank 7) |
| Broche N6 | I/O — User I/O (bank 7) |
| Broche N7 | I/O — User I/O (bank 7) |
| Broche N8 | VCCIO7 — I/O bank 7 supply voltage |
| Broche P1 | I/O — User I/O (bank 7) |
| Broche P2 | GND — Ground |
| Broche P3 | I/O — User I/O (bank 7) |
| Broche P4 | I/O — User I/O (bank 8) |
| Broche P5 | GND — Ground |
| Broche P6 | I/O — User I/O (bank 8) |
| Broche P7 | I/O — User I/O (bank 8) |
| Broche P8 | GND — Ground |
| Broche R1 | VCCINT — Core logic supply voltage (1.2V) |
| Broche R2 | I/O — User I/O (bank 8) |
| Broche R3 | VCCIO8 — I/O bank 8 supply voltage |
| Broche R4 | I/O — User I/O (bank 8) |
| Broche R5 | I/O — User I/O (bank 8) |
| Broche R6 | VCCIO8 — I/O bank 8 supply voltage |
| Broche R7 | I/O — User I/O (bank 8) |
| Broche R8 | VCCINT — Core logic supply voltage (1.2V) |
| Broche T1 | I/O — User I/O (bank 8) |
| Broche T2 | GND — Ground |
| Broche T3 | I/O — User I/O (bank 8) |
| Broche T4 | I/O — User I/O (bank 8) |
| Broche T5 | GND — Ground |
| Broche T6 | I/O — User I/O (bank 8) |
| Broche T7 | I/O — User I/O (bank 8) |
| Broche T8 | GND — Ground |
| Broche U1 | DATA0 — Configuration data (AS/PS mode) |
| Broche U2 | I/O — User I/O (bank 8) |
| Broche U3 | I/O — User I/O (bank 8) |
| Broche U4 | MSEL0 — Configuration mode select 0 |
| Broche U5 | MSEL1 — Configuration mode select 1 |
| Broche U6 | I/O — User I/O (bank 8) |
| Broche U7 | I/O — User I/O (bank 8) |
| Broche U8 | DCLK — Configuration clock input |
| Broche V1 | I/O — User I/O (bank 8) |
| Broche V2 | GND — Ground |
| Broche V3 | I/O — User I/O (bank 8) |
| Broche V4 | I/O — User I/O (bank 8) |
| Broche V5 | GND — Ground |
| Broche V6 | I/O — User I/O (bank 8) |
| Broche V7 | GND — Ground |
| Broche V8 | I/O — User I/O (bank 8) |
| Broche W1 | VCCA_PLL1 — PLL1 analog supply (2.5V) |
| Broche W2 | I/O — User I/O (bank 8) |
| Broche W3 | VCCIO8 — I/O bank 8 supply voltage |
| Broche W4 | I/O — User I/O (bank 8) |
| Broche W5 | nCE — Chip enable (active low) |
| Broche W6 | VCCIO8 — I/O bank 8 supply voltage |
| Broche W7 | I/O — User I/O (bank 8) |
| Broche W8 | GNDA_PLL1 — PLL1 analog ground |
| Broche Y1 | I/O — User I/O (bank 8) |
| Broche Y2 | GND — Ground |
| Broche Y3 | I/O — User I/O (bank 8) |
| Broche Y4 | I/O — User I/O (bank 8) |
| Broche Y5 | GND — Ground |
| Broche Y6 | I/O — User I/O (bank 8) |
| Broche Y7 | I/O — User I/O (bank 8) |
| Broche Y8 | GND — Ground |
Applications typiques
EP3C5U256C6N convient pour 6 applications: Industrial Motor Control, Video Surveillance / Display Bridging, Telecommunications Line Card Glue Logic, Low-Cost ASIC Replacement, USB and Connectivity Bridging, Embedded Control Logic in Factory Automation.
Industrial Motor Control
The EP3C5U256C6N is well-suited for industrial motor control applications where precise timing and flexible I/O configuration are essential. Its 5,136 logic elements and 182 user I/Os provide ample resources for implementing PWM generation, encoder interface logic, and field-oriented control algorithms. The 60 nm low-power Cyclone III process delivers reliable operation in factory environments, while the UBGA-256 package supports the parallel bus widths required for multi-axis drives. Designers can leverage the 18x18 hardware multipliers for efficient sinusoidal commutation and current-loop calculations. Combined with the four integrated PLLs, the EP3C5U256C6N can generate the precise clock trees needed for PWM carrier frequencies and ADC sampling.
Recommandé
Video Surveillance / Display Bridging
The EP3C5U256C6N excels in video bridging applications where camera sensors, displays, and processors must be interconnected with format conversion and timing adjustment. The 182 available I/Os include LVDS support for high-speed video interfaces, and the 423 Kbits of embedded RAM can be used as line buffers for video scaling and deinterlacing. Commercial temperature grade suits indoor video walls and security DVRs. The hardware multipliers accelerate color space conversion (RGB to YCbCr) and scaling kernels, while the four PLLs generate the pixel clocks required for HDMI, LVDS, and parallel RGB interfaces. Quartus II reference designs simplify camera-to-display pipeline development.
Recommandé
Telecommunications Line Card Glue Logic
Telecommunications line cards require programmable glue logic to interface between SERDES, network processors, and backplane connectors, and the EP3C5U256C6N fits this role with its 182 LVCMOS/LVDS/SSTL I/Os. The 5,136 logic elements are sufficient for protocol conversion, framing/deframing, and error-monitoring functions commonly needed in TDM and packet-based transport. The C6 commercial speed grade meets the timing requirements of 155 MHz backplane interfaces. Multiple I/O banks support mixed voltage standards (1.5V, 1.8V, 2.5V, 3.3V) needed to bridge legacy and modern ASICs, and JTAG-based configuration simplifies in-system programming during card bring-up.
Recommandé
Low-Cost ASIC Replacement
The EP3C5U256C6N is widely used as a low-cost ASIC replacement for medium-complexity glue logic, state machines, and protocol bridges where ASIC NRE is unjustified. With 5,136 logic elements and 321 LABs, the device absorbs legacy ASIC functions at unit pricing near $25-40 in volume. Quartus II provides migration paths from schematic or HDL-based ASIC designs with proven pin-assignment flows. Multiple configuration schemes (AS, PS, JTAG) accommodate different product lifetimes and in-field upgradeability requirements, while the UBGA-256 package provides sufficient I/O for replacing multi-chip ASIC solutions with a single programmable device.
Recommandé
USB and Connectivity Bridging
Embedded systems often require bridging between USB, UART, SPI, I2C, and parallel buses, and the EP3C5U256C6N provides sufficient logic and I/O to act as a flexible connectivity bridge. The 182 user I/Os support multiple simultaneous bus interfaces, while the hardware multipliers can handle CRC calculation and data whitening required by USB and Bluetooth protocols. Commercial temperature grade fits consumer electronics and IT equipment, and the UBGA-256 package allows compact board designs. Designers can leverage Quartus reference designs for USB 2.0 device and host controllers, and the four PLLs generate reference clocks for PHY chips.
Recommandé
Embedded Control Logic in Factory Automation
Factory automation equipment requires deterministic control logic for sensor aggregation, actuator control, and safety interlocks, and the EP3C5U256C6N delivers these functions in a single chip. Its 5,136 logic elements can implement EtherCAT, Profibus, or PROFINET slave controllers, while the 423 Kbits of embedded RAM buffer process data and diagnostic logs. Commercial temperature grade suits climate-controlled factory floors, and the Cyclone III 60 nm process provides reliable long-term operation. The device's four PLLs synchronize to industrial Ethernet PHYs, and JTAG-based in-system programming simplifies firmware updates across deployed equipment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3C5U256C6N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3C5U256C6 | EP3C5U256A7N | EP3C10U256C6N | EP3C16U256C8N | EP3C25U256I7N |
|---|---|---|---|---|---|---|
| Package | 256-UBGA (14x14 mm, 0.80 mm pitch) | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 5,136 | 5,136 | 5,136 | 10,320 | 15,408 | 24,624 |
| Speed Grade | C6 | C6 | A7 (faster) | C6 | C8 (slower) | I7 (industrial) |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 516,096 bits | 608,256 bits |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| RoHS / Lead-Free | Yes (Pb-free) | No (Pb-containing) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
Principaux différenciateurs
- Lowest-density Cyclone III in UBGA-256 footprint with C6 speed grade (vs EP3C10U256C6N)
- C6 commercial speed grade optimized for cost-sensitive designs (vs EP3C5U256A7N)
- Commercial temperature grade with RoHS-compliant Pb-free ball finish (vs EP3C25U256I7N)
Notes de conception
The EP3C5U256C6N requires three supply rails: VCCINT (1.2V core), VCCIOx (per-bank I/O supply, 1.5V-3.3V depending on standards), and VCCA_PLLx (2.5V analog supply for each PLL). Place 0.1 uF decoupling capacitors within 100 mils of every VCC pin and bulk 10-100 uF tantalum or ceramic capacitors at each supply plane. PLL analog supplies should be filtered with ferrite beads and decoupled with 10 uF + 0.1 uF to minimize jitter. Estimated core current at 100 MHz toggle activity is ~150 mA, rising with logic utilization and clock frequency.
The 256-ball UBGA package uses 0.80 mm ball pitch requiring microvia or via-in-pad PCB technology for reliable assembly. Escape routing on inner layers should use 0.4-0.5 mm trace/space and 8-12 mil laser-drilled microvias. Stencil aperture of 1:1 with 4-5 mil reduction produces consistent solder joints. Per IPC-7093, BGA packages require X-ray inspection after reflow and BGA rework capability is recommended for prototype builds.
Differential pairs (LVDS) require 100 ohm differential impedance with matched trace lengths within 20 mil. CLK0/CLK1 dedicated clock inputs should be routed with controlled impedance and isolated from switching signals. Use full ground planes on all layers adjacent to BGA breakout traces; avoid power plane splits beneath the device. JTAG chain (TCK, TMS, TDI, TDO) should be kept short and protected with series termination if chain length exceeds 4 inches.
Configuration mode pins (MSEL0, MSEL1, MSEL2) must match the desired configuration scheme - incorrect MSEL settings cause configuration failure. nCONFIG must see a clean rising edge with appropriate RC time constant (typically 1k resistor + 0.1 uF cap). CONF_DONE and nSTATUS are open-drain and require external 10k pull-ups to VCCIO. Do not leave JTAG pins floating during normal operation if JTAG is unused - tie TCK low and TMS high per IEEE 1149.1.
Informations de conformité
RoHS and REACH compliant per Cyclone III product family documentation. Halogen-free status not explicitly stated in available data. AEC-Q100 not applicable for commercial-grade FPGAs. Conflict-minerals compliance per Intel program-level disclosures.
