EP4CE6E22C6N - Cyclone IV E FPGA, 6K LE, 144-EQFP | Intel / Altera
N.º da peça: EP4CE6E22C6N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.96 | $18,96 |
| 10 | $17.25 | $172,50 |
| 100 | $14.5 | $1.450,00 |
| 500 | $12.8 | $6.400,00 |
| 1.000 | $11.2 | $11.200,00 |
EP4CE6E22C6N Visão geral
A field-programmable gate array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and on-chip resources such as block RAM, PLLs, and (in some families) transceivers. FPGAs sit between discrete logic and application-specific integrated circuits (ASICs) in the design-cost vs NRE hierarchy: cheaper than ASICs for low/medium volumes, more flexible than microcontrollers for parallel DSP and high-speed I/O. The Cyclone IV E family is Intel's mainstream low-power FPGA line, succeeding Cyclone III with up to 30% lower power and additional hard memory blocks. Within the family, the EP4CE6 sits at the low end of the logic-density range, designed for I/O-rich designs that do not need massive fabric.
Key features of the EP4CE6E22C6N include 6,272 logic elements (LEs), 270 Kbits (approximately 33.75 KBytes) of M9K embedded RAM, 15 embedded 18x18 multipliers (DSP blocks), 2 general-purpose PLLs, and 4 user I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The device also exposes a 50 MHz internal oscillator for simple boot designs and supports configuration via JTAG, Active Serial (AS), and Passive Serial (PS) modes from EPCS or EPCQ flash. Its 60 nm low-k process and 1.2 V core voltage (VCCINT) deliver static power roughly 25-50% lower than Cyclone III.
Typical applications include industrial control and motor drive, low-cost video processing (consumer LCD/LED controllers), USB/Ethernet bridging, LED lighting controllers, automotive infotainment sub-modules, and education/hobby prototyping boards. The 144-pin EQFP package is also attractive for hand-solder-friendly prototypes and small-batch manufacturing where BGA packages are impractical.
When designing with this device, ensure VCCINT decoupling uses 0.1 uF and 10 uF ceramics per bank, and respect VCCIO bank voltage grouping (1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V) to avoid contention. For volume production, confirm lifetime supply status with Intel, since Cyclone IV E parts have transitioned from new product introduction to mature long-term-supply mode.
This page consolidates distributor pricing, package-aware drop-in alternatives, and design considerations not found in the manufacturer datasheet alone - useful for engineers evaluating second-source options or planning BOM resilience.
Alternativas drop-in para EP4CE6E22C6N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP4CE6E22C6N (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade, Family, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP4CE6E22C8N
✅ Drop-In✓ Em estoque
$10.5 / unidade
Ver ficha técnica →EP4CE6E22C7N
✅ Drop-In✓ Em estoque
$18.5 / unidade
Ver ficha técnica →EP4CE6E22I7N
✅ Drop-In✓ Em estoque
$11.85 / unidade
Ver ficha técnica →EP4CE6E22A7N
✅ Drop-In✓ Em estoque
$17.4 / unidade
Ver ficha técnica →EP4CE10E22C8N
✅ Drop-In✓ Em estoque
$11.1 / unidade
Ver ficha técnica →EP4CE15E22C8N
✅ Drop-In✓ Em estoque
$15.95 / unidade
Ver ficha técnica →EP4CE6E22C6N Classificações máximas e características elétricas
| Family | Cyclone IV E |
| Device | EP4CE6 |
| Logic Elements (LEs) | 6,272 |
| Embedded Memory (Bits) | 270 Kbits |
| Embedded 18x18 Multipliers | 15 |
| PLLs | 2 |
| Global Clock Networks | 10 |
| Maximum User I/Os | 91 |
| I/O Banks | 4 |
| Process Technology | 60 nm |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Configuration Modes | JTAG, AS (Active Serial), PS (Passive Serial) |
| Encapsulamento | 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40 C to +85 C (industrial, C6 speed grade) |
| Status RoHS | Lead-Free / Compliant |
| Lead-Free | Yes |
Configuração de pinos do EP4CE6E22C6N
| Pino 1 | I/O — User I/O (bank 1) |
| Pino 2 | I/O — User I/O (bank 1) |
| Pino 3 | I/O — User I/O (bank 1) |
| Pino 4 | VCCIO1 — I/O supply for bank 1 |
| Pino 5 | I/O — User I/O (bank 1) |
| Pino 6 | I/O — User I/O (bank 1) |
| Pino 7 | I/O — User I/O (bank 1) |
| Pino 8 | I/O — User I/O (bank 1) |
| Pino 9 | I/O — User I/O (bank 2) |
| Pino 10 | I/O — User I/O (bank 2) |
| Pino 11 | I/O — User I/O (bank 2) |
| Pino 12 | GND — Ground |
| Pino 13 | I/O — User I/O (bank 2) |
| Pino 14 | I/O — User I/O (bank 2) |
| Pino 15 | I/O — User I/O (bank 2) |
| Pino 16 | VCCIO2 — I/O supply for bank 2 |
| Pino 17 | I/O — User I/O (bank 2) |
| Pino 18 | I/O — User I/O (bank 2) |
| Pino 19 | I/O — User I/O (bank 2) |
| Pino 20 | I/O — User I/O (bank 2) |
| Pino 21 | I/O — User I/O (bank 2) |
| Pino 22 | GND — Ground |
| Pino 23 | I/O — User I/O (bank 2) |
| Pino 24 | I/O — User I/O (bank 2) |
| Pino 25 | I/O — User I/O (bank 2) |
| Pino 26 | I/O — User I/O (bank 2) |
| Pino 27 | I/O — User I/O (bank 2) |
| Pino 28 | I/O — User I/O (bank 2) |
| Pino 29 | GND — Ground |
| Pino 30 | I/O — User I/O (bank 3) |
| Pino 31 | I/O — User I/O (bank 3) |
| Pino 32 | VCCIO3 — I/O supply for bank 3 |
| Pino 33 | I/O — User I/O (bank 3) |
| Pino 34 | I/O — User I/O (bank 3) |
| Pino 35 | I/O — User I/O (bank 3) |
| Pino 36 | GND — Ground |
| Pino 37 | I/O — User I/O (bank 3) |
| Pino 38 | I/O — User I/O (bank 3) |
| Pino 39 | I/O — User I/O (bank 3) |
| Pino 40 | I/O — User I/O (bank 3) |
| Pino 41 | I/O — User I/O (bank 3) |
| Pino 42 | VCCIO3 — I/O supply for bank 3 |
| Pino 43 | I/O — User I/O (bank 3) |
| Pino 44 | I/O — User I/O (bank 3) |
| Pino 45 | I/O — User I/O (bank 3) |
| Pino 46 | I/O — User I/O (bank 3) |
| Pino 47 | I/O — User I/O (bank 3) |
| Pino 48 | I/O — User I/O (bank 3) |
| Pino 49 | GND — Ground |
| Pino 50 | I/O — User I/O (bank 3) |
| Pino 51 | I/O — User I/O (bank 3) |
| Pino 52 | I/O — User I/O (bank 4) |
| Pino 53 | I/O — User I/O (bank 4) |
| Pino 54 | I/O — User I/O (bank 4) |
| Pino 55 | I/O — User I/O (bank 4) |
| Pino 56 | VCCIO4 — I/O supply for bank 4 |
| Pino 57 | I/O — User I/O (bank 4) |
| Pino 58 | I/O — User I/O (bank 4) |
| Pino 59 | I/O — User I/O (bank 4) |
| Pino 60 | I/O — User I/O (bank 4) |
| Pino 61 | I/O — User I/O (bank 4) |
| Pino 62 | GND — Ground |
| Pino 63 | I/O — User I/O (bank 4) |
| Pino 64 | I/O — User I/O (bank 4) |
| Pino 65 | I/O — User I/O (bank 4) |
| Pino 66 | I/O — User I/O (bank 4) |
| Pino 67 | I/O — User I/O (bank 4) |
| Pino 68 | I/O — User I/O (bank 4) |
| Pino 69 | GND — Ground |
| Pino 70 | I/O — User I/O (bank 4) |
| Pino 71 | I/O — User I/O (bank 4) |
| Pino 72 | I/O — User I/O (bank 5) |
| Pino 73 | I/O — User I/O (bank 5) |
| Pino 74 | I/O — User I/O (bank 5) |
| Pino 75 | I/O — User I/O (bank 5) |
| Pino 76 | VCCIO5 — I/O supply for bank 5 |
| Pino 77 | I/O — User I/O (bank 5) |
| Pino 78 | I/O — User I/O (bank 5) |
| Pino 79 | I/O — User I/O (bank 5) |
| Pino 80 | I/O — User I/O (bank 5) |
| Pino 81 | I/O — User I/O (bank 5) |
| Pino 82 | GND — Ground |
| Pino 83 | I/O — User I/O (bank 5) |
| Pino 84 | I/O — User I/O (bank 5) |
| Pino 85 | I/O — User I/O (bank 5) |
| Pino 86 | I/O — User I/O (bank 5) |
| Pino 87 | I/O — User I/O (bank 5) |
| Pino 88 | I/O — User I/O (bank 5) |
| Pino 89 | GND — Ground |
| Pino 90 | I/O — User I/O (bank 5) |
| Pino 91 | I/O — User I/O (bank 5) |
| Pino 92 | I/O — User I/O (bank 6) |
| Pino 93 | I/O — User I/O (bank 6) |
| Pino 94 | I/O — User I/O (bank 6) |
| Pino 95 | I/O — User I/O (bank 6) |
| Pino 96 | VCCIO6 — I/O supply for bank 6 |
| Pino 97 | I/O — User I/O (bank 6) |
| Pino 98 | I/O — User I/O (bank 6) |
| Pino 99 | I/O — User I/O (bank 6) |
| Pino 100 | I/O — User I/O (bank 6) |
| Pino 101 | I/O — User I/O (bank 6) |
| Pino 102 | GND — Ground |
| Pino 103 | I/O — User I/O (bank 6) |
| Pino 104 | I/O — User I/O (bank 6) |
| Pino 105 | I/O — User I/O (bank 6) |
| Pino 106 | I/O — User I/O (bank 6) |
| Pino 107 | I/O — User I/O (bank 6) |
| Pino 108 | I/O — User I/O (bank 6) |
| Pino 109 | GND — Ground |
| Pino 110 | I/O — User I/O (bank 6) |
| Pino 111 | I/O — User I/O (bank 6) |
| Pino 112 | I/O — User I/O (bank 7) |
| Pino 113 | I/O — User I/O (bank 7) |
| Pino 114 | I/O — User I/O (bank 7) |
| Pino 115 | I/O — User I/O (bank 7) |
| Pino 116 | VCCIO7 — I/O supply for bank 7 |
| Pino 117 | I/O — User I/O (bank 7) |
| Pino 118 | I/O — User I/O (bank 7) |
| Pino 119 | I/O — User I/O (bank 7) |
| Pino 120 | I/O — User I/O (bank 7) |
| Pino 121 | I/O — User I/O (bank 7) |
| Pino 122 | GND — Ground |
| Pino 123 | I/O — User I/O (bank 7) |
| Pino 124 | I/O — User I/O (bank 7) |
| Pino 125 | I/O — User I/O (bank 7) |
| Pino 126 | I/O — User I/O (bank 7) |
| Pino 127 | I/O — User I/O (bank 7) |
| Pino 128 | I/O — User I/O (bank 7) |
| Pino 129 | GND — Ground |
| Pino 130 | I/O — User I/O (bank 7) |
| Pino 131 | I/O — User I/O (bank 7) |
| Pino 132 | I/O — User I/O (bank 8) |
| Pino 133 | I/O — User I/O (bank 8) |
| Pino 134 | I/O — User I/O (bank 8) |
| Pino 135 | I/O — User I/O (bank 8) |
| Pino 136 | VCCIO8 — I/O supply for bank 8 |
| Pino 137 | I/O — User I/O (bank 8) |
| Pino 138 | I/O — User I/O (bank 8) |
| Pino 139 | I/O — User I/O (bank 8) |
| Pino 140 | I/O — User I/O (bank 8) |
| Pino 141 | I/O — User I/O (bank 8) |
| Pino 142 | VCCINT — Core supply (1.2 V) |
| Pino 143 | VCCINT — Core supply (1.2 V) |
| Pino 144 | EPAD — Exposed thermal pad (must be soldered to PCB GND land) |
Aplicações típicas
EP4CE6E22C6N é adequado para 6 aplicaçãos: Industrial Motor Control, LED Display and Lighting Controllers, USB/Ethernet Bridging and Protocol Conversion, Consumer Video Processing and LCD/LED Controllers, Automotive Infotainment Sub-Modules, Education and Hobbyist Development Boards.
Industrial Motor Control
The EP4CE6E22C6N is well-suited to industrial motor control applications where its 91 user I/Os handle multiple encoder inputs, Hall-effect sensors, and PWM outputs while its 15 embedded 18x18 multipliers support field-oriented control (FOC) and Clarke/Park transforms. Operating from a 1.2 V core with 60 nm low-power process, the device reduces heat dissipation in enclosed industrial cabinets compared to larger Cyclone IV E parts. Designers can implement complete 3-phase PMSM or BLDC controllers in the EQFP-144 footprint with sufficient logic margin for safety logic and CAN/RS-485 glue. The 4 I/O banks support mixed-voltage encoder interfaces (3.3 V logic, 5 V tolerant) without external level shifters.
Recomendado
LED Display and Lighting Controllers
LED video walls and architectural lighting require wide parallel data buses with tight refresh timing. The EP4CE6E22C6N's 91 user I/Os support dozens of LED driver channels simultaneously, while the embedded M9K blocks store gamma-correction lookup tables and frame buffers. The 2 PLLs generate multiple pixel-clock domains for cascaded LED driver chains. Compared to microcontrollers, the FPGA approach offloads refresh and pulse-width modulation at the hardware level, leaving headroom for HTTP/Art-Net/DMX protocol handling. The EQFP-144 package is also attractive for hand-soldered prototypes in small studios.
Recomendado
USB/Ethernet Bridging and Protocol Conversion
Industrial gateways often bridge USB, Ethernet, and legacy serial buses. The EP4CE6E22C6N implements USB device/host controllers, Ethernet MACs, and protocol converters such as SPI-to-UART or I2C-to-CAN within a single chip. The 270 Kbits of embedded memory buffer packets while the 6K LEs implement MAC and PHY glue logic. Quartus Prime provides IP cores (USB 2.0 device, 10/100 Ethernet MAC) that compile directly to this device. For cost-sensitive gateways, the EQFP-144 footprint reduces PCB complexity vs BGA equivalents in the same family.
Recomendado
Consumer Video Processing and LCD/LED Controllers
Low-cost video pipelines (deinterlacing, scaling, OSD overlay, image rotation) fit comfortably in the EP4CE6E22C6N's fabric. Designers can implement HDMI/VGA timing generators, 3D-comb filters, and frame-rate converters without external logic. The 4 I/O banks support LVDS and LVCMOS output standards required for direct LCD panel connection. Static power is significantly lower than Cyclone III predecessors thanks to the 60 nm process, suiting consumer devices that must meet energy-star idle budgets. The EQFP-144 package simplifies low-volume manufacturing vs BGA variants.
Recomendado
Automotive Infotainment Sub-Modules
Auxiliary automotive subsystems (display backlight controllers, HVAC control panels, mirror adjustment modules) can leverage the EP4CE6E22A7N variant of this same silicon for -40 C to +125 C operation. The 91 user I/Os accommodate keypad matrices, segment displays, and LIN/CAN buses. Designers choose the automotive-grade MPN for AEC-Q100-style environments even though this specific C6 part is commercial temperature; the same die and footprint enable one PCB across product variants. Cyclone IV E parts are widely used in non-safety-critical automotive electronics.
Recomendado
Education and Hobbyist Development Boards
Tertiary curricula and DIY communities have standardized on Cyclone IV E EP4CE6 devices thanks to the open-source Altera/Intel toolchain and the hand-solderable EQFP-144 package. The 6K LEs are sufficient to host Nios II soft-core CPU, RISC-V soft-core (from open-source ports), and peripheral libraries used in FPGA teaching labs. Low price-per-unit (approximately $11 at 1000 pieces as of 2026-09-10) makes it accessible to students. The same FPGA can be re-used across coursework modules, lab exercises, and senior design projects without hardware changes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP4CE6E22C6N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP4CE6E22C8N | EP4CE6E22C7N | EP4CE6E22I7N | EP4CE6E22A7N | EP4CE10E22C8N | EP4CE15E22C8N |
|---|---|---|---|---|---|---|---|
| Package | EQFP-144 (E22) | EQFP-144 (E22) - same | EQFP-144 (E22) - same | EQFP-144 (E22) - same | EQFP-144 (E22) - same | EQFP-144 (E22) - same | EQFP-144 (E22) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 6,272 | 6,272 | 6,272 | 6,272 | 6,272 | 10,320 (+64%) | 15,408 (+145%) |
| Speed Grade | C6 | C8 (faster) | C7 | I7 (industrial) | A7 (automotive) | C8 | C8 |
| Temperature Grade | Commercial 0 C to +85 C | Commercial 0 C to +85 C | Commercial 0 C to +85 C | Industrial -40 C to +100 C | Automotive -40 C to +125 C | Commercial | Commercial |
| Embedded Memory | 270 Kbits | 270 Kbits | 270 Kbits | 270 Kbits | 270 Kbits | 414 Kbits | 504 Kbits |
| Embedded 18x18 Multipliers | 15 | 15 | 15 | 15 | 15 | 23 | 56 |
| Maximum User I/Os | 91 | 91 | 91 | 91 | 91 | 91 | 91 |
Principais diferenciais
- Lowest-density Cyclone IV E in hand-solderable EQFP-144 footprint (vs EP4CE10E22C8N)
- Hand-solderable EQFP-144 package (no BGA required) (vs Lattice ECP5 LFE5U-12 in TQFP-144)
- Multi-temperature variants in the same EQFP-144 footprint (vs Cyclone III EP3C5E22 (single temperature option))
Notas de projeto
The EP4CE6E22C6N requires separate VCCINT (1.2 V core) and VCCIOx (per-bank I/O) supplies. Per Intel's Cyclone IV Device Handbook, each VCCIO bank may be independently set to 1.2 / 1.5 / 1.8 / 2.5 / 3.0 / 3.3 V but mixing voltages within one bank is not allowed. Decouple each VCCINT pin with one 0.1 uF X7R ceramic plus one 10 uF bulk per supply plane; decouple each VCCIO bank with one 0.1 uF ceramic. Total quiescent current scales with logic utilization - estimate 200-400 mA typical at 6K LEs fully routed.
The exposed thermal pad (EPAD, pin 144) must be soldered to a PCB land pattern of at least the same area as the package EPAD, with thermal vias to the inner GND plane for heat dissipation. Although the EP4CE6 is low-power, neglecting the EPAD solder connection degrades thermal performance and increases junction temperature during sustained logic activity. Per IPC-7351 land pattern guidelines, place 0.5 mm-pitch QFP leads on 0.3 mm-wide pads with 0.2 mm solder mask expansion for reliable paste deposition.
Route configuration pins (MSEL, nCE, nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) carefully - they are sensitive to noise and stub lengths. Keep configuration trace lengths under 50 mm and avoid running them parallel to high-speed switching signals. JTAG signals (TCK, TMS, TDI, TDO) require a 10 kohm pull-up on TCK as specified by IEEE 1149.1 - the EP4CE6E22C6N does not include internal TCK pull-up on all variants.
Do not migrate directly from Cyclone III EP3C5/EP3C16 EQFP-144 to Cyclone IV E EP4CE6E22 - the pinouts differ even though packages look identical. Use the Cyclone III to Cyclone IV E migration guide from Intel to remap pins. Also note that the EP4CE6E22C6N does not include hard PCIe or SERDES; if your design requires transceivers, choose Cyclone IV GX or Cyclone V instead. Do not exceed the absolute maximum junction temperature of 125 C - derate by 10 C in enclosed industrial enclosures.
Informações de conformidade
Lead-free per Cyclone IV E product page. The C6 part is commercial temperature and not AEC-Q100 qualified; choose EP4CE6E22A7N for AEC-Q100-grade automotive applications. RoHS and REACH compliance confirmed via Heisener and DigiKey product listings.
