Intel

EPF10K30EQC208-3N - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel

Name: EPF10K30EQC208-3N - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel
Brand: Intel
SKU: EPF10K30EQC208-3N
Price: 49.1 USD
Availability: InStock

N.º da peça: EPF10K30EQC208-3N ⚠ Última compra

Em estoque Enviado em 1 a 3 dias úteis

2.5 V Vdss 208-pin PQFP (BFQFP, plastic) Package 200 MHz Speed SRAM (volatile, requires external PROM) Memory

A partir de $49.1 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-11

Preços por volume

Qtd.	Preço unitário	Total
1	$78.5	$78,50
10	$70.65	$706,50
100	$62.8	$6.280,00
500	$55.95	$27.975,00
1.000	$49.1	$49.100,00

ℹ️ Todos os preços estão em USD

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EPF10K30EQC208-3N Visão geral

The Intel EPF10K30EQC208-3N is a member of the FLEX 10KE family of Field Programmable Gate Arrays (FPGAs), delivering 30,000 typical gates, 1,728 logic elements, and 24,576 RAM bits in a 208-pin Power Quad Flat Pack (PQFP/BFQFP) package. Operating at a core voltage of 2.5 V on a 0.22 µm CMOS process, the device supports internal clock rates up to 200 MHz with a typical propagation delay of 0.6 ns and offers 147 user I/Os for board-level integration.

A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and programmable I/O cells that the user can program to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the system hierarchy: digital logic IC -> programmable logic -> FPGA -> System-on-Chip (SoC) FPGA. The FLEX 10KE family was Intel's (originally Altera's) industry-first embedded programmable logic device family with on-chip SRAM blocks, enabling System-on-a-Programmable-Chip (SOPC) integration via its embedded array blocks (EABs).

Key features include 216 Logic Array Blocks (LABs) organized across the device fabric, embedded array blocks providing dedicated SRAM for true dual-port or single-port memory functions, in-system programmability via the IEEE 1149.1 JTAG interface, and multi-voltage I/O support allowing 2.5 V, 3.3 V, or 5 V interfaces on the same die. The device's CMOS SRAM-based configuration memory supports unlimited reconfiguration cycles, making it ideal for prototyping and design iteration. The commercial temperature grade (0 °C to 70 °C) targets mainstream industrial and consumer embedded designs.

Typical applications include glue logic replacement, bus-bridging interfaces, custom state-machine controllers, DSP co-processing front-ends, and legacy system refresh designs where a programmable logic upgrade path is desired. The on-chip EABs allow implementation of small FIFOs, dual-port RAM, and ROM look-up tables without consuming general-purpose logic.

When designing with this part, remember that the SRAM configuration memory must be loaded on every power-up via a configuration PROM (EPC2, EPC8, or EPC16) or a microcontroller host. Pin compatibility within the FLEX 10KE family allows design migration across speed grades and package options on the same PCB footprint, simplifying inventory and second-source planning.

Alternativas drop-in para EPF10K30EQC208-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EPF10K30EQC208-3N (mesmo formato e footprint) — diferindo em Package, Process Technology, Operating Temperature, Propagation Delay, RoHS Status.

EPF10K30EQC208-1

Intel

Package: 208-BQFP (PQFP) 28×28 mm

Process Technology: 0.30 µm CMOS SRAM

Propagation Delay: 0.6 ns (typ)