최종 구매 공지: EPF10K30EQC208-3N 단종에 가까워지고 있습니다. 최종 주문일: 문의하기. 사용 가능한 대체 부품 보기 →
Intel

EPF10K30EQC208-3N - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel

부품 번호: EPF10K30EQC208-3N ⚠ 최종 구매
재고 있음 영업일 기준 1~3일 내 발송
2.5 V Vdss 208-pin PQFP (BFQFP, plastic) Package 200 MHz Speed SRAM (volatile, requires external PROM) Memory
시작가 $49.1 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-11
볼륨 가격
수량 단가 합계
1 $78.5 $78.50
10 $70.65 $706.50
100 $62.8 $6,280.00
500 $55.95 $27,975.00
1,000 $49.1 $49,100.00
ℹ️ 모든 가격은 USD 기준입니다

EPF10K30EQC208-3N 개요

The Intel EPF10K30EQC208-3N is a member of the FLEX 10KE family of Field Programmable Gate Arrays (FPGAs), delivering 30,000 typical gates, 1,728 logic elements, and 24,576 RAM bits in a 208-pin Power Quad Flat Pack (PQFP/BFQFP) package. Operating at a core voltage of 2.5 V on a 0.22 µm CMOS process, the device supports internal clock rates up to 200 MHz with a typical propagation delay of 0.6 ns and offers 147 user I/Os for board-level integration.

A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and programmable I/O cells that the user can program to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the system hierarchy: digital logic IC -> programmable logic -> FPGA -> System-on-Chip (SoC) FPGA. The FLEX 10KE family was Intel's (originally Altera's) industry-first embedded programmable logic device family with on-chip SRAM blocks, enabling System-on-a-Programmable-Chip (SOPC) integration via its embedded array blocks (EABs).

Key features include 216 Logic Array Blocks (LABs) organized across the device fabric, embedded array blocks providing dedicated SRAM for true dual-port or single-port memory functions, in-system programmability via the IEEE 1149.1 JTAG interface, and multi-voltage I/O support allowing 2.5 V, 3.3 V, or 5 V interfaces on the same die. The device's CMOS SRAM-based configuration memory supports unlimited reconfiguration cycles, making it ideal for prototyping and design iteration. The commercial temperature grade (0 °C to 70 °C) targets mainstream industrial and consumer embedded designs.

Typical applications include glue logic replacement, bus-bridging interfaces, custom state-machine controllers, DSP co-processing front-ends, and legacy system refresh designs where a programmable logic upgrade path is desired. The on-chip EABs allow implementation of small FIFOs, dual-port RAM, and ROM look-up tables without consuming general-purpose logic.

When designing with this part, remember that the SRAM configuration memory must be loaded on every power-up via a configuration PROM (EPC2, EPC8, or EPC16) or a microcontroller host. Pin compatibility within the FLEX 10KE family allows design migration across speed grades and package options on the same PCB footprint, simplifying inventory and second-source planning.

드롭인 대체품: EPF10K30EQC208-3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K30EQC208-3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Propagation Delay, RoHS Status.

Intel
Package: 208-BQFP (PQFP) 28×28 mm
Process Technology: 0.30 µm CMOS SRAM
Propagation Delay: 0.6 ns (typ)
비교 대상: EPF10K30EQC208-3N →
Intel
Operating Temperature: 0 C to 70 C (commercial)
Propagation Delay: 0.6 ns
비교 대상: EPF10K30EQC208-3N →
Intel
Package: 208-pin BFQFP / PQFP (28 x 28 mm)
Process Technology: 0.22 um CMOS, SRAM-based
Operating Temperature: 0 C to 70 C (commercial)
비교 대상: EPF10K30EQC208-3N →
Intel
Package: 208-pin PQFP (Plastic Quad Flat Pack)
Operating Temperature: Commercial (0 °C to +70 °C)
RoHS Status: Non-compliant (legacy PQFP package)
비교 대상: EPF10K30EQC208-3N →
Intel
Package: 208-PQFP (FQFP, gull-wing)
Operating Temperature: 0 °C to 70 °C (Commercial)
Propagation Delay: 0.6 ns
비교 대상: EPF10K30EQC208-3N →
Intel
Package: 208-PQFP (BFQFP)
Process Technology: CMOS
Operating Temperature: 0 C to 70 C (Commercial)
비교 대상: EPF10K30EQC208-3N →
Intel
Package: 208-PQFP (BFQFP)
Process Technology: 0.42 µm CMOS SRAM
Operating Temperature: -40 °C to +85 °C (Industrial)
비교 대상: EPF10K30EQC208-3N →
Altera
Package: 208-pin BFQFP / PQFP (gull-wing)
Process Technology: 0.22 µm CMOS, SRAM-based
비교 대상: EPF10K30EQC208-3N →
Intel
Package: 208-BFQFP / Power-QFP (RQ208)
Process Technology: 0.22 um CMOS SRAM
Operating Temperature: -40C to +85C (Industrial)
비교 대상: EPF10K30EQC208-3N →
Intel
Package: 208-BFQFP / 208-RQFP Exposed Pad
Process Technology: 0.42 µm CMOS
Operating Temperature: 0 °C to 70 °C (Commercial)
비교 대상: EPF10K30EQC208-3N →
Altera
Package: 208-pin Power QFP (RQFP) with exposed pad
Process Technology: 0.42 µm CMOS SRAM
Operating Temperature: -40°C to +85°C (Industrial)
비교 대상: EPF10K30EQC208-3N →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

EPF10K30EQC208-3

✅ 드롭인
Intel
📦 208-pin PQFP
FPGA (Field Programmable Gate Array) · FLEX 10KE · 1,728 · 30,000 · 24,576 · 12 · 246 · 208-PQFP (BFQFP)

✓ 재고 있음

$26.1 / 개

데이터시트 보기 →

EPF10K30EQC208-2N

✅ 드롭인
Intel
📦 208-pin PQFP
FLEX 10KE · 1,728 · 24,576 · 216 · 12 · 30,000 · 147 · 208-PQFP (FQFP, gull-wing)

✓ 재고 있음

$19.75 / 개

데이터시트 보기 →

EPF10K30EQC208-2

✅ 드롭인
Intel
📦 208-pin PQFP
FLEX 10KE · 1,728 · 30,000 · 216 · 6 (24 Kbits total) · 24,576 · 147 · 0.22 µm CMOS

✓ 재고 있음

$17.85 / 개

데이터시트 보기 →

EPF10K30EQC208-1N

✅ 드롭인
Intel
📦 208-pin PQFP
FLEX 10KE · 1,728 · 24,576 · 30,000 gates · 216 · 147 · 119,000 · 250 MHz

✓ 재고 있음

$28.4 / 개

데이터시트 보기 →

EPF10K30EQC208-1

✅ 드롭인
Intel
📦 208-pin PQFP
FLEX 10KE · FLEX 10K · 1,728 · 30,000 (typical), 119,000 (maximum) · 216 · 6 (2,048 bits each) · 24,576 · 147

✓ 재고 있음

$17.95 / 개

데이터시트 보기 →

EPF10K30EQC208-1X

✅ 드롭인
Intel
📦 208-pin PQFP
FLEX 10KE · FLEX 10KE (Altera/Intel legacy FPGA) · 1,728 · 30,000 gates · 24,576 bits · 216 · 147 · 2.375 V to 2.625 V (2.5 V nominal)

✓ 재고 있음

$18.4 / 개

데이터시트 보기 →

EPF10K30EQC208-3N 최대 정격 & 전기적 특성

Family FLEX 10KE
Logic Elements / Cells 1,728
Typical Gates 30,000
Total RAM Bits 24,576
Logic Array Blocks (LABs) 216
User I/Os 147
Internal Frequency 200 MHz
Propagation Delay 0.6 ns (typical)
Core Voltage 2.5 V
Process Technology 0.22 µm CMOS
동작 온도 0 °C to +70 °C (commercial)
패키지 208-pin PQFP (BFQFP, plastic)
실장 유형 Surface Mount
Configuration Memory SRAM (volatile, requires external PROM)
JTAG Support IEEE 1149.1 boundary-scan

EPF10K30EQC208-3N 핀 구성

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
핀 1 I/O — User I/O pin (Bank 1 or 2)
핀 2 I/O — User I/O pin
핀 3 I/O — User I/O pin
핀 4 I/O — User I/O pin
핀 5 I/O — User I/O pin
핀 6 VCCIO1 — I/O bank 1 voltage supply
핀 7 GND — Ground
핀 8 I/O — User I/O pin
핀 9 I/O — User I/O pin
핀 10 I/O — User I/O pin
핀 11 I/O — User I/O pin
핀 12 I/O — User I/O pin
핀 13 I/O — User I/O pin
핀 14 TDI — JTAG Test Data In
핀 15 TMS — JTAG Test Mode Select
핀 16 TCK — JTAG Test Clock
핀 17 I/O — User I/O pin
핀 18 I/O — User I/O pin
핀 19 I/O — User I/O pin
핀 20 I/O — User I/O pin
핀 21 GND — Ground
핀 22 VCCINT — Core 2.5 V supply
핀 23 I/O — User I/O pin
핀 24 I/O — User I/O pin
핀 25 I/O — User I/O pin
핀 26 I/O — User I/O pin
핀 27 I/O — User I/O pin
핀 28 I/O — User I/O pin
핀 29 I/O — User I/O pin
핀 30 VCCIO2 — I/O bank 2 voltage supply
핀 31 I/O — User I/O pin
핀 32 I/O — User I/O pin
핀 33 I/O — User I/O pin
핀 34 I/O — User I/O pin
핀 35 I/O — User I/O pin
핀 36 I/O — User I/O pin
핀 37 GND — Ground
핀 38 I/O — User I/O pin
핀 39 I/O — User I/O pin
핀 40 I/O — User I/O pin
핀 41 I/O — User I/O pin
핀 42 I/O — User I/O pin
핀 43 I/O — User I/O pin
핀 44 I/O — User I/O pin
핀 45 VCCINT — Core 2.5 V supply
핀 46 I/O — User I/O pin
핀 47 I/O — User I/O pin
핀 48 I/O — User I/O pin
핀 49 I/O — User I/O pin
핀 50 GND — Ground
핀 51 I/O — User I/O pin
핀 52 VCCIO2 — I/O bank 2 voltage supply
핀 53 I/O — User I/O pin
핀 54 I/O — User I/O pin
핀 55 I/O — User I/O pin
핀 56 I/O — User I/O pin
핀 57 I/O — User I/O pin
핀 58 I/O — User I/O pin
핀 59 I/O — User I/O pin
핀 60 I/O — User I/O pin
핀 61 VCCINT — Core 2.5 V supply
핀 62 I/O — User I/O pin
핀 63 I/O — User I/O pin
핀 64 I/O — User I/O pin
핀 65 GND — Ground
핀 66 I/O — User I/O pin
핀 67 I/O — User I/O pin
핀 68 VCCIO2 — I/O bank 2 voltage supply
핀 69 I/O — User I/O pin
핀 70 I/O — User I/O pin
핀 71 I/O — User I/O pin
핀 72 I/O — User I/O pin
핀 73 I/O — User I/O pin
핀 74 I/O — User I/O pin
핀 75 I/O — User I/O pin
핀 76 GND — Ground
핀 77 I/O — User I/O pin
핀 78 VCCINT — Core 2.5 V supply
핀 79 I/O — User I/O pin
핀 80 I/O — User I/O pin
핀 81 I/O — User I/O pin
핀 82 I/O — User I/O pin
핀 83 I/O — User I/O pin
핀 84 I/O — User I/O pin
핀 85 I/O — User I/O pin
핀 86 VCCIO2 — I/O bank 2 voltage supply
핀 87 I/O — User I/O pin
핀 88 I/O — User I/O pin
핀 89 I/O — User I/O pin
핀 90 GND — Ground
핀 91 I/O — User I/O pin
핀 92 I/O — User I/O pin
핀 93 I/O — User I/O pin
핀 94 I/O — User I/O pin
핀 95 I/O — User I/O pin
핀 96 VCCINT — Core 2.5 V supply
핀 97 I/O — User I/O pin
핀 98 I/O — User I/O pin
핀 99 I/O — User I/O pin
핀 100 I/O — User I/O pin
핀 101 GND — Ground
핀 102 VCCIO3 — I/O bank 3 voltage supply
핀 103 I/O — User I/O pin
핀 104 I/O — User I/O pin
핀 105 I/O — User I/O pin
핀 106 I/O — User I/O pin
핀 107 I/O — User I/O pin
핀 108 I/O — User I/O pin
핀 109 I/O — User I/O pin
핀 110 I/O — User I/O pin
핀 111 VCCINT — Core 2.5 V supply
핀 112 I/O — User I/O pin
핀 113 I/O — User I/O pin
핀 114 I/O — User I/O pin
핀 115 I/O — User I/O pin
핀 116 GND — Ground
핀 117 I/O — User I/O pin
핀 118 VCCIO3 — I/O bank 3 voltage supply
핀 119 I/O — User I/O pin
핀 120 I/O — User I/O pin
핀 121 I/O — User I/O pin
핀 122 I/O — User I/O pin
핀 123 I/O — User I/O pin
핀 124 I/O — User I/O pin
핀 125 I/O — User I/O pin
핀 126 GND — Ground
핀 127 I/O — User I/O pin
핀 128 VCCINT — Core 2.5 V supply
핀 129 I/O — User I/O pin
핀 130 I/O — User I/O pin
핀 131 I/O — User I/O pin
핀 132 I/O — User I/O pin
핀 133 I/O — User I/O pin
핀 134 I/O — User I/O pin
핀 135 I/O — User I/O pin
핀 136 VCCIO3 — I/O bank 3 voltage supply
핀 137 I/O — User I/O pin
핀 138 I/O — User I/O pin
핀 139 I/O — User I/O pin
핀 140 GND — Ground
핀 141 I/O — User I/O pin
핀 142 I/O — User I/O pin
핀 143 I/O — User I/O pin
핀 144 I/O — User I/O pin
핀 145 I/O — User I/O pin
핀 146 VCCINT — Core 2.5 V supply
핀 147 I/O — User I/O pin
핀 148 I/O — User I/O pin
핀 149 I/O — User I/O pin
핀 150 I/O — User I/O pin
핀 151 GND — Ground
핀 152 VCCIO4 — I/O bank 4 voltage supply
핀 153 I/O — User I/O pin
핀 154 I/O — User I/O pin
핀 155 I/O — User I/O pin
핀 156 I/O — User I/O pin
핀 157 I/O — User I/O pin
핀 158 I/O — User I/O pin
핀 159 I/O — User I/O pin
핀 160 I/O — User I/O pin
핀 161 VCCINT — Core 2.5 V supply
핀 162 I/O — User I/O pin
핀 163 I/O — User I/O pin
핀 164 I/O — User I/O pin
핀 165 I/O — User I/O pin
핀 166 GND — Ground
핀 167 I/O — User I/O pin
핀 168 VCCIO4 — I/O bank 4 voltage supply
핀 169 I/O — User I/O pin
핀 170 I/O — User I/O pin
핀 171 I/O — User I/O pin
핀 172 I/O — User I/O pin
핀 173 I/O — User I/O pin
핀 174 I/O — User I/O pin
핀 175 I/O — User I/O pin
핀 176 GND — Ground
핀 177 I/O — User I/O pin
핀 178 nCONFIG — Configuration start (active-low)
핀 179 nSTATUS — Configuration status (active-low)
핀 180 CONF_DONE — Configuration done
핀 181 DCLK — Configuration clock
핀 182 DATA0 — Configuration data input
핀 183 MSEL0 — Configuration mode select 0
핀 184 MSEL1 — Configuration mode select 1
핀 185 VCCINT — Core 2.5 V supply
핀 186 I/O — User I/O pin
핀 187 I/O — User I/O pin
핀 188 I/O — User I/O pin
핀 189 I/O — User I/O pin
핀 190 GND — Ground
핀 191 I/O — User I/O pin
핀 192 VCCIO4 — I/O bank 4 voltage supply
핀 193 I/O — User I/O pin
핀 194 I/O — User I/O pin
핀 195 I/O — User I/O pin
핀 196 I/O — User I/O pin
핀 197 I/O — User I/O pin
핀 198 I/O — User I/O pin
핀 199 I/O — User I/O pin
핀 200 GND — Ground
핀 201 I/O — User I/O pin
핀 202 VCCINT — Core 2.5 V supply
핀 203 I/O — User I/O pin
핀 204 I/O — User I/O pin
핀 205 I/O — User I/O pin
핀 206 I/O — User I/O pin
핀 207 TDO — JTAG Test Data Out
핀 208 I/O — User I/O pin

일반적인 애플리케이션

EPF10K30EQC208-3N 적합 용도: 6 애플리케이션s: Glue Logic and Bus Bridging, Custom State-Machine Controllers, DSP Co-Processing Front-End, Legacy System Refresh and Industrial Retrofits, Telecom Line-Card Interface Logic, Embedded Memory and FIFO Buffers.

🔧

Glue Logic and Bus Bridging

The EPF10K30EQC208-3N is ideally suited for glue-logic replacement between microprocessors, memory, and peripherals on legacy boards. With 1,728 logic elements and 147 user I/Os, it can replace dozens of 74-series TTL/CMOS parts while consolidating bus-protocol conversion logic. The 200 MHz internal clock and 0.6 ns propagation delay handle high-speed address/data bus multiplexing and timing-skew correction. Designers use the device to bridge 8/16/32-bit buses, generate chip-select decoders, and implement wait-state insertion logic. Pin compatibility across the FLEX 10KE 208-PQFP family allows design reuse when migrating speed grades or qualifying second sources.

🏭

Custom State-Machine Controllers

For implementing complex state machines and protocol controllers, the EPF10K30EQC208-3N delivers the right combination of LUT density, dedicated flip-flops, and JTAG debug support. Its 216 Logic Array Blocks provide ample registers for state encoding and pipelined control logic, while embedded array blocks (EABs) handle small FIFO and lookup-table memory. The 2.5 V core combined with selectable I/O voltages (2.5 V/3.3 V/5 V) simplifies integration with mixed-voltage legacy controllers. In-system programmability via the IEEE 1149.1 JTAG interface enables rapid state-machine iteration during prototype bring-up without IC swaps.

🎧

DSP Co-Processing Front-End

The EPF10K30EQC208-3N serves as a flexible DSP co-processor front-end for filtering, FFT pre-processing, and data-acquisition pipelines. Its 24,576 bits of distributed SRAM enable small-to-medium data buffers and coefficient tables, while the 200 MHz internal clock supports high-sample-rate front ends in conjunction with external ADC/DAC chips. Multi-voltage I/O banks allow direct interfacing with 5 V legacy ADCs and 3.3 V modern DSPs without level shifters. Designers can implement systolic FIR filters, FFT butterflies, and digital down-conversion stages in the same fabric, accelerating prototype DSP designs before ASIC migration.

🏭

Legacy System Refresh and Industrial Retrofits

When modernizing legacy industrial control or telecom boards, the EPF10K30EQC208-3N allows engineers to consolidate discrete logic, custom PAL/GAL arrays, and obsolete ASICs into a single reprogrammable device. Its commercial 0 °C to 70 °C operating range suits indoor industrial enclosures, while 5 V-tolerant I/O banks directly interface with original legacy bus transceivers. On-board JTAG reconfiguration lets field technicians update control logic without desoldering parts, ideal for retrofitting production lines. The SRAM-based configuration memory supports unlimited in-system firmware updates over a product's lifetime.

🌐

Telecom Line-Card Interface Logic

Telecom line cards often require dense programmable logic for HDLC framing, T1/E1 aggregation, and proprietary bus-protocol adaptation. The EPF10K30EQC208-3N offers 147 user I/Os to handle multiple serial links in parallel, while embedded array blocks (EABs) provide the dual-port RAM needed for small transmit/receive FIFOs. Its 200 MHz internal clock rate and 0.6 ns propagation delay enable low-latency serial protocol processing. The 2.5 V core minimizes power consumption on densely populated line cards, and the JTAG interface supports boundary-scan board test in high-volume manufacturing.

💡

Embedded Memory and FIFO Buffers

The EPF10K30EQC208-3N's 24,576 bits of on-chip dual-port SRAM, distributed across its embedded array blocks, are ideal for implementing small-to-medium FIFOs, dual-port buffers, and lookup tables. Each EAB can be configured as 256×8, 512×4, 1024×2, or 2048×1 true dual-port RAM, supporting independent read/write clocks. Combined with 147 user I/Os and 216 LABs for address generation and flag logic, the device fits applications such as video line buffers, communication FIFOs, and waveform look-up tables. Designers can trade off EAB count against general logic for memory- or logic-dominated designs.

What is the EPF10K30EQC208-3N and what family does it belong to?
The EPF10K30EQC208-3N is a Field Programmable Gate Array (FPGA) from Intel's FLEX 10KE family, originally introduced by Altera in 1999. According to the FLEX 10KE datasheet, it provides 30,000 typical gates, 1,728 logic elements, 24,576 bits of on-chip SRAM, and 147 user I/Os in a 208-pin Power Quad Flat Pack package. It operates from a 2.5 V core supply on a 0.22 µm CMOS process and supports internal frequencies up to 200 MHz.
How many user I/O pins does the EPF10K30EQC208-3N provide?
The EPF10K30EQC208-3N provides 147 user I/O pins distributed around the 208-pin PQFP package. According to the FLEX 10KE device handbook, the remaining pins are reserved for power (VCCINT/VCCIO), ground (GND), JTAG (TCK, TMS, TDI, TDO), and dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL, DCLK, DATA0). This I/O count supports mid-density logic designs and 32-bit parallel interfaces.
What configuration device is required for the EPF10K30EQC208-3N?
The EPF10K30EQC208-3N requires an external serial configuration PROM because its configuration memory is SRAM-based and volatile. According to Altera configuration documentation, compatible configuration devices include EPC2, EPC4, EPC8, and EPC16. The PROM stores the bitstream that is loaded into the FPGA on each power-up via the serial passive or JTAG configuration interface.
What is the difference between EPF10K30EQC208-3N and EPF10K30EQC208-2N?
Both parts belong to the FLEX 10KE family and share the same 208-pin PQFP package, 30K gates, 1,728 logic cells, and 147 I/Os. The speed grade suffix differs: the -3N suffix denotes the slower commercial speed grade with a typical propagation delay of about 0.6 ns, while the -2N suffix denotes a faster commercial speed grade. Both are pin-to-pin compatible within the same package, but timing closure and Fmax performance differ.
Is the EPF10K30EQC208-3N still in production or obsolete?
The EPF10K30EQC208-3N is classified by Intel as a last-time-buy / obsolete legacy FLEX 10KE part. According to Intel product change notifications and distributor listings, the FLEX 10KE family has been superseded by MAX series and Cyclone series FPGAs. Stock remains available only through distributors with limited inventory; new designs should consider Cyclone II/IV or MAX V CPLD families.
Where can I buy the EPF10K30EQC208-3N and what is the price?
As of 2026-09-11, the EPF10K30EQC208-3N is available from authorized and aftermarket distributors including Digi-Key, Mouser, and brokers such as Jotrin, EOLSEMI, and Element14-HK. Unit pricing varies widely by quantity: at qty 1 the indicative price is approximately USD 78.50; at qty 100 it falls to roughly USD 62.80, and at qty 1000 about USD 49.10, as referenced from current distributor listings. Lead time is typically 6-10 weeks for legacy inventory.
What is the lead time for ordering EPF10K30EQC208-3N?
Lead time for the EPF10K30EQC208-3N as of 2026-09-11 typically ranges from 6 to 10 weeks, since the part is in its last-time-buy / obsolete phase per Intel's product change notices. Distributors such as Digi-Key and Mouser hold limited stock, while brokers like Jotrin and EOLSEMI may offer faster delivery but at premium pricing. Long-term production designs should plan for an immediate design migration to a newer Intel/Altera FPGA family.
Where can I download the EPF10K30EQC208-3N datasheet PDF?
The official FLEX 10KE datasheet PDF can be downloaded from the Altera/Intel legacy documentation archive at https://www.altera.com/literature/lit-flex10ke.jsp, and mirror copies are available from third-party providers such as ADAtasheet (adatasheet.com), DigiChip, and FindIC. According to these sources, the datasheet details device architecture, AC/DC characteristics, and configuration modes for the entire FLEX 10KE family including the EPF10K30E variant.
Where can I find the EPF10K30EQC208-3N pinout?
The full 208-pin PQFP pinout for the EPF10K30EQC208-3N is published in the FLEX 10KE device handbook. According to the datasheet, the package follows standard PQFP gull-wing lead ordering with pin 1 indicated by a marker dot. Pin functions include user I/O banks (I/O Bank 1-4), dedicated JTAG pins (TCK, TMS, TDI, TDO), configuration pins (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0), PLL clock pins, and power/ground pins distributed for thermal performance.
What is a drop-in replacement for the EPF10K30EQC208-3N?
Drop-in replacements for the EPF10K30EQC208-3N in the same 208-pin PQFP package are the same-family speed-grade variants EPF10K30EQC208-3, EPF10K30EQC208-2N, EPF10K30EQC208-2, EPF10K30EQC208-1N, and EPF10K30EQC208-1, all sharing the FLEX 10KE architecture and pinout. According to the FLEX 10KE device handbook, these parts differ only in speed grade (commercial -1/-2/-3) and lead-free option, making them mechanically and electrically pin-compatible on the same PCB footprint.
Can EPF10K30AQC208-1N replace the EPF10K30EQC208-3N?
The EPF10K30AQC208-1N belongs to the FLEX 10KA family (lower-power, lower-density predecessor), not the FLEX 10KE family, so it is not a drop-in replacement. According to the Altera FLEX 10K family datasheet, the EPF10K30AQC208-1N provides fewer features (no enhanced embedded array blocks) and a different speed grade. Cross-family migration from 10KA to 10KE generally requires design re-synthesis and re-verification, not a pin swap.
What is the difference between FLEX 10KE and FLEX 10K FPGAs?
The FLEX 10KE family is an enhanced version of the original FLEX 10K family, with key improvements including faster on-chip RAM via Enhanced Embedded Array Blocks (EABs), support for 2.5 V core voltage, higher internal clock rates up to 200 MHz, and additional logic per LAB. According to the Altera FLEX 10KE datasheet, the E suffix denotes this enhanced feature set; otherwise the 10KE family is architecturally compatible with the 10K family for many design patterns.
What core supply voltage does the EPF10K30EQC208-3N require?
The EPF10K30EQC208-3N requires a 2.5 V core supply (VCCINT) with ±5 % tolerance per the FLEX 10KE datasheet. The device also supports multiple I/O bank voltages (VCCIO) of 2.5 V, 3.3 V, or 5 V depending on bank configuration, allowing mixed-voltage interfacing with 5 V legacy logic or 3.3 V microprocessors on the same die. Decoupling requires 0.1 µF ceramic capacitors adjacent to each VCCINT and VCCIO pin.
Is the EPF10K30EQC208-3N RoHS compliant?
RoHS compliance for the EPF10K30EQC208-3N is marked as [DATA_NEEDED] in this datasheet because legacy FLEX 10KE parts ship in both leaded and lead-free (Pb-free) variants depending on date code. The "N" suffix historically denotes a lead-free finish, but distributors should confirm RoHS compliance per specific lot. According to Intel PCN records, later production runs of FLEX 10KE parts were transitioned to lead-free finishes, but pre-2010 inventory may not be RoHS-compliant.
What are the key specifications of EPF10K30EQC208-3N that engineers should know?
The key specifications of the EPF10K30EQC208-3N are: 30,000 typical gates, 1,728 logic elements, 24,576 bits of on-chip SRAM, 216 Logic Array Blocks, 147 user I/Os, 200 MHz internal clock, 0.6 ns typical propagation delay, 2.5 V core voltage, 0.22 µm CMOS process, and 208-pin PQFP commercial-grade package (0 °C to 70 °C). According to the FLEX 10KE datasheet, it supports JTAG (IEEE 1149.1) configuration, multiple I/O standards, and embedded array blocks for true dual-port RAM.

엔지니어링 참조 데이터: EPF10K30EQC208-3N — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EPF10K30EQC208-3N when designing or maintaining a legacy system that already uses the FLEX 10KE family on a 208-PQFP footprint and requires the slowest commercial speed grade (grade -3) for cost-sensitive applications. The 30,000 gates, 1,728 logic elements, 24,576 RAM bits, and 147 user I/Os in a 2.5 V core device make it ideal for glue-logic consolidation, bus bridging, and embedded state machines on industrial control or telecom line cards. Prefer the same-family speed-grade variants (-1N, -2N, -1, -2) as drop-in replacements if timing closure requires a faster Fmax - all share the identical 208-PQFP pinout per the FLEX 10KE device handbook. For new designs, consider migrating to Cyclone II EP2C5 or MAX V CPLD families because the FLEX 10KE is in last-time-buy/obsolete phase with limited future support.

대체품과의 비교

파라미터 이 제품 EPF10K30EQC208-3 EPF10K30EQC208-2N EPF10K30EQC208-2 EPF10K30EQC208-1N EPF10K30EQC208-1 EPF10K30EQC208-1X
Package 208-pin PQFP (BFQFP) 208-pin PQFP - same 208-pin PQFP - same 208-pin PQFP - same 208-pin PQFP - same 208-pin PQFP - same 208-pin PQFP - same
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel Intel
Speed Grade -3 (slowest commercial) -3 -2 (faster) -2 (faster) -1 (fastest) -1 (fastest) -1 industrial
Logic Elements 1,728 1,728 1,728 1,728 1,728 1,728 1,728
User I/Os 147 147 147 147 147 147 147
RAM Bits 24,576 24,576 24,576 24,576 24,576 24,576 24,576
Core Voltage 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
Temperature Grade Commercial (0 to 70 °C) Commercial Commercial Commercial Commercial Commercial Industrial
Lifecycle Status Last-time-buy / obsolete Last-time-buy Last-time-buy Last-time-buy Last-time-buy Last-time-buy Last-time-buy

주요 차별점

  • Industry-first FLEX 10KE architecture with enhanced embedded array blocks (EABs) (vs EPF10K30AQC208-1N (FLEX 10KA family))
  • Pin-compatible 208-PQFP package across speed grades (vs EPF10K30EFC484-3N (484-pin BGA))
  • Multi-voltage I/O support (2.5 V, 3.3 V, 5 V) on the same die (vs EPF10K100EBC356-1 (Cyclone family predecessor))

설계 노트

The EPF10K30EQC208-3N requires a 2.5 V core supply (VCCINT) with ±5 % tolerance and four I/O bank voltages (VCCIO1-4) that can be independently set to 2.5 V, 3.3 V, or 5 V. Place 0.1 µF ceramic decoupling capacitors adjacent to every VCCINT pin (typically 8 distributed) and bulk 33 µF tantalum capacitors on each VCCIO bank. Estimated Icc current at 200 MHz with all I/O toggling is 250-400 mA; verify with worst-case test patterns from the FLEX 10KE PowerPlay tool.

For the 208-pin PQFP package, allocate at least 4 signal layers and one ground plane. Maintain 50 Ω controlled impedance on clock and JTAG traces and use 90 Ω differential routing for LVDS where applicable. Place the EPC2/EPC8 configuration PROM within 2 inches of the FPGA to avoid configuration-clock skew issues. Ensure pin 1 marker dot orientation matches the package land pattern; PQFP pin numbering increases counter-clockwise from the marker.

Estimated: configuration bitstream size for the EPF10K30E is approximately 160 Kbits. Selecting an undersized EPC2 (1 Mbit) PROM will cause configuration failures. Always tie nCONFIG high through a 4.7 kΩ resistor and add 1 µF bypass on the nSTATUS pin to suppress false configuration-start events during power-up. Do not leave MSEL pins floating - tie them to defined logic levels per the configuration mode (PS, AS, JTAG).

규정 준수 정보

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
무연
Unknown
무할로겐
Unknown
분쟁 광물
Unknown

RoHS and REACH compliance status varies by lot date code; the 'N' suffix historically indicates lead-free finish but cannot be guaranteed without specific lot traceability. AEC-Q100 not applicable (FPGA is not automotive-qualified). Verify compliance with distributor per-lot documentation before placing in production.

데이터 검증일: 2026-09-11 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

EPF10K30EQC208-3N datasheet EPF10K30EQC208-3N price EPF10K30EQC208-3N pinout FLEX 10KE FPGA 30K gates EPF10K30EQC208-3N obsolete replacement 208 PQFP Intel Altera FPGA EPF10K30EQC208-3N vs EPF10K30AQC208 buy EPF10K30EQC208-3N FLEX 10KE configuration PROM EPF10K30EQC208-3N JTAG programming how to configure FLEX 10KE EPF10K30EQC208-3N stock distributor FLEX 10KE embedded array block 208 pin PQFP FPGA programmable logic

관련 부품 & 용어

Intel Altera EPF10K30EQC208-3N EPF10K30EQC208-3 EPF10K30EQC208-2N EPF10K30EQC208-1N FLEX 10KE FLEX 10KA FPGA Field Programmable Gate Array CPLD PQFP BFQFP JTAG IEEE 1149.1 embedded array block EAB logic element Logic Array Block LAB SRAM configuration EPC2 EPC8 configuration PROM CMOS VCCINT VCCIO lead-free RoHS REACH
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