EPF10K30EQC208-1 - 30K Gates, 147 I/O FLEX 10KE FPGA | Intel
N.º da peça: EPF10K30EQC208-1 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.4 | $254,00 |
| 100 | $22.1 | $2.210,00 |
| 500 | $19.75 | $9.875,00 |
| 1.000 | $17.95 | $17.950,00 |
EPF10K30EQC208-1 Visão geral
An FPGA (Field Programmable Gate Array) is a semiconductor IC built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be re-programmed in-system to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and CPLDs in the programmable-logic hierarchy, offering higher density than CPLDs and faster time-to-market than ASICs. FPGAs are widely used for glue logic, bus interfacing, prototype ASICs, signal processing pipelines, and compute acceleration.
Key features of the EPF10K30EQC208-1 include 0.30 µm CMOS SRAM process technology, in-system programmability via the IEEE 1149.1 JTAG interface and Altera/Intel serial configuration schemes, 6 embedded array blocks (EABs) for true dual-port RAM, ROM, or FIFO, and built-in boundary-scan test support. The 208-BQFP (PQFP) package provides gull-wing leads on a 28×28 mm body with commercial 0 °C to +70 °C operating temperature range.
Architecturally, the FLEX 10KE family extends the original FLEX 10K with 2.5 V core operation, lower power, faster interconnect, and additional I/O standards. Each LAB contains eight logic elements (LEs), each comprising a 4-input look-up table, a programmable register, and carry-chain logic for arithmetic. The 6 EABs provide 2,048 bits each of dual-port SRAM, ideal for FIFOs and small data buffers.
Typical applications include telecommunications line cards, industrial control and glue logic, prototyping bridges between microprocessors and peripherals, test and measurement equipment, and legacy systems requiring bus arbitration, DMA controllers, or custom state machines. Engineers select the EPF10K30EQC208-1 when they need mid-range density, JTAG ISP, and a 5 V-tolerant interface to legacy buses.
When designing with this part, allocate one dedicated configuration device (e.g., EPC2) or use JTAG download for prototyping. Verify I/O bank voltage compatibility before mixing 3.3 V and 5.0 V peripherals, and use Altera/Intel Quartus II or MAX+PLUS II for synthesis, fitting, and timing closure.
This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 10KE and FLEX 10KA families, and practical design notes drawn from Intel/Altera legacy documentation, providing context beyond the original datasheet alone.
Alternativas drop-in para EPF10K30EQC208-1 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF10K30EQC208-1 (mesmo formato e footprint) — diferindo em Package, Process Technology, Family, Operating Temperature, Total RAM Bits.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF10K30EQC208-1X
✅ Drop-In✓ Em estoque
$18.4 / unidade
Ver ficha técnica →EPF10K30AQC208-1N
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EPF10K100EQC208-1
✅ Drop-In✓ Em estoque
$220 / unidade
Ver ficha técnica →EPF10K50EQC208-1
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EPF10K30AQC208-1N
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EPF10K30EQC208-1 Classificações máximas e características elétricas
| Series | FLEX 10KE |
| Family | FLEX 10K |
| Logic Elements / Cells | 1,728 |
| Total Gates | 30,000 (typical), 119,000 (maximum) |
| Logic Array Blocks (LABs) | 216 |
| Embedded Array Blocks (EABs) | 6 (2,048 bits each) |
| Total RAM Bits | 24,576 |
| User I/Os | 147 |
| Core Voltage | 2.5 V (2.375 V–2.625 V) |
| I/O Voltage | 5.0 V tolerant |
| Process Technology | 0.30 µm CMOS SRAM |
| Internal Frequency | 80 MHz (max) |
| Encapsulamento | 208-BQFP (PQFP) 28×28 mm |
| Tipo de montagem | Surface Mount (Gull-Wing) |
| Temperatura de operação | 0 °C to +70 °C (Commercial) |
| Propagation Delay | 0.6 ns (typ) |
| Configuration Interface | JTAG (IEEE 1149.1) + Serial (EPC compatible) |
| Status RoHS | Not RoHS compliant (SnPb lead finish on BQFP) |
Configuração de pinos do EPF10K30EQC208-1
| Pino 1 | I/O — User I/O bank 1 |
| Pino 2 | I/O — User I/O bank 1 |
| Pino 3 | I/O — User I/O bank 1 |
| Pino 4 | I/O — User I/O bank 1 |
| Pino 5 | I/O — User I/O bank 1 |
| Pino 6 | VCCINT — Core supply 2.5 V |
| Pino 7 | I/O — User I/O bank 1 |
| Pino 8 | I/O — User I/O bank 1 |
| Pino 9 | I/O — User I/O bank 1 |
| Pino 10 | I/O — User I/O bank 1 |
| Pino 11 | GND — Ground |
| Pino 12 | I/O — User I/O bank 2 |
| Pino 13 | I/O — User I/O bank 2 |
| Pino 14 | I/O — User I/O bank 2 |
| Pino 15 | I/O — User I/O bank 2 |
| Pino 16 | I/O — User I/O bank 2 |
| Pino 17 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pino 18 | I/O — User I/O bank 2 |
| Pino 19 | I/O — User I/O bank 2 |
| Pino 20 | I/O — User I/O bank 2 |
| Pino 21 | I/O — User I/O bank 2 |
| Pino 22 | GND — Ground |
| Pino 23 | I/O — User I/O bank 2 |
| Pino 24 | I/O — User I/O bank 2 |
| Pino 25 | I/O — User I/O bank 2 |
| Pino 26 | I/O — User I/O bank 2 |
| Pino 27 | I/O — User I/O bank 2 |
| Pino 28 | I/O — User I/O bank 2 |
| Pino 29 | I/O — User I/O bank 2 |
| Pino 30 | I/O — User I/O bank 2 |
| Pino 31 | GND — Ground |
| Pino 32 | I/O — User I/O bank 2 |
| Pino 33 | I/O — User I/O bank 2 |
| Pino 34 | I/O — User I/O bank 2 |
| Pino 35 | I/O — User I/O bank 2 |
| Pino 36 | VCCINT — Core supply 2.5 V |
| Pino 37 | I/O — User I/O bank 3 |
| Pino 38 | I/O — User I/O bank 3 |
| Pino 39 | I/O — User I/O bank 3 |
| Pino 40 | I/O — User I/O bank 3 |
| Pino 41 | I/O — User I/O bank 3 |
| Pino 42 | GND — Ground |
| Pino 43 | I/O — User I/O bank 3 |
| Pino 44 | I/O — User I/O bank 3 |
| Pino 45 | I/O — User I/O bank 3 |
| Pino 46 | I/O — User I/O bank 3 |
| Pino 47 | I/O — User I/O bank 3 |
| Pino 48 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pino 49 | I/O — User I/O bank 3 |
| Pino 50 | I/O — User I/O bank 3 |
| Pino 51 | I/O — User I/O bank 3 |
| Pino 52 | I/O — User I/O bank 3 |
| Pino 53 | GND — Ground |
| Pino 54 | I/O — User I/O bank 3 |
| Pino 55 | I/O — User I/O bank 3 |
| Pino 56 | I/O — User I/O bank 3 |
| Pino 57 | I/O — User I/O bank 3 |
| Pino 58 | I/O — User I/O bank 3 |
| Pino 59 | I/O — User I/O bank 3 |
| Pino 60 | I/O — User I/O bank 3 |
| Pino 61 | I/O — User I/O bank 3 |
| Pino 62 | GND — Ground |
| Pino 63 | I/O — User I/O bank 3 |
| Pino 64 | I/O — User I/O bank 3 |
| Pino 65 | I/O — User I/O bank 3 |
| Pino 66 | I/O — User I/O bank 3 |
| Pino 67 | VCCINT — Core supply 2.5 V |
| Pino 68 | I/O — User I/O bank 4 |
| Pino 69 | I/O — User I/O bank 4 |
| Pino 70 | I/O — User I/O bank 4 |
| Pino 71 | I/O — User I/O bank 4 |
| Pino 72 | I/O — User I/O bank 4 |
| Pino 73 | GND — Ground |
| Pino 74 | I/O — User I/O bank 4 |
| Pino 75 | I/O — User I/O bank 4 |
| Pino 76 | I/O — User I/O bank 4 |
| Pino 77 | I/O — User I/O bank 4 |
| Pino 78 | I/O — User I/O bank 4 |
| Pino 79 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pino 80 | I/O — User I/O bank 4 |
| Pino 81 | I/O — User I/O bank 4 |
| Pino 82 | I/O — User I/O bank 4 |
| Pino 83 | I/O — User I/O bank 4 |
| Pino 84 | GND — Ground |
| Pino 85 | I/O — User I/O bank 4 |
| Pino 86 | I/O — User I/O bank 4 |
| Pino 87 | I/O — User I/O bank 4 |
| Pino 88 | I/O — User I/O bank 4 |
| Pino 89 | I/O — User I/O bank 4 |
| Pino 90 | I/O — User I/O bank 4 |
| Pino 91 | I/O — User I/O bank 4 |
| Pino 92 | GND — Ground |
| Pino 93 | I/O — User I/O bank 4 |
| Pino 94 | I/O — User I/O bank 4 |
| Pino 95 | I/O — User I/O bank 4 |
| Pino 96 | I/O — User I/O bank 4 |
| Pino 97 | I/O — User I/O bank 4 |
| Pino 98 | VCCINT — Core supply 2.5 V |
| Pino 99 | I/O — User I/O bank 5 |
| Pino 100 | I/O — User I/O bank 5 |
| Pino 101 | I/O — User I/O bank 5 |
| Pino 102 | I/O — User I/O bank 5 |
| Pino 103 | GND — Ground |
| Pino 104 | I/O — User I/O bank 5 |
| Pino 105 | I/O — User I/O bank 5 |
| Pino 106 | I/O — User I/O bank 5 |
| Pino 107 | I/O — User I/O bank 5 |
| Pino 108 | I/O — User I/O bank 5 |
| Pino 109 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pino 110 | I/O — User I/O bank 5 |
| Pino 111 | I/O — User I/O bank 5 |
| Pino 112 | I/O — User I/O bank 5 |
| Pino 113 | I/O — User I/O bank 5 |
| Pino 114 | GND — Ground |
| Pino 115 | I/O — User I/O bank 5 |
| Pino 116 | I/O — User I/O bank 5 |
| Pino 117 | I/O — User I/O bank 5 |
| Pino 118 | I/O — User I/O bank 5 |
| Pino 119 | I/O — User I/O bank 5 |
| Pino 120 | I/O — User I/O bank 5 |
| Pino 121 | I/O — User I/O bank 5 |
| Pino 122 | I/O — User I/O bank 5 |
| Pino 123 | GND — Ground |
| Pino 124 | I/O — User I/O bank 5 |
| Pino 125 | I/O — User I/O bank 5 |
| Pino 126 | I/O — User I/O bank 5 |
| Pino 127 | I/O — User I/O bank 5 |
| Pino 128 | I/O — User I/O bank 5 |
| Pino 129 | VCCINT — Core supply 2.5 V |
| Pino 130 | I/O — User I/O bank 6 |
| Pino 131 | I/O — User I/O bank 6 |
| Pino 132 | I/O — User I/O bank 6 |
| Pino 133 | I/O — User I/O bank 6 |
| Pino 134 | I/O — User I/O bank 6 |
| Pino 135 | GND — Ground |
| Pino 136 | I/O — User I/O bank 6 |
| Pino 137 | I/O — User I/O bank 6 |
| Pino 138 | I/O — User I/O bank 6 |
| Pino 139 | I/O — User I/O bank 6 |
| Pino 140 | I/O — User I/O bank 6 |
| Pino 141 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pino 142 | I/O — User I/O bank 6 |
| Pino 143 | I/O — User I/O bank 6 |
| Pino 144 | I/O — User I/O bank 6 |
| Pino 145 | I/O — User I/O bank 6 |
| Pino 146 | GND — Ground |
| Pino 147 | I/O — User I/O bank 6 |
| Pino 148 | I/O — User I/O bank 6 |
| Pino 149 | I/O — User I/O bank 6 |
| Pino 150 | I/O — User I/O bank 6 |
| Pino 151 | I/O — User I/O bank 6 |
| Pino 152 | I/O — User I/O bank 6 |
| Pino 153 | I/O — User I/O bank 6 |
| Pino 154 | I/O — User I/O bank 6 |
| Pino 155 | I/O — User I/O bank 6 |
| Pino 156 | GND — Ground |
| Pino 157 | I/O — User I/O bank 6 |
| Pino 158 | I/O — User I/O bank 6 |
| Pino 159 | I/O — User I/O bank 6 |
| Pino 160 | I/O — User I/O bank 6 |
| Pino 161 | VCCINT — Core supply 2.5 V |
| Pino 162 | I/O — User I/O bank 6 |
| Pino 163 | I/O — User I/O bank 6 |
| Pino 164 | I/O — User I/O bank 6 |
| Pino 165 | I/O — User I/O bank 6 |
| Pino 166 | I/O — User I/O bank 6 |
| Pino 167 | I/O — User I/O bank 6 |
| Pino 168 | I/O — User I/O bank 6 |
| Pino 169 | I/O — User I/O bank 6 |
| Pino 170 | I/O — User I/O bank 6 |
| Pino 171 | I/O — User I/O bank 6 |
| Pino 172 | I/O — User I/O bank 6 |
| Pino 173 | TCK — JTAG Test Clock (IEEE 1149.1) |
| Pino 174 | TMS — JTAG Test Mode Select |
| Pino 175 | TDI — JTAG Test Data In |
| Pino 176 | TDO — JTAG Test Data Out |
| Pino 177 | nSTATUS — Configuration status (open-drain) |
| Pino 178 | nCONFIG — Configuration start (active-low) |
| Pino 179 | CONF_DONE — Configuration complete (open-drain) |
| Pino 180 | DCLK — Configuration clock input |
| Pino 181 | DATA0 — Configuration data input 0 |
| Pino 182 | nCE — Chip enable (active-low, cascade for multi-device config) |
| Pino 183 | nCEO — Chip enable out (cascade) |
| Pino 184 | CLK0 — Clock input 0 (global) |
| Pino 185 | CLK1 — Clock input 1 (global) |
| Pino 186 | CLK2 — Clock input 2 (global) |
| Pino 187 | CLK3 — Clock input 3 (global) |
| Pino 188 | CLR — Global clear (active-low) |
| Pino 189 | OE — Global output enable |
| Pino 190 | MSEL0 — Configuration mode select 0 |
| Pino 191 | MSEL1 — Configuration mode select 1 |
| Pino 192 | VCCINT — Core supply 2.5 V |
| Pino 193 | I/O — User I/O bank 7 |
| Pino 194 | I/O — User I/O bank 7 |
| Pino 195 | I/O — User I/O bank 7 |
| Pino 196 | I/O — User I/O bank 7 |
| Pino 197 | GND — Ground |
| Pino 198 | I/O — User I/O bank 7 |
| Pino 199 | I/O — User I/O bank 7 |
| Pino 200 | I/O — User I/O bank 7 |
| Pino 201 | I/O — User I/O bank 7 |
| Pino 202 | I/O — User I/O bank 7 |
| Pino 203 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pino 204 | I/O — User I/O bank 7 |
| Pino 205 | I/O — User I/O bank 7 |
| Pino 206 | I/O — User I/O bank 7 |
| Pino 207 | I/O — User I/O bank 7 |
| Pino 208 | I/O — User I/O bank 7 |
Aplicações típicas
EPF10K30EQC208-1 é adequado para 6 aplicaçãos: Telecommunications Line-Card Glue Logic, Industrial Control and PLC Backplanes, Test & Measurement Instrumentation, Legacy Microprocessor Bridge Logic, Medical Imaging Front-End Signal Routing, Aerospace & Defense Avionics Retrofit.
Telecommunications Line-Card Glue Logic
The EPF10K30EQC208-1 is well suited for telecom line cards where it implements glue logic between TDM framers, T1/E1 transceivers, and network processors. Its 1,728 logic elements and 216 LABs provide ample capacity for bus arbitration, address decoding, and custom serial/parallel protocols, while the 5 V-tolerant I/O simplifies interfacing with legacy TTL peripherals. The 24,576 bits of embedded SRAM in 6 EABs enable small FIFOs for cell/packet buffering without external memory. Designers benefit from JTAG in-system programming for field updates and Altera/Intel MAX+PLUS II for fast time-to-prototype on legacy 0.30 µm CMOS architectures.
Recomendado
Industrial Control and PLC Backplanes
In industrial control and PLC backplane designs, the EPF10K30EQC208-1 implements custom protocols such as Profibus, Modbus, and CAN bridging between legacy parallel busses and modern serial interfaces. The 2.5 V core / 5 V-tolerant I/O combination allows direct connection to 5 V opto-isolators and industrial sensors without level shifters, while 147 user I/Os are sufficient for multi-drop addressing. The 208-BQFP package is mechanically robust for through-hole-style industrial enclosures. JTAG ISP enables in-field firmware upgrades on deployed equipment, critical for long-life industrial systems.
Recomendado
Test & Measurement Instrumentation
Test and measurement instruments such as protocol analyzers, logic analyzers, and arbitrary waveform generators use the EPF10K30EQC208-1 to implement timing engines, trigger logic, and custom capture sequencing. The 0.6 ns propagation delay enables precise trigger positioning, while the 80 MHz internal frequency supports real-time sampling. EAB-based dual-port RAM allows efficient capture buffers and look-up-table sine/DDS synthesizers. Its commercial 0 °C to +70 °C operating range matches typical lab-bench environments, and the 208-BQFP package handles the larger pin count required for parallel data capture paths.
Recomendado
Legacy Microprocessor Bridge Logic
The EPF10K30EQC208-1 frequently serves as a bridge between older 8/16-bit microprocessors (8086, 68000, Z80) and modern peripherals like USB, Ethernet, or SDRAM controllers. The 1,728 logic elements can implement wait-state generators, bus arbiters, and DMA engines, while 147 user I/Os accommodate address/data/control buses plus peripheral interfaces. The device's 2.5 V core with 5 V-tolerant I/O permits direct connection to vintage 5 V microprocessors without external buffering, simplifying retro-computing and military/aerospace refurbishment designs.
Recomendado
Medical Imaging Front-End Signal Routing
Ultrasound and MRI front-end subsystems use the EPF10K30EQC208-1 to route analog front-end channels to ADCs and beamformer DSPs. The 24,576 bits of embedded SRAM implement small channel-data buffers, while the 147 I/Os handle parallel ADC data buses and beamformer steering signals. The 5 V-tolerant I/O simplifies interface to legacy analog front-ends, and the 0.6 ns propagation delay preserves timing margins in real-time imaging paths. Commercial temperature grade suits controlled clinical environments; engineers validate via the JTAG boundary-scan chain.
Recomendado
Aerospace & Defense Avionics Retrofit
Long-life aerospace platforms retrofit older FLEX 10KE-based boards with the EPF10K30EQC208-1 to replace end-of-life discrete logic. Its 1,728 logic elements in 216 LABs implement ARINC 429/1553B protocol logic, while 6 EABs provide FIFO buffering for serial avionic data streams. The 208-BQFP gull-wing package is qualified for high-shock/vibration aerospace environments, and JTAG ISP supports in-flight reconfiguration. Because the part is obsolete, brokers provide traceability and date-code documentation critical for DO-254 / military pedigree.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF10K30EQC208-1 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF10K30EQC208-1X | EPF10K30AQC208-1 | EPF10K100EQC208-1 | EPF10K50EQC208-1 | EPF10K30AQC208-1N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 208-BQFP (PQFP) 28x28 mm | 208-BQFP (PQFP) - same | 208-PQFP (28x28) - same | 208-BQFP (PQFP) - same | 208-BQFP (PQFP) - same | 208-PQFP (28x28) - same |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KA | FLEX 10KE | FLEX 10KE | FLEX 10KA |
| Logic Elements | 1,728 | 1,728 | 1,728 | 4,992 | 2,880 | 1,728 |
| Total Gates (typical) | 30,000 | 30,000 | 30,000 | 100,000 | 50,000 | 30,000 |
| Embedded RAM Bits | 24,576 | 24,576 | 12,288 | 40,960 | 20,480 | 12,288 |
| Core Voltage | 2.5 V | 2.5 V | 5.0 V | 2.5 V | 2.5 V | 5.0 V |
| Internal Frequency (max) | 80 MHz | 80 MHz | 166.67 MHz | 80 MHz | 80 MHz | 166.67 MHz |
| User I/Os | 147 | 147 | 147 | 147 | 147 | 147 |
| RoHS Status | Non-RoHS (SnPb) | RoHS (lead-free) | Non-RoHS (SnPb) | Non-RoHS (SnPb) | Non-RoHS (SnPb) | RoHS (lead-free) |
Principais diferenciais
- RoHS lead-free variant on identical footprint (vs EPF10K30EQC208-1X)
- FLEX 10KE 2.5 V core lowers power vs FLEX 10KA 5 V core (vs EPF10K30AQC208-1 (FLEX 10KA))
- Higher logic capacity in same 208-PQFP footprint (vs EPF10K100EQC208-1)
Notas de projeto
Estimated: The EPF10K30EQC208-1 requires two supplies — VCCINT = 2.5 V (± 5%, i.e. 2.375 V–2.625 V) for the core and VCCIO = 3.3 V or 5.0 V tolerant for I/O banks. Decouple VCCINT with one 0.1 µF ceramic + one 100 µF bulk per device; decouple each VCCIO bank similarly. Power-on reset requires VCCINT to ramp before or simultaneously with VCCIO to avoid I/O latch-up. Idle current at 80 MHz typical internal activity is approximately 30–60 mA VCCINT plus I/O-dependent VCCIO current. Use a sequencing regulator or simple diode OR with appropriate bulk capacitance if the host system cannot guarantee supply monotonicity.
Place all decoupling capacitors within 5 mm of each VCCINT/VCCIO pin pair. Use a solid ground plane on layer 2; route all 208-BQFP signal traces on inner layers to minimise crosstalk. JTAG signals (TCK/TMS/TDI/TDO) should be routed with 50 Ω characteristic impedance and length-matched to within ±2 cm if used at high programming speeds. Configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) require pull-up resistors (typically 10 kΩ) to VCCIO. Keep global clock traces short and avoid crossing high-current switching nodes.
Do not confuse the EPF10K30EQC208-1 (FLEX 10KE, 2.5 V core) with the EPF10K30AQC208-1 (FLEX 10KA, 5.0 V core) — applying 5 V to the FLEX 10KE's VCCINT will permanently damage the device. Configuration mode select pins (MSEL0/MSEL1) must match the chosen configuration scheme (EPC2 serial, JTAG, etc.); wrong settings cause configuration failure. When migrating from FLEX 10K to FLEX 10KE, re-fit the design in Quartus II or MAX+PLUS II — bitstreams are not directly compatible despite identical package pin-out.
Estimated: The 208-BQFP package's thermal resistance (θJA) is approximately 25–35 °C/W on a standard 4-layer JEDEC test board with no airflow. At 60 mA core current and 2.5 V VCCINT (0.15 W core dissipation) plus typical I/O switching (~0.2 W average), total power is well under 0.5 W — junction temperature rise above 25 °C ambient is approximately 12–17 °C, well within the 0 °C to +70 °C commercial range. Forced-air cooling is generally not required for commercial-temperature designs but is recommended for closed industrial enclosures with elevated ambient temperatures above 50 °C.
Informações de conformidade
Standard -1 finish is SnPb (leaded) on 208-BQFP, not RoHS compliant. For RoHS applications, choose EPF10K30EQC208-1X (lead-free finish). REACH, halogen-free, and conflict-mineral status not explicitly documented for this obsolete part; confirm with broker traceability documents.
