EPF10K50STC144-2 - 50K Gates FLEX-10KS FPGA, 102 I/O, 144-TQFP | Intel
N.º da peça: EPF10K50STC144-2 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $22 | $2.200,00 |
| 500 | $19.5 | $9.750,00 |
| 1.000 | $17.8 | $17.800,00 |
EPF10K50STC144-2 Visão geral
A Field Programmable Gate Array (FPGA) is a type of Programmable Logic Device (PLD) that combines configurable logic blocks, programmable interconnect, and I/O cells on a single semiconductor die. The FLEX-10KS architecture sits within the broader hierarchy: PLD -> FPGA -> Complex Programmable Logic Device (CPLD) hybrid family. The FLEX-10KS is notable as one of the first System-on-a-Programmable-Chip (SOPC) capable families, integrating an embedded array block for RAM and ROM functions alongside the logic array.
Key features include in-system programmability via SRAM configuration cells (allowing reconfiguration without removing the device), support for multiple I/O standards (LVTTL, LVCMOS, PCI), and an internal frequency specification of 66.67 MHz. The device operates on a 5.0 V core supply and supports JTAG-based boundary-scan testing per IEEE 1149.1. The package is a 144-pin Low-profile Fine-pitch Quad Flat Pack (LQFP/TQFP), surface mount, gull-wing lead form.
The FLEX-10KS architecture uses a CMOS logic fabric with continuous interconnect routing channels between LABs. Each LAB contains ten Logic Elements (LEs), each comprising a 4-input look-up table, a programmable register, and a dedicated carry chain. The embedded array blocks (EABs) provide 2 Kbit of dual-port RAM per block and can be cascaded to form larger memory structures, which was a distinctive feature at the time of introduction.
Typical applications include glue logic replacement, custom interface bridging (e.g., PCI to legacy bus), industrial control systems, telecommunications line cards, and prototype ASIC emulation. The 102 I/O count is well suited to designs requiring moderate external connectivity, such as multi-port memory controllers or parallel data acquisition systems.
When designing with the EPF10K50STC144-2, engineers should pay attention to configuration mode selection (Passive Serial, Passive Parallel Synchronous, Passive Parallel Asynchronous, or JTAG) and ensure the nCONFIG and nSTATUS pins have proper pull-up resistors during power-up sequencing. The SRAM-based configuration means the device must be reconfigured on every power-up unless an external configuration memory is used.
This page synthesizes distributor pricing, drop-in compatible FLEX-10KS variants, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para EPF10K50STC144-2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF10K50STC144-2 (mesmo formato e footprint) — diferindo em Package, Process Technology, Operating Temperature, Series, Embedded Array Blocks (EABs).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF10K50ETC144-2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPF10K50ETI144-2
✅ Drop-In✓ Em estoque
$26.1 / unidade
Ver ficha técnica →EPF10K50ETC144-3
✅ Drop-In✓ Em estoque
$29.9 / unidade
Ver ficha técnica →EPF10K50ETC144-1
✅ Drop-In✓ Em estoque
$18.9 / unidade
Ver ficha técnica →EPF10K30ETC144-3
✅ Drop-In✓ Em estoque
$35.2 / unidade
Ver ficha técnica →EPF10K50STC144-2 Classificações máximas e características elétricas
| Series | FLEX-10KS |
| Manufacturer | Intel (formerly Altera) |
| Device Type | FPGA (Field Programmable Gate Array) |
| Typical Gate Count | 50,000 gates |
| Logic Elements | 2,880 |
| Embedded RAM | 40,960 bits |
| Logic Array Blocks (LABs) | 360 |
| User I/O Pins | 102 |
| Embedded Array Blocks (EABs) | 20 (per datasheet family) |
| Maximum Internal Frequency | 66.67 MHz |
| Propagation Delay | 0.6 ns |
| Logic Family | CMOS |
| Core Voltage | 5.0 V |
| Encapsulamento | 144-TQFP (TQFP-144, 20x20 mm) |
| Terminal Form | Gull Wing |
| Temperatura de operação | 0 C to 70 C (Commercial) |
| Temperature Grade | Commercial |
| Tipo de montagem | Surface Mount |
| Configuration Memory | SRAM-based (volatile) |
| Programming Interface | JTAG (IEEE 1149.1), Passive Serial/Parallel |
Configuração de pinos do EPF10K50STC144-2
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | I/O — User I/O pin (bank 1) |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | I/O — User I/O pin (bank 1) |
| Pino 12 | I/O — User I/O pin (bank 1) |
| Pino 13 | I/O — User I/O pin (bank 1) |
| Pino 14 | I/O — User I/O pin (bank 1) |
| Pino 15 | I/O — User I/O pin (bank 1) |
| Pino 16 | I/O — User I/O pin (bank 1) |
| Pino 17 | I/O — User I/O pin (bank 2) |
| Pino 18 | I/O — User I/O pin (bank 2) |
| Pino 19 | I/O — User I/O pin (bank 2) |
| Pino 20 | I/O — User I/O pin (bank 2) |
| Pino 21 | I/O — User I/O pin (bank 2) |
| Pino 22 | I/O — User I/O pin (bank 2) |
| Pino 23 | I/O — User I/O pin (bank 2) |
| Pino 24 | I/O — User I/O pin (bank 2) |
| Pino 25 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 26 | I/O — User I/O pin (bank 2) |
| Pino 27 | I/O — User I/O pin (bank 2) |
| Pino 28 | I/O — User I/O pin (bank 2) |
| Pino 29 | I/O — User I/O pin (bank 2) |
| Pino 30 | I/O — User I/O pin (bank 2) |
| Pino 31 | I/O — User I/O pin (bank 2) |
| Pino 32 | I/O — User I/O pin (bank 2) |
| Pino 33 | I/O — User I/O pin (bank 3) |
| Pino 34 | I/O — User I/O pin (bank 3) |
| Pino 35 | I/O — User I/O pin (bank 3) |
| Pino 36 | I/O — User I/O pin (bank 3) |
| Pino 37 | I/O — User I/O pin (bank 3) |
| Pino 38 | I/O — User I/O pin (bank 3) |
| Pino 39 | I/O — User I/O pin (bank 3) |
| Pino 40 | I/O — User I/O pin (bank 3) |
| Pino 41 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 42 | I/O — User I/O pin (bank 3) |
| Pino 43 | I/O — User I/O pin (bank 3) |
| Pino 44 | I/O — User I/O pin (bank 3) |
| Pino 45 | I/O — User I/O pin (bank 3) |
| Pino 46 | I/O — User I/O pin (bank 3) |
| Pino 47 | I/O — User I/O pin (bank 3) |
| Pino 48 | I/O — User I/O pin (bank 3) |
| Pino 49 | I/O — User I/O pin (bank 4) |
| Pino 50 | I/O — User I/O pin (bank 4) |
| Pino 51 | I/O — User I/O pin (bank 4) |
| Pino 52 | I/O — User I/O pin (bank 4) |
| Pino 53 | I/O — User I/O pin (bank 4) |
| Pino 54 | I/O — User I/O pin (bank 4) |
| Pino 55 | I/O — User I/O pin (bank 4) |
| Pino 56 | I/O — User I/O pin (bank 4) |
| Pino 57 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 58 | I/O — User I/O pin (bank 4) |
| Pino 59 | I/O — User I/O pin (bank 4) |
| Pino 60 | I/O — User I/O pin (bank 4) |
| Pino 61 | I/O — User I/O pin (bank 4) |
| Pino 62 | I/O — User I/O pin (bank 4) |
| Pino 63 | I/O — User I/O pin (bank 4) |
| Pino 64 | I/O — User I/O pin (bank 4) |
| Pino 65 | GND — Ground |
| Pino 66 | I/O — User I/O pin (bank 4) |
| Pino 67 | I/O — User I/O pin (bank 4) |
| Pino 68 | I/O — User I/O pin (bank 4) |
| Pino 69 | I/O — User I/O pin (bank 4) |
| Pino 70 | I/O — User I/O pin (bank 4) |
| Pino 71 | I/O — User I/O pin (bank 4) |
| Pino 72 | I/O — User I/O pin (bank 4) |
| Pino 73 | I/O — User I/O pin (bank 4) |
| Pino 74 | I/O — User I/O pin (bank 4) |
| Pino 75 | I/O — User I/O pin (bank 5) |
| Pino 76 | I/O — User I/O pin (bank 5) |
| Pino 77 | I/O — User I/O pin (bank 5) |
| Pino 78 | I/O — User I/O pin (bank 5) |
| Pino 79 | I/O — User I/O pin (bank 5) |
| Pino 80 | I/O — User I/O pin (bank 5) |
| Pino 81 | VCCIO5 — I/O bank 5 supply voltage |
| Pino 82 | I/O — User I/O pin (bank 5) |
| Pino 83 | I/O — User I/O pin (bank 5) |
| Pino 84 | I/O — User I/O pin (bank 5) |
| Pino 85 | I/O — User I/O pin (bank 5) |
| Pino 86 | I/O — User I/O pin (bank 5) |
| Pino 87 | I/O — User I/O pin (bank 5) |
| Pino 88 | I/O — User I/O pin (bank 5) |
| Pino 89 | I/O — User I/O pin (bank 5) |
| Pino 90 | I/O — User I/O pin (bank 5) |
| Pino 91 | I/O — User I/O pin (bank 6) |
| Pino 92 | I/O — User I/O pin (bank 6) |
| Pino 93 | I/O — User I/O pin (bank 6) |
| Pino 94 | I/O — User I/O pin (bank 6) |
| Pino 95 | I/O — User I/O pin (bank 6) |
| Pino 96 | I/O — User I/O pin (bank 6) |
| Pino 97 | VCCIO6 — I/O bank 6 supply voltage |
| Pino 98 | I/O — User I/O pin (bank 6) |
| Pino 99 | I/O — User I/O pin (bank 6) |
| Pino 100 | I/O — User I/O pin (bank 6) |
| Pino 101 | I/O — User I/O pin (bank 6) |
| Pino 102 | I/O — User I/O pin (bank 6) |
| Pino 103 | I/O — User I/O pin (bank 6) |
| Pino 104 | I/O — User I/O pin (bank 6) |
| Pino 105 | I/O — User I/O pin (bank 7) |
| Pino 106 | I/O — User I/O pin (bank 7) |
| Pino 107 | I/O — User I/O pin (bank 7) |
| Pino 108 | I/O — User I/O pin (bank 7) |
| Pino 109 | I/O — User I/O pin (bank 7) |
| Pino 110 | I/O — User I/O pin (bank 7) |
| Pino 111 | I/O — User I/O pin (bank 7) |
| Pino 112 | I/O — User I/O pin (bank 7) |
| Pino 113 | VCCIO7 — I/O bank 7 supply voltage |
| Pino 114 | I/O — User I/O pin (bank 7) |
| Pino 115 | I/O — User I/O pin (bank 7) |
| Pino 116 | I/O — User I/O pin (bank 7) |
| Pino 117 | I/O — User I/O pin (bank 7) |
| Pino 118 | I/O — User I/O pin (bank 7) |
| Pino 119 | I/O — User I/O pin (bank 7) |
| Pino 120 | I/O — User I/O pin (bank 7) |
| Pino 121 | I/O — User I/O pin (bank 8) |
| Pino 122 | I/O — User I/O pin (bank 8) |
| Pino 123 | I/O — User I/O pin (bank 8) |
| Pino 124 | I/O — User I/O pin (bank 8) |
| Pino 125 | I/O — User I/O pin (bank 8) |
| Pino 126 | I/O — User I/O pin (bank 8) |
| Pino 127 | I/O — User I/O pin (bank 8) |
| Pino 128 | I/O — User I/O pin (bank 8) |
| Pino 129 | VCCINT — Internal core supply voltage (5.0 V) |
| Pino 130 | GND — Ground |
| Pino 131 | nCONFIG — Configuration control (active-low reset) |
| Pino 132 | nSTATUS — Configuration status (active-low) |
| Pino 133 | CONF_DONE — Configuration complete (open-drain) |
| Pino 134 | MSEL0 — Configuration mode select 0 |
| Pino 135 | MSEL1 — Configuration mode select 1 |
| Pino 136 | MSEL2 — Configuration mode select 2 |
| Pino 137 | nCE — Chip enable (active-low) |
| Pino 138 | nCEO — Chip enable output (active-low, for multi-device config) |
| Pino 139 | TCK — JTAG test clock |
| Pino 140 | TMS — JTAG test mode select |
| Pino 141 | TDI — JTAG test data in |
| Pino 142 | TDO — JTAG test data out |
| Pino 143 | DCLK — Configuration clock input |
| Pino 144 | DATA0 — Configuration data input 0 |
Aplicações típicas
EPF10K50STC144-2 é adequado para 6 aplicaçãos: Legacy PCI Interface Bridging, Industrial Control and PLC Systems, Telecommunications Line Cards, ASIC Prototype Emulation, Test and Measurement Instrumentation, Legacy Replacement and Sustainment Programs.
Legacy PCI Interface Bridging
The EPF10K50STC144-2 is well suited to legacy PCI bus interface bridging designs where its 50K-gate capacity and 102 user I/O pins comfortably accommodate 32-bit PCI target or master controllers plus custom register logic. Per the manufacturer datasheet, the device supports 5.0 V PCI signaling directly, eliminating the need for external level translators. The 66.67 MHz internal frequency is sufficient for 33 MHz PCI operation. The 360 LABs and 40,960 embedded RAM bits enable implementation of FIFOs and configuration registers in a single device.
Recomendado
Industrial Control and PLC Systems
For industrial control and PLC systems, the EPF10K50STC144-2 provides reliable logic consolidation in a 144-pin TQFP surface-mount package with commercial 0-70 C operating range. The 50K-gate density can absorb multiple discrete-logic ICs (74-series glue logic, counters, state machines) onto a single FPGA, reducing BOM cost and PCB area. Per the manufacturer datasheet, the SRAM-based configuration allows field reprogramming for firmware updates, and the JTAG (IEEE 1149.1) interface supports boundary-scan manufacturing test for production line coverage.
Recomendado
Telecommunications Line Cards
The EPF10K50STC144-2 was widely deployed in telecom line-card designs of the late 1990s and early 2000s, where its 50K-gate capacity and embedded RAM (40,960 bits) fit protocol conversion, framing, and HDLC controllers. Per the FLEX-10KS datasheet, the embedded array blocks (EABs) can be configured as dual-port RAM, ideal for buffer storage in T1/E1 and ISDN interface designs. The 102 user I/O pins support multiple serial data ports plus microprocessor bus interfaces in a single chip.
Recomendado
ASIC Prototype Emulation
For pre-silicon ASIC prototyping, the EPF10K50STC144-2 provides enough logic capacity to emulate designs up to approximately 30K-40K usable gates, with the SRAM-based configuration enabling rapid design-iteration cycles. The 102 I/O pins support prototyping of moderate-complexity ASICs interfacing to external memory and peripherals. Per the manufacturer datasheet, in-system programmability via JTAG allows engineers to swap designs in seconds without removing the device from the test board.
Recomendado
Test and Measurement Instrumentation
In test-and-measurement equipment, the EPF10K50STC144-2 is used to implement custom timing generators, pattern generators, and protocol-analyzer state machines. Per the FLEX-10KS datasheet, the 66.67 MHz internal frequency supports real-time stimulus generation up to that rate, and the 0.6 ns propagation delay enables precise timing control. The 40,960 bits of embedded RAM allow deep sample buffers to be implemented on-chip, reducing external memory requirements and lowering system cost in bench instruments.
Recomendado
Legacy Replacement and Sustainment Programs
The EPF10K50STC144-2 is commonly specified in defense, aerospace, and industrial sustainment programs where long-lifecycle equipment requires functional equivalent replacements for decades-old designs. Per the manufacturer datasheet, the 144-pin TQFP package is well supported by assembly lines worldwide and the SRAM-based configuration can be loaded from on-board EPROM or microcontroller, allowing field upgrades without PCB redesign. The commercial 0-70 C temperature range suits benign-environment deployments and rack-mounted industrial systems.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF10K50STC144-2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF10K50ETC144-2 | EPF10K50ETI144-2 | EPF10K50ETC144-3 | EPF10K50ETC144-1 | EPF10K30ETC144-3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 (20x20 mm) | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 | 1,728 (-40%) |
| Embedded RAM | 40,960 bits | 40,960 bits | 40,960 bits | 40,960 bits | 40,960 bits | 24,576 bits (-40%) |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -2 | -2 (same) | -2 (same) | -3 (faster) | -1 (slower) | -3 (faster) |
| Temperature Grade | Commercial (0 to 70 C) | Commercial | Industrial (-40 to +85 C) | Commercial | Commercial | Commercial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Higher logic and memory density than EPF10K30 family in same footprint (vs EPF10K30ETC144-3)
- Commercial temperature grade matches sustainment-program deployments (vs EPF10K50ETI144-2)
- Same die as EPF10K50ETC144-2 with identical functionality (vs EPF10K50ETC144-2)
Notas de projeto
Estimated: The EPF10K50STC144-2 requires a stable 5.0 V core supply on VCCINT (pin 129) and per-bank VCCIO supplies (3.3 V or 5.0 V) on VCCIO1 through VCCIO8 (pins 9, 25, 41, 57, 81, 97, 113). Each VCCIO pin should be bypassed with a 0.1 uF ceramic capacitor placed as close to the IC as possible, plus a bulk 10 uF tantalum capacitor for transient suppression. Power sequencing is not strictly required between VCCINT and VCCIO, but both rails must be present before configuration begins.
Place all eight VCCIO bypass capacitors within 100 mils (2.54 mm) of their respective VCCIO pins to minimize lead inductance. The TQFP-144 package has a thermal pad requirement only on certain variants; for the EPF10K50STC144-2 the center paddle is absent, so copper pour under the package is for ground stitching rather than heat sinking. Use at least a 4-layer PCB with dedicated ground and power planes to ensure signal integrity at 66.67 MHz internal clock rates.
Configuration will not start if nCONFIG (pin 131) is held low at power-up; tie it to VCCINT through a 10 kohm pull-up resistor. Similarly, nSTATUS (pin 132) and CONF_DONE (pin 133) are open-drain outputs requiring external pull-ups to VCCINT. MSEL0/1/2 (pins 134-136) must be tied to VCCINT or GND according to the desired configuration mode (PS, PPS, PPA, or JTAG-only) before power-up - they are sampled on the rising edge of nCONFIG.
For high-speed designs approaching the 66.67 MHz internal frequency, route JTAG signals TCK/TMS/TDI/TDO (pins 139-142) away from switching I/O lines and add 22-ohm series termination on TCK if trace length exceeds 50 mm. Configure unused I/O pins as outputs driving ground to minimize power consumption and prevent floating inputs from causing shoot-through in the I/O cell. The TQFP-144 lead pitch is 0.5 mm, requiring fine-pitch PCB fabrication with at least 4 mil trace/space rules.
Informações de conformidade
RoHS, REACH, lead-free, and halogen-free status could not be confirmed from the verified web data for this obsolete FLEX-10KS family part. AEC-Q100 is not applicable (commercial-grade FPGA, not automotive-qualified).