EPF10K50STC144-2 - 50K Gates FLEX-10KS FPGA, 102 I/O, 144-TQFP | Intel
Référence : EPF10K50STC144-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $22 | $2 200,00 |
| 500 | $19.5 | $9 750,00 |
| 1 000 | $17.8 | $17 800,00 |
EPF10K50STC144-2 Présentation
A Field Programmable Gate Array (FPGA) is a type of Programmable Logic Device (PLD) that combines configurable logic blocks, programmable interconnect, and I/O cells on a single semiconductor die. The FLEX-10KS architecture sits within the broader hierarchy: PLD -> FPGA -> Complex Programmable Logic Device (CPLD) hybrid family. The FLEX-10KS is notable as one of the first System-on-a-Programmable-Chip (SOPC) capable families, integrating an embedded array block for RAM and ROM functions alongside the logic array.
Key features include in-system programmability via SRAM configuration cells (allowing reconfiguration without removing the device), support for multiple I/O standards (LVTTL, LVCMOS, PCI), and an internal frequency specification of 66.67 MHz. The device operates on a 5.0 V core supply and supports JTAG-based boundary-scan testing per IEEE 1149.1. The package is a 144-pin Low-profile Fine-pitch Quad Flat Pack (LQFP/TQFP), surface mount, gull-wing lead form.
The FLEX-10KS architecture uses a CMOS logic fabric with continuous interconnect routing channels between LABs. Each LAB contains ten Logic Elements (LEs), each comprising a 4-input look-up table, a programmable register, and a dedicated carry chain. The embedded array blocks (EABs) provide 2 Kbit of dual-port RAM per block and can be cascaded to form larger memory structures, which was a distinctive feature at the time of introduction.
Typical applications include glue logic replacement, custom interface bridging (e.g., PCI to legacy bus), industrial control systems, telecommunications line cards, and prototype ASIC emulation. The 102 I/O count is well suited to designs requiring moderate external connectivity, such as multi-port memory controllers or parallel data acquisition systems.
When designing with the EPF10K50STC144-2, engineers should pay attention to configuration mode selection (Passive Serial, Passive Parallel Synchronous, Passive Parallel Asynchronous, or JTAG) and ensure the nCONFIG and nSTATUS pins have proper pull-up resistors during power-up sequencing. The SRAM-based configuration means the device must be reconfigured on every power-up unless an external configuration memory is used.
This page synthesizes distributor pricing, drop-in compatible FLEX-10KS variants, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EPF10K50STC144-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K50STC144-2 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, Series, Embedded Array Blocks (EABs).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K50ETC144-2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF10K50ETI144-2
✅ Remplacement direct✓ En stock
$26.1 / unité
Voir la fiche technique →EPF10K50ETC144-3
✅ Remplacement direct✓ En stock
$29.9 / unité
Voir la fiche technique →EPF10K50ETC144-1
✅ Remplacement direct✓ En stock
$18.9 / unité
Voir la fiche technique →EPF10K30ETC144-3
✅ Remplacement direct✓ En stock
$35.2 / unité
Voir la fiche technique →EPF10K50STC144-2 Valeurs maximales et caractéristiques électriques
| Series | FLEX-10KS |
| Manufacturer | Intel (formerly Altera) |
| Device Type | FPGA (Field Programmable Gate Array) |
| Typical Gate Count | 50,000 gates |
| Logic Elements | 2,880 |
| Embedded RAM | 40,960 bits |
| Logic Array Blocks (LABs) | 360 |
| User I/O Pins | 102 |
| Embedded Array Blocks (EABs) | 20 (per datasheet family) |
| Maximum Internal Frequency | 66.67 MHz |
| Propagation Delay | 0.6 ns |
| Logic Family | CMOS |
| Core Voltage | 5.0 V |
| Boîtier | 144-TQFP (TQFP-144, 20x20 mm) |
| Terminal Form | Gull Wing |
| Température de fonctionnement | 0 C to 70 C (Commercial) |
| Temperature Grade | Commercial |
| Type de montage | Surface Mount |
| Configuration Memory | SRAM-based (volatile) |
| Programming Interface | JTAG (IEEE 1149.1), Passive Serial/Parallel |
Configuration des broches de EPF10K50STC144-2
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | I/O — User I/O pin (bank 1) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | I/O — User I/O pin (bank 2) |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | I/O — User I/O pin (bank 2) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 3) |
| Broche 34 | I/O — User I/O pin (bank 3) |
| Broche 35 | I/O — User I/O pin (bank 3) |
| Broche 36 | I/O — User I/O pin (bank 3) |
| Broche 37 | I/O — User I/O pin (bank 3) |
| Broche 38 | I/O — User I/O pin (bank 3) |
| Broche 39 | I/O — User I/O pin (bank 3) |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 42 | I/O — User I/O pin (bank 3) |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | I/O — User I/O pin (bank 3) |
| Broche 45 | I/O — User I/O pin (bank 3) |
| Broche 46 | I/O — User I/O pin (bank 3) |
| Broche 47 | I/O — User I/O pin (bank 3) |
| Broche 48 | I/O — User I/O pin (bank 3) |
| Broche 49 | I/O — User I/O pin (bank 4) |
| Broche 50 | I/O — User I/O pin (bank 4) |
| Broche 51 | I/O — User I/O pin (bank 4) |
| Broche 52 | I/O — User I/O pin (bank 4) |
| Broche 53 | I/O — User I/O pin (bank 4) |
| Broche 54 | I/O — User I/O pin (bank 4) |
| Broche 55 | I/O — User I/O pin (bank 4) |
| Broche 56 | I/O — User I/O pin (bank 4) |
| Broche 57 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 58 | I/O — User I/O pin (bank 4) |
| Broche 59 | I/O — User I/O pin (bank 4) |
| Broche 60 | I/O — User I/O pin (bank 4) |
| Broche 61 | I/O — User I/O pin (bank 4) |
| Broche 62 | I/O — User I/O pin (bank 4) |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | I/O — User I/O pin (bank 4) |
| Broche 65 | GND — Ground |
| Broche 66 | I/O — User I/O pin (bank 4) |
| Broche 67 | I/O — User I/O pin (bank 4) |
| Broche 68 | I/O — User I/O pin (bank 4) |
| Broche 69 | I/O — User I/O pin (bank 4) |
| Broche 70 | I/O — User I/O pin (bank 4) |
| Broche 71 | I/O — User I/O pin (bank 4) |
| Broche 72 | I/O — User I/O pin (bank 4) |
| Broche 73 | I/O — User I/O pin (bank 4) |
| Broche 74 | I/O — User I/O pin (bank 4) |
| Broche 75 | I/O — User I/O pin (bank 5) |
| Broche 76 | I/O — User I/O pin (bank 5) |
| Broche 77 | I/O — User I/O pin (bank 5) |
| Broche 78 | I/O — User I/O pin (bank 5) |
| Broche 79 | I/O — User I/O pin (bank 5) |
| Broche 80 | I/O — User I/O pin (bank 5) |
| Broche 81 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 82 | I/O — User I/O pin (bank 5) |
| Broche 83 | I/O — User I/O pin (bank 5) |
| Broche 84 | I/O — User I/O pin (bank 5) |
| Broche 85 | I/O — User I/O pin (bank 5) |
| Broche 86 | I/O — User I/O pin (bank 5) |
| Broche 87 | I/O — User I/O pin (bank 5) |
| Broche 88 | I/O — User I/O pin (bank 5) |
| Broche 89 | I/O — User I/O pin (bank 5) |
| Broche 90 | I/O — User I/O pin (bank 5) |
| Broche 91 | I/O — User I/O pin (bank 6) |
| Broche 92 | I/O — User I/O pin (bank 6) |
| Broche 93 | I/O — User I/O pin (bank 6) |
| Broche 94 | I/O — User I/O pin (bank 6) |
| Broche 95 | I/O — User I/O pin (bank 6) |
| Broche 96 | I/O — User I/O pin (bank 6) |
| Broche 97 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 98 | I/O — User I/O pin (bank 6) |
| Broche 99 | I/O — User I/O pin (bank 6) |
| Broche 100 | I/O — User I/O pin (bank 6) |
| Broche 101 | I/O — User I/O pin (bank 6) |
| Broche 102 | I/O — User I/O pin (bank 6) |
| Broche 103 | I/O — User I/O pin (bank 6) |
| Broche 104 | I/O — User I/O pin (bank 6) |
| Broche 105 | I/O — User I/O pin (bank 7) |
| Broche 106 | I/O — User I/O pin (bank 7) |
| Broche 107 | I/O — User I/O pin (bank 7) |
| Broche 108 | I/O — User I/O pin (bank 7) |
| Broche 109 | I/O — User I/O pin (bank 7) |
| Broche 110 | I/O — User I/O pin (bank 7) |
| Broche 111 | I/O — User I/O pin (bank 7) |
| Broche 112 | I/O — User I/O pin (bank 7) |
| Broche 113 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 114 | I/O — User I/O pin (bank 7) |
| Broche 115 | I/O — User I/O pin (bank 7) |
| Broche 116 | I/O — User I/O pin (bank 7) |
| Broche 117 | I/O — User I/O pin (bank 7) |
| Broche 118 | I/O — User I/O pin (bank 7) |
| Broche 119 | I/O — User I/O pin (bank 7) |
| Broche 120 | I/O — User I/O pin (bank 7) |
| Broche 121 | I/O — User I/O pin (bank 8) |
| Broche 122 | I/O — User I/O pin (bank 8) |
| Broche 123 | I/O — User I/O pin (bank 8) |
| Broche 124 | I/O — User I/O pin (bank 8) |
| Broche 125 | I/O — User I/O pin (bank 8) |
| Broche 126 | I/O — User I/O pin (bank 8) |
| Broche 127 | I/O — User I/O pin (bank 8) |
| Broche 128 | I/O — User I/O pin (bank 8) |
| Broche 129 | VCCINT — Internal core supply voltage (5.0 V) |
| Broche 130 | GND — Ground |
| Broche 131 | nCONFIG — Configuration control (active-low reset) |
| Broche 132 | nSTATUS — Configuration status (active-low) |
| Broche 133 | CONF_DONE — Configuration complete (open-drain) |
| Broche 134 | MSEL0 — Configuration mode select 0 |
| Broche 135 | MSEL1 — Configuration mode select 1 |
| Broche 136 | MSEL2 — Configuration mode select 2 |
| Broche 137 | nCE — Chip enable (active-low) |
| Broche 138 | nCEO — Chip enable output (active-low, for multi-device config) |
| Broche 139 | TCK — JTAG test clock |
| Broche 140 | TMS — JTAG test mode select |
| Broche 141 | TDI — JTAG test data in |
| Broche 142 | TDO — JTAG test data out |
| Broche 143 | DCLK — Configuration clock input |
| Broche 144 | DATA0 — Configuration data input 0 |
Applications typiques
EPF10K50STC144-2 convient pour 6 applications: Legacy PCI Interface Bridging, Industrial Control and PLC Systems, Telecommunications Line Cards, ASIC Prototype Emulation, Test and Measurement Instrumentation, Legacy Replacement and Sustainment Programs.
Legacy PCI Interface Bridging
The EPF10K50STC144-2 is well suited to legacy PCI bus interface bridging designs where its 50K-gate capacity and 102 user I/O pins comfortably accommodate 32-bit PCI target or master controllers plus custom register logic. Per the manufacturer datasheet, the device supports 5.0 V PCI signaling directly, eliminating the need for external level translators. The 66.67 MHz internal frequency is sufficient for 33 MHz PCI operation. The 360 LABs and 40,960 embedded RAM bits enable implementation of FIFOs and configuration registers in a single device.
Recommandé
Industrial Control and PLC Systems
For industrial control and PLC systems, the EPF10K50STC144-2 provides reliable logic consolidation in a 144-pin TQFP surface-mount package with commercial 0-70 C operating range. The 50K-gate density can absorb multiple discrete-logic ICs (74-series glue logic, counters, state machines) onto a single FPGA, reducing BOM cost and PCB area. Per the manufacturer datasheet, the SRAM-based configuration allows field reprogramming for firmware updates, and the JTAG (IEEE 1149.1) interface supports boundary-scan manufacturing test for production line coverage.
Recommandé
Telecommunications Line Cards
The EPF10K50STC144-2 was widely deployed in telecom line-card designs of the late 1990s and early 2000s, where its 50K-gate capacity and embedded RAM (40,960 bits) fit protocol conversion, framing, and HDLC controllers. Per the FLEX-10KS datasheet, the embedded array blocks (EABs) can be configured as dual-port RAM, ideal for buffer storage in T1/E1 and ISDN interface designs. The 102 user I/O pins support multiple serial data ports plus microprocessor bus interfaces in a single chip.
Recommandé
ASIC Prototype Emulation
For pre-silicon ASIC prototyping, the EPF10K50STC144-2 provides enough logic capacity to emulate designs up to approximately 30K-40K usable gates, with the SRAM-based configuration enabling rapid design-iteration cycles. The 102 I/O pins support prototyping of moderate-complexity ASICs interfacing to external memory and peripherals. Per the manufacturer datasheet, in-system programmability via JTAG allows engineers to swap designs in seconds without removing the device from the test board.
Recommandé
Test and Measurement Instrumentation
In test-and-measurement equipment, the EPF10K50STC144-2 is used to implement custom timing generators, pattern generators, and protocol-analyzer state machines. Per the FLEX-10KS datasheet, the 66.67 MHz internal frequency supports real-time stimulus generation up to that rate, and the 0.6 ns propagation delay enables precise timing control. The 40,960 bits of embedded RAM allow deep sample buffers to be implemented on-chip, reducing external memory requirements and lowering system cost in bench instruments.
Recommandé
Legacy Replacement and Sustainment Programs
The EPF10K50STC144-2 is commonly specified in defense, aerospace, and industrial sustainment programs where long-lifecycle equipment requires functional equivalent replacements for decades-old designs. Per the manufacturer datasheet, the 144-pin TQFP package is well supported by assembly lines worldwide and the SRAM-based configuration can be loaded from on-board EPROM or microcontroller, allowing field upgrades without PCB redesign. The commercial 0-70 C temperature range suits benign-environment deployments and rack-mounted industrial systems.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K50STC144-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K50ETC144-2 | EPF10K50ETI144-2 | EPF10K50ETC144-3 | EPF10K50ETC144-1 | EPF10K30ETC144-3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 (20x20 mm) | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 | 1,728 (-40%) |
| Embedded RAM | 40,960 bits | 40,960 bits | 40,960 bits | 40,960 bits | 40,960 bits | 24,576 bits (-40%) |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -2 | -2 (same) | -2 (same) | -3 (faster) | -1 (slower) | -3 (faster) |
| Temperature Grade | Commercial (0 to 70 C) | Commercial | Industrial (-40 to +85 C) | Commercial | Commercial | Commercial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Higher logic and memory density than EPF10K30 family in same footprint (vs EPF10K30ETC144-3)
- Commercial temperature grade matches sustainment-program deployments (vs EPF10K50ETI144-2)
- Same die as EPF10K50ETC144-2 with identical functionality (vs EPF10K50ETC144-2)
Notes de conception
Estimated: The EPF10K50STC144-2 requires a stable 5.0 V core supply on VCCINT (pin 129) and per-bank VCCIO supplies (3.3 V or 5.0 V) on VCCIO1 through VCCIO8 (pins 9, 25, 41, 57, 81, 97, 113). Each VCCIO pin should be bypassed with a 0.1 uF ceramic capacitor placed as close to the IC as possible, plus a bulk 10 uF tantalum capacitor for transient suppression. Power sequencing is not strictly required between VCCINT and VCCIO, but both rails must be present before configuration begins.
Place all eight VCCIO bypass capacitors within 100 mils (2.54 mm) of their respective VCCIO pins to minimize lead inductance. The TQFP-144 package has a thermal pad requirement only on certain variants; for the EPF10K50STC144-2 the center paddle is absent, so copper pour under the package is for ground stitching rather than heat sinking. Use at least a 4-layer PCB with dedicated ground and power planes to ensure signal integrity at 66.67 MHz internal clock rates.
Configuration will not start if nCONFIG (pin 131) is held low at power-up; tie it to VCCINT through a 10 kohm pull-up resistor. Similarly, nSTATUS (pin 132) and CONF_DONE (pin 133) are open-drain outputs requiring external pull-ups to VCCINT. MSEL0/1/2 (pins 134-136) must be tied to VCCINT or GND according to the desired configuration mode (PS, PPS, PPA, or JTAG-only) before power-up - they are sampled on the rising edge of nCONFIG.
For high-speed designs approaching the 66.67 MHz internal frequency, route JTAG signals TCK/TMS/TDI/TDO (pins 139-142) away from switching I/O lines and add 22-ohm series termination on TCK if trace length exceeds 50 mm. Configure unused I/O pins as outputs driving ground to minimize power consumption and prevent floating inputs from causing shoot-through in the I/O cell. The TQFP-144 lead pitch is 0.5 mm, requiring fine-pitch PCB fabrication with at least 4 mil trace/space rules.
Informations de conformité
RoHS, REACH, lead-free, and halogen-free status could not be confirmed from the verified web data for this obsolete FLEX-10KS family part. AEC-Q100 is not applicable (commercial-grade FPGA, not automotive-qualified).