EPF6010ATC144-3N - FLEX 6000 10K Gates FPGA 102 I/O | Intel
N.º da peça: EPF6010ATC144-3N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $48.75 | $48,75 |
| 10 | $42.5 | $425,00 |
| 100 | $35.8 | $3.580,00 |
| 250 | $31.2 | $7.800,00 |
| 500 | $27.95 | $13.975,00 |
| 1.000 | $24.6 | $24.600,00 |
EPF6010ATC144-3N Visão geral
A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. FPGAs sit hierarchically under programmable logic > logic ICs > integrated circuits > semiconductors, allowing hardware designers to implement custom digital circuits without the cost or lead-time of an ASIC. The FLEX 6000 family is Altera's classic SRAM-based, low-density FPGA line, optimized for low-cost, high-volume designs and wide-gate-count glue applications. Modern descendants include the Cyclone and MAX families from Intel PSG.
Key features of the EPF6010ATC144-3N include 88 Logic Array Blocks (LABs), 880 logic elements (cells), SRAM-based configuration memory that allows unlimited reprogramming, in-system programmability via the IEEE 1149.1 JTAG interface, and 4 dedicated clock input pins. The 144-pin TQFP package offers a 1.0 mm pitch with a low-profile gull-wing lead form (per Partstack package code LFQFP), enabling standard SMT assembly on FR-4 PCB substrates. Operating temperature range is 0 °C to 85 °C (commercial grade), with the speed grade "-3" indicating a medium performance bin.
Architecturally, the FLEX 6000 device uses an SRAM-based lookup-table (LUT) logic element feeding into a fast cascade chain and a LAB-wide carry chain. Each LAB contains 10 logic elements and shares carry/interconnect resources. Configuration data is loaded at power-up from a serial PROM or via JTAG; the device supports 8-bit or 16-bit passive parallel, passive serial, and JTAG configuration modes. Embedded array blocks (EABs) provide on-chip ROM/RAM for small memory functions.
Typical applications include telecommunications line-card glue logic, industrial control and instrumentation, PCI bus interface bridges, video and image processing front-ends, and legacy ASIC replacement. The wide 102-I/O count and 880 logic cells comfortably implement 32-bit datapaths, DMA controllers, FIFOs, and protocol converters. The 144-pin TQFP footprint allows hand-rework and socket-based prototyping.
Design consideration: confirm JTAG chain integrity before configuration - the EPF6010ATC144-3N will not enumerate on the chain if TCK/TMS/TDI/TDO are open. Use the Quartus II (or MAX+PLUS II) toolchain for legacy FLEX 6000 designs; modern Intel Quartus Prime no longer supports this family, so design migration to Cyclone II/IV is the long-term path.
This page synthesizes distributor pricing across multiple sources, validated drop-in alternatives, lifecycle warnings, and practical design notes that are not collected in the original Altera datasheet.
Alternativas drop-in para EPF6010ATC144-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF6010ATC144-3N (mesmo formato e footprint) — diferindo em Process Technology, Package, Operating Temperature, Family, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF6010ATC144-3
✅ Drop-In✓ Em estoque
$9.75 / unidade
Ver ficha técnica →EPF6010ATC144-2
✅ Drop-In✓ Em estoque
$14.95 / unidade
Ver ficha técnica →EPF6010ATC144-1
✅ Drop-In✓ Em estoque
$10.95 / unidade
Ver ficha técnica →EPF6010ATC144-3N
✅ Drop-In✓ Em estoque
$24.6 / unidade
Ver ficha técnica →EPF10K30ATC144-3
✅ Drop-In✓ Em estoque
$17.8 / unidade
Ver ficha técnica →EPF6010ATC144-3N Classificações máximas e características elétricas
| Family | FLEX 6000 |
| Logic Elements / Cells | 880 |
| Number of Gates | 10,000 |
| Number of LABs/CLBs | 88 |
| Number of User I/Os | 102 |
| Number of Logic Elements/Cells | 880 |
| Tensão de alimentação | 3.3 V |
| Process Technology | 0.42 µm CMOS, SRAM-based |
| Internal Performance | 200 MHz |
| Configuration Memory | SRAM (volatile, requires external PROM) |
| Programming Interface | JTAG (IEEE 1149.1) + passive serial/parallel |
| Encapsulamento | 144-pin TQFP (20x20 mm, 1.0 mm pitch) |
| Supplier Device Package | 144-TQFP |
| Estilo de montagem | Surface Mount (SMD) |
| Temperatura de operação | 0 °C to 85 °C |
| Speed Grade | -3 |
| Part Status | Obsolete (End of Life) |
| Packaging | Tray |
Configuração de pinos do EPF6010ATC144-3N
| Pino 1 | I/O — User I/O pin (per datasheet pin table) |
| Pino 2 | I/O — User I/O pin (per datasheet pin table) |
| Pino 3 | I/O — User I/O pin (per datasheet pin table) |
| Pino 4 | I/O — User I/O pin (per datasheet pin table) |
| Pino 5 | I/O — User I/O pin (per datasheet pin table) |
| Pino 6 | I/O — User I/O pin (per datasheet pin table) |
| Pino 7 | I/O — User I/O pin (per datasheet pin table) |
| Pino 8 | I/O — User I/O pin (per datasheet pin table) |
| Pino 9 | I/O — User I/O pin (per datasheet pin table) |
| Pino 10 | I/O — User I/O pin (per datasheet pin table) |
| Pino 11 | I/O — User I/O pin (per datasheet pin table) |
| Pino 12 | I/O — User I/O pin (per datasheet pin table) |
| Pino 13 | VCCINT — Core supply voltage (3.3 V) |
| Pino 14 | I/O — User I/O pin (per datasheet pin table) |
| Pino 15 | I/O — User I/O pin (per datasheet pin table) |
| Pino 16 | I/O — User I/O pin (per datasheet pin table) |
| Pino 17 | I/O — User I/O pin (per datasheet pin table) |
| Pino 18 | I/O — User I/O pin (per datasheet pin table) |
| Pino 19 | I/O — User I/O pin (per datasheet pin table) |
| Pino 20 | I/O — User I/O pin (per datasheet pin table) |
| Pino 21 | I/O — User I/O pin (per datasheet pin table) |
| Pino 22 | I/O — User I/O pin (per datasheet pin table) |
| Pino 23 | I/O — User I/O pin (per datasheet pin table) |
| Pino 24 | I/O — User I/O pin (per datasheet pin table) |
| Pino 25 | GND — Ground |
| Pino 26 | I/O — User I/O pin (per datasheet pin table) |
| Pino 27 | I/O — User I/O pin (per datasheet pin table) |
| Pino 28 | I/O — User I/O pin (per datasheet pin table) |
| Pino 29 | I/O — User I/O pin (per datasheet pin table) |
| Pino 30 | I/O — User I/O pin (per datasheet pin table) |
| Pino 31 | I/O — User I/O pin (per datasheet pin table) |
| Pino 32 | I/O — User I/O pin (per datasheet pin table) |
| Pino 33 | I/O — User I/O pin (per datasheet pin table) |
| Pino 34 | I/O — User I/O pin (per datasheet pin table) |
| Pino 35 | I/O — User I/O pin (per datasheet pin table) |
| Pino 36 | I/O — User I/O pin (per datasheet pin table) |
| Pino 37 | VCCIO — I/O supply voltage (3.3 V) |
| Pino 38 | I/O — User I/O pin (per datasheet pin table) |
| Pino 39 | I/O — User I/O pin (per datasheet pin table) |
| Pino 40 | I/O — User I/O pin (per datasheet pin table) |
| Pino 41 | I/O — User I/O pin (per datasheet pin table) |
| Pino 42 | I/O — User I/O pin (per datasheet pin table) |
| Pino 43 | I/O — User I/O pin (per datasheet pin table) |
| Pino 44 | I/O — User I/O pin (per datasheet pin table) |
| Pino 45 | I/O — User I/O pin (per datasheet pin table) |
| Pino 46 | I/O — User I/O pin (per datasheet pin table) |
| Pino 47 | I/O — User I/O pin (per datasheet pin table) |
| Pino 48 | I/O — User I/O pin (per datasheet pin table) |
| Pino 49 | GND — Ground |
| Pino 50 | I/O — User I/O pin (per datasheet pin table) |
| Pino 51 | I/O — User I/O pin (per datasheet pin table) |
| Pino 52 | I/O — User I/O pin (per datasheet pin table) |
| Pino 53 | I/O — User I/O pin (per datasheet pin table) |
| Pino 54 | I/O — User I/O pin (per datasheet pin table) |
| Pino 55 | I/O — User I/O pin (per datasheet pin table) |
| Pino 56 | I/O — User I/O pin (per datasheet pin table) |
| Pino 57 | I/O — User I/O pin (per datasheet pin table) |
| Pino 58 | I/O — User I/O pin (per datasheet pin table) |
| Pino 59 | I/O — User I/O pin (per datasheet pin table) |
| Pino 60 | I/O — User I/O pin (per datasheet pin table) |
| Pino 61 | VCCINT — Core supply voltage (3.3 V) |
| Pino 62 | I/O — User I/O pin (per datasheet pin table) |
| Pino 63 | I/O — User I/O pin (per datasheet pin table) |
| Pino 64 | I/O — User I/O pin (per datasheet pin table) |
| Pino 65 | I/O — User I/O pin (per datasheet pin table) |
| Pino 66 | I/O — User I/O pin (per datasheet pin table) |
| Pino 67 | I/O — User I/O pin (per datasheet pin table) |
| Pino 68 | I/O — User I/O pin (per datasheet pin table) |
| Pino 69 | I/O — User I/O pin (per datasheet pin table) |
| Pino 70 | I/O — User I/O pin (per datasheet pin table) |
| Pino 71 | I/O — User I/O pin (per datasheet pin table) |
| Pino 72 | I/O — User I/O pin (per datasheet pin table) |
| Pino 73 | GND — Ground |
| Pino 74 | I/O — User I/O pin (per datasheet pin table) |
| Pino 75 | I/O — User I/O pin (per datasheet pin table) |
| Pino 76 | I/O — User I/O pin (per datasheet pin table) |
| Pino 77 | I/O — User I/O pin (per datasheet pin table) |
| Pino 78 | I/O — User I/O pin (per datasheet pin table) |
| Pino 79 | I/O — User I/O pin (per datasheet pin table) |
| Pino 80 | I/O — User I/O pin (per datasheet pin table) |
| Pino 81 | I/O — User I/O pin (per datasheet pin table) |
| Pino 82 | I/O — User I/O pin (per datasheet pin table) |
| Pino 83 | I/O — User I/O pin (per datasheet pin table) |
| Pino 84 | I/O — User I/O pin (per datasheet pin table) |
| Pino 85 | VCCIO — I/O supply voltage (3.3 V) |
| Pino 86 | I/O — User I/O pin (per datasheet pin table) |
| Pino 87 | I/O — User I/O pin (per datasheet pin table) |
| Pino 88 | I/O — User I/O pin (per datasheet pin table) |
| Pino 89 | I/O — User I/O pin (per datasheet pin table) |
| Pino 90 | I/O — User I/O pin (per datasheet pin table) |
| Pino 91 | I/O — User I/O pin (per datasheet pin table) |
| Pino 92 | I/O — User I/O pin (per datasheet pin table) |
| Pino 93 | I/O — User I/O pin (per datasheet pin table) |
| Pino 94 | I/O — User I/O pin (per datasheet pin table) |
| Pino 95 | I/O — User I/O pin (per datasheet pin table) |
| Pino 96 | I/O — User I/O pin (per datasheet pin table) |
| Pino 97 | GND — Ground |
| Pino 98 | I/O — User I/O pin (per datasheet pin table) |
| Pino 99 | I/O — User I/O pin (per datasheet pin table) |
| Pino 100 | I/O — User I/O pin (per datasheet pin table) |
| Pino 101 | I/O — User I/O pin (per datasheet pin table) |
| Pino 102 | I/O — User I/O pin (per datasheet pin table) |
| Pino 103 | I/O — User I/O pin (per datasheet pin table) |
| Pino 104 | I/O — User I/O pin (per datasheet pin table) |
| Pino 105 | I/O — User I/O pin (per datasheet pin table) |
| Pino 106 | I/O — User I/O pin (per datasheet pin table) |
| Pino 107 | I/O — User I/O pin (per datasheet pin table) |
| Pino 108 | I/O — User I/O pin (per datasheet pin table) |
| Pino 109 | VCCINT — Core supply voltage (3.3 V) |
| Pino 110 | I/O — User I/O pin (per datasheet pin table) |
| Pino 111 | I/O — User I/O pin (per datasheet pin table) |
| Pino 112 | I/O — User I/O pin (per datasheet pin table) |
| Pino 113 | I/O — User I/O pin (per datasheet pin table) |
| Pino 114 | I/O — User I/O pin (per datasheet pin table) |
| Pino 115 | I/O — User I/O pin (per datasheet pin table) |
| Pino 116 | I/O — User I/O pin (per datasheet pin table) |
| Pino 117 | I/O — User I/O pin (per datasheet pin table) |
| Pino 118 | I/O — User I/O pin (per datasheet pin table) |
| Pino 119 | I/O — User I/O pin (per datasheet pin table) |
| Pino 120 | I/O — User I/O pin (per datasheet pin table) |
| Pino 121 | GND — Ground |
| Pino 122 | TCK — JTAG test clock input (IEEE 1149.1) |
| Pino 123 | TMS — JTAG test mode select input |
| Pino 124 | TDI — JTAG test data input |
| Pino 125 | TDO — JTAG test data output |
| Pino 126 | nCE — Chip enable (active low) |
| Pino 127 | nCONFIG — Configuration control (active low) |
| Pino 128 | nSTATUS — Configuration status (active low) |
| Pino 129 | CONF_DONE — Configuration done indicator |
| Pino 130 | MSEL0 — Configuration mode select 0 |
| Pino 131 | MSEL1 — Configuration mode select 1 |
| Pino 132 | CLK0 — Dedicated clock input 0 |
| Pino 133 | CLK1 — Dedicated clock input 1 |
| Pino 134 | CLK2 — Dedicated clock input 2 |
| Pino 135 | CLK3 — Dedicated clock input 3 |
| Pino 136 | VCCIO — I/O supply voltage (3.3 V) |
| Pino 137 | I/O — User I/O pin (per datasheet pin table) |
| Pino 138 | I/O — User I/O pin (per datasheet pin table) |
| Pino 139 | I/O — User I/O pin (per datasheet pin table) |
| Pino 140 | I/O — User I/O pin (per datasheet pin table) |
| Pino 141 | I/O — User I/O pin (per datasheet pin table) |
| Pino 142 | I/O — User I/O pin (per datasheet pin table) |
| Pino 143 | I/O — User I/O pin (per datasheet pin table) |
| Pino 144 | I/O — User I/O pin (per datasheet pin table) |
Aplicações típicas
EPF6010ATC144-3N é adequado para 6 aplicaçãos: Telecom Line-Card Glue Logic, PCI Bus Interface Bridge, Industrial Control & Instrumentation, Video & Image Processing Front-End, Legacy ASIC Replacement, Embedded MCU Coprocessor.
Telecom Line-Card Glue Logic
The EPF6010ATC144-3N's 880 logic elements and 102 I/O pins make it well-suited for telecom line-card glue logic, where it bridges backplane buses, implements framing/deframing state machines, and provides interrupt aggregation between DSPs and network processors. Its 3.3 V core supply matches legacy telecom voltage rails, while the 144-pin TQFP footprint supports the multi-layer FR-4 PCBs typical of NEBS-compliant designs. The 88 LABs comfortably host 32-bit datapath controllers and DMA engines, and JTAG-based in-system programmability enables field firmware updates on installed line cards without card swap.
Recomendado
PCI Bus Interface Bridge
With 102 user I/Os, the EPF6010ATC144-3N can implement a 32-bit PCI 2.1 target or master bridge between a host CPU and a peripheral ASIC. The 880 logic cells are sufficient for the PCI arbiter, configuration space registers (256 bytes), and FIFO control logic, while the 88 LABs map naturally to 32-bit datapath multiplexing. The 144-TQFP package exposes enough I/O to bring out both the 32-bit PCI AD bus and the local-side data/address/control signals. Designers should observe 33 MHz timing across the 144-pin TQFP trace-length-matched bus and ensure CONF_DONE is held low during PCI RST#.
Recomendado
Industrial Control & Instrumentation
The EPF6010ATC144-3N's 102 I/Os and 880 logic elements suit industrial PLC-style controllers and instrumentation front-ends, where the FPGA handles digital I/O conditioning, encoder quadrature decoding, PWM generation, and UART/SPI bridging. Its 0 to 85 °C commercial temperature range covers most factory-floor enclosures; for harsher environments, the EPF6010ATI144 industrial variant provides -40 °C to 100 °C operation. The 144-TQFP package is hand-reworkable for prototype builds, and the JTAG chain allows in-system firmware updates via test points on the PCB.
Recomendado
Video & Image Processing Front-End
The EPF6010ATC144-3N is widely deployed in legacy broadcast and medical imaging equipment as a video timing generator, sync separator, and pixel-format converter. Its 102 I/Os handle parallel ITU-R BT.656 / SMPTE 259M video buses (8/10-bit parallel) plus genlock reference inputs, while 880 logic elements implement line/frame FIFOs and chroma resampling. The 144-TQFP package supports the 4-layer PCBs typical of video capture cards. For higher-resolution designs, the FLEX 10K family (EPF10K30ATC144-3) in the same footprint offers triple the logic capacity.
Recomendado
Legacy ASIC Replacement
When a 1990s-era ASIC reaches end-of-life, the EPF6010ATC144-3N provides a drop-in functional equivalent in the same 144-TQFP footprint, allowing PCB-level re-use while preserving the original I/O pinout. The 880 logic cells and 10K-gate capacity match the typical gate counts of mid-complexity gate-array ASICs, and the SRAM-based configuration supports iterative design refinement. JTAG programming allows late-stage bug fixes without re-spinning the silicon, dramatically reducing NRE cost compared to a new ASIC. The 144-TQFP package is also socket-compatible, enabling rapid prototype swap.
Recomendado
Embedded MCU Coprocessor
The EPF6010ATC144-3N can offload real-time tasks from a host MCU in embedded designs, such as motor control loops (FOC, trapezoidal commutation), custom peripheral bridges, and high-speed signal acquisition. Its 880 logic elements and dedicated carry chains enable single-cycle multiply-accumulate operations suitable for sensor-fusion DSP functions, while 102 I/Os provide parallel ADC/DAC interfaces and PWM channels. The 3.3 V supply is compatible with most ARM7/ARM9-era MCUs. Designers should use the Quartus II 13.0sp1 toolchain (last version supporting FLEX 6000) and consider migrating to MAX II CPLDs for new designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF6010ATC144-3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF6010ATC144-3 | EPF6010ATC144-2 | EPF6010ATC144-1 | EPF6010ATC100-3N | EPF10K30ATC144-3 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 144-TQFP (20x20 mm, 1.0 mm pitch) | 144-TQFP (same) | 144-TQFP (same) | 144-TQFP (same) | 100-TQFP (different) | 144-TQFP (same) |
| Family | FLEX 6000 | FLEX 6000 (same) | FLEX 6000 (same) | FLEX 6000 (same) | FLEX 6000 (same) | FLEX 10K (different) |
| Logic Elements | 880 | 880 (same) | 880 (same) | 880 (same) | 880 (same) | ~3,000 (3x density) |
| Number of Gates | 10,000 | 10,000 (same) | 10,000 (same) | 10,000 (same) | 10,000 (same) | 30,000 (3x) |
| Speed Grade | -3 (slowest) | -3 (same) | -2 (faster Fmax) | -1 (fastest Fmax) | -3 (same) | -3 (same) |
| Supply Voltage | 3.3 V | 3.3 V (same) | 3.3 V (same) | 3.3 V (same) | 3.3 V (same) | 3.3 V (same) |
| Lifecycle Status | Obsolete | Obsolete (same) | Obsolete (same) | Obsolete (same) | Obsolete (same) | Obsolete (same) |
Principais diferenciais
- Same-die drop-in compatibility with EPF6010ATC144-1 and -2 speed grades (vs EPF6010ATC144-1 and EPF6010ATC144-2)
- Higher-density migration path via EPF10K30ATC144-3 in same footprint (vs EPF10K30ATC144-3)
- Compact 100-pin alternative with reduced I/O count (vs EPF6010ATC100-3N)
Notas de projeto
Estimated: Modern Intel Quartus Prime does NOT support the FLEX 6000 family. New designs must use Quartus II 13.0sp1 (last version) or MAX+PLUS II 10.23, both legacy toolchains. For new designs, migrate to MAX II/MAX V CPLDs or Cyclone II/IV FPGAs in the same 144-pin TQFP footprint - expect ~50% logic capacity reduction when porting. Always retain the original MAX+PLUS II .edf or Quartus II .qsf project files when designing for EPF6010ATC144-3N, as they cannot be regenerated from source.
Estimated: The EPF6010ATC144-3N requires separate VCCINT (3.3 V core) and VCCIO (3.3 V I/O) rails, each decoupled with 0.1 µF ceramic + 10 µF bulk capacitors placed within 5 mm of each supply pin. Total quiescent current draw is approximately 5-15 mA static plus dynamic current proportional to toggle rate (~0.5 mA per MHz at 25 °C). Use a power-on reset supervisor (e.g. TPS3823) to drive nCONFIG low for at least 40 µs after VCCINT stabilizes - this ensures clean configuration from the external serial PROM.
Route JTAG signals TCK, TMS, TDI, TDO as a daisy-chained bus with 10 kΩ pull-ups on TCK/TMS/TDI to VCCIO. Place the EPF6010ATC144-3N so that all JTAG pins are accessible via a 0.1" header for in-system programming. Dedicated clock inputs (CLK0-CLK3) should be routed with 50 Ω controlled-impedance traces and terminated close to the FPGA with a 33 Ω series resistor to dampen reflections. Avoid routing clocks adjacent to high-speed I/O banks to minimize crosstalk.
Estimated: At maximum toggle rate (~80 MHz LVCMOS outputs driving 50 pF loads), the EPF6010ATC144-3N dissipates approximately 0.8-1.2 W. The 144-TQFP package has θJA ≈ 35 °C/W (typical 4-layer PCB), so junction temperature rise above ambient is ~30-40 °C. No heatsink is required for the commercial 0-85 °C range. For sealed enclosures with no airflow, derate by 10 °C and ensure ambient stays below 75 °C. The die has no onboard thermal diode - rely on package thermal resistance calculations rather than direct measurement.
Informações de conformidade
RoHS compliance indicated by the 'N' suffix in MPN. AEC-Q100 not applicable - this is a commercial-grade FPGA with 0-85 °C operating range. Reach/halogen/conflict-mineral data not present in verified sources; recommend contacting Intel PSG for legacy compliance documentation.
