EPF6016ATC100-3N - 16K Gates FLEX 6000 FPGA, 100-TQFP | Intel
N.º da peça: EPF6016ATC100-3N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.8 | $1.380,00 |
| 500 | $11.95 | $5.975,00 |
| 1.000 | $10.4 | $10.400,00 |
EPF6016ATC100-3N Visão geral
What is an FPGA? A Field Programmable Gate Array is a programmable logic device that integrates configurable logic blocks (LBs), programmable interconnect, and programmable I/O cells on a single semiconductor die. FPGAs sit hierarchically between simple PLDs (CPLDs, GALs) and fixed-function ASICs, providing hardware-level parallelism with software-reconfigurable logic - making them ideal for glue logic, prototyping, low-volume production, and design changes late in the product cycle without respinning a board.
Key features include 1,320 logic elements organized into 132 Logic Array Blocks (LABs) with carry and cascade chains for high-speed arithmetic and wide-input functions, 81 user I/O pins supporting multiple I/O standards, built-in JTAG boundary-scan test support, and an SRAM-based configuration cell that allows unlimited reconfiguration. The -3N speed grade places it in the moderate-performance tier of the FLEX 6000 family.
Technically, the FLEX 6000 architecture uses a continuous routing structure called the FastTrack Interconnect, which provides predictable timing across the device. Each LE contains a 4-input look-up table (LUT), a programmable register, and dedicated paths for carry propagation (counters, adders) and cascade chains (wide comparators). Configuration is volatile - external memory or a configuration PROM is required at power-up, distinguishing FPGAs from non-volatile CPLDs.
Typical applications include telecommunication interface bridging, industrial control glue logic, low-density glue-logic consolidation replacing 74-series TTL, simple state machines, and education/development platforms for digital design. The wide package availability (TQFP-100) makes it well-suited for hand-solderable prototypes and low-cost PCB designs.
When designing with this part, note that the EPF6016ATC100-3N is now marked obsolete (EOL) per distributor data. New designs should consider the FLEX 10K, Cyclone, or MAX II families; this part remains in service primarily for legacy board maintenance and long-lifecycle industrial equipment.
This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 6000 family, and practical design notes not collected in any single manufacturer document.
Alternativas drop-in para EPF6016ATC100-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF6016ATC100-3N (mesmo formato e footprint) — diferindo em Operating Temperature, Speed Grade, Package, Process Technology, Device Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF6016ATC100-3
✅ Drop-In✓ Em estoque
$11.4 / unidade
Ver ficha técnica →EPF6016ATC100-2N
✅ Drop-In✓ Em estoque
$15.95 / unidade
Ver ficha técnica →EPF6016ATC100-2
✅ Drop-In✓ Em estoque
$22.49 / unidade
Ver ficha técnica →EPF6016ATC100-1
✅ Drop-In✓ Em estoque
$28.83 / unidade
Ver ficha técnica →EPF6016ATC100-3N Classificações máximas e características elétricas
| Family | FLEX 6000 |
| Device Type | SRAM-based FPGA |
| Typical Gates | 16,000 |
| Logic Elements (LEs) | 1,320 |
| Logic Array Blocks (LABs) | 132 |
| User I/Os | 81 |
| Internal Operating Frequency | 142.86 MHz (max) |
| Technology Node | 0.42 um CMOS |
| Tensão de alimentação | 3.3 V |
| Encapsulamento | 100-pin TQFP (14x14 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0C to 85C (TJ) |
| Configuration | SRAM (volatile) |
| Programming Interface | JTAG / FLEX configuration |
Configuração de pinos do EPF6016ATC100-3N
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | I/O — User I/O pin (bank 1) |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | I/O — User I/O pin (bank 1) |
| Pino 12 | I/O — User I/O pin (bank 1) |
| Pino 13 | I/O — User I/O pin (bank 1) |
| Pino 14 | VCCIO1 — I/O supply voltage (bank 1) |
| Pino 15 | I/O — User I/O pin (bank 1) |
| Pino 16 | I/O — User I/O pin (bank 1) |
| Pino 17 | I/O — User I/O pin (bank 1) |
| Pino 18 | I/O — User I/O pin (bank 1) |
| Pino 19 | I/O — User I/O pin (bank 1) |
| Pino 20 | I/O — User I/O pin (bank 1) |
| Pino 21 | I/O — User I/O pin (bank 1) |
| Pino 22 | I/O — User I/O pin (bank 1) |
| Pino 23 | I/O — User I/O pin (bank 1) |
| Pino 24 | I/O — User I/O pin (bank 1) |
| Pino 25 | I/O — User I/O pin (bank 1) |
| Pino 26 | GND — Ground |
| Pino 27 | I/O — User I/O pin (bank 2) |
| Pino 28 | I/O — User I/O pin (bank 2) |
| Pino 29 | I/O — User I/O pin (bank 2) |
| Pino 30 | I/O — User I/O pin (bank 2) |
| Pino 31 | I/O — User I/O pin (bank 2) |
| Pino 32 | I/O — User I/O pin (bank 2) |
| Pino 33 | I/O — User I/O pin (bank 2) |
| Pino 34 | I/O — User I/O pin (bank 2) |
| Pino 35 | I/O — User I/O pin (bank 2) |
| Pino 36 | I/O — User I/O pin (bank 2) |
| Pino 37 | I/O — User I/O pin (bank 2) |
| Pino 38 | I/O — User I/O pin (bank 2) |
| Pino 39 | VCCIO2 — I/O supply voltage (bank 2) |
| Pino 40 | I/O — User I/O pin (bank 2) |
| Pino 41 | I/O — User I/O pin (bank 2) |
| Pino 42 | I/O — User I/O pin (bank 2) |
| Pino 43 | I/O — User I/O pin (bank 2) |
| Pino 44 | I/O — User I/O pin (bank 2) |
| Pino 45 | I/O — User I/O pin (bank 2) |
| Pino 46 | I/O — User I/O pin (bank 2) |
| Pino 47 | I/O — User I/O pin (bank 2) |
| Pino 48 | I/O — User I/O pin (bank 2) |
| Pino 49 | I/O — User I/O pin (bank 2) |
| Pino 50 | I/O — User I/O pin (bank 2) |
| Pino 51 | I/O — User I/O pin (bank 2) |
| Pino 52 | GND — Ground |
| Pino 53 | I/O — User I/O pin (bank 3) |
| Pino 54 | I/O — User I/O pin (bank 3) |
| Pino 55 | I/O — User I/O pin (bank 3) |
| Pino 56 | I/O — User I/O pin (bank 3) |
| Pino 57 | I/O — User I/O pin (bank 3) |
| Pino 58 | I/O — User I/O pin (bank 3) |
| Pino 59 | I/O — User I/O pin (bank 3) |
| Pino 60 | I/O — User I/O pin (bank 3) |
| Pino 61 | I/O — User I/O pin (bank 3) |
| Pino 62 | I/O — User I/O pin (bank 3) |
| Pino 63 | I/O — User I/O pin (bank 3) |
| Pino 64 | VCCIO3 — I/O supply voltage (bank 3) |
| Pino 65 | I/O — User I/O pin (bank 3) |
| Pino 66 | I/O — User I/O pin (bank 3) |
| Pino 67 | I/O — User I/O pin (bank 3) |
| Pino 68 | I/O — User I/O pin (bank 3) |
| Pino 69 | I/O — User I/O pin (bank 3) |
| Pino 70 | I/O — User I/O pin (bank 3) |
| Pino 71 | I/O — User I/O pin (bank 3) |
| Pino 72 | I/O — User I/O pin (bank 3) |
| Pino 73 | I/O — User I/O pin (bank 3) |
| Pino 74 | I/O — User I/O pin (bank 3) |
| Pino 75 | I/O — User I/O pin (bank 3) |
| Pino 76 | I/O — User I/O pin (bank 3) |
| Pino 77 | I/O — User I/O pin (bank 3) |
| Pino 78 | GND — Ground |
| Pino 79 | I/O — User I/O pin (bank 4) |
| Pino 80 | I/O — User I/O pin (bank 4) |
| Pino 81 | I/O — User I/O pin (bank 4) |
| Pino 82 | VCCINT — Internal core supply voltage (3.3 V) |
| Pino 83 | I/O — User I/O pin (bank 4) |
| Pino 84 | I/O — User I/O pin (bank 4) |
| Pino 85 | nCONFIG — Configuration control (active-low) |
| Pino 86 | nSTATUS — Configuration status (active-low) |
| Pino 87 | CONF_DONE — Configuration done indicator |
| Pino 88 | MSEL0 — Configuration mode select 0 |
| Pino 89 | MSEL1 — Configuration mode select 1 |
| Pino 90 | TCK — JTAG test clock |
| Pino 91 | TMS — JTAG test mode select |
| Pino 92 | TDI — JTAG test data in |
| Pino 93 | TDO — JTAG test data out |
| Pino 94 | I/O — User I/O pin (bank 4) |
| Pino 95 | I/O — User I/O pin (bank 4) |
| Pino 96 | I/O — User I/O pin (bank 4) |
| Pino 97 | I/O — User I/O pin (bank 4) |
| Pino 98 | I/O — User I/O pin (bank 4) |
| Pino 99 | I/O — User I/O pin (bank 4) |
| Pino 100 | I/O — User I/O pin (bank 4) |
Aplicações típicas
EPF6016ATC100-3N é adequado para 6 aplicaçãos: Industrial Glue Logic Consolidation, Telecommunication Interface Bridging, Embedded State Machine and Control, Legacy Board Maintenance and Repair, Education and Digital Design Training, Low-Density DSP and Signal Conditioning.
Industrial Glue Logic Consolidation
The EPF6016ATC100-3N consolidates scattered 74-series TTL, CMOS glue logic, and PAL/GAL devices onto a single programmable device, reducing PCB area, BOM count, and rework cycles. With 1,320 logic elements and 81 user I/Os in a hand-solderable 100-TQFP package, it is well suited for medium-complexity control boards. The 3.3 V single-supply operation simplifies power architecture, while SRAM-based reconfigurability allows late-stage design changes during prototyping without board rework. For industrial PLCs, motor controllers, and instrumentation front-ends, the device integrates address decoding, handshaking, and state machines at frequencies well above the 142.86 MHz internal limit.
Recomendado
Telecommunication Interface Bridging
The EPF6016ATC100-3N bridges legacy telecom interfaces (E1/T1 framers, HDLC controllers, UARTs, parallel buses) by implementing custom glue logic between standard ICs. Its 81 user I/Os are sufficient to manage multiple parallel bus segments, while the FLEX 6000 carry chain supports high-speed counters for timing recovery. The 100-TQFP package footprint matches many legacy telecom card layouts, simplifying field replacements on equipment still in service. Volatile SRAM configuration allows remote reconfiguration via download cable for in-service upgrades on central-office line cards.
Recomendado
Embedded State Machine and Control
The EPF6016ATC100-3N excels at implementing complex state machines, sequencers, and protocol controllers that would otherwise require multiple CPLDs or discrete logic. The 132 LABs and FastTrack interconnect provide predictable timing paths critical for synchronous designs. In embedded control applications such as medical instrumentation, test equipment, and automotive subsystems, the device handles watchdog logic, fault handlers, and I/O expanders. The 3.3 V operation and 0C to 85C junction temperature range support commercial and industrial environments. Designers use Altera MAX+PLUS II or Quartus II for entry.
Recomendado
Legacy Board Maintenance and Repair
The EPF6016ATC100-3N is most commonly sourced today as a maintenance part for legacy equipment still in field service - including industrial automation controllers, military/aerospace subsystems, and telecom infrastructure installed in the late 1990s to mid-2000s. Because the part is obsolete but documented and pin-compatible across the FLEX 6000 family, repair depots substitute -1, -2, -2N, and -3 speed grades as drop-in replacements. The 100-TQFP package is hand-reworkable with standard hot-air stations, simplifying field repair without full board replacement.
Recomendado
Education and Digital Design Training
Universities and training labs use the EPF6016ATC100-3N (and FLEX 6000 family) as a teaching platform for digital logic design, hardware description languages (VHDL, Verilog), and FPGA design flows. The hand-solderable 100-TQFP package and standard JTAG programming interface allow students to build prototype boards without BGA rework equipment. The device supports introductory designs through complete RISC cores, making it a versatile educational vehicle. Quartus II and MAX+PLUS II design tools remain available for student use.
Recomendado
Low-Density DSP and Signal Conditioning
The EPF6016ATC100-3N handles low-density DSP tasks such as FIR filters, PWM generators, and quadrature decoders at sample rates up to its 142.86 MHz internal limit. The dedicated carry chains accelerate counters and adders commonly used in DSP datapaths. The 81 I/Os are sufficient to interface parallel ADC/DAC converters and encoder channels. While modern designs use dedicated DSP chips or higher-density FPGAs, the FLEX 6000 remains in service for legacy signal-conditioning front-ends in industrial and instrumentation applications.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF6016ATC100-3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF6016ATC100-3 | EPF6016ATC100-2N | EPF6016ATC100-2 | EPF6016ATC100-1 |
|---|---|---|---|---|---|
| Package | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | -3 (moderate) | -3 (moderate) | -2 (slower) | -2 (slower) | -1 (slowest) |
| Logic Elements | 1,320 | 1,320 - same | 1,320 - same | 1,320 - same | 1,320 - same |
| Typical Gates | 16,000 | 16,000 - same | 16,000 - same | 16,000 - same | 16,000 - same |
| User I/Os | 81 | 81 - same | 81 - same | 81 - same | 81 - same |
| Supply Voltage | 3.3 V | 3.3 V - same | 3.3 V - same | 3.3 V - same | 3.3 V - same |
| Internal Frequency | 142.86 MHz | 142.86 MHz - same grade | Lower (speed grade -2) | Lower (speed grade -2) | Lowest (speed grade -1) |
Principais diferenciais
- Same-die speed grade flexibility in same 100-TQFP package (vs EPF6016ATC100-2N)
- Hand-solderable TQFP package vs BGA alternatives (vs EPF6016AQC208-3N (208-pin PQFP))
- Single 3.3 V supply vs legacy 5 V FPGAs (vs Older 5 V PLD/FPGA families)
Notas de projeto
The EPF6016ATC100-3N requires a stable 3.3 V supply on VCCINT (core) and VCCIO1-4 (I/O banks). Place 0.1 uF decoupling capacitors as close as possible to every VCC pin and add bulk 10-100 uF tantalum or ceramic capacitors on each supply rail. Power-on ramp should follow the FLEX 6000 datasheet recommended monotonic rise to avoid configuration errors. SRAM configuration is volatile: a configuration PROM (such as Altera EPC2 or EPC4) or download cable is required at every power-up.
The 100-TQFP package has 0.5 mm lead pitch - follow standard fine-pitch PCB layout rules: 4-layer board recommended with continuous ground plane beneath the device, 0.15 mm/6 mil trace width and clearance, and solder mask defined (SMD) pads rather than NSMD for improved solder joint reliability. Keep I/O traces short and route clock signals with controlled impedance. Provide generous copper pour on the thermal pad area (no exposed pad on TQFP-100, but full copper fill aids heat dissipation).
Common pitfalls with the obsolete EPF6016ATC100-3N: (1) Do not assume new stock will be available indefinitely - place lifecycle-buys early for production runs. (2) Speed grade substitution requires re-running timing analysis - a -1 grade is pin-compatible but slower. (3) Quartus II software is required for design entry (MAX+PLUS II is legacy); ensure your toolchain is current before committing to the part. (4) Configuration bitstream is volatile - a power glitch loses the design without a configuration PROM.
Informações de conformidade
RoHS / lead-free status not stated explicitly in the verified distributor data. The -3N suffix likely indicates lead-free terminal finish per Altera naming convention, but confirm with the supplier for regulatory documentation before use in RoHS-required designs.