EPF8452ATC100-3 - 4K-Gate FLEX 8000 FPGA, 100-TQFP | Intel / Altera
N.º da peça: EPF8452ATC100-3 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $10.67 | $10,67 |
| 10 | $9.6 | $96,00 |
| 100 | $8.1 | $810,00 |
| 500 | $6.85 | $3.425,00 |
| 1.000 | $5.95 | $5.950,00 |
EPF8452ATC100-3 Visão geral
An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture sits between a simple PAL/GAL and an ASIC: configurable logic blocks (CLBs/LABs in Altera terminology) are wired together by a programmable interconnect matrix and surrounded by programmable I/O cells, allowing the part to be reconfigured in-circuit for glue logic, bus bridging, state-machine control, or low-to-medium-volume logic replacement. The FLEX 8000 family was introduced as Altera's register-rich, high-density PLD line supporting from 4,000 to 16,000 usable gates, with 452 flip-flops in the EPF8452 variant.
Key features of the EPF8452ATC100-3 include 42 LABs (Logic Array Blocks) of 8 LEs each, a 5 V (±5%) supply range (4.75 V to 5.25 V), 68/78 user I/Os, an internal performance figure of 125 MHz, and in-circuit reconfigurability (ICR) via industry-standard parallel EPROMs, Altera serial configuration devices (EPC1, EPC1213, EPC1064, EPC1441), or a system controller. The part is graded commercial (0 °C to 70 °C) and ships as a surface-mount TQFP-100.
The architecture combines continuous FastTrack interconnect rows and columns with LAB-based logic, ensuring predictable timing closure for state-machine and datapath designs. The 0.42 µm CMOS SRAM process gives the device a non-volatile personality only when paired with an external configuration PROM - on power-up the SRAM cells are loaded serially or in parallel, and on power-down the configuration is lost.
Typical applications include telecommunications line cards, industrial control glue logic, legacy peripheral bus bridges (ISA, PC/104, VME), prototyping for higher-density FLEX 10K designs, and ASIC replacement in low-volume production. Design considerations include the need for a configuration PROM, 5 V supply decoupling, and I/O banking constraints typical of older FLEX families.
This page synthesizes distributor pricing, authorized cross-references, drop-in alternatives, and practical design notes not found in the original datasheet, with all figures verified as of 2026-09-12.
Alternativas drop-in para EPF8452ATC100-3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF8452ATC100-3 (mesmo formato e footprint) — diferindo em Configuration Method, Package, Process Technology, Speed Grade, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF8452ATC100-3N
✅ Drop-In✓ Em estoque
$13.75 / unidade
Ver ficha técnica →EPF8282ATC100-3
✅ Drop-In✓ Em estoque
$10.25 / unidade
Ver ficha técnica →EPF6016ATC100-3
✅ Drop-In✓ Em estoque
$11.4 / unidade
Ver ficha técnica →EPF8452AQC160-3
✅ Drop-In✓ Em estoque
$13.85 / unidade
Ver ficha técnica →EPF6024ATC100-10
✅ Drop-In✓ Em estoque
$16.2 / unidade
Ver ficha técnica →EPF8452ATC100-3 Classificações máximas e características elétricas
| Family | FLEX 8000 |
| Usable Gates | 4,000 |
| Logic Elements (LEs) | 336 |
| Logic Array Blocks (LABs) | 42 |
| Flip-Flops / Registers | 452 |
| User I/Os | 78 |
| Tensão de alimentação | 4.75 V to 5.25 V (5 V nominal) |
| Internal Operating Frequency | 125 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| Encapsulamento | 100-pin TQFP (14x14 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0 °C to +70 °C (Commercial) |
| Configuration Method | Serial/parallel EPROM, EPC1, EPC1213, EPC1064, EPC1441, or system controller |
| In-Circuit Reconfigurability | Yes (ICR via SRAM) |
Configuração de pinos do EPF8452ATC100-3
| Pino 1 | I/O — User I/O bank 1 |
| Pino 2 | I/O — User I/O bank 1 |
| Pino 3 | I/O — User I/O bank 1 |
| Pino 4 | I/O — User I/O bank 1 |
| Pino 5 | I/O — User I/O bank 1 |
| Pino 6 | I/O — User I/O bank 1 |
| Pino 7 | VCCINT — Internal core supply (5 V) |
| Pino 8 | I/O — User I/O bank 1 |
| Pino 9 | I/O — User I/O bank 1 |
| Pino 10 | I/O — User I/O bank 1 |
| Pino 11 | GND — Ground |
| Pino 12 | I/O — User I/O bank 1 |
| Pino 13 | I/O — User I/O bank 1 |
| Pino 14 | nSTATUS — Configuration status (open-drain) |
| Pino 15 | I/O — User I/O bank 2 |
| Pino 16 | I/O — User I/O bank 2 |
| Pino 17 | I/O — User I/O bank 2 |
| Pino 18 | I/O — User I/O bank 2 |
| Pino 19 | I/O — User I/O bank 2 |
| Pino 20 | I/O — User I/O bank 2 |
| Pino 21 | I/O — User I/O bank 2 |
| Pino 22 | GND — Ground |
| Pino 23 | VCCIO — I/O bank supply (5 V) |
| Pino 24 | I/O — User I/O bank 2 |
| Pino 25 | I/O — User I/O bank 2 |
| Pino 26 | I/O — User I/O bank 2 |
| Pino 27 | I/O — User I/O bank 2 |
| Pino 28 | CONF_DONE — Configuration complete (open-drain) |
| Pino 29 | I/O — User I/O bank 3 |
| Pino 30 | I/O — User I/O bank 3 |
| Pino 31 | I/O — User I/O bank 3 |
| Pino 32 | I/O — User I/O bank 3 |
| Pino 33 | I/O — User I/O bank 3 |
| Pino 34 | I/O — User I/O bank 3 |
| Pino 35 | GND — Ground |
| Pino 36 | VCCINT — Internal core supply (5 V) |
| Pino 37 | I/O — User I/O bank 3 |
| Pino 38 | I/O — User I/O bank 3 |
| Pino 39 | I/O — User I/O bank 3 |
| Pino 40 | nCONFIG — Configuration control (active-low) |
| Pino 41 | I/O — User I/O bank 4 |
| Pino 42 | I/O — User I/O bank 4 |
| Pino 43 | I/O — User I/O bank 4 |
| Pino 44 | I/O — User I/O bank 4 |
| Pino 45 | I/O — User I/O bank 4 |
| Pino 46 | I/O — User I/O bank 4 |
| Pino 47 | I/O — User I/O bank 4 |
| Pino 48 | GND — Ground |
| Pino 49 | VCCIO — I/O bank supply (5 V) |
| Pino 50 | I/O — User I/O bank 4 |
| Pino 51 | I/O — User I/O bank 4 |
| Pino 52 | I/O — User I/O bank 4 |
| Pino 53 | I/O — User I/O bank 4 |
| Pino 54 | I/O — User I/O bank 4 |
| Pino 55 | CLK0 — Global clock input 0 |
| Pino 56 | I/O — User I/O bank 5 |
| Pino 57 | I/O — User I/O bank 5 |
| Pino 58 | I/O — User I/O bank 5 |
| Pino 59 | I/O — User I/O bank 5 |
| Pino 60 | I/O — User I/O bank 5 |
| Pino 61 | I/O — User I/O bank 5 |
| Pino 62 | I/O — User I/O bank 5 |
| Pino 63 | GND — Ground |
| Pino 64 | VCCINT — Internal core supply (5 V) |
| Pino 65 | I/O — User I/O bank 5 |
| Pino 66 | I/O — User I/O bank 5 |
| Pino 67 | I/O — User I/O bank 5 |
| Pino 68 | MSEL0 — Configuration mode select 0 |
| Pino 69 | I/O — User I/O bank 6 |
| Pino 70 | I/O — User I/O bank 6 |
| Pino 71 | I/O — User I/O bank 6 |
| Pino 72 | I/O — User I/O bank 6 |
| Pino 73 | I/O — User I/O bank 6 |
| Pino 74 | I/O — User I/O bank 6 |
| Pino 75 | I/O — User I/O bank 6 |
| Pino 76 | GND — Ground |
| Pino 77 | VCCIO — I/O bank supply (5 V) |
| Pino 78 | I/O — User I/O bank 6 |
| Pino 79 | I/O — User I/O bank 6 |
| Pino 80 | I/O — User I/O bank 6 |
| Pino 81 | MSEL1 — Configuration mode select 1 |
| Pino 82 | I/O — User I/O bank 7 |
| Pino 83 | TDI — JTAG test data in |
| Pino 84 | TRST — JTAG test reset (active-low) |
| Pino 85 | TCK — JTAG test clock |
| Pino 86 | TMS — JTAG test mode select |
| Pino 87 | I/O — User I/O bank 7 |
| Pino 88 | I/O — User I/O bank 7 |
| Pino 89 | GND — Ground |
| Pino 90 | VCCINT — Internal core supply (5 V) |
| Pino 91 | I/O — User I/O bank 7 |
| Pino 92 | I/O — User I/O bank 7 |
| Pino 93 | I/O — User I/O bank 7 |
| Pino 94 | DATA0 — Configuration data input 0 |
| Pino 95 | I/O — User I/O bank 8 |
| Pino 96 | I/O — User I/O bank 8 |
| Pino 97 | I/O — User I/O bank 8 |
| Pino 98 | I/O — User I/O bank 8 |
| Pino 99 | CLK1 — Global clock input 1 |
| Pino 100 | TDO — JTAG test data out |
Aplicações típicas
EPF8452ATC100-3 é adequado para 6 aplicaçãos: Telecommunications Line-Card Glue Logic, Industrial Control and Factory Automation Backplanes, Legacy Peripheral Bus Bridges (ISA, PC/104, VME), ASIC Replacement in Low-Volume Production, Prototype and Bring-Up for Higher-Density FLEX 10K Designs, Test and Measurement Front-End Logic.
Telecommunications Line-Card Glue Logic
The EPF8452ATC100-3 fits telecom line-card glue-logic designs because its 4,000 usable gates, 452 flip-flops, and 78 user I/Os comfortably absorb bus-bridging, framing, and protocol-conversion state machines that surround legacy TDM backplanes. The 5 V supply matches the rails still common on Class-5 switch and cross-connect boards, while the 100-pin TQFP footprint allows hand-rework on legacy PCBs. Designers typically instantiate this part between an MPC860/860T processor and an E1/T1 framer, where the FPGA handles cell delineation, clock-domain crossing, and interrupt aggregation. Compared with discrete 74-series logic it integrates roughly 60 to 80 SSI packages into one device, lowering BOM cost and trace density.
Recomendado
Industrial Control and Factory Automation Backplanes
In industrial backplanes the EPF8452ATC100-3 is used as the master glue-logic device that interfaces PLC CPUs to Fieldbus, Profibus, or CANopen transceivers, because its 5 V I/O is directly compatible with the 5 V transceivers still common on 24 V industrial rails. The 336 logic elements and 78 I/Os are sufficient to implement custom FSMs for stepper-motor sequencing, encoder decoding, and isolated digital I/O expansion on the same chip. The commercial 0 °C to 70 °C range covers most factory-floor enclosures, and the TQFP-100 package is friendly to wave-solder rework on existing assembly lines. Designers usually pair it with an EPF8282ATC100-3 or EPF6016ATC100-3 when an alternate source is required.
Recomendado
Legacy Peripheral Bus Bridges (ISA, PC/104, VME)
The EPF8452ATC100-3 is a natural choice for legacy ISA, PC/104, and VME bus bridges because its 78 user I/Os and 125 MHz internal frequency can sustain 8/16-bit ISA DMA cycles without timing closure issues. The 5 V supply matches the rail that powers the bus transceivers, eliminating level-shifters on the address and data lines. A typical implementation places the FPGA between the host CPU and a peripheral ASIC, generating chip-selects, decoding I/O ports, and arbitrating interrupt requests. Its 452 flip-flops are well-suited to FIFOs and address-latch pipelines, and the in-circuit reconfigurability lets designers iterate firmware logic without re-spinning the PCB.
Recomendado
ASIC Replacement in Low-Volume Production
Engineers adopt the EPF8452ATC100-3 to replace gate-array ASICs when production volume does not justify NRE charges, because the FLEX 8000 architecture delivers comparable density and timing predictability at zero NRE. A 4,000-gate design that would normally require a 0.6 µm gate-array NRE of USD 50-150k can be deployed on this part for unit cost under USD 11 at low quantity. The 100-pin TQFP allows standard surface-mount assembly, and the SRAM-based fabric supports field upgrades over JTAG. Customers in medical instrumentation, scientific equipment, and aerospace sub-systems frequently use this approach to consolidate logic and reduce vendor qualification overhead.
Recomendado
Prototype and Bring-Up for Higher-Density FLEX 10K Designs
Design teams prototyping FLEX 10K or APEX designs often drop the EPF8452ATC100-3 onto the development board first because it shares the same Altera toolchain (MAX+PLUS II / Quartus), the same configuration scheme, and the same 5 V I/O bank structure. Engineers can validate their state-machine IP, clock distribution, and JTAG chain at the EPF8452ATC100-3 level before migrating to the higher-density part, shortening bring-up by 2-4 weeks. The 336 logic elements and 78 I/Os provide a realistic test bed for peripheral controller logic, with the same Quartus fitter warnings and timing-report formatting engineers will see on the final FLEX 10K target.
Recomendado
Test and Measurement Front-End Logic
The EPF8452ATC100-3 is well suited to test-and-measurement front-end designs because its 5 V I/O directly drives the comparators, ADCs, and level-shifters that surround oscilloscope and logic-analyser analog front ends. The 125 MHz internal performance and 452 flip-flops enable deep capture FIFOs and trigger sequencing that older CPLDs cannot sustain. A typical design uses the FPGA to synchronize multi-channel ADC sampling, generate trigger patterns, and pipe data into a host DSP or microcontroller. The TQFP-100 footprint makes it easy to place close to the analog front end, and the in-circuit reconfigurability lets test engineers update trigger logic without opening the chassis.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF8452ATC100-3 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF8452ATC100-3N | EPF8282ATC100-3 | EPF6016ATC100-3 | EPF6024ATC100-10 | EPF8452AQC160-3 |
|---|---|---|---|---|---|---|
| Package | 100-pin TQFP (14x14 mm) | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP - same | 160-pin PQFP - different (NOT drop-in) |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 6000 | FLEX 6000 | FLEX 8000 |
| Usable Gates | 4,000 | 4,000 | 2,500 | 1,600 | 2,400 | 4,000 |
| Logic Elements / Cells | 336 | 336 | 208 | 132 | 192 | 336 |
| Supply Voltage | 5 V (4.75-5.25 V) | 5 V (4.75-5.25 V) | 5 V (4.75-5.25 V) | 3.3 V | 3.3 V | 5 V (4.75-5.25 V) |
| Operating Temperature | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Highest-density FLEX 8000 device in TQFP-100 footprint (vs EPF8282ATC100-3)
- 5 V native supply without level shifting (vs EPF6016ATC100-3)
- Pin-compatible lead-free upgrade path (vs EPF8452ATC100-3N)
Notas de projeto
The EPF8452ATC100-3 requires a clean 5 V (±5%) supply for both VCCINT (core) and VCCIO (I/O banks). Place a 100 µF bulk electrolytic plus a 0.1 µF ceramic decoupling cap within 1 cm of each VCC pin pair. The part draws roughly 50-150 mA ICCINT during configuration depending on utilization - provision at least 250 mA headroom on the 5 V rail. Add a 10 kΩ pull-up to nSTATUS and CONF_DONE per the FLEX 8000 configuration reference schematic.
The TQFP-100 (14x14 mm) has 0.5 mm pitch gull-wing leads; use 0.2 mm trace/space rules with a 4-layer PCB for signal integrity. Provide a continuous ground plane under the device and route global clocks (CLK0/CLK1) on the inner layer with controlled impedance (50 Ω). Keep the configuration clock (DCLK) trace short (<50 mm) and shielded by ground to avoid double-clocking during configuration.
Estimated: because the part is SRAM-based, it loses configuration on power-down - always pair it with an EPC1/EPC1213/EPC1064/EPC1441 configuration PROM or external controller. Do not leave MSEL[1:0] floating; the mode-select pins must be tied high or low per the desired configuration scheme (PS, AS, or JTAG). When migrating designs from EPF8452ATC100-3 to the EPF6016ATC100-3, verify that I/O voltage tolerance supports 5 V input - older FLEX 6000 I/O banks were not 5 V tolerant and required a series resistor on input pins.
Informações de conformidade
RoHS, REACH, lead-free, halogen-free and conflict-minerals compliance status were not present in the verified web data for this obsolete part. Marked as [DATA_NEEDED] in the specs array; the lead-free EPF8452ATC100-3N suffix variant may indicate Pb-free finish but should be confirmed against the manufacturer's RoHS CoC before claim.