EPF6016ATC100-3N - 16K Gates FLEX 6000 FPGA, 100-TQFP | Intel
Référence : EPF6016ATC100-3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.8 | $1 380,00 |
| 500 | $11.95 | $5 975,00 |
| 1 000 | $10.4 | $10 400,00 |
EPF6016ATC100-3N Présentation
What is an FPGA? A Field Programmable Gate Array is a programmable logic device that integrates configurable logic blocks (LBs), programmable interconnect, and programmable I/O cells on a single semiconductor die. FPGAs sit hierarchically between simple PLDs (CPLDs, GALs) and fixed-function ASICs, providing hardware-level parallelism with software-reconfigurable logic - making them ideal for glue logic, prototyping, low-volume production, and design changes late in the product cycle without respinning a board.
Key features include 1,320 logic elements organized into 132 Logic Array Blocks (LABs) with carry and cascade chains for high-speed arithmetic and wide-input functions, 81 user I/O pins supporting multiple I/O standards, built-in JTAG boundary-scan test support, and an SRAM-based configuration cell that allows unlimited reconfiguration. The -3N speed grade places it in the moderate-performance tier of the FLEX 6000 family.
Technically, the FLEX 6000 architecture uses a continuous routing structure called the FastTrack Interconnect, which provides predictable timing across the device. Each LE contains a 4-input look-up table (LUT), a programmable register, and dedicated paths for carry propagation (counters, adders) and cascade chains (wide comparators). Configuration is volatile - external memory or a configuration PROM is required at power-up, distinguishing FPGAs from non-volatile CPLDs.
Typical applications include telecommunication interface bridging, industrial control glue logic, low-density glue-logic consolidation replacing 74-series TTL, simple state machines, and education/development platforms for digital design. The wide package availability (TQFP-100) makes it well-suited for hand-solderable prototypes and low-cost PCB designs.
When designing with this part, note that the EPF6016ATC100-3N is now marked obsolete (EOL) per distributor data. New designs should consider the FLEX 10K, Cyclone, or MAX II families; this part remains in service primarily for legacy board maintenance and long-lifecycle industrial equipment.
This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 6000 family, and practical design notes not collected in any single manufacturer document.
Alternatives de remplacement direct pour EPF6016ATC100-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6016ATC100-3N (même facteur de forme et même empreinte) — différant par Operating Temperature, Speed Grade, Package, Process Technology, Device Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6016ATC100-3
✅ Remplacement direct✓ En stock
$11.4 / unité
Voir la fiche technique →EPF6016ATC100-2N
✅ Remplacement direct✓ En stock
$15.95 / unité
Voir la fiche technique →EPF6016ATC100-2
✅ Remplacement direct✓ En stock
$22.49 / unité
Voir la fiche technique →EPF6016ATC100-1
✅ Remplacement direct✓ En stock
$28.83 / unité
Voir la fiche technique →EPF6016ATC100-3N Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Device Type | SRAM-based FPGA |
| Typical Gates | 16,000 |
| Logic Elements (LEs) | 1,320 |
| Logic Array Blocks (LABs) | 132 |
| User I/Os | 81 |
| Internal Operating Frequency | 142.86 MHz (max) |
| Technology Node | 0.42 um CMOS |
| Tension d'alimentation | 3.3 V |
| Boîtier | 100-pin TQFP (14x14 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to 85C (TJ) |
| Configuration | SRAM (volatile) |
| Programming Interface | JTAG / FLEX configuration |
Configuration des broches de EPF6016ATC100-3N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | VCCIO1 — I/O supply voltage (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | I/O — User I/O pin (bank 1) |
| Broche 17 | I/O — User I/O pin (bank 1) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | I/O — User I/O pin (bank 1) |
| Broche 20 | I/O — User I/O pin (bank 1) |
| Broche 21 | I/O — User I/O pin (bank 1) |
| Broche 22 | I/O — User I/O pin (bank 1) |
| Broche 23 | I/O — User I/O pin (bank 1) |
| Broche 24 | I/O — User I/O pin (bank 1) |
| Broche 25 | I/O — User I/O pin (bank 1) |
| Broche 26 | GND — Ground |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | I/O — User I/O pin (bank 2) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | I/O — User I/O pin (bank 2) |
| Broche 37 | I/O — User I/O pin (bank 2) |
| Broche 38 | I/O — User I/O pin (bank 2) |
| Broche 39 | VCCIO2 — I/O supply voltage (bank 2) |
| Broche 40 | I/O — User I/O pin (bank 2) |
| Broche 41 | I/O — User I/O pin (bank 2) |
| Broche 42 | I/O — User I/O pin (bank 2) |
| Broche 43 | I/O — User I/O pin (bank 2) |
| Broche 44 | I/O — User I/O pin (bank 2) |
| Broche 45 | I/O — User I/O pin (bank 2) |
| Broche 46 | I/O — User I/O pin (bank 2) |
| Broche 47 | I/O — User I/O pin (bank 2) |
| Broche 48 | I/O — User I/O pin (bank 2) |
| Broche 49 | I/O — User I/O pin (bank 2) |
| Broche 50 | I/O — User I/O pin (bank 2) |
| Broche 51 | I/O — User I/O pin (bank 2) |
| Broche 52 | GND — Ground |
| Broche 53 | I/O — User I/O pin (bank 3) |
| Broche 54 | I/O — User I/O pin (bank 3) |
| Broche 55 | I/O — User I/O pin (bank 3) |
| Broche 56 | I/O — User I/O pin (bank 3) |
| Broche 57 | I/O — User I/O pin (bank 3) |
| Broche 58 | I/O — User I/O pin (bank 3) |
| Broche 59 | I/O — User I/O pin (bank 3) |
| Broche 60 | I/O — User I/O pin (bank 3) |
| Broche 61 | I/O — User I/O pin (bank 3) |
| Broche 62 | I/O — User I/O pin (bank 3) |
| Broche 63 | I/O — User I/O pin (bank 3) |
| Broche 64 | VCCIO3 — I/O supply voltage (bank 3) |
| Broche 65 | I/O — User I/O pin (bank 3) |
| Broche 66 | I/O — User I/O pin (bank 3) |
| Broche 67 | I/O — User I/O pin (bank 3) |
| Broche 68 | I/O — User I/O pin (bank 3) |
| Broche 69 | I/O — User I/O pin (bank 3) |
| Broche 70 | I/O — User I/O pin (bank 3) |
| Broche 71 | I/O — User I/O pin (bank 3) |
| Broche 72 | I/O — User I/O pin (bank 3) |
| Broche 73 | I/O — User I/O pin (bank 3) |
| Broche 74 | I/O — User I/O pin (bank 3) |
| Broche 75 | I/O — User I/O pin (bank 3) |
| Broche 76 | I/O — User I/O pin (bank 3) |
| Broche 77 | I/O — User I/O pin (bank 3) |
| Broche 78 | GND — Ground |
| Broche 79 | I/O — User I/O pin (bank 4) |
| Broche 80 | I/O — User I/O pin (bank 4) |
| Broche 81 | I/O — User I/O pin (bank 4) |
| Broche 82 | VCCINT — Internal core supply voltage (3.3 V) |
| Broche 83 | I/O — User I/O pin (bank 4) |
| Broche 84 | I/O — User I/O pin (bank 4) |
| Broche 85 | nCONFIG — Configuration control (active-low) |
| Broche 86 | nSTATUS — Configuration status (active-low) |
| Broche 87 | CONF_DONE — Configuration done indicator |
| Broche 88 | MSEL0 — Configuration mode select 0 |
| Broche 89 | MSEL1 — Configuration mode select 1 |
| Broche 90 | TCK — JTAG test clock |
| Broche 91 | TMS — JTAG test mode select |
| Broche 92 | TDI — JTAG test data in |
| Broche 93 | TDO — JTAG test data out |
| Broche 94 | I/O — User I/O pin (bank 4) |
| Broche 95 | I/O — User I/O pin (bank 4) |
| Broche 96 | I/O — User I/O pin (bank 4) |
| Broche 97 | I/O — User I/O pin (bank 4) |
| Broche 98 | I/O — User I/O pin (bank 4) |
| Broche 99 | I/O — User I/O pin (bank 4) |
| Broche 100 | I/O — User I/O pin (bank 4) |
Applications typiques
EPF6016ATC100-3N convient pour 6 applications: Industrial Glue Logic Consolidation, Telecommunication Interface Bridging, Embedded State Machine and Control, Legacy Board Maintenance and Repair, Education and Digital Design Training, Low-Density DSP and Signal Conditioning.
Industrial Glue Logic Consolidation
The EPF6016ATC100-3N consolidates scattered 74-series TTL, CMOS glue logic, and PAL/GAL devices onto a single programmable device, reducing PCB area, BOM count, and rework cycles. With 1,320 logic elements and 81 user I/Os in a hand-solderable 100-TQFP package, it is well suited for medium-complexity control boards. The 3.3 V single-supply operation simplifies power architecture, while SRAM-based reconfigurability allows late-stage design changes during prototyping without board rework. For industrial PLCs, motor controllers, and instrumentation front-ends, the device integrates address decoding, handshaking, and state machines at frequencies well above the 142.86 MHz internal limit.
Recommandé
Telecommunication Interface Bridging
The EPF6016ATC100-3N bridges legacy telecom interfaces (E1/T1 framers, HDLC controllers, UARTs, parallel buses) by implementing custom glue logic between standard ICs. Its 81 user I/Os are sufficient to manage multiple parallel bus segments, while the FLEX 6000 carry chain supports high-speed counters for timing recovery. The 100-TQFP package footprint matches many legacy telecom card layouts, simplifying field replacements on equipment still in service. Volatile SRAM configuration allows remote reconfiguration via download cable for in-service upgrades on central-office line cards.
Recommandé
Embedded State Machine and Control
The EPF6016ATC100-3N excels at implementing complex state machines, sequencers, and protocol controllers that would otherwise require multiple CPLDs or discrete logic. The 132 LABs and FastTrack interconnect provide predictable timing paths critical for synchronous designs. In embedded control applications such as medical instrumentation, test equipment, and automotive subsystems, the device handles watchdog logic, fault handlers, and I/O expanders. The 3.3 V operation and 0C to 85C junction temperature range support commercial and industrial environments. Designers use Altera MAX+PLUS II or Quartus II for entry.
Recommandé
Legacy Board Maintenance and Repair
The EPF6016ATC100-3N is most commonly sourced today as a maintenance part for legacy equipment still in field service - including industrial automation controllers, military/aerospace subsystems, and telecom infrastructure installed in the late 1990s to mid-2000s. Because the part is obsolete but documented and pin-compatible across the FLEX 6000 family, repair depots substitute -1, -2, -2N, and -3 speed grades as drop-in replacements. The 100-TQFP package is hand-reworkable with standard hot-air stations, simplifying field repair without full board replacement.
Recommandé
Education and Digital Design Training
Universities and training labs use the EPF6016ATC100-3N (and FLEX 6000 family) as a teaching platform for digital logic design, hardware description languages (VHDL, Verilog), and FPGA design flows. The hand-solderable 100-TQFP package and standard JTAG programming interface allow students to build prototype boards without BGA rework equipment. The device supports introductory designs through complete RISC cores, making it a versatile educational vehicle. Quartus II and MAX+PLUS II design tools remain available for student use.
Recommandé
Low-Density DSP and Signal Conditioning
The EPF6016ATC100-3N handles low-density DSP tasks such as FIR filters, PWM generators, and quadrature decoders at sample rates up to its 142.86 MHz internal limit. The dedicated carry chains accelerate counters and adders commonly used in DSP datapaths. The 81 I/Os are sufficient to interface parallel ADC/DAC converters and encoder channels. While modern designs use dedicated DSP chips or higher-density FPGAs, the FLEX 6000 remains in service for legacy signal-conditioning front-ends in industrial and instrumentation applications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6016ATC100-3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6016ATC100-3 | EPF6016ATC100-2N | EPF6016ATC100-2 | EPF6016ATC100-1 |
|---|---|---|---|---|---|
| Package | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | -3 (moderate) | -3 (moderate) | -2 (slower) | -2 (slower) | -1 (slowest) |
| Logic Elements | 1,320 | 1,320 - same | 1,320 - same | 1,320 - same | 1,320 - same |
| Typical Gates | 16,000 | 16,000 - same | 16,000 - same | 16,000 - same | 16,000 - same |
| User I/Os | 81 | 81 - same | 81 - same | 81 - same | 81 - same |
| Supply Voltage | 3.3 V | 3.3 V - same | 3.3 V - same | 3.3 V - same | 3.3 V - same |
| Internal Frequency | 142.86 MHz | 142.86 MHz - same grade | Lower (speed grade -2) | Lower (speed grade -2) | Lowest (speed grade -1) |
Principaux différenciateurs
- Same-die speed grade flexibility in same 100-TQFP package (vs EPF6016ATC100-2N)
- Hand-solderable TQFP package vs BGA alternatives (vs EPF6016AQC208-3N (208-pin PQFP))
- Single 3.3 V supply vs legacy 5 V FPGAs (vs Older 5 V PLD/FPGA families)
Notes de conception
The EPF6016ATC100-3N requires a stable 3.3 V supply on VCCINT (core) and VCCIO1-4 (I/O banks). Place 0.1 uF decoupling capacitors as close as possible to every VCC pin and add bulk 10-100 uF tantalum or ceramic capacitors on each supply rail. Power-on ramp should follow the FLEX 6000 datasheet recommended monotonic rise to avoid configuration errors. SRAM configuration is volatile: a configuration PROM (such as Altera EPC2 or EPC4) or download cable is required at every power-up.
The 100-TQFP package has 0.5 mm lead pitch - follow standard fine-pitch PCB layout rules: 4-layer board recommended with continuous ground plane beneath the device, 0.15 mm/6 mil trace width and clearance, and solder mask defined (SMD) pads rather than NSMD for improved solder joint reliability. Keep I/O traces short and route clock signals with controlled impedance. Provide generous copper pour on the thermal pad area (no exposed pad on TQFP-100, but full copper fill aids heat dissipation).
Common pitfalls with the obsolete EPF6016ATC100-3N: (1) Do not assume new stock will be available indefinitely - place lifecycle-buys early for production runs. (2) Speed grade substitution requires re-running timing analysis - a -1 grade is pin-compatible but slower. (3) Quartus II software is required for design entry (MAX+PLUS II is legacy); ensure your toolchain is current before committing to the part. (4) Configuration bitstream is volatile - a power glitch loses the design without a configuration PROM.
Informations de conformité
RoHS / lead-free status not stated explicitly in the verified distributor data. The -3N suffix likely indicates lead-free terminal finish per Altera naming convention, but confirm with the supplier for regulatory documentation before use in RoHS-required designs.