EPF8452ATC100-3N - FLEX 8000 FPGA, 4K Gates, 100-TQFP | Intel
N.º da peça: EPF8452ATC100-3N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.4 | $244,00 |
| 100 | $19.9 | $1.990,00 |
| 500 | $16.2 | $8.100,00 |
| 1.000 | $13.75 | $13.750,00 |
EPF8452ATC100-3N Visão geral
An FPGA is a programmable logic device that combines a large array of configurable logic blocks (LABs), programmable interconnect, and configurable I/O elements on a single die. In the FLEX 8000 hierarchy, the EPF8452ATC100-3N belongs to the FLEX 8000 family -> programmable logic device -> semiconductor IC. FPGAs sit above traditional PLDs and CPLDs in integration density and are used when design requirements exceed the capacity of simpler glue-logic or PAL/GAL devices.
Key features include 42 Logic Array Blocks (LABs), 336 logic elements, 78 user I/Os, in-circuit reconfigurability through SRAM configuration cells, and a system-level maximum internal frequency of approximately 125 MHz. Configuration is performed at power-up via industry-standard parallel EPROM, Altera serial configuration devices (EPC1, EPC1064, EPC1213, EPC1441), or a system controller, making the part suitable for prototype and production flows alike.
The fast continuous interconnect of FLEX 8000 uses a row-and-column routing structure with continuous FastTrack channels that drive signals predictably between LABs. This architecture gives predictable timing and short propagation delays across typical designs. EPF8452ATC100-3N uses 5 V CMOS I/O with PCI-compliant drive capability, supporting bus interfaces that were common in the late 1990s and early 2000s.
Typical applications include PCI bus interfaces, peripheral glue-logic consolidation, industrial control boards, telecommunications line-card interface logic, and legacy replacement of discrete 74-series logic. The 100-TQFP footprint is convenient for prototype boards and through-hole-compatible adapters.
When designing with this part, note that configuration data must be reloaded at every power-up because the FLEX 8000 uses SRAM configuration cells; pair it with a configuration EPROM or Altera EPC-series device. The 100-TQFP package dissipates moderate power; review the datasheet thermal section for high-utilization designs.
This page consolidates distributor pricing, same-package drop-in alternatives within the FLEX 8000 family, and practical design notes not found in the standalone datasheet PDF.
Alternativas drop-in para EPF8452ATC100-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF8452ATC100-3N (mesmo formato e footprint) — diferindo em Configuration Method, Package, Usable Gates, Operating Temperature, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF8452ATC100-3
✅ Drop-In✓ Em estoque
$5.95 / unidade
Ver ficha técnica →EPF8452ATC100-4N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$7.1 / unidade
Ver ficha técnica →EPF8282ATC100-3
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$10.25 / unidade
Ver ficha técnica →EPF6016ATC100-3N
✅ Drop-In✓ Em estoque
$10.4 / unidade
Ver ficha técnica →EPF8452ATC100-3N Classificações máximas e características elétricas
| Family | FLEX 8000 |
| Logic Elements / Cells | 336 |
| Number of LABs/CLBs | 42 |
| Usable Gates | approximately 4,000 |
| User I/Os | 78 |
| Tensão de alimentação | 5 V (4.75 V to 5.25 V) |
| Process Technology | 0.42 µm CMOS SRAM |
| Temperatura de operação | 0 °C to 70 °C (commercial) |
| Maximum Internal Frequency | 125 MHz |
| Encapsulamento | 100-pin TQFP |
| Tipo de montagem | Surface Mount |
| Configuration Method | SRAM, in-circuit reconfigurable (EPC1/EPC1064/EPC1213/EPC1441 or parallel EPROM) |
| I/O Standard | 5 V CMOS, PCI-compliant drive |
| Logic Family | CMOS |
Configuração de pinos do EPF8452ATC100-3N
| Pino 1 | I/O — User I/O (bank-dependent function per datasheet) |
| Pino 10 | I/O — User I/O |
| Pino 11 | I/O — User I/O |
| Pino 12 | I/O — User I/O |
| Pino 13 | I/O — User I/O |
| Pino 14 | I/O — User I/O |
| Pino 15 | GND — Ground |
| Pino 16 | I/O — User I/O |
| Pino 17 | I/O — User I/O |
| Pino 18 | I/O — User I/O |
| Pino 19 | I/O — User I/O |
| Pino 2 | I/O — User I/O |
| Pino 20 | I/O — User I/O |
| Pino 21 | VCC — 5 V supply |
| Pino 22 | I/O — User I/O |
| Pino 23 | I/O — User I/O |
| Pino 24 | I/O — User I/O |
| Pino 25 | I/O — User I/O |
| Pino 26 | I/O — User I/O |
| Pino 27 | I/O — User I/O |
| Pino 28 | GND — Ground |
| Pino 29 | I/O — User I/O |
| Pino 3 | I/O — User I/O |
| Pino 30 | I/O — User I/O |
| Pino 31 | I/O — User I/O |
| Pino 32 | I/O — User I/O |
| Pino 33 | I/O — User I/O |
| Pino 34 | VCC — 5 V supply |
| Pino 35 | I/O — User I/O |
| Pino 36 | I/O — User I/O |
| Pino 37 | I/O — User I/O |
| Pino 38 | I/O — User I/O |
| Pino 39 | I/O — User I/O |
| Pino 4 | I/O — User I/O |
| Pino 40 | GND — Ground |
| Pino 41 | nCONFIG — Configuration control (active-low) |
| Pino 42 | nSTATUS — Configuration status (active-low) |
| Pino 43 | CONF_DONE — Configuration done indicator |
| Pino 44 | DCLK — Configuration clock input |
| Pino 45 | DATA0 — Configuration data input |
| Pino 46 | MSEL1 — Configuration mode select 1 |
| Pino 47 | MSEL0 — Configuration mode select 0 |
| Pino 48 | I/O — User I/O |
| Pino 49 | I/O — User I/O |
| Pino 5 | I/O — User I/O |
| Pino 50 | VCC — 5 V supply |
| Pino 51 | I/O — User I/O |
| Pino 52 | I/O — User I/O |
| Pino 53 | I/O — User I/O |
| Pino 54 | I/O — User I/O |
| Pino 55 | I/O — User I/O |
| Pino 56 | I/O — User I/O |
| Pino 57 | GND — Ground |
| Pino 58 | I/O — User I/O |
| Pino 59 | I/O — User I/O |
| Pino 6 | I/O — User I/O |
| Pino 60 | I/O — User I/O |
| Pino 61 | I/O — User I/O |
| Pino 62 | I/O — User I/O |
| Pino 63 | I/O — User I/O |
| Pino 64 | I/O — User I/O |
| Pino 65 | VCC — 5 V supply |
| Pino 66 | I/O — User I/O |
| Pino 67 | I/O — User I/O |
| Pino 68 | I/O — User I/O |
| Pino 69 | I/O — User I/O |
| Pino 7 | I/O — User I/O |
| Pino 70 | GND — Ground |
| Pino 71 | I/O — User I/O |
| Pino 72 | I/O — User I/O |
| Pino 73 | I/O — User I/O |
| Pino 74 | I/O — User I/O |
| Pino 75 | I/O — User I/O |
| Pino 76 | I/O — User I/O |
| Pino 77 | I/O — User I/O |
| Pino 78 | VCC — 5 V supply |
| Pino 79 | TDI — JTAG test data input |
| Pino 8 | I/O — User I/O |
| Pino 80 | TMS — JTAG test mode select |
| Pino 81 | TCK — JTAG test clock |
| Pino 82 | TDO — JTAG test data output |
| Pino 83 | I/O — User I/O |
| Pino 84 | I/O — User I/O |
| Pino 85 | I/O — User I/O |
| Pino 86 | GND — Ground |
| Pino 87 | I/O — User I/O |
| Pino 88 | I/O — User I/O |
| Pino 89 | I/O — User I/O |
| Pino 9 | I/O — User I/O |
| Pino 90 | I/O — User I/O |
| Pino 91 | I/O — User I/O |
| Pino 92 | VCC — 5 V supply |
| Pino 93 | I/O — User I/O |
| Pino 94 | I/O — User I/O |
| Pino 95 | I/O — User I/O |
| Pino 96 | I/O — User I/O |
| Pino 97 | I/O — User I/O |
| Pino 98 | GND — Ground |
| Pino 99 | I/O — User I/O |
| Pino 100 | I/O — User I/O |
Aplicações típicas
EPF8452ATC100-3N é adequado para 6 aplicaçãos: PCI Bus Interface Bridge, Industrial Control Glue Logic Consolidation, Telecommunications Line-Card Interface Logic, Legacy 74-Series Logic Replacement, Prototyping Platform for Custom State Machines, Test and Measurement Front-End Logic.
PCI Bus Interface Bridge
The EPF8452ATC100-3N's 5 V PCI-compliant I/O drive strength and 78 user I/Os make it well suited for legacy PCI bus interface bridging between a host controller and peripheral glue logic. With 4,000 usable gates and 42 LABs, it can implement target-state machines, address decoding, interrupt steering, and byte-enable logic in a single 100-TQFP device. The 125 MHz internal frequency comfortably supports 33 MHz PCI timing budgets. Designers place the FPGA between the PCI connector and an application-specific ASIC or microcontroller, using Quartus II for synthesis and timing closure. Its 5 V CMOS I/O eliminates the need for level shifters on the PCI bus side, simplifying PCB routing. Configuration via an EPC1 or EPC1441 serial PROM allows autonomous power-up without host intervention.
Recomendado
Industrial Control Glue Logic Consolidation
In industrial control boards, the EPF8452ATC100-3N replaces dozens of 74-series discrete logic ICs by integrating address decoding, bus arbitration, watchdog timers, and I/O expansion into a single 100-TQFP device. The 78 user I/Os support direct connection to many sensors, optocouplers, and relay drivers, reducing board area and BOM cost. Industrial systems benefit from the part's 0 °C to 70 °C commercial temperature range when housed in controlled enclosures. The in-circuit reconfigurability of FLEX 8000 allows field firmware updates via JTAG, useful for late-stage protocol changes without board rework. Engineers should add a small EEPROM-style configuration device and ensure clean 5 V supply decoupling for reliable operation in electrically noisy industrial environments.
Recomendado
Telecommunications Line-Card Interface Logic
Telecommunications line cards historically rely on FLEX 8000 devices such as the EPF8452ATC100-3N to implement TDM bus formatting, framer/mapper glue, clock-domain crossing, and hardware-protocol adaptation between line-interface units and switch-fabric ASICs. With 4,000 usable gates, the device comfortably fits state machines for HDB3/AMI encoding, slip-buffer control, and alarm-collection registers. Its 5 V tolerant CMOS I/O connects directly to legacy telecom backplanes without external level shifters. The 100-TQFP footprint supports standard SMT assembly lines, while the 78 I/Os are sufficient to drive multi-protocol serial buses. Designers should validate timing closure with Quartus II and use a configuration EPROM sized for the compiled bitstream.
Recomendado
Legacy 74-Series Logic Replacement
The EPF8452ATC100-3N is a strong candidate when modernizing legacy boards that contain many discrete 74LS/74HC/74F TTL packages. The 4,000 usable gates and 78 user I/Os can absorb the equivalent of 20-40 small-scale and medium-scale ICs in a single chip, dramatically reducing PCB complexity and assembly cost. Designers capture the original schematic logic into Quartus II using either VHDL, Verilog, or schematic-entry netlists, then target the FLEX 8000 device directly. The 100-TQFP pinout fits standard 1.6 mm board stack-ups, and the 5 V I/O is drop-in compatible with the TTL rails it replaces. In-circuit reconfigurability allows incremental logic fixes without board spin.
Recomendado
Prototyping Platform for Custom State Machines
Engineering teams use the EPF8452ATC100-3N as a fast-prototyping platform for custom state machines, FIFO controllers, and protocol converters in the 100-TQFP form factor. The 125 MHz internal frequency and Quartus II synthesis flow enable iterative design cycles measured in hours rather than weeks. The 78 user I/Os are accessible on standard 0.5 mm-pitch TQFP land patterns, simplifying breakout-board integration. Because FLEX 8000 supports SRAM-based in-circuit reconfigurability, a single board can host multiple design revisions simply by reprogramming the configuration EPROM. This makes it ideal for FPGA-meets-ASIC proof-of-concept work where designers need a quick hardware target before committing to a masked gate array.
Recomendado
Test and Measurement Front-End Logic
Test and measurement instruments often use FLEX 8000 devices such as the EPF8452ATC100-3N for front-end channel switching, trigger logic, timing generators, and counter pre-scalers. The 4,000 usable gates are sufficient for 8-to-16 channel mux trees, while 78 I/Os interface directly to ADC/DAC and comparator front-ends. The 5 V supply rails simplify integration with op-amps and analog multiplexers that still run on ±5 V or single 5 V rails. PCI-compliant drive strength also supports insertion into PXI/cPCI measurement chassis via a bridge interface. Configuration is straightforward with an EPC1 or EPC1064, and the 100-TQFP package handles reflow assembly on standard 1.6 mm FR-4 boards.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF8452ATC100-3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF8452ATC100-3 | EPF8452ATC100-4N | EPF8282ATC100-3 | EPF6016ATC100-3N |
|---|---|---|---|---|---|
| Package | 100-TQFP | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 6000 |
| Usable Gates | ~4,000 | ~4,000 | ~4,000 | ~2,500 | ~16,000 |
| Logic Cells | 336 | 336 | 336 | 208 | 1,320 |
| User I/Os | 78 | 78 | 78 | ~68 | 81 |
| Speed Grade | -3 | -3 | -4 (slower) | -3 | -3 |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
Principais diferenciais
- Higher logic density within the same 100-TQFP footprint (vs EPF8282ATC100-3)
- Same-package FLEX 8000 family drop-in compatibility (vs EPF8452ATC100-4N)
- Mature, well-documented 5 V PCI-capable I/O (vs EPF6016ATC100-3N)
Notas de projeto
EPF8452ATC100-3N requires a clean 5 V ±5% supply. Place a 0.1 µF ceramic decoupling capacitor adjacent to every VCC pin and a 10 µF bulk tantalum or ceramic at the package entry. Because the device draws surge current during configuration, ensure the upstream regulator can supply at least 200 mA peak. Decoupling the JTAG and configuration pins separately prevents configuration failures caused by supply bounce.
Use a 4-layer PCB with a continuous ground plane beneath the 100-TQFP footprint. Keep configuration traces (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) under 50 mm and away from switching signals. Route user I/O differential pairs with matched lengths if used for clock distribution. Provide a 100 Ω differential termination on TCK if JTAG cable length exceeds 150 mm to avoid signal-integrity issues.
Do not leave MSEL0/MSEL1 floating - they select the configuration mode (passive serial vs. parallel) and an undefined state can prevent the device from configuring. Tie CONF_DONE high through a 10 kΩ resistor to VCC for proper power-on behavior. Remember that FLEX 8000 configuration is volatile: the device loses its logic on every power-down, so a configuration EPROM (EPC1/EPC1064/EPC1213/EPC1441) is mandatory for autonomous operation.
Informações de conformidade
RoHS/REACH/halogen-free status not specified in verified web data. EPF8452ATC100-3N is a legacy 5 V FPGA in a commercial temperature grade; the lead-free variant is the EPF8452ATC100-3 suffix. AEC-Q100 not applicable as this is a commercial-grade programmable logic device.