EPF6016TC1443N - FLEX 6000 FPGA, 16K Gates, 117 I/O, 144-LQFP | Intel
N.º da peça: EPF6016TC1443N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $28.75 | $287,50 |
| 100 | $22.4 | $2.240,00 |
| 500 | $18.9 | $9.450,00 |
| 1.000 | $16.2 | $16.200,00 |
EPF6016TC1443N Visão geral
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer can reprogram after manufacture to implement arbitrary digital logic. Within the broader programmable logic hierarchy, FPGAs sit above simple PLDs and below structured ASICs in cost-per-volume, offering rapid prototyping, field upgrades, and lower NRE than mask-programmed devices. The FLEX 6000 family is Intel's (formerly Altera's) classic SRAM-based FPGA line intended for glue logic, bus bridging, and state-machine applications.
Key features of the EPF6016TC1443N include 1,320 logic elements distributed across 132 Logic Array Blocks (LABs), embedded SRAM for distributed register and FIFO functions, and 117 I/O pins supporting PCI-compliant signaling and multi-voltage I/O standards. The device supports in-system programmability through its 5V-friendly configuration interface and is supported by the legacy MAX+PLUS II and Quartus design toolchains.
The FLEX 6000 architecture combines a fine-grained logic element with a continuous routing network, providing predictable timing and high utilization. The 0.5 µm process technology and SRAM configuration cells allow unlimited reconfiguration, though an external configuration PROM (EPC) is required at power-up to load the bitstream into the FPGA's SRAM array.
Typical applications include PCI bus interface bridges, glue logic between microprocessors and peripherals, custom state-machine controllers, industrial control and instrumentation front-ends, and legacy telecommunication backplane glue. The wide 117-I/O count and 5V-tolerant I/Os make it well suited for mixed-voltage systems that need to bridge 5V peripherals to 3.3V cores.
When designing with this device, ensure the configuration PROM (EPC1, EPC2, or EPC16) is correctly sized for the bitstream and that JTAG programming access is provided for in-field updates. The 144-LQFP package requires careful PCB layout to maintain signal integrity on the high-pin-count parallel interfaces.
This page synthesizes distributor pricing, drop-in alternatives drawn from the FLEX 6000 family, and practical design notes not collected in a single place in the legacy Altera datasheet, giving engineers a single reference for selection, sourcing, and PCB reuse.
Alternativas drop-in para EPF6016TC1443N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF6016TC1443N (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Configuration Method, Speed Grade, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF6016TC144-3
✅ Drop-In✓ Em estoque
$9.85 / unidade
Ver ficha técnica →EPF6016TC144-3U
✅ Drop-In✓ Em estoque
$19.8 / unidade
Ver ficha técnica →EPF6016TC144-3N
✅ Drop-In✓ Em estoque
$10.5 / unidade
Ver ficha técnica →EPF6016TC144-2N
✅ Drop-In✓ Em estoque
$14.2 / unidade
Ver ficha técnica →EPF6016TC144-2
✅ Drop-In✓ Em estoque
$13.85 / unidade
Ver ficha técnica →EPF6016ATC144-3N
✅ Drop-In✓ Em estoque
$12.4 / unidade
Ver ficha técnica →EPF6016ATC144-3
✅ Drop-In✓ Em estoque
$9.85 / unidade
Ver ficha técnica →EPF6016TC1443N Classificações máximas e características elétricas
| Family | FLEX 6000 |
| Logic Elements / Cells | 1320 |
| Number of Gates | 16000 |
| Number of I/O | 117 |
| Number of LABs/CLBs | 132 |
| Tensão de alimentação | 5 V |
| Temperatura de operação | 0C to +70C (commercial) |
| Tipo de montagem | Surface Mount |
| Encapsulamento | 144-LQFP (TQFP) |
| Package Body Size | 20 mm x 20 mm |
| Lead Pitch | 0.5 mm |
| Speed Grade | -3 |
| Process Technology | 0.5 µm CMOS SRAM |
| Configuration Method | SRAM (serial/parallel, requires EPC PROM) |
| Status RoHS | Non-compliant (legacy Altera product) |
| Lead Free | No (contains lead, SnPb finish) |
Configuração de pinos do EPF6016TC1443N
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | GND — Ground |
| Pino 10 | I/O — User I/O pin (bank 2) |
| Pino 11 | I/O — User I/O pin (bank 2) |
| Pino 12 | I/O — User I/O pin (bank 2) |
| Pino 13 | I/O — User I/O pin (bank 2) |
| Pino 14 | I/O — User I/O pin (bank 2) |
| Pino 15 | I/O — User I/O pin (bank 2) |
| Pino 16 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 17 | I/O — User I/O pin (bank 2) |
| Pino 18 | I/O — User I/O pin (bank 2) |
| Pino 19 | I/O — User I/O pin (bank 2) |
| Pino 20 | I/O — User I/O pin (bank 2) |
| Pino 21 | I/O — User I/O pin (bank 2) |
| Pino 22 | I/O — User I/O pin (bank 2) |
| Pino 23 | I/O — User I/O pin (bank 2) |
| Pino 24 | I/O — User I/O pin (bank 2) |
| Pino 25 | GND — Ground |
| Pino 26 | I/O — User I/O pin (bank 2) |
| Pino 27 | I/O — User I/O pin (bank 2) |
| Pino 28 | I/O — User I/O pin (bank 2) |
| Pino 29 | I/O — User I/O pin (bank 2) |
| Pino 30 | I/O — User I/O pin (bank 2) |
| Pino 31 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 32 | I/O — User I/O pin (bank 2) |
| Pino 33 | I/O — User I/O pin (bank 2) |
| Pino 34 | I/O — User I/O pin (bank 2) |
| Pino 35 | I/O — User I/O pin (bank 2) |
| Pino 36 | I/O — User I/O pin (bank 2) |
| Pino 37 | I/O — User I/O pin (bank 2) |
| Pino 38 | I/O — User I/O pin (bank 2) |
| Pino 39 | GND — Ground |
| Pino 40 | I/O — User I/O pin (bank 3) |
| Pino 41 | I/O — User I/O pin (bank 3) |
| Pino 42 | I/O — User I/O pin (bank 3) |
| Pino 43 | I/O — User I/O pin (bank 3) |
| Pino 44 | I/O — User I/O pin (bank 3) |
| Pino 45 | I/O — User I/O pin (bank 3) |
| Pino 46 | I/O — User I/O pin (bank 3) |
| Pino 47 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 48 | I/O — User I/O pin (bank 3) |
| Pino 49 | I/O — User I/O pin (bank 3) |
| Pino 50 | I/O — User I/O pin (bank 3) |
| Pino 51 | I/O — User I/O pin (bank 3) |
| Pino 52 | I/O — User I/O pin (bank 3) |
| Pino 53 | I/O — User I/O pin (bank 3) |
| Pino 54 | I/O — User I/O pin (bank 3) |
| Pino 55 | GND — Ground |
| Pino 56 | I/O — User I/O pin (bank 3) |
| Pino 57 | I/O — User I/O pin (bank 3) |
| Pino 58 | I/O — User I/O pin (bank 3) |
| Pino 59 | I/O — User I/O pin (bank 3) |
| Pino 60 | I/O — User I/O pin (bank 3) |
| Pino 61 | I/O — User I/O pin (bank 3) |
| Pino 62 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 63 | I/O — User I/O pin (bank 3) |
| Pino 64 | I/O — User I/O pin (bank 3) |
| Pino 65 | I/O — User I/O pin (bank 3) |
| Pino 66 | I/O — User I/O pin (bank 3) |
| Pino 67 | I/O — User I/O pin (bank 3) |
| Pino 68 | I/O — User I/O pin (bank 3) |
| Pino 69 | GND — Ground |
| Pino 70 | I/O — User I/O pin (bank 4) |
| Pino 71 | I/O — User I/O pin (bank 4) |
| Pino 72 | I/O — User I/O pin (bank 4) |
| Pino 73 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 74 | I/O — User I/O pin (bank 4) |
| Pino 75 | I/O — User I/O pin (bank 4) |
| Pino 76 | I/O — User I/O pin (bank 4) |
| Pino 77 | I/O — User I/O pin (bank 4) |
| Pino 78 | I/O — User I/O pin (bank 4) |
| Pino 79 | I/O — User I/O pin (bank 4) |
| Pino 80 | GND — Ground |
| Pino 81 | I/O — User I/O pin (bank 4) |
| Pino 82 | I/O — User I/O pin (bank 4) |
| Pino 83 | I/O — User I/O pin (bank 4) |
| Pino 84 | I/O — User I/O pin (bank 4) |
| Pino 85 | VCCINT — Core supply voltage (5V) |
| Pino 86 | I/O — User I/O pin (bank 4) |
| Pino 87 | I/O — User I/O pin (bank 4) |
| Pino 88 | I/O — User I/O pin (bank 4) |
| Pino 89 | I/O — User I/O pin (bank 4) |
| Pino 90 | GND — Ground |
| Pino 91 | I/O — User I/O pin (bank 4) |
| Pino 92 | I/O — User I/O pin (bank 4) |
| Pino 93 | I/O — User I/O pin (bank 4) |
| Pino 94 | I/O — User I/O pin (bank 4) |
| Pino 95 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 96 | I/O — User I/O pin (bank 4) |
| Pino 97 | I/O — User I/O pin (bank 4) |
| Pino 98 | I/O — User I/O pin (bank 4) |
| Pino 99 | I/O — User I/O pin (bank 4) |
| Pino 100 | GND — Ground |
| Pino 101 | I/O — User I/O pin (bank 5) |
| Pino 102 | I/O — User I/O pin (bank 5) |
| Pino 103 | I/O — User I/O pin (bank 5) |
| Pino 104 | I/O — User I/O pin (bank 5) |
| Pino 105 | I/O — User I/O pin (bank 5) |
| Pino 106 | VCCIO5 — I/O bank 5 supply voltage |
| Pino 107 | I/O — User I/O pin (bank 5) |
| Pino 108 | I/O — User I/O pin (bank 5) |
| Pino 109 | I/O — User I/O pin (bank 5) |
| Pino 110 | I/O — User I/O pin (bank 5) |
| Pino 111 | I/O — User I/O pin (bank 5) |
| Pino 112 | I/O — User I/O pin (bank 5) |
| Pino 113 | GND — Ground |
| Pino 114 | I/O — User I/O pin (bank 5) |
| Pino 115 | I/O — User I/O pin (bank 5) |
| Pino 116 | I/O — User I/O pin (bank 5) |
| Pino 117 | I/O — User I/O pin (bank 5) |
| Pino 118 | I/O — User I/O pin (bank 5) |
| Pino 119 | VCCIO5 — I/O bank 5 supply voltage |
| Pino 120 | I/O — User I/O pin (bank 5) |
| Pino 121 | I/O — User I/O pin (bank 5) |
| Pino 122 | I/O — User I/O pin (bank 5) |
| Pino 123 | I/O — User I/O pin (bank 5) |
| Pino 124 | I/O — User I/O pin (bank 5) |
| Pino 125 | I/O — User I/O pin (bank 5) |
| Pino 126 | I/O — User I/O pin (bank 5) |
| Pino 127 | GND — Ground |
| Pino 128 | MSEL0 — Configuration mode select 0 |
| Pino 129 | MSEL1 — Configuration mode select 1 |
| Pino 130 | nSTATUS — Configuration status (active low) |
| Pino 131 | nCONFIG — Configuration control (active low) |
| Pino 132 | DCLK — Configuration clock |
| Pino 133 | DATA0 — Configuration data input 0 |
| Pino 134 | CONF_DONE — Configuration done (open drain) |
| Pino 135 | TCK — JTAG test clock |
| Pino 136 | TMS — JTAG test mode select |
| Pino 137 | TDI — JTAG test data in |
| Pino 138 | TDO — JTAG test data out |
| Pino 139 | VCCINT — Core supply voltage (5V) |
| Pino 140 | GND — Ground |
| Pino 141 | I/O — User I/O pin (bank 1) |
| Pino 142 | I/O — User I/O pin (bank 1) |
| Pino 143 | I/O — User I/O pin (bank 1) |
| Pino 144 | I/O — User I/O pin (bank 1) |
Aplicações típicas
EPF6016TC1443N é adequado para 6 aplicaçãos: PCI Bus Interface Bridge, Microprocessor Peripheral Glue Logic, Custom State-Machine Controllers, Legacy Telecom Backplane Glue, Industrial Control Front-End, Legacy Instrumentation and Test Equipment.
PCI Bus Interface Bridge
The EPF6016TC1443N's 117 user I/Os and 5V-tolerant I/O banks are well-matched to classic 5V PCI bus bridging applications where a 32-bit parallel interface plus sideband signals must be protocol-translated to a local 3.3V or 5V peripheral bus. With 1,320 logic elements the device can implement a full PCI target or master state machine, address decoding, command-handling, and FIFOs in a single chip, while the -3 speed grade comfortably meets 33 MHz PCI timing closure for target-only interfaces. Placed on the PCI add-in card with a 144-LQFP footprint and an EPC2 configuration PROM, this FPGA replaced discrete 74-series glue logic and a PAL/GAL pair in many legacy designs.
Recomendado
Microprocessor Peripheral Glue Logic
In embedded systems pairing a microprocessor with multiple peripherals, the EPF6016TC1443N excels as a glue-logic replacement for dozens of 74-series TTL buffers, latches, transceivers, and address decoders. Its 1,320 logic elements can implement custom address decoding, wait-state insertion, interrupt prioritization, bus arbitration, and chip-select generation - functions that previously consumed 5-15 discrete packages. The 5V-tolerant I/Os let the FPGA bridge between a 5V processor bus and 3.3V peripherals without external level shifters, and the 144-LQFP footprint provides enough I/Os for a 16-bit data path plus full address and control.
Recomendado
Custom State-Machine Controllers
Complex multi-state control logic - such as industrial motor controllers, washing-machine sequencers, vending-machine controllers, and HVAC state machines - is a sweet spot for the EPF6016TC1443N. Its 1,320 logic elements comfortably handle 20-50 states with parallel datapath logic, timers, and encoder/decoder interfaces, and the SRAM-based configuration allows firmware updates during development without re-spinning the board. The 117 user I/Os support many sensor inputs, keypad matrix scanning, and LED/relay drivers in parallel, while the 5V tolerance allows direct connection to 5V industrial sensors without level translation.
Recomendado
Legacy Telecom Backplane Glue
Telecom backplanes from the late 1990s and early 2000s typically combined parallel data buses, framing logic, clock distribution, and alarm monitoring - all of which are well served by the EPF6016TC1443N's high I/O count and 5V signaling capability. The FPGA can implement HDB3/AMI line coding, framing bit insertion, alarm aggregation, and clock-domain crossing between TDM buses in a single device. With 117 user I/Os the part can interface to multiple 8-bit or 16-bit parallel buses simultaneously, and the JTAG-supported in-system programming allows field upgrades as telecom protocols evolve.
Recomendado
Industrial Control Front-End
Industrial control front-ends aggregating multiple sensor inputs, encoder counters, PWM outputs, and serial communication channels are a classic FLEX 6000 application. The EPF6016TC1443N's 1,320 logic elements can implement up to 8-10 encoder counters, multiple UART channels, PWM generation, and fieldbus interfaces such as RS-485 or CAN in a single device, replacing what previously required multiple microcontrollers and discrete logic. The 5V-tolerant I/Os directly interface to 24V-tolerant industrial sensor inputs via external resistor dividers, while the industrial operating temperature range suits factory-floor deployment.
Recomendado
Legacy Instrumentation and Test Equipment
Test-and-measurement instruments from the late 1990s often combined a microcontroller with custom digital signal conditioning, timing generators, and display drivers - functions that map naturally onto the EPF6016TC1443N. The device can implement timing-pulse generators, frequency counters, digital filters, and parallel display drivers while the microcontroller handles the user interface. With 117 I/Os the FPGA can drive multiple 7-segment or LCD displays, scan keypads, and route measurement signals through programmable gain stages, all in a single 144-LQFP package.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF6016TC1443N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF6016TC144-3 | EPF6016TC144-3U | EPF6016TC144-3N | EPF6016TC144-2N | EPF6016TC144-2 | EPF6016ATC144-3N | EPF6016ATC144-3 |
|---|---|---|---|---|---|---|---|---|
| Package | 144-LQFP | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 1320 | 1320 | 1320 | 1320 | 1320 | 1320 | 1320 | 1320 |
| User I/Os | 117 | 117 | 117 | 117 | 117 | 117 | 117 | 117 |
| Speed Grade | -3 | -3 | -3 | -3 | -2 (faster) | -2 (faster) | -3 | -3 |
| Finish (Pb-free) | No (Pb-bearing) | No (Pb-bearing) | Yes (Pb-free) | Pb-free marking | Pb-free marking | No (Pb-bearing) | Pb-free marking | No (Pb-bearing) |
| Core Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Identical FLEX 6000 die with multiple speed-grade and finish options (vs EPF6016TC144-3N)
- Faster -2 speed grade available in same package (vs EPF6016TC144-2N)
- 5V-tolerant I/O banks supporting direct 5V peripheral connection (vs EPF6010ATC144-3N)
Notas de projeto
The EPF6016TC1443N requires both a 5V VCCINT (core) supply and per-bank VCCIO supplies (3.3V or 5V depending on the I/O standard). Decouple each VCCINT pin with a 0.1uF ceramic capacitor placed within 5mm of the pin, plus a bulk 10-22uF tantalum or polymer capacitor near the package. Each VCCIO bank pin also requires 0.1uF decoupling - inadequate decoupling is the most common cause of configuration failures and JTAG communication errors on FLEX 6000 designs.
Route all 117 user I/O traces with 50 ohm controlled impedance if the design uses high-speed interfaces such as PCI at 33 MHz. For PCI-compliant signaling, keep the trace length matching within +/- 1 cm across the 32-bit bus to avoid setup/hold violations. Place the EPC configuration PROM adjacent to the FPGA's dedicated configuration pins (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) and route these traces short and away from switching signals to avoid configuration errors.
Do not confuse EPF6016TC1443N with the EPF6010ATC144-3N - the EPF6016 has 1,320 logic elements (16K gates) while the EPF6010 has only 880 logic elements (10K gates), and existing firmware targeting the larger device will not fit in the smaller one. Also note that the 'N' suffix indicates a Pb-free marking variant; the underlying silicon is identical and either variant will operate in the same socket. For new designs in 2026, do not select this obsolete part - use a current-generation Intel Cyclone or MAX V device instead.
Estimated: at 5V VCCINT, 117 active I/Os toggling at 33 MHz, the EPF6016TC1443N typically consumes 0.5-1.0W depending on toggle rate and I/O loading. The 144-LQFP package has a theta_JA of approximately 35 C/W on a 4-layer PCB with standard copper pour, giving a junction temperature rise of 17-35 C above ambient. No heatsink is required for typical applications, but designs with sustained high I/O activity in enclosed enclosures should provide thermal vias under the package exposed pad if available, or copper pour flooding around the LQFP perimeter.
Informações de conformidade
Pb-bearing finish (SnPb) - non-RoHS by default. REACH compliance assumed per Intel/legacy Altera documentation. AEC-Q100 not applicable to FPGAs. Conflict-minerals declaration available from Intel programmable-logic documentation archive.