Intel

EPF6024ATC144-11 - FLEX 6000 FPGA 24K Gates 117 I/O 144-LQFP | Intel

Name: EPF6024ATC144-11 - FLEX 6000 FPGA 24K Gates 117 I/O 144-LQFP | Intel
Brand: Intel
SKU: EPF6024ATC144-11
Price: 15.4 USD
Availability: InStock

N.º da peça: EPF6024ATC144-11 ✗ Fim de vida

Em estoque Enviado em 1 a 3 dias úteis

5 V Vdss 144-LQFP (LQFP-144, 20x20 mm, 0.5 mm pitch) Package -11 Speed

A partir de $15.4 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-11

Preços por volume

Qtd.	Preço unitário	Total
1	$28.5	$28,50
10	$24.75	$247,50
100	$19.2	$1.920,00
500	$16.8	$8.400,00
1.000	$15.4	$15.400,00

ℹ️ Todos os preços estão em USD

Ver datasheet (PDF) Ver alternativas

Quantidade

EPF6024ATC144-11 Visão geral

The Intel EPF6024ATC144-11 is a member of the FLEX 6000 programmable logic device family, providing 24,000 gates of logic capacity in a 144-pin LQFP package with 117 user I/O pins and 1,960 logic elements organized in 196 Logic Array Blocks (LABs). It operates with a -11 speed grade, indicating the timing bin within the family, and uses SRAM-based configuration cells that require an external configuration device. According to Altera FLEX 6000 datasheet literature, this device family is built on a 5V SRAM process and supports in-system programmability through the JTAG-compatible ByteBlaster or BitBlaster interfaces, which enables iterative design updates without removing the part from the board.

A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. The hierarchy in the broader taxonomy is: FPGA -> programmable logic device -> digital logic IC -> semiconductor. FPGAs fill the design gap between fixed-function ASICs (high NRE, low per-unit cost at volume) and small-scale glue logic (low cost, low density), offering fast time-to-market, in-field reprogrammability, and parallel hardware execution. The FLEX 6000 family occupies the low-density legacy tier of the Altera/Intel FPGA portfolio, predating the Cyclone and MAX families that replaced it for new designs.

Key features of the EPF6024ATC144-11 include a dedicated carry chain architecture supporting high-speed arithmetic operations, cascade chains for wide-input logic, configurable I/O standards (TTL, CMOS), and a 4-input look-up table (LUT) per logic element. The LQFP-144 (Low-profile Quad Flat Pack, 20x20 mm, 0.5 mm pitch) surface-mount package provides a familiar plastic footprint compatible with hand-soldering and standard SMT assembly, unlike the later BGA packages that require X-ray inspection. The device is built on a 0.42 µm CMOS SRAM process and supports 5V core operation, distinguishing it from the lower-voltage 3.3V Cyclone family.

Typical applications for the EPF6024ATC144-11 include legacy glue logic replacement, telecom interface bridging, industrial control state machines, and educational FPGA training platforms where the FLEX 6000 architecture is well documented. The wide 5V tolerance makes it particularly suitable for industrial bus interfacing (parallel ATA, ISA-style address decoding, glue logic between microcontrollers and peripherals) and for replacing multiple 74-series TTL packages in legacy equipment redesigns.

When designing with this FPGA, allocate dedicated configuration PROM (such as the EPC1 or EPC1441) since the SRAM configuration cells are volatile and reload on every power-up. Provide a clean 5V supply with adequate decoupling (100 nF plus 10 µF bulk) near VCCINT pins, and ensure JTAG pins are routed to a stable header for in-system programming. Note that FLEX 6000 parts are now in mature lifecycle stages - verify stock and lead time before committing the design.

This page synthesizes distributor pricing, FLEX 6000 family alternatives, and practical design considerations not consolidated in the original manufacturer datasheet, enabling engineers to evaluate the EPF6024ATC144-11 against current alternatives and to plan configuration, power, and PCB layout decisions.

Alternativas drop-in para EPF6024ATC144-11 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EPF6024ATC144-11 (mesmo formato e footprint) — diferindo em Operating Temperature, Speed Grade, Package, Process Technology, Configuration Memory.

EPF6016ATC144-3

Intel

Operating Temperature: 0 °C to +85 °C (commercial)

Speed Grade: -3

Package: TQFP-144 (20 x 20 mm)