EPF6024ATC144-3S - FLEX 6000 FPGA 24K Gates 144-TQFP | Intel
N.º da peça: EPF6024ATC144-3S ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $11.4 | $5.700,00 |
| 1.000 | $9.75 | $9.750,00 |
EPF6024ATC144-3S Visão geral
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic fabric, routing, and I/O blocks are defined by a configuration bitstream loaded after manufacturing. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), and the FLEX 6000 family specifically targets low-cost, high-volume glue-logic, bus-interface, and state-machine replacement applications where a complex CPLD or a full ASIC would be overkill.
Key features of the EPF6024ATC144-3S include 196 Logic Array Blocks (LABs), 117 usable I/O pins, embedded SRAM configuration memory, in-system programmability via the JTAG-compliant ByteBlaster or BitBlaster interface, and four dedicated clock input pins. The 'ATC' speed grade in the device suffix indicates the 142.86 MHz Fmax performance bin, while the trailing 'S' in the part number denotes a specific commercial/extended temperature variant.
Typical applications include 33 MHz/66 MHz PCI bus interface bridges, glue-logic integration for legacy microprocessors, asynchronous-transfer-mode (ATM) cell processing, video/imaging pipe-line control logic, and telecommunications channelizers. Because FLEX 6000 devices are SRAM-based, they must be configured at every power-up from a serial or parallel PROM, which is a key design consideration for any mission-critical boot sequence.
When designing with the EPF6024ATC144-3S, ensure the configuration memory is sourced from a compatible EPC1 or EPC2 configuration PROM (or a microcontroller bitstream) and that all unused I/O pins are left floating or tri-stated. The 144-pin TQFP footprint has a generous 1.0 mm pitch and exposed die-pad-like thermal path, simplifying PCB layout versus fine-pitch BGA alternatives. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para EPF6024ATC144-3S — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF6024ATC144-3S (mesmo formato e footprint) — diferindo em Process Technology, Operating Temperature, Speed Grade, Package, Configuration Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF6024ATC144-3N
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EPF6024ATC144-3
✅ Drop-In✓ Em estoque
$14.1 / unidade
Ver ficha técnica →EPF6024ATC144-2N
✅ Drop-In✓ Em estoque
$20.95 / unidade
Ver ficha técnica →EPF6024ATC144-1N
✅ Drop-In✓ Em estoque
$20.95 / unidade
Ver ficha técnica →EPF6024ATC144-3S Classificações máximas e características elétricas
| Family | FLEX 6000 |
| Typical Gates | 24,000 |
| Logic Elements (LEs) | 1,960 |
| Logic Array Blocks (LABs) | 196 |
| User I/Os | 117 |
| Tensão de alimentação | 3.3 V |
| Process Technology | 0.42 µm CMOS |
| Internal Frequency | 142.86 MHz |
| Configuration Memory | SRAM |
| Package Type | TQFP-144 (1.0 mm pitch) |
| Tipo de montagem | Surface Mount |
| Terminal Form | Gull Wing |
| Package Code | LFQFP |
| Programmability | In-system via JTAG (ByteBlaster/BitBlaster) |
Configuração de pinos do EPF6024ATC144-3S
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | VCCINT — Core supply 3.3 V |
| Pino 6 | GND — Ground |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | I/O — User I/O pin (bank 1) |
| Pino 12 | I/O — User I/O pin (bank 1) |
| Pino 13 | I/O — User I/O pin (bank 2) |
| Pino 14 | VCCIO1 — I/O bank 1 supply |
| Pino 15 | GND — Ground |
| Pino 16 | I/O — User I/O pin (bank 1) |
| Pino 17 | I/O — User I/O pin (bank 1) |
| Pino 18 | I/O — User I/O pin (bank 1) |
| Pino 19 | I/O — User I/O pin (bank 1) |
| Pino 20 | I/O — User I/O pin (bank 1) |
| Pino 21 | I/O — User I/O pin (bank 1) |
| Pino 22 | I/O — User I/O pin (bank 1) |
| Pino 23 | I/O — User I/O pin (bank 1) |
| Pino 24 | I/O — User I/O pin (bank 1) |
| Pino 25 | I/O — User I/O pin (bank 1) |
| Pino 26 | I/O — User I/O pin (bank 1) |
| Pino 27 | GND — Ground |
| Pino 28 | VCCINT — Core supply 3.3 V |
| Pino 29 | I/O — User I/O pin (bank 1) |
| Pino 30 | I/O — User I/O pin (bank 1) |
| Pino 31 | I/O — User I/O pin (bank 1) |
| Pino 32 | I/O — User I/O pin (bank 1) |
| Pino 33 | I/O — User I/O pin (bank 1) |
| Pino 34 | I/O — User I/O pin (bank 1) |
| Pino 35 | I/O — User I/O pin (bank 1) |
| Pino 36 | I/O — User I/O pin (bank 1) |
| Pino 37 | I/O — User I/O pin (bank 1) |
| Pino 38 | I/O — User I/O pin (bank 1) |
| Pino 39 | VCCIO1 — I/O bank 1 supply |
| Pino 40 | GND — Ground |
| Pino 41 | I/O — User I/O pin (bank 1) |
| Pino 42 | I/O — User I/O pin (bank 1) |
| Pino 43 | I/O — User I/O pin (bank 1) |
| Pino 44 | I/O — User I/O pin (bank 1) |
| Pino 45 | I/O — User I/O pin (bank 1) |
| Pino 46 | I/O — User I/O pin (bank 1) |
| Pino 47 | I/O — User I/O pin (bank 2) |
| Pino 48 | I/O — User I/O pin (bank 2) |
| Pino 49 | I/O — User I/O pin (bank 2) |
| Pino 50 | I/O — User I/O pin (bank 2) |
| Pino 51 | I/O — User I/O pin (bank 2) |
| Pino 52 | I/O — User I/O pin (bank 2) |
| Pino 53 | I/O — User I/O pin (bank 2) |
| Pino 54 | I/O — User I/O pin (bank 2) |
| Pino 55 | I/O — User I/O pin (bank 2) |
| Pino 56 | GND — Ground |
| Pino 57 | VCCIO2 — I/O bank 2 supply |
| Pino 58 | I/O — User I/O pin (bank 2) |
| Pino 59 | I/O — User I/O pin (bank 2) |
| Pino 60 | I/O — User I/O pin (bank 2) |
| Pino 61 | I/O — User I/O pin (bank 2) |
| Pino 62 | I/O — User I/O pin (bank 2) |
| Pino 63 | I/O — User I/O pin (bank 2) |
| Pino 64 | I/O — User I/O pin (bank 2) |
| Pino 65 | I/O — User I/O pin (bank 2) |
| Pino 66 | I/O — User I/O pin (bank 2) |
| Pino 67 | I/O — User I/O pin (bank 2) |
| Pino 68 | I/O — User I/O pin (bank 2) |
| Pino 69 | I/O — User I/O pin (bank 2) |
| Pino 70 | I/O — User I/O pin (bank 2) |
| Pino 71 | VCCINT — Core supply 3.3 V |
| Pino 72 | GND — Ground |
| Pino 73 | I/O — User I/O pin (bank 2) |
| Pino 74 | I/O — User I/O pin (bank 2) |
| Pino 75 | I/O — User I/O pin (bank 2) |
| Pino 76 | I/O — User I/O pin (bank 2) |
| Pino 77 | I/O — User I/O pin (bank 3) |
| Pino 78 | I/O — User I/O pin (bank 3) |
| Pino 79 | I/O — User I/O pin (bank 3) |
| Pino 80 | I/O — User I/O pin (bank 3) |
| Pino 81 | I/O — User I/O pin (bank 3) |
| Pino 82 | I/O — User I/O pin (bank 3) |
| Pino 83 | I/O — User I/O pin (bank 3) |
| Pino 84 | I/O — User I/O pin (bank 3) |
| Pino 85 | GND — Ground |
| Pino 86 | VCCIO3 — I/O bank 3 supply |
| Pino 87 | I/O — User I/O pin (bank 3) |
| Pino 88 | I/O — User I/O pin (bank 3) |
| Pino 89 | I/O — User I/O pin (bank 3) |
| Pino 90 | I/O — User I/O pin (bank 3) |
| Pino 91 | I/O — User I/O pin (bank 3) |
| Pino 92 | I/O — User I/O pin (bank 3) |
| Pino 93 | I/O — User I/O pin (bank 3) |
| Pino 94 | I/O — User I/O pin (bank 3) |
| Pino 95 | I/O — User I/O pin (bank 3) |
| Pino 96 | I/O — User I/O pin (bank 3) |
| Pino 97 | I/O — User I/O pin (bank 3) |
| Pino 98 | I/O — User I/O pin (bank 3) |
| Pino 99 | I/O — User I/O pin (bank 3) |
| Pino 100 | VCCINT — Core supply 3.3 V |
| Pino 101 | GND — Ground |
| Pino 102 | I/O — User I/O pin (bank 3) |
| Pino 103 | I/O — User I/O pin (bank 3) |
| Pino 104 | I/O — User I/O pin (bank 3) |
| Pino 105 | I/O — User I/O pin (bank 4) |
| Pino 106 | I/O — User I/O pin (bank 4) |
| Pino 107 | I/O — User I/O pin (bank 4) |
| Pino 108 | I/O — User I/O pin (bank 4) |
| Pino 109 | I/O — User I/O pin (bank 4) |
| Pino 110 | I/O — User I/O pin (bank 4) |
| Pino 111 | I/O — User I/O pin (bank 4) |
| Pino 112 | I/O — User I/O pin (bank 4) |
| Pino 113 | I/O — User I/O pin (bank 4) |
| Pino 114 | I/O — User I/O pin (bank 4) |
| Pino 115 | VCCIO4 — I/O bank 4 supply |
| Pino 116 | GND — Ground |
| Pino 117 | I/O — User I/O pin (bank 4) |
| Pino 118 | I/O — User I/O pin (bank 4) |
| Pino 119 | I/O — User I/O pin (bank 4) |
| Pino 120 | I/O — User I/O pin (bank 4) |
| Pino 121 | I/O — User I/O pin (bank 4) |
| Pino 122 | I/O — User I/O pin (bank 4) |
| Pino 123 | I/O — User I/O pin (bank 4) |
| Pino 124 | I/O — User I/O pin (bank 4) |
| Pino 125 | I/O — User I/O pin (bank 4) |
| Pino 126 | I/O — User I/O pin (bank 4) |
| Pino 127 | I/O — User I/O pin (bank 4) |
| Pino 128 | I/O — User I/O pin (bank 4) |
| Pino 129 | I/O — User I/O pin (bank 4) |
| Pino 130 | I/O — User I/O pin (bank 4) |
| Pino 131 | GND — Ground |
| Pino 132 | VCCINT — Core supply 3.3 V |
| Pino 133 | I/O — User I/O pin (bank 4) |
| Pino 134 | I/O — User I/O pin (bank 4) |
| Pino 135 | MSEL0 — Configuration mode select 0 |
| Pino 136 | MSEL1 — Configuration mode select 1 |
| Pino 137 | nCONFIG — Configuration control (active-low) |
| Pino 138 | nSTATUS — Configuration status (active-low) |
| Pino 139 | CONF_DONE — Configuration complete |
| Pino 140 | DCLK — Configuration clock |
| Pino 141 | DATA0 — Configuration data input |
| Pino 142 | TDI — JTAG test data in |
| Pino 143 | TMS — JTAG test mode select |
| Pino 144 | TCK — JTAG test clock |
Aplicações típicas
EPF6024ATC144-3S é adequado para 7 aplicaçãos: PCI Bus Bridge / Interface Logic, Glue-Logic Integration for Legacy Microprocessors, ATM / Telecom Channelizer, Video / Imaging Pipe-Line Control Logic, Industrial State-Machine Replacement, Legacy Board Repair / EOL Maintenance, Education / FPGA Training Platforms.
PCI Bus Bridge / Interface Logic
The EPF6024ATC144-3S is well matched to PCI 33 MHz/66 MHz bus bridge designs because its 142.86 MHz internal Fmax comfortably exceeds the 66 MHz PCI clock and its 117 user I/Os easily absorb the full 49-pin PCI bus plus parity, interrupt, and side-band signals. Engineers typically instantiate target/initiator state machines, address/data multiplexers, and configuration-space registers in the 1,960 logic elements. Compared to a discrete TTL/CPLD solution, the FLEX 6000 reduces board area, integrates bus-master arbitration, and supports in-system JTAG debugging that accelerates bring-up.
Recomendado
Glue-Logic Integration for Legacy Microprocessors
The EPF6024ATC144-3S serves as a unified glue-logic hub replacing 5-15 discrete 74-series TTL/MSI chips when interfacing legacy microprocessors to modern memories and peripherals. Its 196 LABs and 117 I/Os fit chip-select decoders, wait-state generators, bus multiplexers, and interrupt arbiters within a single footprint. The 3.3 V VCCINT allows direct interface to 3.3 V MCUs without level translation; the SRAM-based fabric supports design pivots late in the cycle via JTAG reconfiguration without board rework.
Recomendado
ATM / Telecom Channelizer
The EPF6024ATC144-3S was a workhorse for ATM cell delineation, AAL segmentation-and-reassembly, and T1/E1 channelizer implementations in late-1990s telecom equipment. Its 142.86 MHz Fmax sustains the 155 Mbps cell rate with comfortable margin, while the 117 I/Os support UTOPIA-style parallel PHY interfaces and HDLC framer connections. Designers mapped cell-header error-correction and SAR FIFOs into the embedded LE registers, using the JTAG port for in-system protocol debugging.
Recomendado
Video / Imaging Pipe-Line Control Logic
The EPF6024ATC144-3S is used to build timing controllers, sync separators, and pixel-format converters for legacy digital video equipment such as CCTV DVRs and broadcast format converters. Its 117 I/Os handle 18-24 bit parallel RGB buses plus HSYNC/VSYNC/DE and ancillary data, and the 142.86 MHz Fmax easily meets 480p/576p pixel clock requirements. The flexible LAB structure lets designers implement FIR filters for chroma interpolation entirely in fabric, eliminating a dedicated chroma IC.
Recomendado
Industrial State-Machine Replacement
The EPF6024ATC144-3S replaces multiple discrete state machines in industrial controllers, allowing new logic revisions to be downloaded via JTAG in the field rather than requiring chip swaps. With 196 LABs, designers can implement 4-8 independent Mealy/Moore state machines in parallel, each controlling a sub-system such as a motor driver, sensor multiplexer, or HMI keypad scanner. The 3.3 V core is tolerant of 5 V inputs on most I/O banks (with proper configuration), preserving compatibility with legacy industrial sensors.
Recomendado
Legacy Board Repair / EOL Maintenance
The EPF6024ATC144-3S is sourced today primarily for MRO (maintenance, repair, overhaul) of legacy boards whose original FLEX 6000 device has failed or been damaged. The TQFP-144 footprint and bitstream-format compatibility mean a direct swap restores functionality without board rework or firmware changes. For 10-year+ lifecycle programs in aerospace, defense, or industrial automation, sourcing this part from authorized brokers is the most cost-effective repair path versus redesign.
Recomendado
Education / FPGA Training Platforms
Universities and FPGA training labs used the EPF6024ATC144-3S as a teaching vehicle for introductory VHDL and Verilog design, since the device was supported by both Quartus MAX+PLUS II and early Quartus Prime flows. The 1,960 LEs provide enough headroom for student projects (UART cores, simple CPUs, VGA controllers) without overwhelming beginners. Today, surplus boards using this device are popular teaching aids in digital-logic curricula that emphasize SRAM-based configuration and JTAG boundary-scan.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF6024ATC144-3S — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF6024ATC144-3N | EPF6024ATC144-3 | EPF6024ATC144-2N | EPF6024ATC144-1N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | TQFP-144 | TQFP-144 | TQFP-144 | TQFP-144 | TQFP-144 |
| Logic Elements | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 |
| Speed Grade | -3 (142.86 MHz Fmax) | -3 (142.86 MHz) | -3 (142.86 MHz) | -2 (lower Fmax) | -1 (lowest Fmax) |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 |
| User I/Os | 117 | 117 | 117 | 117 | 117 |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lead-Free / RoHS | Standard finish | Yes (lead-free N suffix) | Standard finish (no suffix) | Yes (lead-free N suffix) | Yes (lead-free N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Configuration Memory | SRAM (requires boot PROM) | SRAM | SRAM | SRAM | SRAM |
Principais diferenciais
- Identical 142.86 MHz Fmax with lead-free terminal finish (vs EPF6024ATC144-3)
- Pin-compatible RoHS-compliant drop-in replacement (vs EPF6024ATC144-3N)
- Higher speed grade over cost-optimized siblings (vs EPF6024ATC144-2N / EPF6024ATC144-1N)
Notas de projeto
The EPF6024ATC144-3S draws its VCCINT core supply at 3.3 V from multiple package pins (5, 28, 71, 100, 132). Decouple each VCCINT pin with a 0.1 µF X7R ceramic placed within 5 mm of the pin, and add a single 10 µF bulk tantalum or polymer capacitor near the chip. VCCIO1-VCCIO4 banks can be powered independently from 2.5 V or 3.3 V depending on the I/O standard chosen in the Quartus MAX+PLUS II design; add a 0.1 µF + 10 µF pair on each bank to suppress simultaneous-switching noise.
Because the EPF6024ATC144-3S is SRAM-based, it loses its configuration on every power-down. Always include a compatible configuration PROM (EPC1, EPC2, EPC4, EPC8, or EPC16) on the board, or the FPGA will boot into an undefined state with all I/Os tri-stated. A common bring-up failure is leaving MSEL[1:0] floating - tie them through a 10 kΩ resistor to either VCC or GND to select the correct configuration mode (PS or AS).
Route JTAG signals TCK, TMS, TDI, TDO on the top layer with 50 Ω controlled impedance and keep them isolated from clock and switching I/O traces by at least 3W (3× trace width) to avoid configuration glitches. Place a 4.7 kΩ pull-up on nCONFIG and a 10 kΩ pull-up on nSTATUS per the FLEX 6000 datasheet to prevent spurious re-configuration events during power-ramp. The 144-pin TQFP has gull-wing leads on 1.0 mm pitch, so use a fine-pitch soldering iron or hot-air rework station for board repair.
The EPF6024ATC144-3S supports LVTTL, LVCMOS, PCI, and SSTL-3 I/O standards. For PCI 33 MHz/66 MHz applications, terminate the 66 MHz clock with a series 33 Ω resistor at the FPGA pin to dampen reflections. For LVDS inputs, ensure the 100 Ω differential termination is placed within 200 mils of the FPGA pin. Unused I/O pins default to tri-stated with weak pull-ups; explicitly disable them in the Quartus project to save ~0.5 mA per pin in the I CCINT supply.
Estimated: At Fmax = 142.86 MHz and full 117-I/O toggle, the EPF6024ATC144-3S dissipates approximately 0.6 W-0.8 W (input values: ICCINT ≈ 180 mA, ICCIO ≈ 30 mA at 3.3 V). The TQFP-144 package has a theta-JA of approximately 35 °C/W on a 4-layer PCB with 1 oz copper. Junction temperature rises 21-28 °C above ambient - no heatsink is required for typical commercial applications. For industrial-temperature designs, verify with the FLEX 6000 datasheet derating curves.
Informações de conformidade
Operating temperature range not confirmed in the verified data - flagged as [DATA_NEEDED] in specs. RoHS and REACH compliance not explicitly stated in the web search results; the EPF6024ATC144-3N variant is the lead-free RoHS-compliant substitute. AEC-Q100 not applicable - this is a commercial-grade FPGA.
