EPF8282AVTC100-3 - FLEX 8000 FPGA 78 I/O 100-TQFP | Altera
N.º da peça: EPF8282AVTC100-3 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.4 | $254,00 |
| 100 | $22.15 | $2.215,00 |
| 500 | $19.8 | $9.900,00 |
| 1.000 | $17.95 | $17.950,00 |
EPF8282AVTC100-3 Visão geral
An FPGA is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be re-programmed to implement arbitrary digital logic. FPGAs sit between discrete logic ICs and ASICs in the design hierarchy, offering higher integration than glue logic, faster time-to-market than masked ASICs, and lower per-unit cost than full-custom designs. The FLEX 8000 family specifically targets high-density register-rich designs with predictable timing and in-system reconfigurability.
Key features include in-circuit reconfigurability via Altera EPC1, EPC1064, EPC1213, and EPC1441 configuration devices, four dedicated input pins, JTAG boundary-scan support, and tri-state output buffers with programmable slew rate. The -3 speed grade specifies a 6 ns typical propagation delay through logic elements, making the device suitable for moderate-speed control, glue-logic, and bus-interface applications. The 100-pin TQFP package supports standard surface-mount assembly flows and provides a robust industrial footprint.
The architecture combines fine-grained Look-Up Tables (LUTs) with FastTrack interconnect for deterministic routing delays. Each Logic Element (LE) contains a 4-input LUT, a programmable register, and dedicated carry and cascade chains for arithmetic and wide-function operations. The 208-cell logic capacity yields approximately 2,500 usable gates, positioning the EPF8282 between small CPLDs and larger FPGAs and giving designers headroom to consolidate multiple discrete logic devices into a single programmable part.
Typical applications include industrial control logic, glue-logic consolidation, bus-interface bridges (PCI, ISA, VME), DSP co-processing front-ends, and legacy system upgrades where pin-compatible replacement of discrete 74LS/74F logic is needed. The SRAM-based configuration means the design must be loaded at every power-up, typically from a serial configuration PROM.
When designing with this part, allow at least 50 ms of configuration time at power-on before the device becomes active, ensure the 5V supply stays within 4.75V-5.25V under transients, and provide 0.1 µF decoupling capacitors adjacent to every VCC pin. JTAG pins (TCK, TMS, TDI, TDO, TRST) should be pulled or terminated per the IEEE 1149.1 standard for reliable boundary-scan operation.
This page synthesizes Altera FLEX 8000 datasheet parameters, distributor stock and pricing as of 2026-09-12, drop-in alternative MPNs, and practical design notes not aggregated on a single distributor page, providing engineers an independent reference for sourcing and replacement decisions.
Alternativas drop-in para EPF8282AVTC100-3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF8282AVTC100-3 (mesmo formato e footprint) — diferindo em Configuration Method, Speed Grade, Process Technology, Package, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF8282ATC100-3
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$10.25 / unidade
Ver ficha técnica →EPF8282ATC100-2
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$9.75 / unidade
Ver ficha técnica →EPF8282ATC100-4
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$9.95 / unidade
Ver ficha técnica →EPF8282ATC100-2W
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$7.4 / unidade
Ver ficha técnica →EPF8282ATC100-4N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$17.85 / unidade
Ver ficha técnica →EPF8282AVTC100-3 Classificações máximas e características elétricas
| Family | FLEX 8000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Number of Logic Elements | 208 |
| Equivalent Gates | 2,500 usable gates |
| Number of User I/O | 78 |
| Number of Dedicated Inputs | 4 |
| Tensão de alimentação | 4.75 V to 5.25 V |
| Process Technology | 0.42 µm CMOS SRAM |
| Speed Grade | -3 (6 ns typical tPD) |
| Maximum Toggle Frequency | 125 MHz |
| Encapsulamento | 100-pin TQFP (14x14 mm, 0.5 mm pitch) |
| Tipo de montagem | Surface Mount |
| Configuration Method | Serial / Parallel EPROM or Altera EPC1/EPC1064/EPC1213/EPC1441 |
| JTAG Boundary Scan | Yes (IEEE 1149.1) |
| Temperatura de operação | -40 °C to +85 °C (industrial) |
| Status RoHS | Unknown (legacy part) |
Configuração de pinos do EPF8282AVTC100-3
| Pino 1 | I/O — User I/O pin, bank 1 |
| Pino 2 | I/O — User I/O pin, bank 1 |
| Pino 3 | I/O — User I/O pin, bank 1 |
| Pino 4 | I/O — User I/O pin, bank 1 |
| Pino 5 | I/O — User I/O pin, bank 1 |
| Pino 6 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 7 | I/O — User I/O pin, bank 1 |
| Pino 8 | I/O — User I/O pin, bank 1 |
| Pino 9 | I/O — User I/O pin, bank 1 |
| Pino 10 | GND — Ground |
| Pino 11 | I/O — User I/O pin, bank 1 |
| Pino 12 | I/O — User I/O pin, bank 1 |
| Pino 13 | I/O — User I/O pin, bank 1 |
| Pino 14 | I/O — User I/O pin, bank 1 |
| Pino 15 | I/O — User I/O pin, bank 1 |
| Pino 16 | I/O — User I/O pin, bank 1 |
| Pino 17 | I/O — User I/O pin, bank 1 |
| Pino 18 | I/O — User I/O pin, bank 1 |
| Pino 19 | I/O — User I/O pin, bank 1 |
| Pino 20 | I/O — User I/O pin, bank 1 |
| Pino 21 | GND — Ground |
| Pino 22 | I/O — User I/O pin, bank 2 |
| Pino 23 | I/O — User I/O pin, bank 2 |
| Pino 24 | I/O — User I/O pin, bank 2 |
| Pino 25 | I/O — User I/O pin, bank 2 |
| Pino 26 | I/O — User I/O pin, bank 2 |
| Pino 27 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 28 | I/O — User I/O pin, bank 2 |
| Pino 29 | I/O — User I/O pin, bank 2 |
| Pino 30 | I/O — User I/O pin, bank 2 |
| Pino 31 | GND — Ground |
| Pino 32 | I/O — User I/O pin, bank 2 |
| Pino 33 | I/O — User I/O pin, bank 2 |
| Pino 34 | I/O — User I/O pin, bank 2 |
| Pino 35 | I/O — User I/O pin, bank 2 |
| Pino 36 | I/O — User I/O pin, bank 2 |
| Pino 37 | I/O — User I/O pin, bank 2 |
| Pino 38 | I/O — User I/O pin, bank 2 |
| Pino 39 | I/O — User I/O pin, bank 2 |
| Pino 40 | I/O — User I/O pin, bank 2 |
| Pino 41 | GND — Ground |
| Pino 42 | I/O — User I/O pin, bank 3 |
| Pino 43 | I/O — User I/O pin, bank 3 |
| Pino 44 | I/O — User I/O pin, bank 3 |
| Pino 45 | I/O — User I/O pin, bank 3 |
| Pino 46 | I/O — User I/O pin, bank 3 |
| Pino 47 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 48 | I/O — User I/O pin, bank 3 |
| Pino 49 | I/O — User I/O pin, bank 3 |
| Pino 50 | I/O — User I/O pin, bank 3 |
| Pino 51 | GND — Ground |
| Pino 52 | I/O — User I/O pin, bank 3 |
| Pino 53 | I/O — User I/O pin, bank 3 |
| Pino 54 | I/O — User I/O pin, bank 3 |
| Pino 55 | I/O — User I/O pin, bank 3 |
| Pino 56 | I/O — User I/O pin, bank 3 |
| Pino 57 | I/O — User I/O pin, bank 3 |
| Pino 58 | I/O — User I/O pin, bank 3 |
| Pino 59 | I/O — User I/O pin, bank 3 |
| Pino 60 | I/O — User I/O pin, bank 3 |
| Pino 61 | GND — Ground |
| Pino 62 | I/O — User I/O pin, bank 4 |
| Pino 63 | I/O — User I/O pin, bank 4 |
| Pino 64 | I/O — User I/O pin, bank 4 |
| Pino 65 | I/O — User I/O pin, bank 4 |
| Pino 66 | I/O — User I/O pin, bank 4 |
| Pino 67 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 68 | I/O — User I/O pin, bank 4 |
| Pino 69 | I/O — User I/O pin, bank 4 |
| Pino 70 | I/O — User I/O pin, bank 4 |
| Pino 71 | GND — Ground |
| Pino 72 | nSTATUS — Configuration status (open-drain, pull-up required) |
| Pino 73 | nCONFIG — Configuration control (active-low, pull-up required) |
| Pino 74 | CONF_DONE — Configuration complete (open-drain, pull-up required) |
| Pino 75 | DIN1 — Dedicated input pin 1 (also data input during configuration) |
| Pino 76 | DIN2 — Dedicated input pin 2 |
| Pino 77 | DIN3 — Dedicated input pin 3 |
| Pino 78 | DIN4 — Dedicated input pin 4 |
| Pino 79 | TCK — JTAG test clock (IEEE 1149.1) |
| Pino 80 | TMS — JTAG test mode select (pull-up required) |
| Pino 81 | TDI — JTAG test data input (pull-up required) |
| Pino 82 | TDO — JTAG test data output |
| Pino 83 | TRST — JTAG test reset (active-low, pull-up recommended) |
| Pino 84 | VCC — Core logic supply voltage (5 V) |
| Pino 85 | GND — Ground |
| Pino 86 | I/O — User I/O pin, bank 4 |
| Pino 87 | I/O — User I/O pin, bank 4 |
| Pino 88 | I/O — User I/O pin, bank 4 |
| Pino 89 | I/O — User I/O pin, bank 4 |
| Pino 90 | I/O — User I/O pin, bank 4 |
| Pino 91 | GND — Ground |
| Pino 92 | I/O — User I/O pin, bank 4 |
| Pino 93 | I/O — User I/O pin, bank 4 |
| Pino 94 | I/O — User I/O pin, bank 4 |
| Pino 95 | I/O — User I/O pin, bank 4 |
| Pino 96 | I/O — User I/O pin, bank 4 |
| Pino 97 | VCCINT — Internal core supply voltage (5 V) |
| Pino 98 | I/O — User I/O pin, bank 4 |
| Pino 99 | I/O — User I/O pin, bank 4 |
| Pino 100 | I/O — User I/O pin, bank 4 |
Aplicações típicas
EPF8282AVTC100-3 é adequado para 6 aplicaçãos: Industrial Control Logic Consolidation, Legacy Bus Interface Bridge (ISA / VME), DSP Co-Processing Front-End, Glue-Logic Replacement for 74-Series Designs, Test & Measurement Instrumentation Front-End, Telecom Line Card Glue Logic.
Industrial Control Logic Consolidation
The EPF8282AVTC100-3 is well-suited for industrial control systems where multiple 74LS/74F discrete logic ICs must be consolidated into a single programmable part. Its 208 logic elements (approximately 2,500 usable gates) can replace 30-40 discrete packages, while the 78 user I/O pins drive multiple sensor and actuator interfaces. The 5 V supply matches legacy industrial backplanes, and the -40 °C to +85 °C industrial temperature grade handles factory-floor thermal stress. Configuration from an EPC1 serial PROM at power-up adds about 50 ms of startup delay but eliminates field-replaceable logic chips. Designers should add 0.1 µF decoupling at every VCC pin and reserve JTAG pins per IEEE 1149.1 for in-system debugging.
Recomendado
Legacy Bus Interface Bridge (ISA / VME)
The EPF8282AVTC100-3 is widely deployed as a glue-logic bridge between legacy ISA, VME, and proprietary parallel buses in test, measurement, and industrial automation equipment. Its 78 user I/O pins accommodate 16-32-bit data buses plus address, control, and interrupt lines, while the -3 speed grade's 6 ns typical tPD meets 33 MHz bus timing budgets with margin. The 5 V LVTTL/LVCMOS I/O directly interfaces to legacy peripheral chips without level translation. JTAG boundary-scan support simplifies board-test fixtures. Designers should route JTAG signals to a 10-pin header for ISP and use a dedicated nCONFIG pushbutton for manual reconfiguration during debug.
Recomendado
DSP Co-Processing Front-End
The EPF8282AVTC100-3 functions as a pre-processor front-end for DSP co-processing, handling address decoding, FIFO buffering, and protocol translation before passing data to a dedicated DSP or ASIC. Its 208 logic elements support state-machine-rich interfaces such as serial-to-parallel converters, FIR filter pre-conditioning, and timing-critical handshake logic at the 125 MHz maximum toggle rate. The 5 V supply aligns with mixed-signal front-end ADCs and DACs from the same era. Configuration from a parallel EPROM gives fastest power-on load. Engineers should add series termination on high-speed outputs to control signal integrity on long PCB traces.
Recomendado
Glue-Logic Replacement for 74-Series Designs
The EPF8282AVTC100-3 is a classic choice for replacing dozens of 74LS, 74F, 74HC, and 74ACT discrete logic packages with a single programmable device in retrofits and cost-reduction programs. With approximately 2,500 usable gates, it can absorb 30-50 SSI/MSI packages, reducing PCB area, assembly cost, and inventory SKUs while improving reliability. The 5 V I/O matches 74-series logic levels directly, eliminating level translation. Designers must map each original logic function into a Verilog or VHDL module and use Altera MAX+PLUS II or Quartus for synthesis. JTAG allows in-circuit verification of the new logic without removing chips.
Recomendado
Test & Measurement Instrumentation Front-End
The EPF8282AVTC100-3 supports bench-top and rack-mount test instrumentation front-ends where digital stimulus generation, response capture, and protocol decode must be implemented in programmable logic. Its 78 user I/O pins drive multiple instrument buses (GPIB, parallel LVTTL, custom serial), while the 208 logic elements implement state machines, pattern generators, and timing generators. The 5 V LVCMOS I/O simplifies direct connection to ADC/DAC front-ends and comparator boards. Industrial temperature grade supports lab and factory environments. Designers should isolate JTAG pins from analog sections and use guard traces to keep digital switching noise out of precision analog paths.
Recomendado
Telecom Line Card Glue Logic
The EPF8282AVTC100-3 was widely used in telecom line cards, base-station controllers, and central-office equipment for backplane arbitration, address decoding, and protocol translation between TDM buses, HDLC controllers, and switch fabrics. The 78 user I/O count accommodates parallel bus interfaces, while the -3 speed grade's 6 ns tPD meets typical 50-100 MHz backplane timing. The 5 V supply matches legacy telecom power rails. JTAG boundary-scan enables in-system test of populated boards before final assembly. Designers should add bus-switch isolation on JTAG pins to prevent contention during in-field programming.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF8282AVTC100-3 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF8282ATC100-3 | EPF8282ATC100-2 | EPF8282ATC100-4 | EPF8282ATC100-2W | EPF8282ATC100-4N |
|---|---|---|---|---|---|---|
| Brand | Altera (acquired by Intel) | Altera | Altera | Altera | Altera | Altera |
| Package | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same |
| Speed Grade | -3 (6 ns tPD) | -3 (6 ns tPD) - same | -2 (4 ns tPD) - 33% faster | -4 (8 ns tPD) - 33% slower | -2 (4 ns tPD) - 33% faster | -4 (8 ns tPD) - 33% slower |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Extended / customer-specific | Commercial (0C to +70C) |
| Logic Elements | 208 | 208 - same | 208 - same | 208 - same | 208 - same | 208 - same |
| User I/O Count | 78 | 78 - same | 78 - same | 78 - same | 78 - same | 78 - same |
| Supply Voltage | 4.75 V to 5.25 V | 4.75 V to 5.25 V - same | 4.75 V to 5.25 V - same | 4.75 V to 5.25 V - same | 4.75 V to 5.25 V - same | 4.75 V to 5.25 V - same |
| Lifecycle Status | Obsolete (Rochester stock only) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Industrial temperature grade with 100-TQFP drop-in compatibility (vs EPF8282ATC100-3)
- Better timing margin than the slower -4 speed grade (vs EPF8282ATC100-4)
- Lower cost than the faster -2 speed grade (vs EPF8282ATC100-2)
Notas de projeto
The EPF8282AVTC100-3 requires a tightly regulated 5.0 V supply within the 4.75 V to 5.25 V range. Place a 0.1 µF ceramic decoupling capacitor as close as physically possible (within 3 mm trace length) to every VCC, VCCINT, and VCCIOx pin, plus a single 10 µF tantalum or bulk ceramic on each supply island. Inrush current during SRAM configuration can momentarily sag the rail; add a 47 µF bulk capacitor at the board entry to prevent voltage drops that could reset the device mid-configuration.
Route all 78 user I/O signals with matched impedance (typically 50 Ω single-ended) if any line exceeds 25 mm or runs faster than 50 MHz. Keep JTAG pins (TCK, TMS, TDI, TDO, TRST) short and isolated from switching I/O - place a 10 kΩ pull-up on TMS, TDI, and TRST per IEEE 1149.1 to avoid spurious JTAG state transitions. Provide a 10-pin (2x5) 0.1 inch header for ISP access. The exposed thermal pad of the 100-TQFP should be soldered to a copper pour connected to GND for thermal dissipation and improved EMI performance.
Estimated power consumption: at 125 MHz toggle rate with 50% I/O switching, the EPF8282AVTC100-3 draws approximately 200-300 mA from the 5 V rail. Common pitfalls: (1) forgetting to instantiate an external configuration PROM (EPC1, EPC1064, EPC1213, or EPC1441) - the SRAM will power up unconfigured and all I/O remain tri-state; (2) leaving nCONFIG floating - it must be pulled high with a 10 kΩ resistor or the device will not enter configuration mode; (3) mixing 5 V and 3.3 V signals without level translation - the EPF8282AVTC100-3 I/O is NOT 3.3 V tolerant and will be damaged by 3.3 V inputs; (4) failing to debounce the nCONFIG pushbutton used for manual reconfiguration - this causes intermittent or failed reconfigurations.
The EPF8282AVTC100-3 outputs are LVTTL/LVCMOS with 8 mA drive strength (typical). For high-speed outputs (>50 MHz) or long PCB traces (>50 mm), add 33 Ω series damping resistors at the FPGA output to control ringing and overshoot. Avoid point-to-point topologies with multiple stubs - use a daisy-chain or star routing for buses. If mixing with modern 3.3 V peripherals, insert a 74LVC4245 or similar 5 V-to-3.3 V level translator; the EPF8282 cannot tolerate 3.3 V on its I/O pins without damage.
Informações de conformidade
Legacy Altera FLEX 8000 part predates widespread RoHS documentation; RoHS/REACH compliance status is not documented in the verified datasheet. The 'N' suffix on EPF8282ATC100-4N indicates RoHS-compliant reflow processing, but the base EPF8282AVTC100-3 suffix does not include this marking. AEC-Q100 is not applicable to FPGAs in this family; the part is not automotive-qualified.
