EPF8282ATC100-4N - FLEX 8000 FPGA 2.5K Gates 100-TQFP | Altera
MPN: EPF8282ATC100-4N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.75 | $327.50 |
| 100 | $26.4 | $2,640.00 |
| 500 | $21.1 | $10,550.00 |
| 1,000 | $17.85 | $17,850.00 |
Drop-in alternatives for EPF8282ATC100-4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPF8282ATC100-3
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$10.25 / Unit
View Datasheet βEPF8282ATC100-2
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$9.75 / Unit
View Datasheet βEPF8282ATC100-3N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EPF8282ATC100-4
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$9.95 / Unit
View Datasheet βEPF8282ATC100-4N Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Gates | 2,500 gates |
| Logic Cells | 208 cells |
| Logic Array Blocks (LABs) | 26 LABs |
| Number of I/Os | 78 I/O |
| Number of Dedicated Inputs | 4 (clock, clear, preset fast inputs) |
| Operating Frequency (max) | 125 MHz |
| Process Technology | 0.42 Β΅m CMOS |
| Supply Voltage | 5 V |
| Package | 100-pin TQFP (Thin Quad Flat Pack) |
| Speed Grade | -4 (commercial) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 Β°C to +70 Β°C (commercial) |
| Configuration Method | External serial configuration device (e.g. EPC1/EPC2) |
EPF8282ATC100-4N Pin Configuration
| Pin 1 | I/O β User I/O pin (general purpose) |
| Pin 2 | I/O β User I/O pin (general purpose) |
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| Pin 10 | I/O β User I/O pin (general purpose) |
| Pin 11 | VCC β 5 V supply voltage |
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| Pin 21 | GND β Ground |
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| Pin 49 | GND β Ground |
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| Pin 77 | VCC β 5 V supply voltage |
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Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8282ATC100-4N is suitable for 6 applications: 32-Bit Bus Integration in Industrial Control, Telecom Peripheral Interfacing and Glue Logic, Custom State Machines in Test and Measurement, Replacement of Multiple SSI/MSI Logic ICs, Legacy 5V System Design and Migration Platform, Prototyping Platform for ASIC Replacement.
32-Bit Bus Integration in Industrial Control
The EPF8282ATC100-4N's 78 user I/Os and 100-pin TQFP package make it well-suited for consolidating multiple parallel buses in industrial control systems. According to the Altera datasheet, the high-pin-count packages in the FLEX 8000 family are specifically designed to integrate multiple 32-bit buses onto a single device, replacing several discrete TTL buffers and transceivers. The 2,500 gates and 208 logic cells provide sufficient capacity for address decoding, bus arbitration, and protocol glue logic. The 5 V supply matches legacy industrial backplanes, and the dedicated clock/clear/preset fast inputs support synchronous state-machine designs typical in PLC and motor-control applications. Compared to discrete logic, the EPF8282ATC100-4N reduces PCB area and BOM count while adding design flexibility through in-system reprogrammability.
Recommended
Telecom Peripheral Interfacing and Glue Logic
In telecom and networking equipment of the 1990s-2000s era, the EPF8282ATC100-4N served as a flexible glue-logic device interfacing processors to peripheral ICs such as UARTs, DSPs, and framers. Its 78 I/Os provide ample connectivity for address/data buses plus control signals, while the 208-cell logic capacity easily absorbs dozens of SSI/MSI replacement functions. The LUT-based architecture with dedicated carry and cascade chains accelerates arithmetic operations such as CRC generation and HDLC framing commonly used in telecom designs. The 5 V tolerant I/O matches legacy 5 V peripheral interfaces, eliminating level-shifters. Engineers appreciated the in-system reprogrammability, which allowed late-stage design changes and field upgrades without board rework, a critical advantage during rapid telecom standards evolution.
Recommended
Custom State Machines in Test and Measurement
Test and measurement instruments often require custom state machines that are awkward to implement in discrete logic but too small to justify ASIC development. The EPF8282ATC100-4N addresses this niche with 208 logic cells enough for complex sequencing logic, 78 I/Os for instrument front-panel and backplane signals, and the FLEX 8000 architecture's fast-input pins for clock and control signals. The 125 MHz internal performance supports real-time instrument control loops. The 100-pin TQFP package enables compact PCB designs in portable test equipment, while the 5 V supply aligns with legacy analog front-end ICs. Designers benefit from MAX+PLUS II or Quartus development environment support, with logic synthesis from VHDL or Verilog HDL descriptions, accelerating development of instrument-specific control sequences.
Recommended
Replacement of Multiple SSI/MSI Logic ICs
A classic application of the EPF8282ATC100-4N is consolidating dozens of discrete 74-series TTL or 4000-series CMOS logic ICs into a single programmable device. With 2,500 gates and 208 logic cells, the EPF8282ATC100-4N can replace 10-20 SSI chips (gates, flip-flops, multiplexers, counters) in a typical board design. The 78 user I/Os accommodate the signal count of such designs, while the 5 V supply matches the legacy 5 V logic ecosystem. The FLEX 8000 architecture's bypassable flip-flop option allows purely combinatorial functions by routing LUT outputs straight to I/O pins, minimizing latency for glue logic. Reduced PCB area, lower power consumption, simplified BOM, and in-system reprogrammability are the key engineering wins versus discrete implementations.
Recommended
Legacy 5V System Design and Migration Platform
The EPF8282ATC100-4N's 5 V core and I/O supply directly supports legacy 5 V digital systems without level shifting, making it valuable for maintaining and extending legacy equipment. Many industrial, military, and aerospace systems from the 1990s use 5 V logic exclusively, and modern FPGAs typically require 3.3 V or lower core voltages. The 0.42 Β΅m CMOS process and 5 V tolerance position the EPF8282ATC100-4N as one of the last-generation FPGAs to natively support 5 V I/O. The 100-pin TQFP package provides high I/O count for complex legacy bus architectures. While the part is obsolete, distributors still hold inventory, and the FLEX 8000 toolchain (MAX+PLUS II, Quartus legacy versions) remains available for design reuse and incremental feature additions to existing systems.
Recommended
Prototyping Platform for ASIC Replacement
Before ASIC fabrication, the EPF8282ATC100-4N served as a high-density prototyping platform enabling engineers to validate ASIC designs in silicon before committing to mask costs. With 2,500 gates and 208 logic cells, the EPF8282ATC100-4N accommodates mid-complexity ASIC designs in the 1,500-3,000 gate range. The LUT-based FLEX 8000 architecture mirrors the synthesis flow used for ASIC implementation, easing migration from FPGA prototype to ASIC production. The 100-pin TQFP package supports the same signal assignment as many QFP-packaged ASICs, simplifying pin-compatibility verification. Although obsolete today, the EPF8282ATC100-4N remains in use at universities, research labs, and aerospace retrofit programs where 5 V tolerance and proven design tools are mandatory.
Recommended
Recommended Products Summary
Engineering reference data for EPF8282ATC100-4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8282ATC100-3 | EPF8282ATC100-2 | EPF8282ATC100-3N | EPF8282ATC100-4 |
|---|---|---|---|---|---|
| Package | 100-pin TQFP | 100-pin TQFP (same) | 100-pin TQFP (same) | 100-pin TQFP (same) | 100-pin TQFP (same) |
| Brand | Altera | Altera (same) | Altera (same) | Altera (same) | Altera (same) |
| Speed Grade | -4 (slowest commercial) | -3 (faster) | -2 (fastest commercial) | -3 (faster) | -4 (same) |
| Logic Gates | 2,500 | 2,500 (same) | 2,500 (same) | 2,500 (same) | 2,500 (same) |
| Logic Cells | 208 | 208 (same) | 208 (same) | 208 (same) | 208 (same) |
| User I/Os | 78 | 78 (same) | 78 (same) | 78 (same) | 78 (same) |
| Supply Voltage | 5 V | 5 V (same) | 5 V (same) | 5 V (same) | 5 V (same) |
| Lead-Free Finish | Yes (N suffix) | No (SnPb) | No (SnPb) | Yes (N suffix) | No (SnPb) |
| Max Internal Frequency | 125 MHz | 125 MHz (same die, faster grade) | 125 MHz (same die, fastest grade) | 125 MHz (same die, faster grade) | 125 MHz (same) |
Key Differentiators
- Highest I/O count in the EPF8282 family at 78 user I/Os (vs EPF8282ALC84-4N (84-pin PLCC))
- Surface-mount TQFP package suitable for modern reflow assembly (vs EPF8282ALI84-4 (84-pin PLCC))
- Lead-free (Pb-free) 'N' finish for RoHS compliance (vs EPF8282ATC100-4 (SnPb finish))
Design Notes
The EPF8282ATC100-4N requires a stable 5 V Β±5% supply on VCC pins (multiple VCC pins distributed across the package) with adequate decoupling. Place 0.1 Β΅F ceramic capacitors close to each VCC pin, plus a bulk 10-47 Β΅F tantalum or electrolytic capacitor near the device. The 0.42 Β΅m CMOS core draws dynamic current proportional to switching frequency and logic utilization; at 50 MHz with 50% utilization, expect approximately 100-200 mA core current. Add a 10 Β΅F bulk capacitor at the board input to suppress transient current spikes during configuration. The dedicated VCC pins and GND pins must all be connected; leaving any VCC or GND pin floating causes logic errors and potential latch-up.
Estimated: at full 125 MHz operation with 80% logic utilization, the EPF8282ATC100-4N dissipates approximately 0.5-1.0 W. The 100-pin TQFP package has a typical theta_JA of 50-60 Β°C/W (estimated, no datasheet figure available), giving a junction temperature rise of 25-60 Β°C above ambient. For commercial temperature range (0 Β°C to +70 Β°C), operation up to 60 Β°C ambient is comfortable without a heatsink. For enclosed industrial housings, ensure 100+ LFM airflow or attach a small clip-on heatsink. The TQFP package does not have an exposed thermal pad; thermal performance relies on the lead frame and PCB copper pours.
Route all user I/O signals on inner or top PCB layers with controlled impedance if signals exceed 50 MHz. Place the EPC1 or EPC2 serial configuration device within 2 inches of the FLEX 8000 device to keep the configuration clock (DCLK) trace short and avoid reflections. Use a ground plane on layer 2 directly beneath the TQFP to minimize ground bounce and provide low-impedance return paths. Separate analog and digital grounds if any analog signals interface to user I/Os. The JTAG pins (TDI, TDO, TMS, TCK) require 10 kΞ© pull-ups on TDI, TMS, TCK per IEEE 1149.1 boundary-scan requirements. Allow space for a JTAG header (2x5 or 2x10 pin, 0.1 inch pitch) for programming and debug access.
Common pitfalls with the EPF8282ATC100-4N include: (1) Forgetting to connect all VCC and GND pins, which causes logic errors. (2) Using the wrong configuration device - the EPC1 supports 5 V operation while the EPC1441 and EPC2 variants have different voltage and density options; consult the FLEX 8000 configuration handbook. (3) Driving user I/Os beyond 5.5 V absolute maximum, which damages the device. (4) Leaving JTAG pins floating, which causes unreliable boundary-scan operation. (5) Assuming bitstream compatibility across speed grades - the same .sof file works on all EPF8282ATC100-x variants, but the MAX+PLUS II or Quartus programmer must be configured for the correct device and speed grade.
Compliance Information
RoHS compliant per the 'N' suffix denoting lead-free terminal finish (Pb-free). REACH, halogen-free, and conflict-minerals declarations were not found in the verified web data; consult Altera/Intel product compliance documentation. AEC-Q100 is not applicable as the part is not automotive-qualified.