Intel

EPM1270T144C3N - MAX II 1270 LE CPLD, 144-pin TQFP | Intel

N.º da peça: EPM1270T144C3N ✓ Ativo

Em estoque Enviado em 1 a 3 dias úteis

1.8 V Vdss 144-pin TQFP (T144) Package C3 (commercial, -3) Speed 8 Kbits Memory

A partir de $12.75 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-11

Preços por volume

Qtd.	Preço unitário	Total
1	$18.5	$18,50
10	$16.85	$168,50
100	$15.2	$1.520,00
500	$13.9	$6.950,00
1.000	$12.75	$12.750,00

ℹ️ Todos os preços estão em USD

Ver datasheet (PDF) Ver alternativas

Quantidade

EPM1270T144C3N Visão geral

The Intel (formerly Altera) EPM1270T144C3N is a low-power, non-volatile MAX II Complex Programmable Logic Device (CPLD) with 1270 logic elements, housed in a 144-pin TQFP package. Operating from a single 1.8 V core supply (VCCINT) with 3.3 V I/O (VCCIO), it delivers up to 300 MHz internal performance and instant-on operation thanks to on-chip Flash configuration memory.

A Complex Programmable Logic Device (CPLD) is a non-volatile digital IC that implements combinatorial and sequential logic using a macrocell-based architecture with a centralized interconnect. CPLDs sit below FPGAs in the programmable logic hierarchy (CPLD -> PLD -> programmable logic -> digital IC), offering deterministic timing, instant-on configuration, and high drive strength ideal for glue logic, bus bridging, and power-up sequencing.

Key features include 1270 logic elements (LEs), 980 equivalent macrocells, 8 Kbits of user Flash memory (UFM), 212 maximum user I/O pins, and MultiVolt I/O support for 1.5 V, 1.8 V, 2.5 V, 3.3 V interfaces. The device supports in-system programmability via IEEE 1149.1 JTAG and IEEE 1532, and offers 4-input look-up tables (LUTs) per logic element.

Architecturally, the EPM1270 uses a classic MAX II LAB (Logic Array Block) structure with 16 macrocells per LAB, fast propagation delays (~3.6 ns pin-to-pin at -3 speed grade), and low standby current (~29 mA typical). The on-chip UFM supports up to 8 Kbits of non-volatile user storage, eliminating the need for external EEPROM for parameter storage.

Typical applications include bus-interface bridging (e.g., 8/16/32-bit MCU-to-peripheral glue logic), power-up sequencing for FPGAs/ASICs, LED control and display driving, I/O expansion for microcontrollers, and replacement of multiple discrete 74-series logic gates. The wide MultiVolt I/O makes it ideal for mixed-voltage system designs.

When designing with this device, evaluate total I/O count against the 212-pin maximum, and derate by at least 10% for routing flexibility. Always use the Quartus II or Intel Quartus Prime design software (free Web Edition) for synthesis, fitting, and JTAG programming. The T144 suffix denotes the 144-pin TQFP package; alternate package options (100-pin TQFP, 256-pin FineLine BGA) are available in the same EPM1270 die family.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing engineers with a single reference for sourcing, replacement, and application guidance.

Alternativas drop-in para EPM1270T144C3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EPM1270T144C3N (mesmo formato e footprint) — diferindo em Package, Programming Interface, Configuration Memory, Operating Temperature, Speed Grade.

EPM1270T144A5N

Intel

Package: 144-TQFP (T144, 20x20 mm)

Programming Interface: JTAG (IEEE 1149.1) / ISP

Comparar com EPM1270T144C3N →

EPM1270T144C4N

Intel

Package: TQFP-144 (T144) 22x22 mm

Configuration Memory: On-chip Flash (non-volatile, instant-on)

Comparar com EPM1270T144C3N →

EPM1270T144C5N

Altera

Package: TQFP-144 (T144), 22 x 22 mm, 0.5 mm pitch

Programming Interface: JTAG (IEEE 1149.1), In-System Programmable

Operating Temperature: 0 °C to +85 °C (Commercial)

Comparar com EPM1270T144C3N →

EPM1270T144I5N

Intel

Package: 144-pin TQFP (TQ)

Programming Interface: JTAG (IEEE 1149.1)

Configuration Memory: Non-volatile Flash (ISP)

Comparar com EPM1270T144C3N →

EPM1270TI144C5N

Intel

Package: 144-pin TQFP

Configuration Memory: On-chip flash (non-volatile, instant-on)

Comparar com EPM1270T144C3N →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EPM1270T144A5N

✅ Drop-In

Intel

📦 TQFP-144 (T144)

CPLD (Complex Programmable Logic Device) · MAX II · 1270 · 980 · 116 · 8192 bits (8 Kbit) · 6.2 ns · 2.5 V / 3.3 V

✓ Em estoque

$32.94 / unidade

Ver ficha técnica →

EPM1270T144C3

✅ Drop-In

📦 TQFP-144 (T144)

same die, same -3 speed grade, no 'N' suffix (non Pb-free marking variant) - pin-to-pin identical

📋 Alternativa de referência (fora do catálogo)

EPM1270T144C4N

✅ Drop-In ⚠️ Especificações não verificadas

Intel

📦 TQFP-144 (T144)

MAX II · CPLD - Complex Programmable Logic Device · 980 · 980 · 16 · 80 · 8 Kbit · 247.5 MHz

✓ Em estoque

$10.45 / unidade

Ver ficha técnica →

EPM1270T144C5N

✅ Drop-In ⚠️ Especificações não verificadas

Altera

📦 TQFP-144 (T144)

MAX II · CPLD (Complex Programmable Logic Device) · 980 · 1270 · 212 · 127 · 0.18 µm · 6.2 ns

✓ Em estoque

$19.75 / unidade

Ver ficha técnica →

EPM1270T144I5N

✅ Drop-In

Intel

📦 TQFP-144 (T144)

MAX II · CPLD (Complex Programmable Logic Device) · 980 · 16 · 212 · 201.1 MHz · 2.5 V / 3.3 V · 1.5 V / 1.8 V / 2.5 V / 3.3 V

✓ Em estoque

$23.4 / unidade

Ver ficha técnica →

EPM1270T144C3N Classificações máximas e características elétricas

Device Family	MAX II
Logic Elements (LEs)	1270
Equivalent Macrocells	980
User Flash Memory (UFM)	8 Kbits
Maximum User I/O	212
Operating Voltage (VCCINT)	1.8 V
I/O Voltage (VCCIO)	1.5 V / 1.8 V / 2.5 V / 3.3 V
Speed Grade	C3 (commercial, -3)
Encapsulamento	144-pin TQFP (T144)
Temperatura de operação	0C to +85C (commercial)
Configuration Memory	Internal Flash (non-volatile, instant-on)
Programming Interface	JTAG (IEEE 1149.1) / IEEE 1532
Tipo de montagem	Surface Mount
Status RoHS	Compliant
LE Family	MAX II (low-power, non-volatile)

Configuração de pinos do EPM1270T144C3N

Pino 1	I/O — User I/O (bank 1)
Pino 2	I/O — User I/O (bank 1)
Pino 3	I/O — User I/O (bank 1)
Pino 4	I/O — User I/O (bank 1)
Pino 5	VCCIO1 — I/O bank 1 supply voltage
Pino 6	I/O — User I/O (bank 1)
Pino 7	I/O — User I/O (bank 1)
Pino 8	I/O — User I/O (bank 1)
Pino 9	I/O — User I/O (bank 1)
Pino 10	GND — Ground
Pino 11	I/O — User I/O (bank 2)
Pino 12	I/O — User I/O (bank 2)
Pino 13	I/O — User I/O (bank 2)
Pino 14	I/O — User I/O (bank 2)
Pino 15	VCCIO2 — I/O bank 2 supply voltage
Pino 16	I/O — User I/O (bank 2)
Pino 17	I/O — User I/O (bank 2)
Pino 18	I/O — User I/O (bank 2)
Pino 19	I/O — User I/O (bank 2)
Pino 20	GND — Ground
Pino 21	I/O — User I/O (bank 3)
Pino 22	I/O — User I/O (bank 3)
Pino 23	I/O — User I/O (bank 3)
Pino 24	I/O — User I/O (bank 3)
Pino 25	VCCIO3 — I/O bank 3 supply voltage
Pino 26	I/O — User I/O (bank 3)
Pino 27	I/O — User I/O (bank 3)
Pino 28	I/O — User I/O (bank 3)
Pino 29	I/O — User I/O (bank 3)
Pino 30	GND — Ground
Pino 31	I/O — User I/O (bank 4)
Pino 32	I/O — User I/O (bank 4)
Pino 33	I/O — User I/O (bank 4)
Pino 34	I/O — User I/O (bank 4)
Pino 35	VCCIO4 — I/O bank 4 supply voltage
Pino 36	I/O — User I/O (bank 4)
Pino 37	I/O — User I/O (bank 4)
Pino 38	I/O — User I/O (bank 4)
Pino 39	I/O — User I/O (bank 4)
Pino 40	GND — Ground
Pino 41	I/O — User I/O (bank 5)
Pino 42	I/O — User I/O (bank 5)
Pino 43	I/O — User I/O (bank 5)
Pino 44	I/O — User I/O (bank 5)
Pino 45	VCCIO5 — I/O bank 5 supply voltage
Pino 46	I/O — User I/O (bank 5)
Pino 47	I/O — User I/O (bank 5)
Pino 48	I/O — User I/O (bank 5)
Pino 49	I/O — User I/O (bank 5)
Pino 50	GND — Ground
Pino 51	I/O — User I/O (bank 6)
Pino 52	I/O — User I/O (bank 6)
Pino 53	I/O — User I/O (bank 6)
Pino 54	I/O — User I/O (bank 6)
Pino 55	VCCIO6 — I/O bank 6 supply voltage
Pino 56	I/O — User I/O (bank 6)
Pino 57	I/O — User I/O (bank 6)
Pino 58	I/O — User I/O (bank 6)
Pino 59	I/O — User I/O (bank 6)
Pino 60	GND — Ground
Pino 61	I/O — User I/O (bank 7)
Pino 62	I/O — User I/O (bank 7)
Pino 63	I/O — User I/O (bank 7)
Pino 64	I/O — User I/O (bank 7)
Pino 65	VCCIO7 — I/O bank 7 supply voltage
Pino 66	I/O — User I/O (bank 7)
Pino 67	I/O — User I/O (bank 7)
Pino 68	I/O — User I/O (bank 7)
Pino 69	I/O — User I/O (bank 7)
Pino 70	GND — Ground
Pino 71	I/O — User I/O (bank 8)
Pino 72	I/O — User I/O (bank 8)
Pino 73	I/O — User I/O (bank 8)
Pino 74	I/O — User I/O (bank 8)
Pino 75	VCCIO8 — I/O bank 8 supply voltage
Pino 76	I/O — User I/O (bank 8)
Pino 77	I/O — User I/O (bank 8)
Pino 78	I/O — User I/O (bank 8)
Pino 79	I/O — User I/O (bank 8)
Pino 80	GND — Ground
Pino 81	TDI — JTAG Test Data In
Pino 82	TMS — JTAG Test Mode Select
Pino 83	TCK — JTAG Test Clock
Pino 84	TDO — JTAG Test Data Out
Pino 85	nCONFIG — Configuration start (active-low)
Pino 86	nSTATUS — Configuration status (active-low)
Pino 87	CONF_DONE — Configuration complete indicator
Pino 88	DEV_OE — Device-wide output enable (active-low)
Pino 89	DEV_CLRn — Device-wide clear (active-low)
Pino 90	GND — Ground
Pino 91	VCCINT — Core logic supply (1.8 V)
Pino 92	I/O — User I/O
Pino 93	I/O — User I/O
Pino 94	I/O — User I/O
Pino 95	I/O — User I/O
Pino 96	GND — Ground
Pino 97	I/O — User I/O
Pino 98	I/O — User I/O
Pino 99	I/O — User I/O
Pino 100	I/O — User I/O
Pino 101	VCCINT — Core logic supply (1.8 V)
Pino 102	I/O — User I/O
Pino 103	I/O — User I/O
Pino 104	I/O — User I/O
Pino 105	I/O — User I/O
Pino 106	GND — Ground
Pino 107	I/O — User I/O
Pino 108	I/O — User I/O
Pino 109	I/O — User I/O
Pino 110	I/O — User I/O
Pino 111	VCCINT — Core logic supply (1.8 V)
Pino 112	I/O — User I/O
Pino 113	I/O — User I/O
Pino 114	I/O — User I/O
Pino 115	I/O — User I/O
Pino 116	GND — Ground
Pino 117	I/O — User I/O
Pino 118	I/O — User I/O
Pino 119	I/O — User I/O
Pino 120	I/O — User I/O
Pino 121	VCCINT — Core logic supply (1.8 V)
Pino 122	I/O — User I/O
Pino 123	I/O — User I/O
Pino 124	I/O — User I/O
Pino 125	I/O — User I/O
Pino 126	GND — Ground
Pino 127	I/O — User I/O
Pino 128	I/O — User I/O
Pino 129	I/O — User I/O
Pino 130	I/O — User I/O
Pino 131	VCCINT — Core logic supply (1.8 V)
Pino 132	I/O — User I/O
Pino 133	I/O — User I/O
Pino 134	I/O — User I/O
Pino 135	I/O — User I/O
Pino 136	GND — Ground
Pino 137	I/O — User I/O
Pino 138	I/O — User I/O
Pino 139	I/O — User I/O
Pino 140	I/O — User I/O
Pino 141	VCCINT — Core logic supply (1.8 V)
Pino 142	I/O — User I/O
Pino 143	I/O — User I/O
Pino 144	I/O — User I/O

Aplicações típicas

EPM1270T144C3N é adequado para 6 aplicaçãos: MCU Bus Interface Bridging and Glue Logic, FPGA/ASIC Power-Up Sequencing Controller, Industrial Control I/O Expansion, LED Display and Signage Drivers, Communication Protocol Bridge (UART/SPI/I2C), Replacement of Discrete 74-Series Logic.

🔧

MCU Bus Interface Bridging and Glue Logic

The EPM1270T144C3N excels at bridging incompatible MCU-to-peripheral bus interfaces in mixed-voltage designs. With 1270 LEs and MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V on the same die, it can directly translate between a 3.3 V ARM Cortex-M MCU bus and a 1.8 V sensor peripheral without external level shifters. The fast ~3.6 ns pin-to-pin delay at -3 grade handles typical 50-100 MHz bus clocks with deterministic propagation, while the 980 macrocells accommodate wide address/data bus multiplexers and decode logic. Its instant-on Flash configuration eliminates external boot memory, simplifying PCB layout versus small FPGAs.

Recomendado

⚡

FPGA/ASIC Power-Up Sequencing Controller

The EPM1270T144C3N is widely deployed as a multi-rail power-sequencer for FPGAs, ASICs, and DSPs that require strict rail-ordering on board bring-up. Its instant-on non-volatile Flash configuration guarantees deterministic timing at T=0 with no bootloader delay, and the wide MultiVolt I/O (1.5 V to 3.3 V) lets one CPLD drive PG (power-good) signals and EN pins of regulators at different voltage levels. The 1270 LEs and 980 macrocells provide ample headroom for 4-8 rail sequencers with adjustable delays, fault monitoring, and watchdog logic, while JTAG (IEEE 1149.1) programming simplifies in-system firmware updates during board bring-up.

Recomendado

TPS54302DDC (3.3 V buck regulator with PG output) EP4CE22F17C8N (Cyclone IV FPGA powered by this sequencer)

🏭

Industrial Control I/O Expansion

In industrial PLCs and distributed I/O modules, the EPM1270T144C3N provides deterministic-logic I/O expansion for microcontrollers that lack sufficient GPIO or require galvanic-isolated channel management. With 212 maximum user I/O and TQFP-144 footprint exposing approximately 114 usable pins, it can handle matrix-scanned keypads, LED drivers, and relay multiplexing simultaneously. The MultiVolt I/O directly interfaces 24 V-tolerant digital inputs via external resistor dividers, and the 8-Kbit user Flash memory (UFM) stores configuration parameters, calibration data, and serial numbers without an external EEPROM.

Recomendado

STM32F103C8T6 · STMicroelectronics STM32F103C8T6 · STMicroelectronics TLP181 (optocoupler for isolated inputs)

💡

LED Display and Signage Drivers

The EPM1270T144C3N is well-suited for driving large LED matrix displays, scoreboards, and signage where parallel data throughput and multi-channel PWM are required. Its 1270 LEs handle row/column multiplexing of 8x8 to 32x32 LED arrays, while its MultiVolt I/O can directly interface 3.3 V microcontrollers and 5 V LED driver inputs. The -3 speed grade delivers fast refresh rates (>1 kHz) for flicker-free 16-level grayscale PWM generation. The instant-on Flash configuration is valuable in signage where reboot timing must be deterministic and minimal.

Recomendado

MBI5024 (16-channel LED driver) STM32F103C8T6 · STMicroelectronics STM32F103C8T6 · STMicroelectronics

🌐

Communication Protocol Bridge (UART/SPI/I2C)

The EPM1270T144C3N is ideal for protocol bridging tasks - converting between UART, SPI, I2C, parallel buses, and custom protocols at line rates up to ~200 MHz. With 1270 LEs and fast propagation delays (~3.6 ns), it can implement multi-master I2C controllers, SPI-to-parallel bridges, and custom serial protocols without software overhead. The MultiVolt I/O allows direct interface to 1.8 V sensors and 3.3 V microcontrollers simultaneously, eliminating external level translators and reducing BOM cost in sensor hub designs.

Recomendado

MAX3232 (RS-232 line driver) ADXL345 (I2C/SPI accelerometer sensor)

🔧

Replacement of Discrete 74-Series Logic

Engineers frequently use the EPM1270T144C3N to replace dozens of discrete 74HC/74LVC series logic gates, multiplexers, and flip-flops on legacy boards. A single MAX II CPLD can absorb 30-50+ discrete packages (TTL/CMOS logic, bus transceivers, latches), dramatically reducing PCB area, BOM count, and assembly cost. The 980 macrocells and JTAG programmability allow in-system design changes without board rework - the design can be re-fitted and re-flashed via JTAG in seconds. The instant-on Flash configuration ensures identical power-up behavior to discrete logic.

Recomendado

74HC245 (octal bus transceiver being replaced) 74HC138 (3-to-8 line decoder being replaced)

Resumo dos produtos recomendados

STM32F407VGT6 STMicroelectronics Usado em: MCU Bus Interface Bridging and Glue Logic EP4CE6E22C8N Intel Usado em: MCU Bus Interface Bridging and Glue Logic TPS54302DDC 3.3 V buck regulator with PG output Usado em: FPGA/ASIC Power-Up Sequencing Controller EP4CE22F17C8N Cyclone IV FPGA powered by this sequencer Usado em: FPGA/ASIC Power-Up Sequencing Controller STM32F103C8T6 STMicroelectronics Usado em: Industrial Control I/O Expansion, Industrial Control I/O Expansion, LED Display and Signage Drivers, LED Display and Signage Drivers TLP181 optocoupler for isolated inputs Usado em: Industrial Control I/O Expansion MBI5024 16-channel LED driver Usado em: LED Display and Signage Drivers MAX3232 RS-232 line driver Usado em: Communication Protocol Bridge (UART/SPI/I2C) ADXL345 I2C/SPI accelerometer sensor Usado em: Communication Protocol Bridge (UART/SPI/I2C) 74HC245 octal bus transceiver being replaced Usado em: Replacement of Discrete 74-Series Logic 74HC138 3-to-8 line decoder being replaced Usado em: Replacement of Discrete 74-Series Logic

What is the logic capacity of EPM1270T144C3N?

The EPM1270T144C3N contains 1270 Logic Elements (LEs) and 980 equivalent macrocells in the MAX II family. According to the Intel MAX II Device Family datasheet, the 1270 LE variant is the second-largest density in the MAX II lineup, supporting up to 212 user I/O pins and 8 Kbits of user Flash memory for non-volatile parameter storage.

What package does EPM1270T144C3N use?

The EPM1270T144C3N ships in a 144-pin Thin Quad Flat Pack (TQFP), indicated by the T144 package code in the part number. The TQFP-144 is a surface-mount plastic package with 1.0 mm pitch and 20x20 mm body, suitable for standard SMT assembly and offering a good balance between I/O count, board area, and ease of rework.

What is the difference between EPM1270T144C3N and EPM1270T144A5N?

The EPM1270T144C3N is a commercial-grade -3 speed grade variant, while the EPM1270T144A5N is the -5 speed grade (slower) variant. Both share identical 1270 LE density and 144-pin TQFP package. The C3 designation means faster pin-to-pin delays (~3.6 ns vs ~5 ns) and higher internal performance, at a higher price point.

Where can I buy EPM1270T144C3N online?

The EPM1270T144C3N is available from authorized distributors including DigiKey (PN 544-1335-ND), Mouser, Win Source, and Octopart-listed inventory of 6 distributors. As of 2026-09-12, single-unit pricing is approximately $18.50, with quantity discounts available at 10/100/500/1000-piece breaks. Stock is generally stable but lead times vary by distributor.

What is the price of EPM1270T144C3N?

As of 2026-09-12, the EPM1270T144C3N list price on DigiKey is approximately $18.50 per unit at qty 1, dropping to ~$15.20 at qty 100 and ~$12.75 at qty 1000. Pricing varies by distributor; Mouser and Octopart aggregators often show competitive per-unit pricing for volume orders. Bulk quotes from authorized Intel FPGA distributors are recommended for production volumes.

Is EPM1270T144C3N in stock?

Yes, the EPM1270T144C3N is currently listed as in stock at multiple authorized distributors as of 2026-09-12, including DigiKey, Mouser, and Win Source. Distributor aggregator Octopart reports availability from 6 active distributors. Lead times for production-volume orders (1k+ pieces) typically range from 4-8 weeks from authorized channels.

EPM1270T144C3N vs EPM1270F256C5N - which is better for I/O expansion?

The EPM1270T144C3N uses a 144-pin TQFP with up to 212 user I/O (144-pin variant limits to ~114 usable I/O), while the EPM1270F256C5N uses a 256-pin FineLine BGA with up to 212 user I/O available (more usable pins in smaller board area). For maximum I/O density, choose the F256 BGA package; for hand-solder/rework-friendly prototyping, the T144 TQFP is preferable.

What is the best drop-in replacement for EPM1270T144C3N?

The best drop-in replacement is the EPM1270T144C3 itself (non-N suffix variant), or for a slight speed/grade change, the EPM1270T144A5N (same package, -5 speed). For new designs requiring more I/O, the EPM1270F256C5N shares the same 1270-LE MAX II die but in a 256-pin BGA package. All variants use the same JTAG chain and Quartus toolchain.

Is EPM1270T144C3N suitable for power-sequencing applications?

Yes, the EPM1270T144C3N is ideal for power-sequencing applications due to its non-volatile instant-on configuration (no external boot memory required), fast propagation delay (~3.6 ns at -3 grade), and MultiVolt I/O support (1.5 V to 3.3 V) that allows direct interface to multiple rails. It is commonly used to sequence FPGA/ASIC power rails on board power-up.

When should I choose EPM1270T144C3N over a small FPGA?

Choose the EPM1270T144C3N over a small FPGA when you need deterministic timing, instant-on from non-volatile memory, lower per-unit cost at low densities, and simple JTAG-only programming without external boot flash. FPGAs (e.g., Cyclone IV) win for higher logic density (>5K LEs), large block RAM needs, or high-speed serial transceivers - none of which the EPM1270T144C3N provides.

What design software supports EPM1270T144C3N?

The EPM1270T144C3N is supported by Intel Quartus Prime (free Web Edition handles MAX II family), Altera Quartus II (legacy), and compatible with USB-Blaster or ByteBlaster II JTAG programmers. According to Intel's MAX II datasheet, the design flow supports VHDL, Verilog, and schematic entry with the same fitter that handles MAX 3000A/7000-series designs.

Where to download EPM1270T144C3N datasheet PDF?

The EPM1270T144C3N datasheet (Section I, MAX II Device Family Data Sheet) can be downloaded from Alldatasheet.com, Intel FPGA's official documentation portal, or aggregator sites like Datasheets.com. The datasheet PDF is approximately 988 KB and contains 88 pages covering electrical characteristics, pinout, timing, and configuration specifications.

Where can I find EPM1270T144C3N pinout information?

The complete EPM1270T144C3N 144-pin TQFP pinout is published in the MAX II Device Family datasheet Section I, pin information tables. The package uses a 20x20 mm body with 1.0 mm pitch. Engineers can also use Quartus Prime Pin Planner tool to view I/O assignments interactively. The T144 variant exposes approximately 114 user I/O plus dedicated JTAG, power, and configuration pins.

What is the difference between EPM1270T144C3N and EPM1270GT144I5?

The EPM1270T144C3N is a MAX II family part (commercial temp, -3 speed), while the EPM1270GT144I5 is a MAX II G family part (industrial temp, -5 speed). Both share the same 144-pin TQFP footprint and pinout. The G variant supports additional external supply voltage options and ISP features, but for most standard glue-logic applications the C3N is faster and less expensive.

What are the key specifications of EPM1270T144C3N that engineers should know?

The EPM1270T144C3N has 1270 Logic Elements, 980 equivalent macrocells, 8 Kbits of user Flash memory, and 212 maximum user I/Os in a 144-pin TQFP package. It operates from a 1.8 V core supply with MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces. According to the Intel MAX II datasheet, the -3 speed grade delivers 3.6 ns pin-to-pin delay and supports JTAG (IEEE 1149.1) in-system programming with instant-on from internal Flash configuration memory.

Dados de referência de engenharia para EPM1270T144C3N — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EPM1270T144C3N when you need the fastest commercial-grade MAX II 1270-LE CPLD in the 144-pin TQFP footprint for high-speed glue logic, bus bridging, or power-sequencing above 50 MHz. For cost-sensitive designs where ~5 ns pin-to-pin delay is acceptable, the EPM1270T144A5N or EPM1270T144C5N are interchangeable drop-in alternatives at lower price. For industrial temperature range (-40C to +100C), the EPM1270T144I5N is the only drop-in TQFP-144 alternative. The non-N EPM1270T144C3 is pin-compatible but lacks Pb-free compliance - only use for legacy or non-RoHS builds. All 5 alternatives share the same TQFP-144 footprint and Quartus toolchain.

Comparação com alternativas

Parâmetro	Este produto	EPM1270T144A5N	EPM1270T144C3	EPM1270T144C4N	EPM1270T144C5N	EPM1270T144I5N
Package	TQFP-144 (T144)	TQFP-144 (T144) - same	TQFP-144 (T144) - same	TQFP-144 (T144) - same	TQFP-144 (T144) - same	TQFP-144 (T144) - same
Brand	Intel	Intel - same	Intel - same	Intel - same	Intel - same	Intel - same
Speed Grade	-3 (C3, fastest)	-5 (slower)	-3 (same)	-4 (mid)	-5 (slower)	-5 (slower, industrial)
Pin-to-Pin Delay (tPD)	~3.6 ns	~5.0 ns	~3.6 ns	~4.5 ns	~5.0 ns	~5.0 ns
Operating Temperature	0C to +85C (commercial)	0C to +85C (commercial)	0C to +85C (commercial)	0C to +85C (commercial)	0C to +85C (commercial)	-40C to +100C (industrial)
Logic Elements	1270	1270 (same)	1270 (same)	1270 (same)	1270 (same)	1270 (same)
User I/O (max)	212	212	212	212	212	212
User Flash Memory (UFM)	8 Kbits	8 Kbits	8 Kbits	8 Kbits	8 Kbits	8 Kbits
Pb-Free / RoHS	Yes (N suffix)	Yes	No (non-N)	Yes	Yes	Yes

Principais diferenciais

Fastest commercial speed grade in MAX II 1270 T144 family (vs EPM1270T144A5N)
Lead-free / Pb-free marking (N suffix) (vs EPM1270T144C3)
Non-volatile Flash configuration for instant-on (vs EPM1270T144C5N)

Notas de projeto

The EPM1270T144C3N requires separate VCCINT (1.8 V) and VCCIO (1.5 V/1.8 V/2.5 V/3.3 V) rails. Decouple each VCCINT pin with a 0.1 uF ceramic capacitor placed within 5 mm of the package, and each VCCIO bank pin with 0.1 uF + bulk 10 uF tantalum. The 8 I/O banks (VCCIO1-8) can each operate at a different voltage, but the core VCCINT (1.8 V) must come up first or simultaneously with VCCIO. Sequence the 1.8 V rail before the I/O rails to prevent I/O latch-up during power-up transient.

TQFP-144 has a 0.5 mm pin pitch with 1.0 mm lead width - use 0.20 mm trace width and 0.20 mm spacing to escape pins cleanly. Place 4-layer PCB recommended: layer 1 for signals, layer 2 GND plane, layer 3 power planes (split for VCCINT and VCCIO banks), layer 4 signals. Avoid routing high-speed signals (>50 MHz) under the TQFP thermal pad area to minimize crosstalk.

Common pitfalls: (1) Forgetting to drive nCONFIG high after power-up - device will not configure. (2) Mixing VCCIO voltages on the same bank causes I/O contention - each bank must use a single VCCIO. (3) JTAG chain must include proper TMS/TCK pull-ups (typically 10 kohm to VCCIO of bank 1). (4) Not connecting unused I/O - leave them floating or tie to GND via internal pulldown to reduce crosstalk and power consumption. (5) Configuring I/O as inputs before VCCIO ramps - use BUS_HOLD or input delay to avoid input metastability.

Informações de conformidade

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Sem chumbo

Yes

Sem halogênios

Unknown

Minerais de conflito

Compliant

RoHS compliant per N suffix designation (Pb-free). Not AEC-Q100 qualified - this is a commercial/industrial-grade CPLD, not automotive. Industrial temperature range variants (I5N) available for extended environments.

Dados verificados em: 2026-09-12 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Fontes: Distributor, Distributor, Manufacturer Datasheet, Octopart, Manufacturer Datasheet, Distributor, Distributor

Buscas relacionadas

EPM1270T144C3N EPM1270T144C3N datasheet Intel MAX II CPLD 144-pin TQFP MAX II 1270 logic elements CPLD EPM1270T144C3N price EPM1270T144C3N buy online EPM1270T144C3N pinout TQFP-144 EPM1270T144C3N vs EPM1270T144A5N MAX II CPLD drop-in replacement EPM1270T144C3N power sequencing application CPLD vs FPGA difference MultiVolt IO 1.5V 1.8V 2.5V 3.3V CPLD

Componentes & termos relacionados

Intel Altera MAX II EPM1270T144C3N CPLD Complex Programmable Logic Device PLD programmable logic logic element macrocell Logic Array Block LAB TQFP-144 TQFP TQFP package Surface Mount JTAG IEEE 1149.1 IEEE 1532 in-system programmability ISP MultiVolt IO Quartus Prime user Flash memory UFM non-volatile configuration instant-on power sequencing glue logic bus bridge RoHS Pb-free AEC-Q100