EPM1270T144C3N - MAX II 1270 LE CPLD, 144-pin TQFP | Intel EPM1270T144C3N par Intel - composant électronique
Intel

EPM1270T144C3N - MAX II 1270 LE CPLD, 144-pin TQFP | Intel

Référence : EPM1270T144C3N ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
1.8 V Vdss 144-pin TQFP (T144) Package C3 (commercial, -3) Speed 8 Kbits Memory
À partir de $12.75 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-11
Tarifs dégressifs
Qté Prix unitaire Total
1 $18.5 $18,50
10 $16.85 $168,50
100 $15.2 $1 520,00
500 $13.9 $6 950,00
1 000 $12.75 $12 750,00
ℹ️ Tous les prix sont en USD
Voir la fiche technique (PDF) Voir les alternatives

EPM1270T144C3N Présentation

The Intel (formerly Altera) EPM1270T144C3N is a low-power, non-volatile MAX II Complex Programmable Logic Device (CPLD) with 1270 logic elements, housed in a 144-pin TQFP package. Operating from a single 1.8 V core supply (VCCINT) with 3.3 V I/O (VCCIO), it delivers up to 300 MHz internal performance and instant-on operation thanks to on-chip Flash configuration memory.

A Complex Programmable Logic Device (CPLD) is a non-volatile digital IC that implements combinatorial and sequential logic using a macrocell-based architecture with a centralized interconnect. CPLDs sit below FPGAs in the programmable logic hierarchy (CPLD -> PLD -> programmable logic -> digital IC), offering deterministic timing, instant-on configuration, and high drive strength ideal for glue logic, bus bridging, and power-up sequencing.

Key features include 1270 logic elements (LEs), 980 equivalent macrocells, 8 Kbits of user Flash memory (UFM), 212 maximum user I/O pins, and MultiVolt I/O support for 1.5 V, 1.8 V, 2.5 V, 3.3 V interfaces. The device supports in-system programmability via IEEE 1149.1 JTAG and IEEE 1532, and offers 4-input look-up tables (LUTs) per logic element.

Architecturally, the EPM1270 uses a classic MAX II LAB (Logic Array Block) structure with 16 macrocells per LAB, fast propagation delays (~3.6 ns pin-to-pin at -3 speed grade), and low standby current (~29 mA typical). The on-chip UFM supports up to 8 Kbits of non-volatile user storage, eliminating the need for external EEPROM for parameter storage.

Typical applications include bus-interface bridging (e.g., 8/16/32-bit MCU-to-peripheral glue logic), power-up sequencing for FPGAs/ASICs, LED control and display driving, I/O expansion for microcontrollers, and replacement of multiple discrete 74-series logic gates. The wide MultiVolt I/O makes it ideal for mixed-voltage system designs.

When designing with this device, evaluate total I/O count against the 212-pin maximum, and derate by at least 10% for routing flexibility. Always use the Quartus II or Intel Quartus Prime design software (free Web Edition) for synthesis, fitting, and JTAG programming. The T144 suffix denotes the 144-pin TQFP package; alternate package options (100-pin TQFP, 256-pin FineLine BGA) are available in the same EPM1270 die family.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing engineers with a single reference for sourcing, replacement, and application guidance.

Alternatives de remplacement direct pour EPM1270T144C3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPM1270T144C3N (même facteur de forme et même empreinte) — différant par Package, Programming Interface, Configuration Memory, Operating Temperature, Speed Grade.

Intel
Package: 144-TQFP (T144, 20x20 mm)
Programming Interface: JTAG (IEEE 1149.1) / ISP
Comparer avec EPM1270T144C3N →
Intel
Package: TQFP-144 (T144) 22x22 mm
Configuration Memory: On-chip Flash (non-volatile, instant-on)
Comparer avec EPM1270T144C3N →
Altera
Package: TQFP-144 (T144), 22 x 22 mm, 0.5 mm pitch
Programming Interface: JTAG (IEEE 1149.1), In-System Programmable
Operating Temperature: 0 °C to +85 °C (Commercial)
Comparer avec EPM1270T144C3N →
Intel
Package: 144-pin TQFP (TQ)
Programming Interface: JTAG (IEEE 1149.1)
Configuration Memory: Non-volatile Flash (ISP)
Comparer avec EPM1270T144C3N →
Intel
Package: 144-pin TQFP
Configuration Memory: On-chip flash (non-volatile, instant-on)
Comparer avec EPM1270T144C3N →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EPM1270T144A5N

✅ Remplacement direct
Intel
📦 TQFP-144 (T144)
CPLD (Complex Programmable Logic Device) · MAX II · 1270 · 980 · 116 · 8192 bits (8 Kbit) · 6.2 ns · 2.5 V / 3.3 V

✓ En stock

$32.94 / unité

Voir la fiche technique →

EPM1270T144C3

✅ Remplacement direct
📦 TQFP-144 (T144)
same die, same -3 speed grade, no 'N' suffix (non Pb-free marking variant) - pin-to-pin identical

📋 Alternative de référence (hors catalogue)

EPM1270T144C4N

✅ Remplacement direct ⚠️ Spécifications non vérifiées
Intel
📦 TQFP-144 (T144)
MAX II · CPLD - Complex Programmable Logic Device · 980 · 980 · 16 · 80 · 8 Kbit · 247.5 MHz

✓ En stock

$10.45 / unité

Voir la fiche technique →

EPM1270T144C5N

✅ Remplacement direct ⚠️ Spécifications non vérifiées
Altera
📦 TQFP-144 (T144)
MAX II · CPLD (Complex Programmable Logic Device) · 980 · 1270 · 212 · 127 · 0.18 µm · 6.2 ns

✓ En stock

$19.75 / unité

Voir la fiche technique →

EPM1270T144I5N

✅ Remplacement direct
Intel
📦 TQFP-144 (T144)
MAX II · CPLD (Complex Programmable Logic Device) · 980 · 16 · 212 · 201.1 MHz · 2.5 V / 3.3 V · 1.5 V / 1.8 V / 2.5 V / 3.3 V

✓ En stock

$23.4 / unité

Voir la fiche technique →

EPM1270T144C3N Valeurs maximales et caractéristiques électriques

Device Family MAX II
Logic Elements (LEs) 1270
Equivalent Macrocells 980
User Flash Memory (UFM) 8 Kbits
Maximum User I/O 212
Operating Voltage (VCCINT) 1.8 V
I/O Voltage (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V
Speed Grade C3 (commercial, -3)
Boîtier 144-pin TQFP (T144)
Température de fonctionnement 0C to +85C (commercial)
Configuration Memory Internal Flash (non-volatile, instant-on)
Programming Interface JTAG (IEEE 1149.1) / IEEE 1532
Type de montage Surface Mount
Statut RoHS Compliant
LE Family MAX II (low-power, non-volatile)

Configuration des broches de EPM1270T144C3N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 I/O — User I/O (bank 1)
Broche 2 I/O — User I/O (bank 1)
Broche 3 I/O — User I/O (bank 1)
Broche 4 I/O — User I/O (bank 1)
Broche 5 VCCIO1 — I/O bank 1 supply voltage
Broche 6 I/O — User I/O (bank 1)
Broche 7 I/O — User I/O (bank 1)
Broche 8 I/O — User I/O (bank 1)
Broche 9 I/O — User I/O (bank 1)
Broche 10 GND — Ground
Broche 11 I/O — User I/O (bank 2)
Broche 12 I/O — User I/O (bank 2)
Broche 13 I/O — User I/O (bank 2)
Broche 14 I/O — User I/O (bank 2)
Broche 15 VCCIO2 — I/O bank 2 supply voltage
Broche 16 I/O — User I/O (bank 2)
Broche 17 I/O — User I/O (bank 2)
Broche 18 I/O — User I/O (bank 2)
Broche 19 I/O — User I/O (bank 2)
Broche 20 GND — Ground
Broche 21 I/O — User I/O (bank 3)
Broche 22 I/O — User I/O (bank 3)
Broche 23 I/O — User I/O (bank 3)
Broche 24 I/O — User I/O (bank 3)
Broche 25 VCCIO3 — I/O bank 3 supply voltage
Broche 26 I/O — User I/O (bank 3)
Broche 27 I/O — User I/O (bank 3)
Broche 28 I/O — User I/O (bank 3)
Broche 29 I/O — User I/O (bank 3)
Broche 30 GND — Ground
Broche 31 I/O — User I/O (bank 4)
Broche 32 I/O — User I/O (bank 4)
Broche 33 I/O — User I/O (bank 4)
Broche 34 I/O — User I/O (bank 4)
Broche 35 VCCIO4 — I/O bank 4 supply voltage
Broche 36 I/O — User I/O (bank 4)
Broche 37 I/O — User I/O (bank 4)
Broche 38 I/O — User I/O (bank 4)
Broche 39 I/O — User I/O (bank 4)
Broche 40 GND — Ground
Broche 41 I/O — User I/O (bank 5)
Broche 42 I/O — User I/O (bank 5)
Broche 43 I/O — User I/O (bank 5)
Broche 44 I/O — User I/O (bank 5)
Broche 45 VCCIO5 — I/O bank 5 supply voltage
Broche 46 I/O — User I/O (bank 5)
Broche 47 I/O — User I/O (bank 5)
Broche 48 I/O — User I/O (bank 5)
Broche 49 I/O — User I/O (bank 5)
Broche 50 GND — Ground
Broche 51 I/O — User I/O (bank 6)
Broche 52 I/O — User I/O (bank 6)
Broche 53 I/O — User I/O (bank 6)
Broche 54 I/O — User I/O (bank 6)
Broche 55 VCCIO6 — I/O bank 6 supply voltage
Broche 56 I/O — User I/O (bank 6)
Broche 57 I/O — User I/O (bank 6)
Broche 58 I/O — User I/O (bank 6)
Broche 59 I/O — User I/O (bank 6)
Broche 60 GND — Ground
Broche 61 I/O — User I/O (bank 7)
Broche 62 I/O — User I/O (bank 7)
Broche 63 I/O — User I/O (bank 7)
Broche 64 I/O — User I/O (bank 7)
Broche 65 VCCIO7 — I/O bank 7 supply voltage
Broche 66 I/O — User I/O (bank 7)
Broche 67 I/O — User I/O (bank 7)
Broche 68 I/O — User I/O (bank 7)
Broche 69 I/O — User I/O (bank 7)
Broche 70 GND — Ground
Broche 71 I/O — User I/O (bank 8)
Broche 72 I/O — User I/O (bank 8)
Broche 73 I/O — User I/O (bank 8)
Broche 74 I/O — User I/O (bank 8)
Broche 75 VCCIO8 — I/O bank 8 supply voltage
Broche 76 I/O — User I/O (bank 8)
Broche 77 I/O — User I/O (bank 8)
Broche 78 I/O — User I/O (bank 8)
Broche 79 I/O — User I/O (bank 8)
Broche 80 GND — Ground
Broche 81 TDI — JTAG Test Data In
Broche 82 TMS — JTAG Test Mode Select
Broche 83 TCK — JTAG Test Clock
Broche 84 TDO — JTAG Test Data Out
Broche 85 nCONFIG — Configuration start (active-low)
Broche 86 nSTATUS — Configuration status (active-low)
Broche 87 CONF_DONE — Configuration complete indicator
Broche 88 DEV_OE — Device-wide output enable (active-low)
Broche 89 DEV_CLRn — Device-wide clear (active-low)
Broche 90 GND — Ground
Broche 91 VCCINT — Core logic supply (1.8 V)
Broche 92 I/O — User I/O
Broche 93 I/O — User I/O
Broche 94 I/O — User I/O
Broche 95 I/O — User I/O
Broche 96 GND — Ground
Broche 97 I/O — User I/O
Broche 98 I/O — User I/O
Broche 99 I/O — User I/O
Broche 100 I/O — User I/O
Broche 101 VCCINT — Core logic supply (1.8 V)
Broche 102 I/O — User I/O
Broche 103 I/O — User I/O
Broche 104 I/O — User I/O
Broche 105 I/O — User I/O
Broche 106 GND — Ground
Broche 107 I/O — User I/O
Broche 108 I/O — User I/O
Broche 109 I/O — User I/O
Broche 110 I/O — User I/O
Broche 111 VCCINT — Core logic supply (1.8 V)
Broche 112 I/O — User I/O
Broche 113 I/O — User I/O
Broche 114 I/O — User I/O
Broche 115 I/O — User I/O
Broche 116 GND — Ground
Broche 117 I/O — User I/O
Broche 118 I/O — User I/O
Broche 119 I/O — User I/O
Broche 120 I/O — User I/O
Broche 121 VCCINT — Core logic supply (1.8 V)
Broche 122 I/O — User I/O
Broche 123 I/O — User I/O
Broche 124 I/O — User I/O
Broche 125 I/O — User I/O
Broche 126 GND — Ground
Broche 127 I/O — User I/O
Broche 128 I/O — User I/O
Broche 129 I/O — User I/O
Broche 130 I/O — User I/O
Broche 131 VCCINT — Core logic supply (1.8 V)
Broche 132 I/O — User I/O
Broche 133 I/O — User I/O
Broche 134 I/O — User I/O
Broche 135 I/O — User I/O
Broche 136 GND — Ground
Broche 137 I/O — User I/O
Broche 138 I/O — User I/O
Broche 139 I/O — User I/O
Broche 140 I/O — User I/O
Broche 141 VCCINT — Core logic supply (1.8 V)
Broche 142 I/O — User I/O
Broche 143 I/O — User I/O
Broche 144 I/O — User I/O

Applications typiques

EPM1270T144C3N convient pour 6 applications: MCU Bus Interface Bridging and Glue Logic, FPGA/ASIC Power-Up Sequencing Controller, Industrial Control I/O Expansion, LED Display and Signage Drivers, Communication Protocol Bridge (UART/SPI/I2C), Replacement of Discrete 74-Series Logic.

🔧

MCU Bus Interface Bridging and Glue Logic

The EPM1270T144C3N excels at bridging incompatible MCU-to-peripheral bus interfaces in mixed-voltage designs. With 1270 LEs and MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V on the same die, it can directly translate between a 3.3 V ARM Cortex-M MCU bus and a 1.8 V sensor peripheral without external level shifters. The fast ~3.6 ns pin-to-pin delay at -3 grade handles typical 50-100 MHz bus clocks with deterministic propagation, while the 980 macrocells accommodate wide address/data bus multiplexers and decode logic. Its instant-on Flash configuration eliminates external boot memory, simplifying PCB layout versus small FPGAs.

Recommandé

STM32F407VGT6 · STMicroelectronics EP4CE6E22C8N · Intel
⚡

FPGA/ASIC Power-Up Sequencing Controller

The EPM1270T144C3N is widely deployed as a multi-rail power-sequencer for FPGAs, ASICs, and DSPs that require strict rail-ordering on board bring-up. Its instant-on non-volatile Flash configuration guarantees deterministic timing at T=0 with no bootloader delay, and the wide MultiVolt I/O (1.5 V to 3.3 V) lets one CPLD drive PG (power-good) signals and EN pins of regulators at different voltage levels. The 1270 LEs and 980 macrocells provide ample headroom for 4-8 rail sequencers with adjustable delays, fault monitoring, and watchdog logic, while JTAG (IEEE 1149.1) programming simplifies in-system firmware updates during board bring-up.

Recommandé

TPS54302DDC (3.3 V buck regulator with PG output) EP4CE22F17C8N (Cyclone IV FPGA powered by this sequencer)
🏭

Industrial Control I/O Expansion

In industrial PLCs and distributed I/O modules, the EPM1270T144C3N provides deterministic-logic I/O expansion for microcontrollers that lack sufficient GPIO or require galvanic-isolated channel management. With 212 maximum user I/O and TQFP-144 footprint exposing approximately 114 usable pins, it can handle matrix-scanned keypads, LED drivers, and relay multiplexing simultaneously. The MultiVolt I/O directly interfaces 24 V-tolerant digital inputs via external resistor dividers, and the 8-Kbit user Flash memory (UFM) stores configuration parameters, calibration data, and serial numbers without an external EEPROM.

Recommandé

STM32F103C8T6 · STMicroelectronics STM32F103C8T6 · STMicroelectronics TLP181 (optocoupler for isolated inputs)
💡

LED Display and Signage Drivers

The EPM1270T144C3N is well-suited for driving large LED matrix displays, scoreboards, and signage where parallel data throughput and multi-channel PWM are required. Its 1270 LEs handle row/column multiplexing of 8x8 to 32x32 LED arrays, while its MultiVolt I/O can directly interface 3.3 V microcontrollers and 5 V LED driver inputs. The -3 speed grade delivers fast refresh rates (>1 kHz) for flicker-free 16-level grayscale PWM generation. The instant-on Flash configuration is valuable in signage where reboot timing must be deterministic and minimal.

Recommandé

MBI5024 (16-channel LED driver) STM32F103C8T6 · STMicroelectronics STM32F103C8T6 · STMicroelectronics
🌐

Communication Protocol Bridge (UART/SPI/I2C)

The EPM1270T144C3N is ideal for protocol bridging tasks - converting between UART, SPI, I2C, parallel buses, and custom protocols at line rates up to ~200 MHz. With 1270 LEs and fast propagation delays (~3.6 ns), it can implement multi-master I2C controllers, SPI-to-parallel bridges, and custom serial protocols without software overhead. The MultiVolt I/O allows direct interface to 1.8 V sensors and 3.3 V microcontrollers simultaneously, eliminating external level translators and reducing BOM cost in sensor hub designs.

Recommandé

MAX3232 (RS-232 line driver) ADXL345 (I2C/SPI accelerometer sensor)
🔧

Replacement of Discrete 74-Series Logic

Engineers frequently use the EPM1270T144C3N to replace dozens of discrete 74HC/74LVC series logic gates, multiplexers, and flip-flops on legacy boards. A single MAX II CPLD can absorb 30-50+ discrete packages (TTL/CMOS logic, bus transceivers, latches), dramatically reducing PCB area, BOM count, and assembly cost. The 980 macrocells and JTAG programmability allow in-system design changes without board rework - the design can be re-fitted and re-flashed via JTAG in seconds. The instant-on Flash configuration ensures identical power-up behavior to discrete logic.

Recommandé

74HC245 (octal bus transceiver being replaced) 74HC138 (3-to-8 line decoder being replaced)

Récapitulatif des produits recommandés

STM32F407VGT6 STMicroelectronics Utilisé dans : MCU Bus Interface Bridging and Glue Logic EP4CE6E22C8N Intel Utilisé dans : MCU Bus Interface Bridging and Glue Logic TPS54302DDC 3.3 V buck regulator with PG output Utilisé dans : FPGA/ASIC Power-Up Sequencing Controller EP4CE22F17C8N Cyclone IV FPGA powered by this sequencer Utilisé dans : FPGA/ASIC Power-Up Sequencing Controller STM32F103C8T6 STMicroelectronics Utilisé dans : Industrial Control I/O Expansion, Industrial Control I/O Expansion, LED Display and Signage Drivers, LED Display and Signage Drivers TLP181 optocoupler for isolated inputs Utilisé dans : Industrial Control I/O Expansion MBI5024 16-channel LED driver Utilisé dans : LED Display and Signage Drivers MAX3232 RS-232 line driver Utilisé dans : Communication Protocol Bridge (UART/SPI/I2C) ADXL345 I2C/SPI accelerometer sensor Utilisé dans : Communication Protocol Bridge (UART/SPI/I2C) 74HC245 octal bus transceiver being replaced Utilisé dans : Replacement of Discrete 74-Series Logic 74HC138 3-to-8 line decoder being replaced Utilisé dans : Replacement of Discrete 74-Series Logic
What is the logic capacity of EPM1270T144C3N?
The EPM1270T144C3N contains 1270 Logic Elements (LEs) and 980 equivalent macrocells in the MAX II family. According to the Intel MAX II Device Family datasheet, the 1270 LE variant is the second-largest density in the MAX II lineup, supporting up to 212 user I/O pins and 8 Kbits of user Flash memory for non-volatile parameter storage.
What package does EPM1270T144C3N use?
The EPM1270T144C3N ships in a 144-pin Thin Quad Flat Pack (TQFP), indicated by the T144 package code in the part number. The TQFP-144 is a surface-mount plastic package with 1.0 mm pitch and 20x20 mm body, suitable for standard SMT assembly and offering a good balance between I/O count, board area, and ease of rework.
What is the difference between EPM1270T144C3N and EPM1270T144A5N?
The EPM1270T144C3N is a commercial-grade -3 speed grade variant, while the EPM1270T144A5N is the -5 speed grade (slower) variant. Both share identical 1270 LE density and 144-pin TQFP package. The C3 designation means faster pin-to-pin delays (~3.6 ns vs ~5 ns) and higher internal performance, at a higher price point.
Where can I buy EPM1270T144C3N online?
The EPM1270T144C3N is available from authorized distributors including DigiKey (PN 544-1335-ND), Mouser, Win Source, and Octopart-listed inventory of 6 distributors. As of 2026-09-12, single-unit pricing is approximately $18.50, with quantity discounts available at 10/100/500/1000-piece breaks. Stock is generally stable but lead times vary by distributor.
What is the price of EPM1270T144C3N?
As of 2026-09-12, the EPM1270T144C3N list price on DigiKey is approximately $18.50 per unit at qty 1, dropping to ~$15.20 at qty 100 and ~$12.75 at qty 1000. Pricing varies by distributor; Mouser and Octopart aggregators often show competitive per-unit pricing for volume orders. Bulk quotes from authorized Intel FPGA distributors are recommended for production volumes.
Is EPM1270T144C3N in stock?
Yes, the EPM1270T144C3N is currently listed as in stock at multiple authorized distributors as of 2026-09-12, including DigiKey, Mouser, and Win Source. Distributor aggregator Octopart reports availability from 6 active distributors. Lead times for production-volume orders (1k+ pieces) typically range from 4-8 weeks from authorized channels.
EPM1270T144C3N vs EPM1270F256C5N - which is better for I/O expansion?
The EPM1270T144C3N uses a 144-pin TQFP with up to 212 user I/O (144-pin variant limits to ~114 usable I/O), while the EPM1270F256C5N uses a 256-pin FineLine BGA with up to 212 user I/O available (more usable pins in smaller board area). For maximum I/O density, choose the F256 BGA package; for hand-solder/rework-friendly prototyping, the T144 TQFP is preferable.
What is the best drop-in replacement for EPM1270T144C3N?
The best drop-in replacement is the EPM1270T144C3 itself (non-N suffix variant), or for a slight speed/grade change, the EPM1270T144A5N (same package, -5 speed). For new designs requiring more I/O, the EPM1270F256C5N shares the same 1270-LE MAX II die but in a 256-pin BGA package. All variants use the same JTAG chain and Quartus toolchain.
Is EPM1270T144C3N suitable for power-sequencing applications?
Yes, the EPM1270T144C3N is ideal for power-sequencing applications due to its non-volatile instant-on configuration (no external boot memory required), fast propagation delay (~3.6 ns at -3 grade), and MultiVolt I/O support (1.5 V to 3.3 V) that allows direct interface to multiple rails. It is commonly used to sequence FPGA/ASIC power rails on board power-up.
When should I choose EPM1270T144C3N over a small FPGA?
Choose the EPM1270T144C3N over a small FPGA when you need deterministic timing, instant-on from non-volatile memory, lower per-unit cost at low densities, and simple JTAG-only programming without external boot flash. FPGAs (e.g., Cyclone IV) win for higher logic density (>5K LEs), large block RAM needs, or high-speed serial transceivers - none of which the EPM1270T144C3N provides.
What design software supports EPM1270T144C3N?
The EPM1270T144C3N is supported by Intel Quartus Prime (free Web Edition handles MAX II family), Altera Quartus II (legacy), and compatible with USB-Blaster or ByteBlaster II JTAG programmers. According to Intel's MAX II datasheet, the design flow supports VHDL, Verilog, and schematic entry with the same fitter that handles MAX 3000A/7000-series designs.
Where to download EPM1270T144C3N datasheet PDF?
The EPM1270T144C3N datasheet (Section I, MAX II Device Family Data Sheet) can be downloaded from Alldatasheet.com, Intel FPGA's official documentation portal, or aggregator sites like Datasheets.com. The datasheet PDF is approximately 988 KB and contains 88 pages covering electrical characteristics, pinout, timing, and configuration specifications.
Where can I find EPM1270T144C3N pinout information?
The complete EPM1270T144C3N 144-pin TQFP pinout is published in the MAX II Device Family datasheet Section I, pin information tables. The package uses a 20x20 mm body with 1.0 mm pitch. Engineers can also use Quartus Prime Pin Planner tool to view I/O assignments interactively. The T144 variant exposes approximately 114 user I/O plus dedicated JTAG, power, and configuration pins.
What is the difference between EPM1270T144C3N and EPM1270GT144I5?
The EPM1270T144C3N is a MAX II family part (commercial temp, -3 speed), while the EPM1270GT144I5 is a MAX II G family part (industrial temp, -5 speed). Both share the same 144-pin TQFP footprint and pinout. The G variant supports additional external supply voltage options and ISP features, but for most standard glue-logic applications the C3N is faster and less expensive.
What are the key specifications of EPM1270T144C3N that engineers should know?
The EPM1270T144C3N has 1270 Logic Elements, 980 equivalent macrocells, 8 Kbits of user Flash memory, and 212 maximum user I/Os in a 144-pin TQFP package. It operates from a 1.8 V core supply with MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces. According to the Intel MAX II datasheet, the -3 speed grade delivers 3.6 ns pin-to-pin delay and supports JTAG (IEEE 1149.1) in-system programming with instant-on from internal Flash configuration memory.

Données de référence d'ingénierie pour EPM1270T144C3N — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EPM1270T144C3N when you need the fastest commercial-grade MAX II 1270-LE CPLD in the 144-pin TQFP footprint for high-speed glue logic, bus bridging, or power-sequencing above 50 MHz. For cost-sensitive designs where ~5 ns pin-to-pin delay is acceptable, the EPM1270T144A5N or EPM1270T144C5N are interchangeable drop-in alternatives at lower price. For industrial temperature range (-40C to +100C), the EPM1270T144I5N is the only drop-in TQFP-144 alternative. The non-N EPM1270T144C3 is pin-compatible but lacks Pb-free compliance - only use for legacy or non-RoHS builds. All 5 alternatives share the same TQFP-144 footprint and Quartus toolchain.

Comparaison avec les alternatives

Paramètre Ce produit EPM1270T144A5N EPM1270T144C3 EPM1270T144C4N EPM1270T144C5N EPM1270T144I5N
Package TQFP-144 (T144) TQFP-144 (T144) - same TQFP-144 (T144) - same TQFP-144 (T144) - same TQFP-144 (T144) - same TQFP-144 (T144) - same
Brand Intel Intel - same Intel - same Intel - same Intel - same Intel - same
Speed Grade -3 (C3, fastest) -5 (slower) -3 (same) -4 (mid) -5 (slower) -5 (slower, industrial)
Pin-to-Pin Delay (tPD) ~3.6 ns ~5.0 ns ~3.6 ns ~4.5 ns ~5.0 ns ~5.0 ns
Operating Temperature 0C to +85C (commercial) 0C to +85C (commercial) 0C to +85C (commercial) 0C to +85C (commercial) 0C to +85C (commercial) -40C to +100C (industrial)
Logic Elements 1270 1270 (same) 1270 (same) 1270 (same) 1270 (same) 1270 (same)
User I/O (max) 212 212 212 212 212 212
User Flash Memory (UFM) 8 Kbits 8 Kbits 8 Kbits 8 Kbits 8 Kbits 8 Kbits
Pb-Free / RoHS Yes (N suffix) Yes No (non-N) Yes Yes Yes

Principaux différenciateurs

  • Fastest commercial speed grade in MAX II 1270 T144 family (vs EPM1270T144A5N)
  • Lead-free / Pb-free marking (N suffix) (vs EPM1270T144C3)
  • Non-volatile Flash configuration for instant-on (vs EPM1270T144C5N)

Notes de conception

The EPM1270T144C3N requires separate VCCINT (1.8 V) and VCCIO (1.5 V/1.8 V/2.5 V/3.3 V) rails. Decouple each VCCINT pin with a 0.1 uF ceramic capacitor placed within 5 mm of the package, and each VCCIO bank pin with 0.1 uF + bulk 10 uF tantalum. The 8 I/O banks (VCCIO1-8) can each operate at a different voltage, but the core VCCINT (1.8 V) must come up first or simultaneously with VCCIO. Sequence the 1.8 V rail before the I/O rails to prevent I/O latch-up during power-up transient.

TQFP-144 has a 0.5 mm pin pitch with 1.0 mm lead width - use 0.20 mm trace width and 0.20 mm spacing to escape pins cleanly. Place 4-layer PCB recommended: layer 1 for signals, layer 2 GND plane, layer 3 power planes (split for VCCINT and VCCIO banks), layer 4 signals. Avoid routing high-speed signals (>50 MHz) under the TQFP thermal pad area to minimize crosstalk.

Common pitfalls: (1) Forgetting to drive nCONFIG high after power-up - device will not configure. (2) Mixing VCCIO voltages on the same bank causes I/O contention - each bank must use a single VCCIO. (3) JTAG chain must include proper TMS/TCK pull-ups (typically 10 kohm to VCCIO of bank 1). (4) Not connecting unused I/O - leave them floating or tie to GND via internal pulldown to reduce crosstalk and power consumption. (5) Configuring I/O as inputs before VCCIO ramps - use BUS_HOLD or input delay to avoid input metastability.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

RoHS compliant per N suffix designation (Pb-free). Not AEC-Q100 qualified - this is a commercial/industrial-grade CPLD, not automotive. Industrial temperature range variants (I5N) available for extended environments.

Données vérifiées le : 2026-09-12 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EPM1270T144C3N EPM1270T144C3N datasheet Intel MAX II CPLD 144-pin TQFP MAX II 1270 logic elements CPLD EPM1270T144C3N price EPM1270T144C3N buy online EPM1270T144C3N pinout TQFP-144 EPM1270T144C3N vs EPM1270T144A5N MAX II CPLD drop-in replacement EPM1270T144C3N power sequencing application CPLD vs FPGA difference MultiVolt IO 1.5V 1.8V 2.5V 3.3V CPLD

Composants & termes associés

Intel Altera MAX II EPM1270T144C3N CPLD Complex Programmable Logic Device PLD programmable logic logic element macrocell Logic Array Block LAB TQFP-144 TQFP TQFP package Surface Mount JTAG IEEE 1149.1 IEEE 1532 in-system programmability ISP MultiVolt IO Quartus Prime user Flash memory UFM non-volatile configuration instant-on power sequencing glue logic bus bridge RoHS Pb-free AEC-Q100
RFQ de devis rapide
Notre équipe commerciale vous répondra sous 24 heures
RéférenceMfrPkgQtéPrix cible
×
Total : 0,00 USD
✓
Devis envoyé !

Nous répondrons à votre e-mail sous 24 heures

Panier 0 article
Votre panier est vide
RFQ de devis rapide
Renseignez tous les détails — notre équipe commerciale vous répondra sous 24 heures
Référence Fabricant Boîtier QTY Prix cible Total
Total : 0,00 USD
✓
Devis envoyé !

Nous répondrons à votre e-mail sous 24 heures

1
RFQ envoyée
2
Devis reçu
3
Commande passée
4
Paiement
5
Expédié
6
Livré
Voir les détails de la RFQ