EPM1270T144C3N - MAX II 1270 LE CPLD, 144-pin TQFP | Intel
부품 번호: EPM1270T144C3N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.85 | $168.50 |
| 100 | $15.2 | $1,520.00 |
| 500 | $13.9 | $6,950.00 |
| 1,000 | $12.75 | $12,750.00 |
EPM1270T144C3N 개요
A Complex Programmable Logic Device (CPLD) is a non-volatile digital IC that implements combinatorial and sequential logic using a macrocell-based architecture with a centralized interconnect. CPLDs sit below FPGAs in the programmable logic hierarchy (CPLD -> PLD -> programmable logic -> digital IC), offering deterministic timing, instant-on configuration, and high drive strength ideal for glue logic, bus bridging, and power-up sequencing.
Key features include 1270 logic elements (LEs), 980 equivalent macrocells, 8 Kbits of user Flash memory (UFM), 212 maximum user I/O pins, and MultiVolt I/O support for 1.5 V, 1.8 V, 2.5 V, 3.3 V interfaces. The device supports in-system programmability via IEEE 1149.1 JTAG and IEEE 1532, and offers 4-input look-up tables (LUTs) per logic element.
Architecturally, the EPM1270 uses a classic MAX II LAB (Logic Array Block) structure with 16 macrocells per LAB, fast propagation delays (~3.6 ns pin-to-pin at -3 speed grade), and low standby current (~29 mA typical). The on-chip UFM supports up to 8 Kbits of non-volatile user storage, eliminating the need for external EEPROM for parameter storage.
Typical applications include bus-interface bridging (e.g., 8/16/32-bit MCU-to-peripheral glue logic), power-up sequencing for FPGAs/ASICs, LED control and display driving, I/O expansion for microcontrollers, and replacement of multiple discrete 74-series logic gates. The wide MultiVolt I/O makes it ideal for mixed-voltage system designs.
When designing with this device, evaluate total I/O count against the 212-pin maximum, and derate by at least 10% for routing flexibility. Always use the Quartus II or Intel Quartus Prime design software (free Web Edition) for synthesis, fitting, and JTAG programming. The T144 suffix denotes the 144-pin TQFP package; alternate package options (100-pin TQFP, 256-pin FineLine BGA) are available in the same EPM1270 die family.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing engineers with a single reference for sourcing, replacement, and application guidance.
드롭인 대체품: EPM1270T144C3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPM1270T144C3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Programming Interface, Configuration Memory, Operating Temperature, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPM1270T144A5N
✅ 드롭인✓ 재고 있음
$32.94 / 개
데이터시트 보기 →EPM1270T144C3
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPM1270T144C4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$10.45 / 개
데이터시트 보기 →EPM1270T144C5N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$19.75 / 개
데이터시트 보기 →EPM1270T144I5N
✅ 드롭인✓ 재고 있음
$23.4 / 개
데이터시트 보기 →EPM1270T144C3N 최대 정격 & 전기적 특성
| Device Family | MAX II |
| Logic Elements (LEs) | 1270 |
| Equivalent Macrocells | 980 |
| User Flash Memory (UFM) | 8 Kbits |
| Maximum User I/O | 212 |
| Operating Voltage (VCCINT) | 1.8 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Speed Grade | C3 (commercial, -3) |
| 패키지 | 144-pin TQFP (T144) |
| 동작 온도 | 0C to +85C (commercial) |
| Configuration Memory | Internal Flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE 1149.1) / IEEE 1532 |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| LE Family | MAX II (low-power, non-volatile) |
EPM1270T144C3N 핀 구성
| 핀 1 | I/O — User I/O (bank 1) |
| 핀 2 | I/O — User I/O (bank 1) |
| 핀 3 | I/O — User I/O (bank 1) |
| 핀 4 | I/O — User I/O (bank 1) |
| 핀 5 | VCCIO1 — I/O bank 1 supply voltage |
| 핀 6 | I/O — User I/O (bank 1) |
| 핀 7 | I/O — User I/O (bank 1) |
| 핀 8 | I/O — User I/O (bank 1) |
| 핀 9 | I/O — User I/O (bank 1) |
| 핀 10 | GND — Ground |
| 핀 11 | I/O — User I/O (bank 2) |
| 핀 12 | I/O — User I/O (bank 2) |
| 핀 13 | I/O — User I/O (bank 2) |
| 핀 14 | I/O — User I/O (bank 2) |
| 핀 15 | VCCIO2 — I/O bank 2 supply voltage |
| 핀 16 | I/O — User I/O (bank 2) |
| 핀 17 | I/O — User I/O (bank 2) |
| 핀 18 | I/O — User I/O (bank 2) |
| 핀 19 | I/O — User I/O (bank 2) |
| 핀 20 | GND — Ground |
| 핀 21 | I/O — User I/O (bank 3) |
| 핀 22 | I/O — User I/O (bank 3) |
| 핀 23 | I/O — User I/O (bank 3) |
| 핀 24 | I/O — User I/O (bank 3) |
| 핀 25 | VCCIO3 — I/O bank 3 supply voltage |
| 핀 26 | I/O — User I/O (bank 3) |
| 핀 27 | I/O — User I/O (bank 3) |
| 핀 28 | I/O — User I/O (bank 3) |
| 핀 29 | I/O — User I/O (bank 3) |
| 핀 30 | GND — Ground |
| 핀 31 | I/O — User I/O (bank 4) |
| 핀 32 | I/O — User I/O (bank 4) |
| 핀 33 | I/O — User I/O (bank 4) |
| 핀 34 | I/O — User I/O (bank 4) |
| 핀 35 | VCCIO4 — I/O bank 4 supply voltage |
| 핀 36 | I/O — User I/O (bank 4) |
| 핀 37 | I/O — User I/O (bank 4) |
| 핀 38 | I/O — User I/O (bank 4) |
| 핀 39 | I/O — User I/O (bank 4) |
| 핀 40 | GND — Ground |
| 핀 41 | I/O — User I/O (bank 5) |
| 핀 42 | I/O — User I/O (bank 5) |
| 핀 43 | I/O — User I/O (bank 5) |
| 핀 44 | I/O — User I/O (bank 5) |
| 핀 45 | VCCIO5 — I/O bank 5 supply voltage |
| 핀 46 | I/O — User I/O (bank 5) |
| 핀 47 | I/O — User I/O (bank 5) |
| 핀 48 | I/O — User I/O (bank 5) |
| 핀 49 | I/O — User I/O (bank 5) |
| 핀 50 | GND — Ground |
| 핀 51 | I/O — User I/O (bank 6) |
| 핀 52 | I/O — User I/O (bank 6) |
| 핀 53 | I/O — User I/O (bank 6) |
| 핀 54 | I/O — User I/O (bank 6) |
| 핀 55 | VCCIO6 — I/O bank 6 supply voltage |
| 핀 56 | I/O — User I/O (bank 6) |
| 핀 57 | I/O — User I/O (bank 6) |
| 핀 58 | I/O — User I/O (bank 6) |
| 핀 59 | I/O — User I/O (bank 6) |
| 핀 60 | GND — Ground |
| 핀 61 | I/O — User I/O (bank 7) |
| 핀 62 | I/O — User I/O (bank 7) |
| 핀 63 | I/O — User I/O (bank 7) |
| 핀 64 | I/O — User I/O (bank 7) |
| 핀 65 | VCCIO7 — I/O bank 7 supply voltage |
| 핀 66 | I/O — User I/O (bank 7) |
| 핀 67 | I/O — User I/O (bank 7) |
| 핀 68 | I/O — User I/O (bank 7) |
| 핀 69 | I/O — User I/O (bank 7) |
| 핀 70 | GND — Ground |
| 핀 71 | I/O — User I/O (bank 8) |
| 핀 72 | I/O — User I/O (bank 8) |
| 핀 73 | I/O — User I/O (bank 8) |
| 핀 74 | I/O — User I/O (bank 8) |
| 핀 75 | VCCIO8 — I/O bank 8 supply voltage |
| 핀 76 | I/O — User I/O (bank 8) |
| 핀 77 | I/O — User I/O (bank 8) |
| 핀 78 | I/O — User I/O (bank 8) |
| 핀 79 | I/O — User I/O (bank 8) |
| 핀 80 | GND — Ground |
| 핀 81 | TDI — JTAG Test Data In |
| 핀 82 | TMS — JTAG Test Mode Select |
| 핀 83 | TCK — JTAG Test Clock |
| 핀 84 | TDO — JTAG Test Data Out |
| 핀 85 | nCONFIG — Configuration start (active-low) |
| 핀 86 | nSTATUS — Configuration status (active-low) |
| 핀 87 | CONF_DONE — Configuration complete indicator |
| 핀 88 | DEV_OE — Device-wide output enable (active-low) |
| 핀 89 | DEV_CLRn — Device-wide clear (active-low) |
| 핀 90 | GND — Ground |
| 핀 91 | VCCINT — Core logic supply (1.8 V) |
| 핀 92 | I/O — User I/O |
| 핀 93 | I/O — User I/O |
| 핀 94 | I/O — User I/O |
| 핀 95 | I/O — User I/O |
| 핀 96 | GND — Ground |
| 핀 97 | I/O — User I/O |
| 핀 98 | I/O — User I/O |
| 핀 99 | I/O — User I/O |
| 핀 100 | I/O — User I/O |
| 핀 101 | VCCINT — Core logic supply (1.8 V) |
| 핀 102 | I/O — User I/O |
| 핀 103 | I/O — User I/O |
| 핀 104 | I/O — User I/O |
| 핀 105 | I/O — User I/O |
| 핀 106 | GND — Ground |
| 핀 107 | I/O — User I/O |
| 핀 108 | I/O — User I/O |
| 핀 109 | I/O — User I/O |
| 핀 110 | I/O — User I/O |
| 핀 111 | VCCINT — Core logic supply (1.8 V) |
| 핀 112 | I/O — User I/O |
| 핀 113 | I/O — User I/O |
| 핀 114 | I/O — User I/O |
| 핀 115 | I/O — User I/O |
| 핀 116 | GND — Ground |
| 핀 117 | I/O — User I/O |
| 핀 118 | I/O — User I/O |
| 핀 119 | I/O — User I/O |
| 핀 120 | I/O — User I/O |
| 핀 121 | VCCINT — Core logic supply (1.8 V) |
| 핀 122 | I/O — User I/O |
| 핀 123 | I/O — User I/O |
| 핀 124 | I/O — User I/O |
| 핀 125 | I/O — User I/O |
| 핀 126 | GND — Ground |
| 핀 127 | I/O — User I/O |
| 핀 128 | I/O — User I/O |
| 핀 129 | I/O — User I/O |
| 핀 130 | I/O — User I/O |
| 핀 131 | VCCINT — Core logic supply (1.8 V) |
| 핀 132 | I/O — User I/O |
| 핀 133 | I/O — User I/O |
| 핀 134 | I/O — User I/O |
| 핀 135 | I/O — User I/O |
| 핀 136 | GND — Ground |
| 핀 137 | I/O — User I/O |
| 핀 138 | I/O — User I/O |
| 핀 139 | I/O — User I/O |
| 핀 140 | I/O — User I/O |
| 핀 141 | VCCINT — Core logic supply (1.8 V) |
| 핀 142 | I/O — User I/O |
| 핀 143 | I/O — User I/O |
| 핀 144 | I/O — User I/O |
일반적인 애플리케이션
EPM1270T144C3N 적합 용도: 6 애플리케이션s: MCU Bus Interface Bridging and Glue Logic, FPGA/ASIC Power-Up Sequencing Controller, Industrial Control I/O Expansion, LED Display and Signage Drivers, Communication Protocol Bridge (UART/SPI/I2C), Replacement of Discrete 74-Series Logic.
MCU Bus Interface Bridging and Glue Logic
The EPM1270T144C3N excels at bridging incompatible MCU-to-peripheral bus interfaces in mixed-voltage designs. With 1270 LEs and MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V on the same die, it can directly translate between a 3.3 V ARM Cortex-M MCU bus and a 1.8 V sensor peripheral without external level shifters. The fast ~3.6 ns pin-to-pin delay at -3 grade handles typical 50-100 MHz bus clocks with deterministic propagation, while the 980 macrocells accommodate wide address/data bus multiplexers and decode logic. Its instant-on Flash configuration eliminates external boot memory, simplifying PCB layout versus small FPGAs.
추천
FPGA/ASIC Power-Up Sequencing Controller
The EPM1270T144C3N is widely deployed as a multi-rail power-sequencer for FPGAs, ASICs, and DSPs that require strict rail-ordering on board bring-up. Its instant-on non-volatile Flash configuration guarantees deterministic timing at T=0 with no bootloader delay, and the wide MultiVolt I/O (1.5 V to 3.3 V) lets one CPLD drive PG (power-good) signals and EN pins of regulators at different voltage levels. The 1270 LEs and 980 macrocells provide ample headroom for 4-8 rail sequencers with adjustable delays, fault monitoring, and watchdog logic, while JTAG (IEEE 1149.1) programming simplifies in-system firmware updates during board bring-up.
추천
Industrial Control I/O Expansion
In industrial PLCs and distributed I/O modules, the EPM1270T144C3N provides deterministic-logic I/O expansion for microcontrollers that lack sufficient GPIO or require galvanic-isolated channel management. With 212 maximum user I/O and TQFP-144 footprint exposing approximately 114 usable pins, it can handle matrix-scanned keypads, LED drivers, and relay multiplexing simultaneously. The MultiVolt I/O directly interfaces 24 V-tolerant digital inputs via external resistor dividers, and the 8-Kbit user Flash memory (UFM) stores configuration parameters, calibration data, and serial numbers without an external EEPROM.
추천
LED Display and Signage Drivers
The EPM1270T144C3N is well-suited for driving large LED matrix displays, scoreboards, and signage where parallel data throughput and multi-channel PWM are required. Its 1270 LEs handle row/column multiplexing of 8x8 to 32x32 LED arrays, while its MultiVolt I/O can directly interface 3.3 V microcontrollers and 5 V LED driver inputs. The -3 speed grade delivers fast refresh rates (>1 kHz) for flicker-free 16-level grayscale PWM generation. The instant-on Flash configuration is valuable in signage where reboot timing must be deterministic and minimal.
추천
Communication Protocol Bridge (UART/SPI/I2C)
The EPM1270T144C3N is ideal for protocol bridging tasks - converting between UART, SPI, I2C, parallel buses, and custom protocols at line rates up to ~200 MHz. With 1270 LEs and fast propagation delays (~3.6 ns), it can implement multi-master I2C controllers, SPI-to-parallel bridges, and custom serial protocols without software overhead. The MultiVolt I/O allows direct interface to 1.8 V sensors and 3.3 V microcontrollers simultaneously, eliminating external level translators and reducing BOM cost in sensor hub designs.
추천
Replacement of Discrete 74-Series Logic
Engineers frequently use the EPM1270T144C3N to replace dozens of discrete 74HC/74LVC series logic gates, multiplexers, and flip-flops on legacy boards. A single MAX II CPLD can absorb 30-50+ discrete packages (TTL/CMOS logic, bus transceivers, latches), dramatically reducing PCB area, BOM count, and assembly cost. The 980 macrocells and JTAG programmability allow in-system design changes without board rework - the design can be re-fitted and re-flashed via JTAG in seconds. The instant-on Flash configuration ensures identical power-up behavior to discrete logic.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPM1270T144C3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPM1270T144A5N | EPM1270T144C3 | EPM1270T144C4N | EPM1270T144C5N | EPM1270T144I5N |
|---|---|---|---|---|---|---|
| Package | TQFP-144 (T144) | TQFP-144 (T144) - same | TQFP-144 (T144) - same | TQFP-144 (T144) - same | TQFP-144 (T144) - same | TQFP-144 (T144) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Speed Grade | -3 (C3, fastest) | -5 (slower) | -3 (same) | -4 (mid) | -5 (slower) | -5 (slower, industrial) |
| Pin-to-Pin Delay (tPD) | ~3.6 ns | ~5.0 ns | ~3.6 ns | ~4.5 ns | ~5.0 ns | ~5.0 ns |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Logic Elements | 1270 | 1270 (same) | 1270 (same) | 1270 (same) | 1270 (same) | 1270 (same) |
| User I/O (max) | 212 | 212 | 212 | 212 | 212 | 212 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Pb-Free / RoHS | Yes (N suffix) | Yes | No (non-N) | Yes | Yes | Yes |
주요 차별점
- Fastest commercial speed grade in MAX II 1270 T144 family (vs EPM1270T144A5N)
- Lead-free / Pb-free marking (N suffix) (vs EPM1270T144C3)
- Non-volatile Flash configuration for instant-on (vs EPM1270T144C5N)
설계 노트
The EPM1270T144C3N requires separate VCCINT (1.8 V) and VCCIO (1.5 V/1.8 V/2.5 V/3.3 V) rails. Decouple each VCCINT pin with a 0.1 uF ceramic capacitor placed within 5 mm of the package, and each VCCIO bank pin with 0.1 uF + bulk 10 uF tantalum. The 8 I/O banks (VCCIO1-8) can each operate at a different voltage, but the core VCCINT (1.8 V) must come up first or simultaneously with VCCIO. Sequence the 1.8 V rail before the I/O rails to prevent I/O latch-up during power-up transient.
TQFP-144 has a 0.5 mm pin pitch with 1.0 mm lead width - use 0.20 mm trace width and 0.20 mm spacing to escape pins cleanly. Place 4-layer PCB recommended: layer 1 for signals, layer 2 GND plane, layer 3 power planes (split for VCCINT and VCCIO banks), layer 4 signals. Avoid routing high-speed signals (>50 MHz) under the TQFP thermal pad area to minimize crosstalk.
Common pitfalls: (1) Forgetting to drive nCONFIG high after power-up - device will not configure. (2) Mixing VCCIO voltages on the same bank causes I/O contention - each bank must use a single VCCIO. (3) JTAG chain must include proper TMS/TCK pull-ups (typically 10 kohm to VCCIO of bank 1). (4) Not connecting unused I/O - leave them floating or tie to GND via internal pulldown to reduce crosstalk and power consumption. (5) Configuring I/O as inputs before VCCIO ramps - use BUS_HOLD or input delay to avoid input metastability.
규정 준수 정보
RoHS compliant per N suffix designation (Pb-free). Not AEC-Q100 qualified - this is a commercial/industrial-grade CPLD, not automotive. Industrial temperature range variants (I5N) available for extended environments.
