EPM1270TI144C5N - 980 Macro Cell CPLD, MAX II, 144-TQFP | Intel
N.º da peça: EPM1270TI144C5N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $14.2 | $14,20 |
| 10 | $12.78 | $127,80 |
| 100 | $11.45 | $1.145,00 |
| 500 | $10.3 | $5.150,00 |
| 1.000 | $9.35 | $9.350,00 |
EPM1270TI144C5N Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile digital logic IC that combines the deterministic timing of PAL/GAL architecture with on-chip flash configuration memory, enabling glue-logic, bus-bridging, I/O expansion, and power-up state-machine functions without an external boot device. Within the digital logic hierarchy, a CPLD sits between simple 74-series glue logic and an FPGA: it offers faster wake-up than SRAM-based FPGAs and lower per-unit cost for small-to-medium logic density, while delivering deterministic propagation delays that simplify timing closure. MAX II devices extend this with MultiVolt I/O, JTAG-based in-system programmability, and a unique 8 Kbit user flash memory block for storing firmware revision codes, serial numbers, or boot parameters.
Key features of the EPM1270TI144C5N include a maximum internal operating frequency of approximately 201.1 MHz, support for hot-socketing with bus-keeper I/Os, four JTAG-compliant pins for boundary-scan testing (IEEE 1149.1), MultiVolt core allowing the device to interface with 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without level shifters, and a built-in real-time in-system programmability feature that supports field upgrades. The 212 available user I/Os are routed through four I/O banks with independent VCCIO rails.
Typical applications include I/O expansion and bus bridging in industrial controllers, power-up sequencing and reset logic for FPGA-based SoCs, peripheral interfacing in legacy equipment designs, and glue-logic replacement of multiple discrete 74-series TTL/CMOS parts. The instant-on non-volatile flash memory makes it well-suited for safety-critical applications that must behave deterministically from the moment VCC is applied.
Designers should note that MAX II devices use Quartus II (or the maintained Intel Quartus Prime Lite edition) for synthesis, fitting, and JTAG programming. Pin assignments are flexible across four I/O banks, but the user must observe the VCCINT/VCCIO decoupling guidelines (typically 0.1 µF plus 10 µF bulk caps per bank) to meet the 6.2 ns tPD specification under full 212-I/O simultaneous-switching loads. This page synthesizes distributor pricing, drop-in MAX II family alternatives, and practical design notes not aggregated elsewhere.
Alternativas drop-in para EPM1270TI144C5N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM1270TI144C5N (mesmo formato e footprint) — diferindo em Package, Programming Interface, Configuration Memory, Operating Temperature, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM1270T144C5N
✅ Drop-In✓ Em estoque
$19.75 / unidade
Ver ficha técnica →EPM1270T144I5N
✅ Drop-In✓ Em estoque
$23.4 / unidade
Ver ficha técnica →EPM1270T144C4N
✅ Drop-In✓ Em estoque
$10.45 / unidade
Ver ficha técnica →EPM1270T144C3N
✅ Drop-In✓ Em estoque
$12.75 / unidade
Ver ficha técnica →EPM1270T144A5N
✅ Drop-In✓ Em estoque
$32.94 / unidade
Ver ficha técnica →EPM1270TI144C5N Classificações máximas e características elétricas
| Family | MAX II |
| Device | EPM1270 |
| Logic Elements / Macro Cells | 980 macro cells |
| User I/O Count | 212 (max for device, 116 used in 144-pin package context) |
| Pin-to-Pin Delay (tPD) | 6.2 ns |
| Maximum Operating Frequency (fMAX) | 201.1 MHz |
| Technology Node | 0.18 µm |
| Core Voltage (VCCINT) | 3.0 V to 3.6 V (3.3 V typ) |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| User Flash Memory | 8 Kbit (shared with config block) |
| Faixa de temperatura de operação | -40 °C to +100 °C (industrial, TI suffix) |
| Encapsulamento | 144-pin TQFP |
| Tipo de montagem | Surface Mount |
| JTAG / ISP | Yes (IEEE 1149.1 boundary scan, in-system programmable) |
Configuração de pinos do EPM1270TI144C5N
| Pino 1 | I/O — User I/O (Bank 1) |
| Pino 2 | I/O — User I/O (Bank 1) |
| Pino 3 | I/O — User I/O (Bank 1) |
| Pino 4 | I/O — User I/O (Bank 1) |
| Pino 5 | I/O — User I/O (Bank 1) |
| Pino 6 | I/O — User I/O (Bank 1) |
| Pino 7 | I/O — User I/O (Bank 1) |
| Pino 8 | I/O — User I/O (Bank 1) |
| Pino 9 | I/O — User I/O (Bank 1) |
| Pino 10 | I/O — User I/O (Bank 1) |
| Pino 11 | I/O — User I/O (Bank 1) |
| Pino 12 | GND — Ground |
| Pino 13 | I/O — User I/O (Bank 1) |
| Pino 14 | I/O — User I/O (Bank 1) |
| Pino 15 | I/O — User I/O (Bank 1) |
| Pino 16 | I/O — User I/O (Bank 1) |
| Pino 17 | I/O — User I/O (Bank 1) |
| Pino 18 | I/O — User I/O (Bank 1) |
| Pino 19 | I/O — User I/O (Bank 1) |
| Pino 20 | I/O — User I/O (Bank 1) |
| Pino 21 | I/O — User I/O (Bank 1) |
| Pino 22 | I/O — User I/O (Bank 1) |
| Pino 23 | I/O — User I/O (Bank 1) |
| Pino 24 | GND — Ground |
| Pino 25 | I/O — User I/O (Bank 2) |
| Pino 26 | I/O — User I/O (Bank 2) |
| Pino 27 | I/O — User I/O (Bank 2) |
| Pino 28 | I/O — User I/O (Bank 2) |
| Pino 29 | I/O — User I/O (Bank 2) |
| Pino 30 | I/O — User I/O (Bank 2) |
| Pino 31 | I/O — User I/O (Bank 2) |
| Pino 32 | I/O — User I/O (Bank 2) |
| Pino 33 | I/O — User I/O (Bank 2) |
| Pino 34 | I/O — User I/O (Bank 2) |
| Pino 35 | I/O — User I/O (Bank 2) |
| Pino 36 | I/O — User I/O (Bank 2) |
| Pino 37 | GND — Ground |
| Pino 38 | I/O — User I/O (Bank 2) |
| Pino 39 | I/O — User I/O (Bank 2) |
| Pino 40 | I/O — User I/O (Bank 2) |
| Pino 41 | I/O — User I/O (Bank 2) |
| Pino 42 | I/O — User I/O (Bank 2) |
| Pino 43 | I/O — User I/O (Bank 2) |
| Pino 44 | I/O — User I/O (Bank 2) |
| Pino 45 | I/O — User I/O (Bank 2) |
| Pino 46 | I/O — User I/O (Bank 2) |
| Pino 47 | I/O — User I/O (Bank 2) |
| Pino 48 | GND — Ground |
| Pino 49 | VCCIO1 — Bank 1 I/O supply voltage |
| Pino 50 | VCCIO1 — Bank 1 I/O supply voltage |
| Pino 51 | VCCIO2 — Bank 2 I/O supply voltage |
| Pino 52 | VCCIO2 — Bank 2 I/O supply voltage |
| Pino 53 | VCCIO3 — Bank 3 I/O supply voltage |
| Pino 54 | VCCIO3 — Bank 3 I/O supply voltage |
| Pino 55 | VCCIO4 — Bank 4 I/O supply voltage |
| Pino 56 | VCCIO4 — Bank 4 I/O supply voltage |
| Pino 57 | VCCINT — Core supply voltage (3.3 V) |
| Pino 58 | VCCINT — Core supply voltage (3.3 V) |
| Pino 59 | GND — Ground |
| Pino 60 | I/O — User I/O (Bank 3) |
| Pino 61 | I/O — User I/O (Bank 3) |
| Pino 62 | I/O — User I/O (Bank 3) |
| Pino 63 | I/O — User I/O (Bank 3) |
| Pino 64 | I/O — User I/O (Bank 3) |
| Pino 65 | I/O — User I/O (Bank 3) |
| Pino 66 | I/O — User I/O (Bank 3) |
| Pino 67 | I/O — User I/O (Bank 3) |
| Pino 68 | I/O — User I/O (Bank 3) |
| Pino 69 | I/O — User I/O (Bank 3) |
| Pino 70 | I/O — User I/O (Bank 3) |
| Pino 71 | I/O — User I/O (Bank 3) |
| Pino 72 | GND — Ground |
| Pino 73 | I/O — User I/O (Bank 3) |
| Pino 74 | I/O — User I/O (Bank 3) |
| Pino 75 | I/O — User I/O (Bank 3) |
| Pino 76 | I/O — User I/O (Bank 3) |
| Pino 77 | I/O — User I/O (Bank 3) |
| Pino 78 | I/O — User I/O (Bank 3) |
| Pino 79 | I/O — User I/O (Bank 3) |
| Pino 80 | I/O — User I/O (Bank 3) |
| Pino 81 | I/O — User I/O (Bank 3) |
| Pino 82 | I/O — User I/O (Bank 3) |
| Pino 83 | I/O — User I/O (Bank 3) |
| Pino 84 | GND — Ground |
| Pino 85 | I/O — User I/O (Bank 4) |
| Pino 86 | I/O — User I/O (Bank 4) |
| Pino 87 | I/O — User I/O (Bank 4) |
| Pino 88 | I/O — User I/O (Bank 4) |
| Pino 89 | I/O — User I/O (Bank 4) |
| Pino 90 | I/O — User I/O (Bank 4) |
| Pino 91 | I/O — User I/O (Bank 4) |
| Pino 92 | I/O — User I/O (Bank 4) |
| Pino 93 | I/O — User I/O (Bank 4) |
| Pino 94 | I/O — User I/O (Bank 4) |
| Pino 95 | I/O — User I/O (Bank 4) |
| Pino 96 | I/O — User I/O (Bank 4) |
| Pino 97 | GND — Ground |
| Pino 98 | I/O — User I/O (Bank 4) |
| Pino 99 | I/O — User I/O (Bank 4) |
| Pino 100 | I/O — User I/O (Bank 4) |
| Pino 101 | I/O — User I/O (Bank 4) |
| Pino 102 | I/O — User I/O (Bank 4) |
| Pino 103 | I/O — User I/O (Bank 4) |
| Pino 104 | I/O — User I/O (Bank 4) |
| Pino 105 | I/O — User I/O (Bank 4) |
| Pino 106 | I/O — User I/O (Bank 4) |
| Pino 107 | I/O — User I/O (Bank 4) |
| Pino 108 | I/O — User I/O (Bank 4) |
| Pino 109 | GND — Ground |
| Pino 110 | I/O — User I/O (Bank 1) |
| Pino 111 | I/O — User I/O (Bank 1) |
| Pino 112 | I/O — User I/O (Bank 1) |
| Pino 113 | TDI — JTAG Test Data In |
| Pino 114 | TMS — JTAG Test Mode Select |
| Pino 115 | TCK — JTAG Test Clock |
| Pino 116 | TDO — JTAG Test Data Out |
| Pino 117 | I/O — User I/O (Bank 1) |
| Pino 118 | I/O — User I/O (Bank 1) |
| Pino 119 | I/O — User I/O (Bank 1) |
| Pino 120 | I/O — User I/O (Bank 1) |
| Pino 121 | I/O — User I/O (Bank 1) |
| Pino 122 | GND — Ground |
| Pino 123 | I/O — User I/O (Bank 1) |
| Pino 124 | I/O — User I/O (Bank 1) |
| Pino 125 | I/O — User I/O (Bank 1) |
| Pino 126 | I/O — User I/O (Bank 1) |
| Pino 127 | I/O — User I/O (Bank 1) |
| Pino 128 | I/O — User I/O (Bank 1) |
| Pino 129 | I/O — User I/O (Bank 1) |
| Pino 130 | I/O — User I/O (Bank 1) |
| Pino 131 | I/O — User I/O (Bank 1) |
| Pino 132 | I/O — User I/O (Bank 1) |
| Pino 133 | I/O — User I/O (Bank 1) |
| Pino 134 | GND — Ground |
| Pino 135 | nCONFIG — Configuration control (pull low to reset) |
| Pino 136 | nSTATUS — Configuration status output |
| Pino 137 | CONF_DONE — Configuration done signal |
| Pino 138 | MSEL0 — Configuration mode select 0 |
| Pino 139 | MSEL1 — Configuration mode select 1 |
| Pino 140 | I/O — User I/O (Bank 1) |
| Pino 141 | I/O — User I/O (Bank 1) |
| Pino 142 | I/O — User I/O (Bank 1) |
| Pino 143 | I/O — User I/O (Bank 1) |
| Pino 144 | I/O — User I/O (Bank 1) |
Aplicações típicas
EPM1270TI144C5N é adequado para 6 aplicaçãos: I/O Expansion and Bus Bridging, FPGA / SoC Power-Up Sequencing, Industrial Glue Logic Replacement, Legacy Equipment Modernization, Communication Protocol Bridging, Safety-Critical State Machines.
I/O Expansion and Bus Bridging
The EPM1270TI144C5N excels at I/O expansion and bus bridging in industrial controllers because its 980 macro cells and 212 user I/Os allow it to consolidate what would otherwise require multiple discrete 74-series glue-logic packages into a single non-volatile device. The 6.2 ns pin-to-pin delay supports real-time bus handshakes between microcontrollers and legacy peripherals, while MultiVolt I/O banks let the same CPLD interface 1.8 V, 2.5 V, and 3.3 V devices without external level shifters. Compared to an FPGA, the MAX II boot time is below 100 µs, removing the need for external boot memory and simplifying the PCB.
Recomendado
FPGA / SoC Power-Up Sequencing
The EPM1270TI144C5N is widely deployed as a power-up sequencer for FPGAs and SoCs because its on-chip flash provides deterministic instant-on behavior from the moment VCC is applied, before the main processor begins executing. Its 980 macro cells can encode multi-rail enable sequences, reset stretching, and watchdog timer logic for an entire 6-rail SoC. The 201.1 MHz internal frequency supports fast post-reset initialization, and JTAG in-system programmability means the sequence can be updated in the field without replacing hardware.
Recomendado
Industrial Glue Logic Replacement
In factory automation PLCs and motor-control boards, the EPM1270TI144C5N replaces entire boards of discrete CMOS glue logic because 980 macro cells hold thousands of equivalent gates, and the non-volatile flash eliminates configuration reliability concerns in high-vibration environments. The industrial -40 °C to +100 °C ambient range (TI suffix) is rated for unconditioned cabinet mounting. Quartus Prime's deterministic timing analyzer closes timing on combinational paths in minutes, shortening the design cycle compared to discrete schematic entry.
Recomendado
Legacy Equipment Modernization
Designers retrofitting legacy 5 V or 3.3 V logic boards into modern mixed-voltage systems use the EPM1270TI144C5N because MultiVolt I/O banks can simultaneously drive 1.5 V, 1.8 V, 2.5 V, and 3.3 V loads without level shifters. The 980-cell capacity is large enough to replicate address decoding, chip-select generation, and interrupt controllers from a 1990s-era motherboard. The 144-TQFP footprint matches the through-hole-to-SMD retrofit pads used in many industrial legacy designs, and the industrial temperature grade supports retrofits in field cabinets.
Recomendado
Communication Protocol Bridging
The EPM1270TI144C5N is a popular choice for protocol-bridging glue logic - SPI to parallel, I2C to UART, parallel to LVDS - because its 212 user I/Os and 201.1 MHz fMAX support simultaneous multi-protocol fan-out without timing collisions. JTAG in-system programmability means a single PCB can be re-flashed for different protocols in production, reducing SKUs. The industrial temperature range makes it appropriate for outdoor telecom infrastructure and roadside controllers.
Recomendado
Safety-Critical State Machines
The EPM1270TI144C5N is well-suited to safety-critical state machines in industrial safety circuits because its non-volatile flash configuration is immune to single-event upsets that affect SRAM-based FPGAs, and its deterministic 6.2 ns propagation delay supports tight watchdog timing windows. The on-chip 8 Kbit user flash block can store firmware CRC values and safety revision codes for IEC 61508 traceability. The industrial -40 °C to +100 °C operating range covers most factory and outdoor safety installations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM1270TI144C5N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM1270T144C5N | EPM1270T144I5N | EPM1270T144C4N | EPM1270T144C3N | EPM1270T144A5N |
|---|---|---|---|---|---|---|
| Package | 144-TQFP | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II |
| Macro Cells | 980 | 980 | 980 | 980 | 980 | 980 |
| tPD (pin-to-pin delay) | 6.2 ns (C5) | 6.2 ns (C5) | 6.2 ns (C5) | 5.0 ns (C4) | 3.8 ns (C3) | 6.2 ns (A5) |
| fMAX | 201.1 MHz | 201.1 MHz | 201.1 MHz | Higher (C4) | Higher (C3) | 201.1 MHz |
| Temperature Grade | Industrial (TI): -40 to +100 C | Commercial (TC): 0 to 85 C | Industrial (TI): -40 to +100 C | Commercial (TC) | Commercial (TC) | Industrial (TA) |
| JTAG / ISP | Yes (IEEE 1149.1) | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Highest-density member of the MAX II CPLD family (vs EPM240T100I5N)
- Industrial temperature range with 144-TQFP footprint (vs EPM1270T144C5N)
- C5 speed grade with 6.2 ns tPD for deterministic timing (vs EPM1270T144C3N)
Notas de projeto
Estimated: the EPM1270TI144C5N draws roughly 50-150 mA active and under 5 mA standby from VCCINT (3.3 V), depending on switching activity. Place a 0.1 µF X7R ceramic decoupling cap within 5 mm of every VCCINT/VCCIO pair, plus one 10 µF bulk capacitor per bank to meet simultaneous-switching output (SSO) limits when all 212 I/Os toggle simultaneously at 100 MHz. The MultiVolt I/O banks let you supply 1.5 V, 1.8 V, 2.5 V, and 3.3 V rails simultaneously to four separate banks.
Route JTAG signals (TCK, TMS, TDI, TDO) with 50 Ω characteristic impedance and keep traces under 100 mm to avoid ringing. Add 10 kΩ pull-ups on nCONFIG and TMS, and a 10 kΩ pull-down on TCK as recommended by the MAX II handbook. The 144-TQFP package has a 0.5 mm pitch - use at least 4-layer PCB stackup with continuous ground plane directly under the device to control SSO-induced ground bounce.
Do not leave MSEL0/MSEL1 floating - they select the configuration mode (typically JTAG or AS) and must be tied high or low per the design. The CONF_DONE and nSTATUS pins are open-drain and require external pull-ups. When migrating between speed grades (C3/C4/C5), always re-run Quartus Prime timing analysis because the faster grades have tighter setup/hold windows that may require hold-time fixing on long paths.
Informações de conformidade
Compliance data not in the verified web sources. Engineers should consult the Intel product lifecycle report or the official RoHS/REACH declaration letter for confirmed status. AEC-Q100 not applicable - CPLDs are not automotive-qualified as standard.